KR20080022179A - Method of forming partition wall of plasma display panel - Google Patents

Abstract

A partition wall is formed using a glass sheet, thereby lowering cost of partition wall formation and facilitating formation of partition wall and electrode. Dry film (31) convertible to a dielectric layer by firing is provided on substrate (21). Glass sheet (32) with a thickness corresponding to the height of partition wall to be formed is fixed on the dry film. Resist pattern (33) corresponding to the morphology of partition wall is provided on the glass sheet. Unwanted portion of the glass sheet is sandblasted off, thereby forming the glass sheet into a configuration of partition wall. The dry film is fired at a temperature not higher than the softening points of the substrate and glass sheet so as to attain bonding of the substrate with the glass sheet by means of a dielectric layer being a fired dry film. Thus, formation of a partition wall is accomplished. ® KIPO & WIPO 2008

Description

Partition wall formation method of plasma display panel {METHOD OF FORMING PARTITION WALL OF PLASMA DISPLAY PANEL}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a partition of a plasma display panel (PDP), and more particularly, to a method for forming a partition mainly applied to an AC drive type 3-electrode surface discharge type PDP.

As a conventional PDP, an AC drive type 3-electrode surface discharge type PDP is known. The PDP is provided with a plurality of display electrodes capable of surface discharge in the horizontal direction on the inner surface of one substrate (for example, the substrate on the front side or the display surface side), and the other substrate (for example, the substrate on the back side). A plurality of address electrodes for light emitting cell selection are provided on the inner surface in a direction crossing the display electrodes, so that the intersection of the display electrodes and the address electrodes is one cell (unit light emitting region). One pixel is composed of three cells, a red (R) cell, a green (G) cell, and a blue (B) cell.

The display electrode of the substrate on the front side is covered with a dielectric layer. The address electrodes of the substrate on the back side are also covered with a dielectric layer, and partition walls are formed between the address electrodes and the address electrodes, and R, G, and B, respectively, between partition walls of the corresponding regions of the R cells, the G cells, and the B cells. The phosphor layer for dragons is formed.

The PDP is manufactured by sealing the periphery by opposing the substrate on the front side and the substrate on the back side thus produced (see Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2003-303542

<Start of invention>

Problems to be Solved by the Invention

As the formation method of the partition wall of the said PDP, the following method is known. The first method forms a barrier material layer by forming an electrode barrier layer (such as a fired film of a dielectric) on a substrate, applying a low melting glass paste thereon, and drying the barrier material layer, and sandblasting the barrier material layer. It is a method of cutting by a sandblast and forming a partition. The second method is a method in which a glass substrate is directly cut by sand blast to form a partition wall.

The first method has mass production results, but has the following problems. That is, since half or more of the partition material is discarded, the manufacturing cost becomes high. Moreover, since the dry film formed by the sand blast is fired, the edge part of the longitudinal direction of a partition jumps by the plastic shrinkage of a partition, and the clearance gap arises with an opposing board | substrate, and this is a joint sound accompanying panel vibration. It is caused by occurrence. In addition, since a low melting glass paste is used, if foreign matters are mixed in the paste, problems such as partition walls and convex portions are formed in the partition walls.

Since the said 2nd method does not require the low melting-point glass paste as a partition material, and reduction of material cost is anticipated, development is progressing. However, there are the following problems. That is, since the address electrode is formed after the partition wall formation, the address electrode is difficult to form. In the case of forming a so-called box-shaped partition wall having not only a vertical partition wall but also a horizontal partition wall, an address electrode must be provided so as to form a through-hole in the horizontal partition wall or pass over the horizontal partition wall. Therefore, in view of reliability, application is very difficult at the present time.

This invention is made in view of such a situation, and forming a partition using a glass sheet reduces the formation cost of a partition, and makes formation of a partition and an electrode easy.

Means for solving the problem

The present invention forms a dry film that becomes a dielectric layer by firing on a substrate, and fixes a glass sheet having a thickness corresponding to the height of the partition wall to be formed on the dry film, and corresponds to the partition shape on the glass sheet. By forming a resist pattern, cutting the glass sheet of the unnecessary portion by sand blasting, forming the glass sheet into a partition wall shape, and baking the dry film at a temperature below the softening point of the substrate and the glass sheet, It is a method of forming a partition of a plasma display panel, wherein the substrate and the glass sheet are adhered to a dielectric layer that is a plastic dry film.

Effect of the Invention

According to the present invention, since the glass sheet is used for the partition wall, there is no problem such as the occurrence of a joint due to panel vibration without jumping of the partition wall end due to plastic shrinkage of the partition wall. Moreover, since the glass sheet surface becomes a top of a partition as it is, the top of a partition with high smoothness is obtained, and adhesiveness with an opposing board | substrate is maintained easily. As a result, crosstalk with adjacent cells hardly occurs, and sufficient panel reliability is obtained. And since a low melting glass paste is unnecessary, a significant cost reduction is attained. In addition, even when forming a barrier rib by directly cutting the substrate, for example, when forming a closed barrier rib such as a box shape, the electrode is easily formed by forming an electrode on the substrate before the dry film is formed. .

BRIEF DESCRIPTION OF THE DRAWINGS Explanatory drawing which shows the structure of the PDP of this invention.

2 is an explanatory diagram illustrating a method of forming a partition wall.

3 is an explanatory diagram showing a method of forming a partition wall;

<Description of the code>

10: PDP

11: front side board

12: transparent electrode

13: bus electrode

17: dielectric layer

18: protective film

21: back side substrate

24: dielectric layer

28R, 28G, 28B: phosphor layer

29: bulkhead

30: discharge space

31 dry film of dielectric material

32: glass sheet

33: partition pattern of dry film resist

A: address electrode

G: load

L: display line

X, Y: display electrode

<Best Mode for Carrying Out the Invention>

In the present invention, first, a dry film serving as a dielectric layer is formed on a substrate. As a board | substrate, board | substrates, such as glass, quartz, and ceramics, and the board | substrate which formed desired structures, such as an electrode, on these board | substrates are contained.

The dry film which becomes a dielectric layer can be formed by apply | coating low melting glass paste to a board | substrate by well-known methods, such as a screen printing method and a paste coating method, for example, and drying it. The low melting glass paste can be formed using various paste materials known in the art. However, in this invention, it is preferable to form the dry film from the material which contained the resin of the quantity which can have adhesiveness with a glass sheet, and sandblast tolerance after drying.

Alternatively, the dry film may be formed by adhering a previously produced pressure-sensitive adhesive sheet to a substrate, which contains a resin in an amount capable of providing adhesion to the glass sheet and sand blast resistance.

You may spray-spray the adhesive which contained the resin of the quantity which can give adhesiveness with a glass sheet, and sandblast tolerance to a dry film. Thereby, adhesiveness with a glass sheet can be provided.

In the present invention, a glass sheet having a thickness corresponding to the height of the partition wall to be formed is then fixed on the dry film. The glass sheet can apply what was formed using various materials well-known in the said field | area. For example, boron silicate glass, soda-lime glass generally used as window glass, etc. can be used.

You may use a colored glass sheet for this glass sheet. In addition, before forming a resist pattern on a glass sheet, you may further set the process of apply | coating black paste on a glass sheet and drying it.

In the present invention, the resist sheet corresponding to the partition shape is next formed on the glass sheet, and the glass sheet of the unnecessary portion is cut by sand blasting to form the glass sheet in the partition shape.

The resist pattern may be formed by exposing and developing a photolithographic method using a dry film resist to form a resist pattern of the partition wall, and applying a liquid resist, and drying and exposing and developing the resist pattern of the partition wall. You may form a pattern.

In the present invention, the dried film is then fired at a temperature below the softening point of the substrate and the glass sheet, thereby fixing the substrate and the glass sheet to a dielectric layer which is a fired dry film. Firing can be carried out using a firing furnace known in the art.

When baking this dry film, you may further set the process of pressing the glass sheet to the board | substrate side, and improving the adhesiveness of a board | substrate and a glass sheet.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is explained in full detail based on embodiment shown in drawing. In addition, this invention is not limited by this, A various deformation | transformation is possible.

1 (a) and 1 (b) are explanatory diagrams showing the configuration of the PDP of the present invention. FIG. 1A is an overall view, and FIG. 1B is a partially exploded perspective view. This PDP is an AC drive type 3-electrode surface discharge PDP for color display.

The PDP 10 is composed of a substrate 11 on the front side and a substrate 21 on the back side. As the substrate 11 on the front side and the substrate 21 on the back side, a glass substrate, a quartz substrate, a ceramic substrate, or the like can be used.

On the inner surface of the substrate 11 on the front side, display electrodes X and display electrodes Y are arranged at equal intervals in the horizontal direction. The display line L is between the adjacent display electrode X and the display electrode Y. Each display electrode X, Y is a wide transparent electrode 12 such as ITO, SnO ₂ , and the like, for example, Ag, Au, Al, Cu, Cr, and laminates thereof (for example, Cr / Cu / Cr. Lamination structure), and the narrow metal bus electrode 13 is comprised. The display electrodes X and Y use a thick film formation technique such as screen printing for Ag and Au, and other thin film formation techniques such as vapor deposition and sputtering, and etching techniques for the desired number, thickness, width and spacing. It can be formed as.

In the present PDP, the display electrodes X and the display electrodes Y are arranged at equal intervals, and the display electrodes L and the adjacent display electrodes X and Y are both display lines L. However, the display is paired. Even if the electrodes X and Y are PDPs having a structure spaced apart from an interval (non-discharge gap) in which no discharge occurs, the partition formation method of the present invention can be applied.

On the display electrodes X and Y, a dielectric layer 17 for alternating current (AC) driving is formed so as to cover the display electrodes X and Y. The dielectric layer 17 is formed by applying a low melting glass paste onto the substrate 11 on the front side by screen printing and firing. The dielectric layer 17 may be formed by forming a SiO ₂ film by plasma CVD.

On the dielectric layer 17, a protective film 18 for protecting the dielectric layer 17 from damage caused by collision of ions caused by discharge during display is formed. This protective film is formed of MgO or the like. The protective film can be formed by a thin film formation process known in the art, such as an electron beam deposition method or a sputtering method.

On the inner surface of the substrate 21 on the back side, a plurality of address electrodes A are formed in a direction intersecting the display electrodes X and Y in plan view, and a dielectric layer 24 is formed covering the address electrodes A. FIG. The address electrode A generates address discharge for selecting a light emitting cell at the intersection with the display electrode Y, and is formed in a three-layer structure of Cr / Cu / Cr. In addition, this address electrode A can also be formed with Ag, Au, Al, Cu, Cr, etc., for example. Similarly to the display electrodes X and Y, the address electrodes A use a thick film formation technique such as screen printing for Ag and Au, and other thin films and etching techniques such as a vapor deposition method and a sputtering method. , Thickness, width and spacing. The dielectric layer 24 serves as an electrode barrier layer when forming the partition wall.

On the dielectric layer 24 between the adjacent address electrode A and the address electrode A, a plurality of stripe barrier ribs 29 are formed. The shape of the partition 29 is not limited to this, and may be a mesh shape (box shape) which divides the discharge space for each cell. The partition 29 is formed by the sandblasting method using a glass sheet. The formation method of this partition is mentioned later.

Phosphor layers 28R, 28G, and 28B of red (R), green (G), and blue (B) are formed on the dielectric layer 24 between the side walls of the barrier ribs 29 and the barrier ribs. The phosphor layers 28R, 28G, and 28B apply a phosphor paste containing phosphor powder, a binder resin, and a solvent into the concave groove-shaped discharge spaces between the partition walls 29 by screen printing or by using a dispenser. After repeating for each color, it forms by baking. The phosphor layers 28R, 28G, and 28B may be formed by photolithography using a sheet-like phosphor layer material (so-called green sheet) containing phosphor powder, a photosensitive material, and a binder resin. In this case, a sheet of a desired color is adhered to the entire display area on the substrate to perform exposure and development, and this is repeated for each color, whereby phosphor layers of each color can be formed between the corresponding partition walls.

The PDP is arranged such that the front substrate 11 on the front side and the substrate 21 on the back side face each other such that the display electrodes X, Y and the address electrode A intersect, seal the periphery, and are surrounded by the partition 29. It is produced by filling the discharge space 30 with the discharge gas which mixed Xe and Ne. In this PDP, the discharge space 30 at the intersection of the display electrodes X, Y and the address electrode A is one cell (unit light emitting area) which is the minimum unit of display. One pixel is composed of three cells of R, G, and B.

FIG.2 (a)-FIG.2 (c), FIG.3 (a), FIG.3 (b) are explanatory drawing which shows the formation method of a partition. Hereinafter, the partition formation method of this invention is demonstrated in order of process.

<Dry Film Forming Step>

First, a dry film 31 is formed on the glass substrate 21 on the rear side where the address electrode A is formed using a dielectric material (see FIG. 2A). The address electrode A is formed using materials and methods known in the art. The dry film 31 of the dielectric material is formed by applying and drying a low melting glass paste by a screen printing method, a paste coating method, or the like. The low melting glass paste is obtained by adding a filler such as ceramics, a binder resin, and a solvent to the low melting glass paste. The dry film 31 of the dielectric material may be formed by adhering a sheet-like thing (called a green sheet or the like).

The dry film 31 of the dielectric material functions as an electrode barrier layer. That is, the sandblast is prevented from cutting during sandblasting described later, and serves to protect the address electrode A. FIG. For this reason, the low melting glass paste to be used contains many resins, and is made to have sufficient viscoelasticity.

<Glass Sheet Fixing Process>

Next, the glass sheet 32 having a thickness corresponding to the desired partition height is placed on the dry film 31 of the dielectric material and fixed (see FIG. 2B). At this time, since the dry film 31 of the dielectric material has sufficient adhesiveness, the glass sheet 32 can be fixed. It is preferable that the thickness of the glass sheet 32 is 50-500 micrometers.

<Resist Film Forming Step>

Next, the dry film resist is adhered on the glass sheet 32, exposed through a desired photomask, and developed to form a partition pattern 33 of the dry film resist on the glass sheet 32 (FIG. 2). (C) of). At this time, the pattern of the address electrode A may be used as an alignment mark. That is, when alignment of the resist pattern on the glass sheet (at the time of exposure) is performed using the alignment mark formed at the same time when the address electrode pattern is formed, accurate position alignment is possible.

Next, the glass sheet 32 is partitioned by sandblasting by removing the glass sheet 32 of the unnecessary part to the bottom (refer FIG. 3 (a)). As the abrasive, alumina, zirconia, calcium carbonate, metal and the like are used. At this time, since the dry film 31 of the dielectric material has sufficient elasticity, it is not cut by the abrasive of sand blast and serves as a stopper layer (electrode barrier layer).

Dry Film Firing Process

After cutting by sand blast, the substrate 21 on the back side is placed in a firing furnace, and the glass transition temperature of the glass sheet 32 is higher than or equal to the softening temperature of the low melting glass contained in the dry film 31 of the dielectric material. The dry film 31 is fired at the following temperature, and the glass sheet 32 is fixed to the softened dry film 31. At this time, since the glass sheet 32 sinks in the dry film 31 by the weight of the glass sheet 32, sufficient adhesion strength is obtained.

In this case, in order to control the finishing partition height, you may apply the load G on the glass sheet 32 (refer FIG.3 (b)). That is, the height of the partition is controlled by the magnitude of the load G. For example, if the load G is increased, a slightly lower partition can be formed. If the load G is reduced, a slightly higher partition can be formed.

The following method may be applied to the partition formation method.

In the dry film forming step, as described above, the dry film may be formed by adhering the green sheet. However, the green sheet can be easily adhered to the substrate by adjusting the amount of resin to give adhesiveness. The green sheet may be rolled up in a roll shape beforehand and used to be taken out from the roll during use.

The dry film 31 of the dielectric material may be formed using a low melting glass paste having no viscosity when dried. In that case, after apply | coating a low melting glass paste by the screen printing method or the paste coat method, what is necessary is just to spray a sticky resin after spray drying after paste drying. In other words, the pressure-sensitive adhesive resin containing an amount of the adhesive resin capable of providing adhesion to the glass sheet and elasticity sufficient to withstand the sand blast abrasive is sprayed with a spray.

In the glass sheet fixing step, in order to generally improve the contrast of the screen, a method of making the top of the partition black is employed. However, when such a need arises, a glass sheet colored in black may be used.

Alternatively, after fixing the glass sheet on the dry film, a black paste may be applied by a screen printing method or a paste coating method after the glass sheet is fixed on the dry film, and the resist film may be formed after drying.

In addition, as a method of blackening the top of the partition wall, black paste is applied to the glass sheet from which the resist film is peeled off after sand blasting by screen printing, and after drying, the black paste dry film is fired at the time of firing the dry film of the dielectric material. You may also do so.

In the resist film formation process, it was formed by adhering a dry film resist on the glass sheet 32, but a resist film may be formed by applying a liquid resist on the glass sheet 32 and drying it.

The resist pattern of the partition formed in this process is not specifically limited, Any pattern may be sufficient. For example, it may be a stripe shape, or may be a shape other than a closed partition wall shape, for example, a box shape, a delta shape, and other straight shapes.

After the sand blast process, the removal of the resist film remaining on the glass sheet may be peeled off with an adhesive roll. Alternatively, the drying film may be removed at the same time.

In this way, by using the glass sheet for the partition wall, since there is no baking step of the partition wall, there is no jumping of the end of the partition wall caused by shrinkage at the time of partition wall firing, and it is possible to prevent the occurrence of a joint from the panel. In addition, since the upper surface of the glass sheet becomes the top of the partition as it is, the smoothness of the top of the partition is increased, and the adhesion with the substrate on the front side is improved, and as a result, it is difficult to generate discharge bonds (crosstalk) with the adjacent cells. Panel reliability is obtained. In addition, since the low melting glass paste is not required, the partition material cost is reduced. In addition, even when forming a barrier rib by directly cutting a glass substrate, even in the case of forming a closed barrier rib such as a box type, the electrode is easily formed by forming an electrode on the substrate before the dry film is formed. Become.

In addition, instead of the sand blasting process mentioned above, laser micromachining and the chemical etching process by chemical liquid are also employable for the cutting of a glass sheet.

Claims (11)

On the substrate, by baking, a dry film serving as a dielectric layer is formed, On the dry film, a glass sheet having a thickness corresponding to the height of the partition wall to be formed is fixed, By forming a resist pattern corresponding to the partition shape on the glass sheet and cutting the glass sheet of the unnecessary portion by sand blasting, the glass sheet is formed in the partition shape, By baking a dry film at the temperature below the softening point of a board | substrate and a glass sheet, a board | substrate and a glass sheet are adhere | attached on the dielectric layer which is a baking dry film A partition wall forming method of a plasma display panel. The method of claim 1, A dry film is formed by coating and drying a paste-like dielectric material on a substrate, and the paste-like dielectric material is capable of providing adhesiveness and sandblast resistance with the glass sheet after drying. A partition wall formation method of a plasma display panel which is a material containing resin. The method of claim 2, A method of forming a partition wall of a plasma display panel, wherein a step of applying a paste-like dielectric material onto a substrate is performed by a screen printing method. The method of claim 2, A method of forming a partition wall of a plasma display panel in which a step of applying a paste-like dielectric material onto a substrate is performed by a paste coat method. The method of claim 1, A dry film is formed by adhering an adhesive sheet on a substrate, and the adhesive sheet is a plasma display panel which is a previously produced adhesive sheet containing a resin in an amount capable of providing adhesiveness and sand blast resistance with a glass sheet. Method of forming bulkheads. The method of claim 1, The dry film is formed by spray-spraying a pressure-sensitive adhesive containing a resin capable of giving adhesiveness and sand blast resistance to a glass sheet on a paste dry film obtained by applying a paste-like dielectric material onto a substrate. A partition wall formation method of a plasma display panel. The method of claim 1, A partition wall forming method for a plasma display panel, in which the glass sheet is formed of a colored glass sheet. The method of claim 1, A method of forming a partition wall of a plasma display panel, further comprising: applying a black paste onto the glass sheet and drying the glass sheet after fixing the glass sheet on the glass sheet and before forming a resist pattern on the glass sheet. The method of claim 1, A method of forming a partition wall of a plasma display panel, further comprising the step of pressing the glass sheet against the substrate side when firing the dried film to improve adhesion between the substrate and the glass sheet. On the substrate, by baking, a dry film serving as a dielectric layer is formed, On the dry film, a glass sheet having a thickness corresponding to the height of the partition wall to be formed is fixed, By forming a resist pattern corresponding to the partition wall shape on the glass sheet and removing the glass sheet of the unnecessary portion, the glass sheet is formed in the partition wall shape, By baking a dry film at the temperature below the softening point of a board | substrate and a glass sheet, a board | substrate and a glass sheet are adhere | attached on the dielectric layer which is a baking dry film A partition wall forming method of a plasma display panel. A plasma display panel in which a partition is formed by the partition formation method according to any one of claims 1 to 10.

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