KR20080021261A - Gas supply system for semiconductor manufacturing equipment and gas supply changing method - Google Patents

Abstract

A gas supply system for semiconductor manufacturing equipment having a gas supply switching unit and a gas supply switching method using the same are provided to prevent an accident due to leakage of a process gas by removing previously a cause of gas leakage. A gas supply system includes one or plural first gas supply units, a first gas supply line, a second gas supply line(150), one or plural second gas supply tubes(100), and a gas supply switching unit. The first gas supply line is formed to connect the first gas supply unit and a main body to each other. A first valve is installed in the first gas supply line. The second gas supply line is connected to the first gas supply line. A second valve is installed in the second gas supply line. The second gas supply unit is connected to the second gas supply line. The gas supply switching unit senses the residual amount of first gas and supplies the second gas of the second gas supply unit to the main body according to the sensed result.

Description

GAS SUPPLY SYSTEM FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT AND GAS SUPPLY CHANGING METHOD}

1 is a view showing a gas supply system for a semiconductor manufacturing equipment of the present invention.

2 is a view showing an embodiment of a gas supply system for semiconductor manufacturing equipment of the present invention.

3 is a view showing another embodiment of a gas supply system for semiconductor manufacturing equipment of the present invention.

4 is a flowchart showing a gas supply switching method using the gas supply system for semiconductor manufacturing equipment of the present invention.

** Explanation of Signs of Major Parts of Drawings **

100: second gas supply unit

150: second gas supply line

200: first gas supply unit body

210: first gas supply unit

250: first gas supply line

300: equipment body

400: control unit

The present invention relates to a gas supply system for semiconductor manufacturing equipment, and more particularly, in supplying process gas to a facility, a gas supply switching unit which can be easily switched from a small capacity gas supply unit to a large capacity gas supply unit without stopping the gas supply. It relates to a gas supply system for semiconductor manufacturing equipment having and a gas supply switching method using the same.

In general, a semiconductor device is manufactured by a plurality of processes, such as diffusion, deposition, etching, ion implantation, exposure, and cleaning, sequentially or selectively repeated.

Among these, the deposition method is classified into physical vapor deposition and chemical vapor deposition. In general, the chemical vapor deposition is a deposition method widely used due to the uniformity of the layer covering of the deposit on the stepped portion, as compared with the physical vapor deposition, because the chemical vapor deposition proceeds by the diffusion, adsorption, chemical reaction of the reaction gases.

The chemical vapor deposition is used for depositing metallization, insulating films and passivation. Among them, low pressure chemical vapor deposition is mainly used for the metallization chemical vapor deposition, and recently, due to the development of a device using the low pressure chemical vapor deposition, doping of polysilicon and polycrystalline silicon and in-situ tungsten silicide are performed. The deposition method is in the limelight because it does not require a separate precleaning process and is advantageous in various aspects with high integration of the device.

At this time, the deposition reaction formula has the following formula.

WF6 + 2SiH4 → WSix + 6HF ↑ + H2 ↑... … … Chemical formula

In order to deposit the metal wires exemplified above, a certain amount of process gas, SiH 4, must be continuously supplied into the deposition facility. Therefore, the semiconductor manufacturing equipment such as the chemical vapor deposition equipment as described above is essentially provided with a gas supply system for supplying the process gas required for the desired process.

Typically, such a process gas such as SiH4 is stored and stored in a gas supply container such as a cylinder of about 47 liters (small capacity), and the gas supply system has at least one gas supply container of the small capacity.

Therefore, in the conventional gas supply system, when the gas remaining amount of any one of the gas supply containers becomes a certain amount, the gas supply system replaces the other gas supply container and supplies the gas to the facility.

However, when all of the process gases stored in the plurality of small capacity gas supply containers are exhausted, the process gas is sufficiently supplied to a facility by connecting to a separate large capacity gas supply container.

At this time, in the case of replacing the small capacity gas supply container from the small capacity gas supply container in which the process gas is exhausted, the operation of the facility is stopped, and the facility and the large capacity gas supply container are connected to each other. Will be operated.

Accordingly, there is a problem in that a time loss occurs when the operation of the facility is stopped, thereby lowering the product production rate.

In addition, the process gas is not limited to SiH4, and since most of the gases are harmful to the human body, there is a problem that a safety accident such as human or physical damage occurs due to the leakage of gas when the gas is replaced with a large-capacity gas supply container.

In addition, due to the frequent replacement of the gas supply vessel as described above there is a problem that a product defect occurs by changing the conditions for the internal process elements of the facility.

In addition, there is a problem in that the production cost is increased in terms of production cost because the additional cost of stopping the equipment and replacing the new gas supply container.

Accordingly, the present invention has been made in order to solve the above problems, the first object of the present invention is to switch the exhausted small capacity gas supply unit to the large capacity gas supply unit without stopping the operation of the equipment (loss of work time) The present invention provides a gas supply system for semiconductor manufacturing equipment and a gas supply conversion method using the same, which can prevent occurrence of the same.

In addition, the second object of the present invention is to provide a gas supply system for semiconductor manufacturing equipment that can prevent the safety accident due to the leakage of the process gas in advance by removing the cause of the gas leakage caused by replacing the conventional gas supply system and It is to provide a gas supply conversion method using the same.

In addition, the third object of the present invention is to stabilize the conditions for the internal process elements of the equipment caused by frequent replacement of the gas supply system gas supply system for semiconductor manufacturing equipment that can prevent product defects and the gas using the same To provide a supply switching method.

In addition, the fourth object of the present invention is to provide a gas supply system for a semiconductor manufacturing equipment and a gas supply switching method using the same, which can reduce the production cost by preventing the additional cost of stopping the equipment and replacing a new gas supply container. In providing.

In order to achieve the above object, the present invention provides a gas supply system for semiconductor manufacturing equipment having a gas supply switching unit.

The gas supply system is in communication with one or a plurality of first gas supply unit, the first gas supply unit and the equipment main body, the first gas supply line provided with a first valve, and the first gas supply line, A second gas supply line provided with a second valve, one or a plurality of second gas supply parts connected to the second gas supply line, and a first gas amount stored in the first gas supply part; It includes a gas supply switching unit for supplying the second gas stored in the supply unit to the facility body.

The gas supply switching unit may be configured to detect a gas remaining amount stored in the first gas supply unit in real time, and may be electrically connected to the detector so that the gas remaining amount of the first gas supply part is a predetermined amount. It is preferable to include a control unit which opens to supply the second gas together with the first gas to the facility body.

Here, the control unit preferably closes the first valve after a predetermined time.

The gas supply switching unit may include first detectors for detecting a gas remaining amount of each of the first gas supply parts, second detectors for detecting a gas remaining amount of each of the second gas supply parts, and the first detector. And electrically connected to the second detectors, and when the gas remaining amount of at least one of the first gas supply units reaches a preset remaining amount, the second valve is opened to allow the second gas to be combined with the first gas. It may be provided with a control unit for supplying to the facility body.

Here, the control unit may select at least one of the second gas supply units larger than a preset gas remaining amount and supply the same to the facility body, and close the first valve after a predetermined time.

And, the gas capacity of the second gas supply unit is preferably larger than the capacity of the first gas supply unit.

In order to achieve the above object, the present invention provides a gas supply switching method using a gas supply system for semiconductor manufacturing equipment.

In the gas supply switching method, a predetermined amount of the first gas is supplied from the at least one first gas supply unit to the facility body, the remaining amount of the supplied first gas is measured, and the remaining amount of the measured first gas is measured. When the remaining amount is set, the second gas is supplied from the at least one second gas supply unit together with the first gas to the facility main body for a predetermined time, and the supply of the first gas is stopped after the predetermined time elapses. .

Here, the remaining amount measurement of the first gas may be any one of a predetermined remaining amount of the first gas supply units.

In addition, at least one of the second gas supply units larger than a predetermined gas remaining amount may be selected and supplied to the facility body.

Hereinafter, with reference to the accompanying drawings, it will be described an embodiment of the gas supply system of the semiconductor manufacturing equipment of the present invention and the gas supply switching method using the same.

1 is a view showing a gas supply system for a semiconductor manufacturing equipment of the present invention, Figure 2 is a view showing an embodiment of a gas supply system for a semiconductor manufacturing equipment of the present invention, Figure 4 is a semiconductor manufacturing equipment for the present invention A flow chart showing a gas supply switching method using a gas supply system.

First, the gases stored in the first gas supply unit 100 and the second gas supply unit 210 mentioned above are called first and second gases, respectively, which may be the same, and the gas in the following description is SiH4. This will be described as an example.

Referring to FIG. 1, the gas supply system is provided with one first gas supply unit 210. The first gas supply unit 210 may be a 47-liter small capacity bomber, and may store SiH 4 gas, which is a process gas used for a metal wiring process in a chemical vapor deposition process. The first gas supply unit 210 is provided with a first gas supply line 250 to communicate with the facility main body 300. A first valve is installed in the first gas supply line 250. The first valve may be a plurality of. That is, as shown in Figure 2, it may be ④ valve 172 to ⑨ valve 241. '200', which is not described, is the body of the first gas supply unit.

A second gas supply line 150 is provided which communicates with the first gas supply line 250. The second gas supply line 150 is divided into a plurality of branches 151, 152, and 153 so as to communicate with the plurality of second gas supply units 110, 120, and 130 independently. The second gas supply units 110, 120, and 130 may be bombs, and may have a large capacity of 47 liters or more of a gas storage capacity. A second valve is installed in the second gas supply line 150. There may be a plurality of second valves, and as shown in FIG. 2, ① valves 161 to ③ valves 171 may be used. In addition, separate valves 151a, 152a and 153a may be further mounted on the respective second gas supply lines.

On the other hand, the second gas supply unit 100 is provided with second detectors (111, 121, 131) for measuring in real time the remaining amount of the gas stored therein. The second detectors 111, 121, and 131 may be water level detectors for detecting a residual amount of gas stored in the second gas supply unit 100. The configuration of the level sensor will not be described separately.

In addition, the first gas supply unit 210 is also provided with a first sensor 211 having the same configuration as the second sensor (111, 121, 131) provided in the second gas supply unit (100).

In addition, when the residual amount of the gas stored in the plurality of second gas supply units 110, 120, and 130 and the first gas supply unit 210 is sensed and reaches a predetermined amount, the facility stores the second gas stored in the second gas supply unit 100. Gas supply switching unit for supplying the main body 300 is provided.

Accordingly, the gas supply switching unit includes the first detectors 111, 121, and 131, and is electrically connected to the first detectors 111, 121, and 131 so that the gas remaining amount of the first gas supply unit 210 is a predetermined amount. The control unit 400 is provided to open the valve to supply the gas to the facility body 300 together with the gas flowing from the first gas supply unit. The controller 400 operates the first valve to close the first valve after a preset time.

In addition, the second gas supply line 150 is equipped with two additional valves ① and ② valves 161 and 162. A case 163 is provided to cover the valves 161 and 162. The case 163 is provided with a visible window 164 to which the ①, ② valves 161 and 162 are exposed to the outside. Accordingly, ① valve 161 is in communication with the second gas supply line 151 to 153 and 154, ② valve 162 is in communication with the second gas supply line 155. Of course, the ①, ② valves (161, 162) are in communication with each other so that the gas can flow.

And, in more detail with respect to the first gas supply line 250 for connecting the first gas supply unit 210 and the facility body 300 to each other, the front end of the first gas supply unit 210, ⑥, (7) valves 231 and 232 are installed, and the first and second gas supply lines 250 passing through the 6 and 7 valves 231 and 232 are in communication with the second gas supply line 150. Here, ④ and ⑤ valves 172 and 173 are installed in the first gas supply line 250, and ③ valve 170 is installed in the second gas supply line 150.

Through the above configuration, it will be described the operation state and gas supply switching method of the gas supply system for semiconductor manufacturing equipment of the present invention.

1, 2 and 4, a predetermined amount of the first gas is supplied from the at least one first gas supply unit 210 to the facility main body 300 (S100). Hereinafter, the first gas is referred to as a gas such as SiH 4.

That is, the gas stored in the first gas supply unit 210 is supplied to the facility main body 300 through the first gas supply line 250. At this time, ③, ⑥, ⑦ valves (171, 231, 232) is open, the remaining valves are closed.

At this time, the first sensor 211 measures the remaining amount of the gas stored in the first gas supply unit 210 in real time (S200). The measured gas remaining amount is transmitted to the controller 400 in the form of an electrical signal. The controller 400 compares the measured residual amount of gas with a predetermined residual amount and determines whether the measured residual amount of gas is the same.

If the measured gas remaining amount is the same as the preset gas remaining amount, the control unit 400 supplies the gas of the second gas supply unit 100 to the facility main body 300. At this time, together with the gas from the first gas supply unit 210 is supplied to the facility main body 300 for a predetermined time (S200).

More specifically, the control unit 400 receives an electrical signal for the gas remaining amount of each of the second gas supply units 110, 120, and 130. The controller 400 arbitrarily selects any one of the second gas supply units 110, 120, and 130 when the gas remaining amount of the second gas supply units 110, 120, 130 is higher than a preset residual amount.

For example, when the first gas supply unit 110 is selected, the controller 400 opens the 151a valve and the ① valve 161. At this time, ② the valve 162 is in a closed state. Accordingly, the gas stored in the first gas supply unit 110 is filled in the second gas supply line 150 until the front end of the valve 161.

Then, the controller 400 closes the valves 231 and 232 of the first gas supply line 250 after a predetermined time passes. Therefore, the gas supply from the first gas supply unit 210 is stopped (S400). The above-mentioned predetermined time may be set in the controller 400, but may be arbitrarily set.

Subsequently, the controller 400 opens the ② valve 162 and ③, ④, and ⑤ valves 171, 172, 173. Therefore, the gas filled up to the front end of the ① valve 161 is supplied to the facility main body 300 in communication with the second gas supply line 150 through the opening of the ③ valve 171.

At the same time, the controller 400 opens the valves 241 and 242. Therefore, the gas remaining in the first gas supply line 250 is discharged to the outside through the ban line 270.

In summary, before the gas of the first gas supply unit 210 is almost consumed, the gas of the second gas supply unit 100 having a large capacity is supplied to the facility main body 300 so that the operation of the facility is not stopped. The first gas supply unit 210 can be easily converted to a large-capacity gas supply unit.

On the other hand, the first gas remaining amount of the second gas supply unit 110 is measured in real time by the second detector 111 is transmitted to the control unit 400. If the gas remaining amount of the first second gas supply unit 110 is equal to the preset gas remaining amount, the control unit 400 closes the 151 a valve and opens the 152 a valve to open the second gas supply unit 2 ( The gas is continuously supplied from the second gas supply line 150 through 120.

In addition, the third gas supply unit 130 is replaced with the same method as described above.

Furthermore, before all the gases of the third gas supply unit 130 are exhausted, the first gas supply unit 210 may be replaced with another gas supply unit in which gas is filled, and then replaced with a small capacity without stopping the operation of the equipment. It may be. Of course, when the third gas supply unit 130 is used, the second and second gas supply units 110 and 120 may be replaced with another gas supply unit newly filled with gas.

Next, another embodiment of the gas supply system for semiconductor manufacturing equipment of the present invention will be described with reference to FIG. 3.

Compared to the above embodiment, the first embodiment is different from the first gas supply unit 210 and 220, and the first gas supply units 210 and 220 are provided with first detectors 211 and 221, respectively. do. Therefore, the first detectors 211 and 221 measure the gas remaining amount of the first gas supply parts 210 and 220, and transmit the measured gas remaining amount to the controller 400. When the measured gas remaining amount is equal to the preset gas remaining amount, the controller 400 selects another first gas supply part to supply gas to the first gas supply pipe 250.

That is, the control unit closes the valve 232 and opens another valve 233 to supply gas from the other first gas supply unit 220 to the first gas supply line 250, and eventually installs the main body of the facility ( 300) to be supplied.

The gas supply from the second gas supply unit 100 and the method or configuration for converting the small capacity first gas supply unit 210 and 220 into the large capacity second gas supply unit 100 are the same as above, and thus will be omitted. do.

As described above, the present invention has an effect that can prevent the occurrence of a loss of working time because the process proceeds without stopping the operation of the equipment when switching from the exhausted small-capacity gas supply unit to large-capacity gas supply unit .

In addition, there is also an effect that can prevent the safety accident due to the leakage of the process gas by removing the cause of the leakage of gas in advance by replacing the conventional gas supply system.

In addition, by stabilizing the conditions for the internal process elements of the equipment generated by frequent replacement of the conventional gas supply system has the effect of preventing the occurrence of product defects to improve the quality of the product.

In addition, it is possible to reduce the production cost by preventing the input of additional costs by stopping the existing equipment and replacing the new gas supply container.

Claims (7)

One or more first gas supply units; A first gas supply line communicating with the first gas supply unit and the facility main body and provided with a first valve; A second gas supply line communicating with the first gas supply line and provided with a second valve; One or more second gas supply parts connected to the second gas supply line; And The semiconductor manufacturing equipment having a gas supply switching unit including a gas supply switching unit for supplying the second gas stored in the second gas supply unit to the facility main body when the first gas remaining amount stored in the first gas supply unit is sensed. Gas supply system. The method of claim 1, The gas supply switching unit detects the gas remaining amount stored in the first gas supply unit in real time, and is electrically connected to the detector to open the second valve when the gas remaining amount of the first gas supply part is a predetermined amount. It is provided with a control unit for supplying the second gas with the first gas to the facility body, The control unit is a gas supply system for a semiconductor manufacturing equipment having a gas supply switching unit, characterized in that for closing the first valve after a predetermined time. The method of claim 1, The gas supply switching unit includes first detectors for detecting a gas remaining amount of each of the first gas supply parts, second detectors for detecting a gas remaining amount of each of the second gas supply parts, and the first and second parts. When the gas remaining amount of at least one of the first gas supply units reaches a preset remaining amount, the second main body is opened to the second gas together with the first gas. Is provided with a control unit to supply to, The control unit selects and supplies at least one of the second gas supply units larger than a preset gas remaining amount to the facility main body, and closes the first valve after a predetermined time. Gas supply system for semiconductor manufacturing equipment having. The method of claim 1, And a gas capacity of the second gas supply part is greater than that of the first gas supply part. Supplying a predetermined amount of the first gas from the at least one first gas supply unit to the facility body, Measure the remaining amount of the supplied first gas, When the residual amount of the first gas to be measured becomes a predetermined residual amount, at least one or more second gas supply unit for supplying a second gas with the first gas for a predetermined time, and The gas supply switching method of the semiconductor manufacturing equipment to stop the supply of the first gas after the predetermined time. The method of claim 5, The remaining amount measurement of the first gas is any one of the predetermined remaining amount of the first gas supply unit gas supply switching method of the semiconductor manufacturing equipment. The method of claim 5, The gas supply switching method of the semiconductor manufacturing equipment, characterized in that at least one selected from the second gas supply unit more than the predetermined gas remaining amount is supplied to the equipment main body.

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