KR20080004919A - Seat block and auto lid attach & press system for semiconductor production - Google Patents

Abstract

A seat block and an auto lid attach and press system of a semiconductor fabricating apparatus are provided to reduce a failure rate of a chip by providing a member for attaching a lid in a state when the flatness of a press having a processing error or an assembly error is accurately adjusted. An auto lid attach and press system of a semiconductor fabricating apparatus includes a on-loader(10), a loading picker(13), a lid picker(14), a seat block(12), a lid press(17), an unloading picker(18), and an off-loader(19). The on-loader is used for inputting a boat including a plurality of chips. The loading picker loads the boat inputted from the on-loader onto the seat block while moving by a transfer(11a). The lid picker loads one lid onto a top part of the chip on the seat block. The seat block is movable in a length direction along a seat block rail(15) and seats the boat having the chip. The lid press presses and attaches the lid on the top part of the chip on the seat block. The unloading picker unloads the boat including the chip to which the lid is attached from the seat block.

Description

Seat lid and auto lid attach & press system for semiconductor production

1 is a plan view illustrating a layout of an auto lead attach / press device according to an embodiment of the present invention.

2 is a perspective view illustrating a seat block in an auto lead attach / press device according to an embodiment of the present invention;

3 is a front view showing a state in which a chip is set on a sheet block in an auto lead attach / press device according to an embodiment of the present invention;

4A and 4B are front views illustrating a state of correcting flatness of a lead press in an auto lead attach / press device according to an embodiment of the present invention;

5A and 5B are front views illustrating an operating state of a lead press in an auto lead attach / press device according to an embodiment of the present invention.

6 is a plan view illustrating a layout of an auto lead attach / press device according to another embodiment of the present invention.

7 is a plan view illustrating a layout of an auto lead attach / press device according to another embodiment of the present invention.

<Explanation of symbols for main parts of drawing>

10: Onloader 11a, 11b: Transfer

12: seat block 13: loading picker

14: lead picker 15: seat block rail

16: lead press rail 17: lead press

18: Unloading Picker 19: Offloader

20a, 20b, 20c: Vision 21: Air bearing

22: load cell 23a, 23b: pusher

24: inlet rail 25: lead supply

26a, 26b: reject box 27: outlet rail

28: support

The present invention relates to an auto lead attach / press device and a sheet block of a semiconductor manufacturing equipment, and more particularly, by implementing a system for automatically attaching a lead for heat dissipation such as a heat spreader to an upper surface of a chip. The present invention relates to an auto lead attach / press device and a sheet block of a semiconductor manufacturing equipment capable of increasing the efficiency of a process and significantly reducing a defect rate of a chip when a lead is attached.

As the electronics industry has become lighter, smaller, faster, more versatile, and higher in performance, there is a demand for a technology for manufacturing a product having higher reliability at a lower cost.

One of the important technologies for enabling such a requirement is the package technology.

With high performance and high speed of semiconductor chips, semiconductor chip packages are evolving from thin small outline pakage (TSOP) to ball chip array (BGA) or chip size pakage (CSP) to flip chip technology.

This flip chip technology has the advantage of designing a larger chip in the same single area compared to the existing BGA, etc., further accelerates development.

However, since the flip chip technology does not mold the chip, there is a relatively weak side in package robustness or thermal release, and in order to solve this problem, a stiffener and a square plate having a hollow portion formed in the center portion where the chip is set are solved. It is designed to protect the chip and dissipate heat by bonding and fixing the heat spreader in the form.

For example, a chip that generates a lot of heat, such as a flip chip, is provided with a lead (Lid) made of a material having high thermal conductivity such as a heat spreader to release heat generated outside the chip.

The conventional lead attach / press device is a device for attaching a lead having a high thermal conductivity to an upper surface of a chip. The lead attach / press device covers a plurality of upper surfaces of a chip seated on a boat and presses it with a press. Basically, the overall process is dependent on the manual process such as laying the lead on the chip and pressing the entire boat including the lead and the chip on the press. have.

In addition, since the boat is manufactured by sheet metal processing, the flatness of the chip seated on the boat is not accurate. As a result, the lead is not correctly attached after the press working, and thus the defect rate is considerably high.

In addition, the press for pressing the lead is to use a general press, in this case, because the assembly is composed of a plurality of components, an error occurs in the machining or assembling process, resulting in accurate flatness of the press end after assembly Failure to do so causes a high failure rate during the press process for lead pressurization.

Therefore, the present invention has been made in view of the above, and a series of processes for attaching the lead for heat dissipation on the upper surface of the chip, such as automatic input and discharge of the chip, automatic supply of the lead, automatic transfer and press process, etc. The purpose is to provide an auto lead attach / press device and a sheet block of semiconductor manufacturing equipment that can improve the efficiency of the lead attaching process, such as improving the workability and productivity by building an automatic system. .

In addition, the present invention includes a means for attaching leads in a state in which the flatness of a press having a processing error or an assembly error is precisely adjusted, thereby reducing the defect rate of the chip at the time of attaching the lead. Another object is to provide a lead attach / press device and a seat block.

According to one or more embodiments of the present invention, an auto lead attach / press device includes an onloader for inputting a boat including a plurality of chips, and at least two boats inserted while being moved in the width direction by a transfer. A loading picker for loading onto the seat block one by one, a lead picker for integrally assembled with the lead picker for loading one side of the lead onto the chip on the seat block, and a longitudinally transportable width along the seat block rail Each seat block for seating a boat having chips while being arranged side by side with each other, and movable in the width direction along a lead press rail disposed across the upper feed trajectory of each seat block, and having an upper chip on the seat block. Lead press for pressing and attaching the lid placed on the lid, and the lid is moved in the width direction by the transfer And an unloading picker for unloading the boat including the finished chip from the seat block, and an offloader for discharging the boat including the chip having the lead attached thereto.

The loading picker may further include a vision unit for checking an accurate loading state of the chip on the sheet block.

In addition, a vision unit for checking the state of the lead is provided on the moving track line of the lead picker for loading the lead.

In addition, the seat block is composed of a base for boat seating, and a plurality of chip seating portions arranged in two rows parallel to the longitudinal direction on the base and having a higher surface than the base surface, so that the chip is spaced apart from the boat after boat loading on the seat block. Characterized in that it can be placed on the chip seat.

The seat block may further include a flatness correction area serving as a reference plane for matching the flatness of the lead press.

In addition, the lead press is characterized in that it is made in the form of pressing by using a screw transmission, including a screw driven by a motor, a moving block coupled to the screw up and down and a press block assembled to the lower end thereof. .

In addition, the lead press is characterized in that it further comprises an air bearing interposed between the moving block and the press block to enable the posture switching and fixing of the press block for press flatness correction.

In addition, the lead press is characterized in that it further comprises a load cell that is supported on the moving block side and bound to the press block side to detect the press pressure during lead pressurization.

In addition, the unloading picker is characterized in that it further comprises a vision unit for confirming the correct attachment state of the lead.

On the other hand, the auto lead attach / press device according to another embodiment of the present invention for achieving the above object is a boat inserted while being moved in the width direction by the on-loader and the transfer for the boat including a plurality of chips A loading picker for loading at least two pieces onto the seat block, and a lead picker for loading the lead on one side onto the chip on the seat block and integrally assembled therewith; And arranged side by side in the width direction, each seat block for seating the boat having the chip, and the lead placed on top of the transfer trajectory of the seat block, respectively, for pressing and attaching the lead placed on the chip on the seat block Seat the boat containing the two lead presses and the chip that has been moved in the width direction by the transfer and finished with the lids attached. Characterized in that it comprises a picker for the unloading cycle was unloaded from trucks, Offload for the discharge of the boat including the chip complete the lead attachment

In addition, the auto lead attach / press device according to another embodiment of the present invention for achieving the above object is an on-loader for the injection of the boat including a plurality of chips, and the boat is inserted while moving in the width direction by the transfer A loading picker for loading at least two pieces onto the seat block, a lead picker for integrally assembled with the lead picker for loading the lead on one side onto the chip on the seat block, and a longitudinally transportable chip along the seat block rail. A seat block for seating the boat, a lead press for attaching the lead placed on the chip on the seat block and placed on the chip on the seat block, and moved in the width direction by a transfer, Unloading picker for unloading the boat containing the finished chip from the seat block, And an offloader for discharging the boat containing the chip.

Hereinafter, an auto lead attach / press device according to various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view illustrating a layout of an auto lead attach / press device according to an embodiment of the present invention.

As shown in FIG. 1, the auto lead attach / press device is a semiconductor manufacturing equipment for automatically attaching a lead such as a stiffener, a heat spreader, and the like to an upper portion of a chip mounted on a boat. Each work area is sequentially formed, and an automated process of performing a lead attaching operation on a chip while continuously performing a boat stepwise to each work area thus formed is performed.

For example, it is possible to automatically carry out the entire process from the introduction of the boat with the first chip, the seating on the seat block, the supply of the lead, the press on the lead, and the discharge of the boat with the chip with the final lead attachment.

To this end, an onloader 10 for input of a boat having a plurality of chips and an offloader 19 for discharging a boat having a chip having a lead attached thereto are respectively disposed in the front region and the rear region of the equipment, respectively. The area between the onloader 10 and the offloader 19 may be used to load a boat onto the seat block 12 or to unload the boat from the seat block 12, supply a lead, or press against the lead. It is created as a work area in which work such as is performed.

On-loader 10 for the input of the boat can apply the structure and supply method commonly applied in the semiconductor manufacturing equipment.

For example, a plurality of magazines containing a plurality of boats mounted in a stacked structure are sequentially supplied from below by conveyor means, and the magazines at the boat loading position are stepped up and down by the pitch between the boats mounted by the elevator means. The empty magazine that provides all the boats can be applied from the top.

A pusher 23a and a pusher cylinder (not shown) for pushing each boat in the magazine one by one are arranged on one side of the onloader 10.

The pushers 23a are located side by side on the back of the boat in the magazine and push the boat to a certain position, for example to the area where the inlet rail 24 belongs, while entering the inside of the magazine during the forward and backward operation of the pusher cylinder. After returning to the function will be.

The pusher 23a may be pushed out of the magazine one by one while operating in association with the magazine which is lifted and operated in the onloader 10 one by one.

For example, when one boat is pulled out by one forward and backward operation of the pusher 23a, the magazine is lifted up and down by one step, and the boat at the position where the boat is continuously lifted is one time forward and backward operation of the pusher 23a. Pulled out by.

In this way, the forward and backward movements of the pusher 23a and the ascending and descending of the magazine are alternately repeated, so that all the boats in the magazine are sequentially exited.

The offloader 19 for final loading of the boat after the reed attachment is arranged at the end of the equipment (right side of the drawing) and consists of the same operating mechanism as the onloader 10.

The work area of the equipment is provided with an inlet rail 24 for initially placing a boat provided on the onloader 10 side, and a seat block 12 for seating two boats on both sides of the inlet rail 24. ) Are placed respectively.

At this time, each seat block 12 is installed in the form of being assembled on each seat block rail 15 is installed in a two-row structure side by side along the longitudinal direction of the equipment, so that each seat block 12 It is transported along the seat block rail 15 to which it belongs so that vision inspection or press work for each chip or lead can be performed.

Here, the seat block rail may be a one-axis robot, or the like, which is a normal moving means using a stator as a power source and a ball screw transmission as an operating source.

The loading picker 13 is responsible for seating the boat on the inlet rail 24 on the seat block 12.

The loading picker 13 is a dual picker, and moves the boat positioned on the inlet rail 24 while moving in the width direction from the top of the area to which the two seat blocks 12 arranged side by side in the width direction of the equipment. After clamping, two pieces are seated on the seat block 12.

The loading picker 13 includes conventional pick-up means such as grippers and the like that are commonly used when picking up strips and the like in semiconductor manufacturing equipment, and self-lifting means such as cylinders. Then, the boat is picked up and released by clamping four sides of the boat.

The movement of the loading picker 13 is made by the transfer 11a.

The transfer (11a) is located in front of the work area of the equipment and at the same time is installed in a shape that is arranged across the width direction while maintaining a constant height, the loading picker (13) in the front portion of the transfer (11a) is installed It is assembled to allow the movement of the loading picker according to the operation of the transfer.

At this time, the transfer can be applied to a conventional moving means, a single-axis robot, etc. using a step motor as a power source and a ball screw transmission as an operating source.

In addition, the loading picker 13 is equipped with a vision unit 20a including a vision camera or the like, so that the correct loading state of the chip on the seat block 12, for example, whether the chip is turned upside down, and the direction of the chip is properly Whether or not it is hit, as well as the amount of the adhesive applied to the chip and whether or not the application range is possible can be confirmed.

At this time, the value (image) captured by the vision unit 20a may be provided to the controller (not shown) of the equipment to be used as a control value for determining a defect of the product.

Here, the signal system between the vision unit and the control unit may be applied to the signal system of the vision system that is commonly employed in semiconductor manufacturing equipment.

In addition, one side of the loading picker 13 is integrally assembled with a lead picker 14 for loading a lead on the chip, and the lead picker 14 also has a loading picker during operation of the transfer 11a. While moving together integrally with (13), pick up leads such as stiffeners, heat spreaders, etc. provided by the lead supply unit 25 disposed on one side of the main work area, and then load them onto the chip on the seat block 12. To work.

At this time, the lead picker 14 can pick up and place the lead using a pickup means or a suction method such as a universal gripper similar to that employed by the loading picker 13.

Here, the lead supply unit 25 may include a method of supplying a lead using a magazine equipped with a plurality of leads.

In addition, the state of the lead, i.e. whether the lead is picked up or whether the picked up state is misaligned, is located on the movement track line of the lead picker 14 for loading the lead, for example, at the bottom of the front position of the inlet rail 24. The vision unit 20b for checking the state of the same lead is installed, and as it is possible to check the state of the lead before loading, it is possible to determine the accuracy of the lead loading operation.

On the other hand, a reject box 26a is installed on one side of the work area of the equipment, for example, on one side of the seat block 12 to collect leads determined as defective by the vision unit 20b. The lead can be collected.

In this case, the reject box 26a is located outside the lead tracker 14 on the movement track line and then moves up to the movement track line when the defective lead is collected. For this purpose, the reject box 26a is a cylinder means and a guide means. It includes.

The lead press 17, which substantially presses the lead, is placed across the top of the feed trajectory of each sheet block 12, i.e. across the seat block rail 15 arranged longitudinally of the equipment. It is installed in a form movable along the lead press rail 16 arranged in the width direction of the.

Accordingly, the lead press 17 can selectively perform a lead attachment operation to the chips on the sheet block 12 on both sides while traveling both sides along the lead press rail 16.

In addition, at a position behind the work area of the equipment, for example, adjacent to the offloader 19, another side-by-side arrangement with the transfer 11a for moving the loading picker 13 and the lead picker 14 is arranged side by side. The transfer 11b is provided, and the unloading picker 18 is assembled to the front part of the transfer 11b thus installed.

At this time, the unloading picker 18 is moved along the transfer 11b while having a predetermined movement trajectory, for example, a trajectory crossing the movement trajectory line of the two seat blocks 12 in the width direction to finish attaching the lead. Unloading the boat including the chip from the seat block 12.

That is, it picks up the boat on the seat block 12 and serves to release it on the outlet rail 27 on the discharge side of the equipment.

In addition, at this time, the unloading picker 18 is equipped with a vision unit 20c to check the correct attachment state of the lead, etc. In this case, the defective chip is provided on the side of the equipment work area by the boat with the reject box 26b. Are collected).

In addition, an outlet rail 27 is installed in a position adjacent to the offloader 19 between the work area discharge side of the equipment, for example, between two rows of seat block rails 15, whereby lead attachment and vision check are performed. When the boat including the finished chip is placed on the outlet rail 27 by the unloading picker 18, it can be sent to the offloader 19 by the pusher 23b and then mounted in the magazine.

2 is a perspective view illustrating a seat block in an auto lead attach / press device according to an embodiment of the present invention.

As shown in FIG. 2, the sheet block 12 is a portion supporting the chip during a press operation for attaching a lead, and includes a base plate 12a having a square plate shape and a plurality of rows arranged side by side on the base 12a. It consists of a plurality of chip seating portion (12b) arranged in two rows divided into four independent regions.

In particular, the chip seating portion 12b has a rectangular protruding surface higher than the base surface, so that the chip is placed thereon, and the protruding surface at this time is processed by precision machining to ensure flatness. The chip to be placed can also maintain accurate flatness.

In addition, each chip seat 12 is provided with a vacuum hole 12e, so that it is possible to fix and fix the chip, and a plurality of guides 12d are formed to protrude a predetermined height around the seat. It is possible to prevent the flow or departure of.

In particular, the sheet block 12 is provided with a flatness correction region 12c in a form of double speed in each row of chip seating portions. Surface is machined by precision machining to ensure flatness.

Accordingly, the lead press 17 performs the press operation after correcting the flatness through the flatness correction area 12c before the press for attaching the lead, so that the lead can be accurately pressed onto the chip.

That is, the chip seating portion and the flatness correction region secure almost the same level of flatness, so if the lead press is in the state of correcting the flatness on the basis of the flatness correction region, the chip placed on the chip seating portion and its The flatness of the pressure-adhesive work of the upper lid can also be expected.

3 is a front view illustrating a state in which a chip is set on a sheet block in an auto lead attach / press device according to an embodiment of the present invention.

As shown in FIG. 3, the boat 100 is a kind of carrier member on which a plurality of chips 110, for example, six chips are mounted, and the chips are mounted in such a manner that the edges of the chips are placed around the holes. Doing.

The boat 100 carrying a plurality of chips is placed on top of the seat block 12 in a state of being picked up by a loading picker and then placed on the seat block 12 by the picker lowering, where the boat is seated. The chip 12 placed on the base 12a surface of the block 12 is placed on the chip seating portion 12b surface higher than the base surface.

At this time, the height between the base 12a surface and the chip seating portion 12b surface is higher than the thickness of the boat 100, so that when the boat 100 is seated, the chip 110 is first placed on the chip seating portion 12b surface. It will fall off the side and continue to be placed further down the boat.

Therefore, the press work for attaching the lead is performed on the chip on the chip seating portion 12b made of a precise surface having flatness secured, so that the lead can be accurately attached to the chip.

4A and 4B are front views illustrating a state in which the flatness of the lead press is corrected in the auto lead attach / press device according to one embodiment of the present invention, and FIGS. 5A and 5B are auto according to one embodiment of the present invention. It is a front view which shows the operation state of a lead press in a lead attach / press apparatus.

Here, the structure of the lead press which substantially performs the press operation, the press process of attaching the lead to the upper part of the chip, and the process of correcting the flatness performed before that are shown.

First, the lead press 17 is a method of pressing using a screw electric force driven by a motor (not shown), and for this purpose, a screw 17a that rotates through a motor side and belt transmission and the like and a screw combination are interlocked with each other. And a moving block 17b movable up and down, and a press block 17c assembled to the lower end of the moving block 17b to directly press the lead.

The lead press 17 is installed on the lead press rail 16 which is installed using the support 28 and is disposed across the upper portion of the transfer trajectory of each sheet block 12, and the lead press rail 16 at this time It is possible to perform the lead attachment operation for the chip on the sheet block 12 on both sides while moving along both sides.

In particular, an air bearing 21 for press flatness correction is connected between the moving block 17b and the press block 17c of the lead press 17, and thus is supported by the air bearing 21. The press block 17c can be freely flowed before bearing operation.

That is, in the case of the press block 17c supported by the movable side 21b, which consists of the fixed side 21a and the movable side 21b which are combined so that the said air bearing 21 can flow together, it flows freely. Since it is possible to change the angle freely in any direction within the flow range of the air bearing, for example, it is possible to match the flatness of the press block, that is, the lead press, by using such operating characteristics.

Here, the air bearing 21 may be applied to a conventional one.

In addition, between the moving block 17b and the press block 17c of the lead press 17, a load cell 22 which is supported on the moving block 17b side and engaged with the press block 17c side is provided. At this time, the pressure value provided by the load cell 22 may be used as a control value related to the press operation of the lead press 17.

For example, it becomes possible to control such that the operating pressure of the lead press is adjusted according to the output control of the controller (not shown) which takes the pressure value provided from the load cell as an input value.

The variable control method of such a lead press can adopt a universal press variable control method.

As shown in FIGS. 4A and 4B, in the case of the lead press 17, the flatness of the lead press 17 may be corrected using the flatness correction region 12c in the sheet block 12 before the lead press operation.

Such flatness correction is performed individually for each sheet block 12. When two sheet blocks on both sides are arranged, the flatness correction is performed on the sheet block before the press operation for each sheet block.

That is, since one set of lead presses alternately presses the two sheet blocks on both sides of the sheet presser, the press work is performed after the flatness correction is performed again.

Even though the chip seat and flatness correction area in each sheet block are precisely processed by precision machining, there is no error between blocks such that the chip seat and flatness correction area in both sheet blocks cannot be processed under the same conditions. Since it may exist, it may be preferable in terms of allowing the flatness correction to be performed again each time during the press operation on the sheet block.

The flatness correction for the lead press 17 starts by activating the press and bringing the press block 17c into contact with the surface of the flatness correction region 12c in the sheet block 12.

For example, when the lead press 17 is operated and the bottom surface of the press block 17c is brought into contact with the surface of the flatness correction area 12c, the air bearing 21 at this time is in a pre-operation state, that is, freely movable. Since the press block 17c is in a state where the angle or the like is changed in accordance with the plane of the flatness correction area 12c, the press block 17c is in a state in which the press block 17c coincides with the plane of the flatness correction area 12c.

Subsequently, when the posture of the press block 17c is determined in this way, the air bearing 21 is operated at the same time (via air supply) to fix the predetermined posture of the press block at this time, so that the flatness of the press block 17c In other words, the flatness of the lead press 17 can be secured at the same level as the flatness of the flatness correction region 12c.

As shown in Figs. 5A and 5B, the attaching operation of the lead on the chip is performed in a state where the flatness of the lead press 17 is correctly adjusted.

When the sheet block 12 is moved one step after the flatness correction for the lead press, the moving block 17b is lowered by screw transmission with the operation of the lead press 17, and then the adhesive is pressed by the press block 17c. The lead on the chip including the press can be accurately attached.

At this time, in the case of the chip placed on the chip seating portion 12b, the flatness is secured, and the lead press 17 is also in a state of flatness correction. It becomes possible.

FIG. 6 is a plan view showing the layout of an auto lead attach / press device according to another embodiment of the present invention, wherein the lead press 17 is individually assigned to each seat block 12 to perform a press operation. Here is an example of how to do this

That is, an example of arranging fixed lead presses 17 on the transfer trajectory line of the sheet block 12 to perform a press operation on the chip on the sheet block 12 exclusively is shown.

In addition, since the press work is performed using a dedicated lead press each assigned to one sheet block, the flatness correction for the lead press is sufficient once.

7 is a plan view showing a layout of an auto lead attach / press device according to another embodiment of the present invention, in which one sheet block 12 and one lead press 17 corresponding thereto are attached. Shows an example of performing a press operation.

Therefore, the overall operation relationship of the auto lead attach / press device according to the present invention configured as described above will be described.

In the on-loader 10, the boat is continuously supplied in a state loaded in the magazine, and supply is made for each boat from the magazine located on the operation line of the pusher 23a.

The boats in the magazine are pushed by the pusher 23a and sent to the inlet rail 24 one by one. When the boats in the magazine are all pulled out by the repeated forward and backward movements of the pusher 23a, the magazine is raised and lowered. New magazines, including boats, will be refurbished to provide a continuous supply of boats.

The boat sent to the inlet rail 24 is picked up by the loading picker 13 waiting on its upper side and then seated on the seat block 12 arranged on either side.

At this time, the loading picker 13 picks up two boats one by one and seats two on the seat block 12 at a time. The chips on the seated boat are separated from the boat while the It is placed on the chip seat.

Subsequently, vision inspection is performed on the chips seated on the sheet block 12.

The vision inspection at this time is for checking the state of the chip, and is performed by the vision unit 20a in the loading picker 13, and the loading picker 13 is in a stopped state and the seat block 12 below it. The sheet block rail 15 is moved in the longitudinal direction by one step.

After the vision inspection is completed, the lead is supplied by the lead picker 14.

That is, the lead picker 14 reciprocates between the lead supply section 25 and the seat block 12 along the transfer 11a, picking up two leads (the leads at this time may be stiffeners or heat spreaders). Then, it is placed on top of the chip on the sheet block 12, the sheet block 12 is moved by one step accordingly.

Vision inspection of the state of the lead is performed by the vision unit 20b during the lead supply process.

The lead thus supplied is placed on top of the chip, ie, on the adhesive applied to the chip.

When the supply of the lead is completed as described above, the seat block 12 is moved by one step along the seat block rail 15, and the lead attaching operation is performed by the lead press 17 in the lead press work area.

That is, the lead press 17 first performs flatness correction, and then sequentially performs a press operation for pressurizing the lead.

In this case, two rows are simultaneously formed by two sets of lead presses.

The lead pressed by the lead press 17 can be accurately pressed onto the chip with the adhesive interposed therebetween.

As described above, while the press work for one seat block 12 is being performed, the other seat block 12 is mounted on the boat through the operation of the loading picker 13 and the lead picker 14. And so on.

That is, by operating the two seat blocks 12 in conjunction with each other, it is possible to effectively design the overall cycle time of the equipment in an optimal state.

After the press operation, the seat block 12 is transferred to an area adjacent to the offloader 19 side, where the boat on the seat block 12 is unloaded picker 18 together with vision inspection by the vision unit 20c. After being picked up by the pump, it is sent to the outlet rail 27 and finally loaded into the magazine in the offloader 19 by the operation of the pusher 23b.

Here, the method of operating in conjunction with the control of each actuator means of the equipment and the like can be adopted without particular limitation as long as it is a method commonly known in the art.

Thus, the boat supplied from the onloader is seated on the seat block by the picker means and then sent to the press work area to which the lead press belongs, where the press work for pressurizing the lead is performed and then continued by the picker means. As it is loaded on the off-loader side, one cycle of the lead attaching operation for each chip on the boat is completed, and this one cycle process is repeatedly performed in a continuous process, and the lead attaching process for the chip is made as a continuous automation process. will be.

As described above, the present invention provides a system for automatically performing a series of processes for attaching a lead for heat dissipation to an upper surface of a chip, thereby improving workability and productivity, thereby improving efficiency related to a lead attaching process. It can be effective.

In addition, by providing a means for attaching the lead in a state in which the flatness of the press having a processing error or assembly error is exactly set, there is an effect that the defect rate of the chip can be significantly reduced when the lead is attached.

Claims (9)

An onloader 10 for inputting a boat comprising a plurality of chips; A loading picker 13 and a lead on one side are loaded onto the chip on the seat block 12 to move the boat loaded from the onloader 10 onto the seat block 12 while being moved by the transfer 11a. A lead picker 14 for giving; A seat block 12 capable of being longitudinally transported along the seat block rail 15 and for seating a boat having chips; A lead press (17) disposed above the transport trajectory of the seat block (12) to press-fit the lead placed on the chip on the seat block (12); An unloading picker 18 for unloading the boat including the chip, which has been moved by the transfer 11b and finished attaching the lead, from the seat block 12; An offloader 19 for discharging a boat including a chip having a lead attached thereto; Auto lead attach / press device for semiconductor manufacturing equipment comprising a. 2. The auto lead attach of claim 1, wherein the sheet block 12 further includes a flatness correction region 12c serving as a reference plane for adjusting the flatness of the lead press 17. Press device. 2. The lid press 17 according to claim 1, wherein the lead press 17 is a screw 17a driven by a motor, a moving block 17b which is screwed to the screw 17a and movable up and down, and a press block 17c assembled at a lower end thereof. Auto lead attach / press device of a semiconductor manufacturing equipment, characterized in that formed in the form of pressurization using a screw transmission. The air bearing according to claim 1 or 3, wherein the lead press 17 is interposed between the moving block 17b and the press block 17c to enable the attitude change and fixation of the press block for press flatness correction. 21) The auto lead attach / press device for semiconductor manufacturing equipment further comprising. The method according to claim 1 or 3, wherein the lead press 17 further includes a load cell 22 which is supported on the moving block 17b side and bound to the press block 17c side to detect press pressure during lead pressurization. An auto lead attach / press device for semiconductor manufacturing equipment. The method according to claim 1, wherein the lead press 17 is moved along the lead press rail 16 disposed across the upper feed trajectory of each seat block 12 when the seat block is provided in two rows, each seat block 12 The auto lead attach / press device of a semiconductor manufacturing equipment, characterized by being able to press-fit the lead placed on the chip. The method according to claim 1, wherein the lead press 17 is arranged in the upper portion of the transport trajectory of each sheet block 12 when the seat block is provided in two rows can press the lead placed on the chip on the seat block 12 Auto lead attach / press device for semiconductor manufacturing equipment characterized in that. A base 12a for boat seating including a chip, and a plurality of chip seating portions 12b having a surface higher than the surface of the base 12a, and the chip seated with the chip spaced apart from the boat after boat loading on a seat block. A seat block of semiconductor manufacturing equipment, characterized by being able to be placed on a float. The seat block of claim 8, further comprising a flatness correction region (12c) formed on one side of the base (12a) and serving as a reference plane for matching the flatness of the lead press.

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