KR20070104791A - Electroless plating method by printing process and electroless plating articles the same - Google Patents

Electroless plating method by printing process and electroless plating articles the same Download PDF

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Publication number
KR20070104791A
KR20070104791A KR1020060036871A KR20060036871A KR20070104791A KR 20070104791 A KR20070104791 A KR 20070104791A KR 1020060036871 A KR1020060036871 A KR 1020060036871A KR 20060036871 A KR20060036871 A KR 20060036871A KR 20070104791 A KR20070104791 A KR 20070104791A
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South Korea
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electroless plating
base
pattern
printing
plating
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KR1020060036871A
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Korean (ko)
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성낙훈
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성낙훈
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Priority to KR1020060036871A priority Critical patent/KR20070104791A/en
Publication of KR20070104791A publication Critical patent/KR20070104791A/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)

Abstract

An electroless plating method by a printing method and an electroless plating article by the same are provided to form patterns of desired shapes on a base without an etching process by printing the patterns on the base surface and removing the pattern part. An inferior base surface is whole formed by a chemical method. Patterns are printed on the base surface through a base. The base having an inferior part and a printed pattern part is electroless-plated. The pattern part is removed by the printing method after the electroless plating process. A microcircuit is formed on the base with the necessary patterns.

Description

인쇄법에 의한 무전해 도금방법과 그 방법에 의한 무전해도금체{Electroless plating method by printing process and electroless plating articles the same}Electroless plating method by printing method and electroless plating body by the same method {Electroless plating method by printing process and electroless plating articles the same}

본원 발명은 무전해 도금방법에 대한 것이다. 무전해 도금은 전기를 사용하지 않고 화학반응을 통해 도금되는 방식이다. 도금이란 금속이온이 전자를 받아서 환원이 되어 특정표면에 달라붙는 것을 말한다. 도금은 정류기를 통해 나온 전기를 이용하여 도금하는 방식이 가장 많이 사용이 된다.The present invention relates to an electroless plating method. Electroless plating is a method of plating through a chemical reaction without using electricity. Plating means that metal ions receive electrons and are reduced to stick to a specific surface. Plating is most often used by plating with electricity from a rectifier.

일반적인 도금은 전도체에 전기를 통하여서 도금을 실행하나, 기판(substrate)에 전기를 줄 수 없는 경우, 즉 에폭시나 플라스틱 같은 물질에는 통전을 시킬 수가 없으므로 도금이 불가능하게 된다.In general, plating is performed through electricity to a conductor, but plating is impossible because electricity cannot be supplied to a substrate, that is, it cannot conduct electricity to a material such as epoxy or plastic.

이러한 경우에는 무전해 도금을 통하여 도금을 실시하게 되는 것이 일반적이다. 무전해 도금은 환원도금과 치환도금의 2가지 방법이 사용이 되어진다.In this case, plating is generally performed through electroless plating. For electroless plating, two methods are used, reducing plating and substitution plating.

베이스 상에 극히 미세한 회로를 제작하기 위하여서는 주로 베이스에 동박을 입히며, 상기 동박에 감광재를 도포한 후, 노광 및 현상 작업을 통하여 패턴을 형성하고, 이후 다시 에칭작업을 실시하여 결과적으로 남아 있는 부분을 원하는 미세 회로로 사용을 하는 것이 종래의 기술이었다.  In order to fabricate an extremely fine circuit on the base, the copper foil is mainly coated on the base, the photosensitive material is coated on the copper foil, and then a pattern is formed through exposure and development, and then etched again, thereby remaining. It has been a prior art to use a part as a desired fine circuit.

그러나 이러한 공정은 에칭을 하기 위한 복잡한 공정이 소요가 되어지며, 필요한 형태의 미세 회로를 형성하기 위하여 전체적으로 동박을 입힌 다음 필요없는 부분을 에칭법에 의하여 제거하는 공정을 택함으로서 재료의 낭비와 공정이 복잡할 수 밖에 없었다.However, such a process requires a complicated process for etching, and the process of waste of materials and processes is performed by applying copper foil as a whole to form a fine circuit of a required shape and then removing unnecessary parts by etching. It was complicated.

그러나 본 발명은 베이스 상에 동박을 전체적으로 입히는 공정을 생략하며 또한 에칭공정을 생략할 수가 있는 특징을 제공한다.However, the present invention provides a feature in which the step of coating the copper foil on the base as a whole is omitted and the etching step can be omitted.

본원 발명은 인쇄법에 의한 무전해 도금방법과 그 방법에 의한 무전해도금체에 대한 것이다. The present invention relates to an electroless plating method by a printing method and an electroless plating body by the method.

본 발명은 특히, 무전해 도금방법에 있어서, 베이스에 화학적 방법으로 베이스 표면을 전체적으로 조악하게 하는 표면조악공정과; 전체적으로 조악이 되어진 베이스 표면에 인쇄법에 의하여 패턴을 인쇄하는 패턴인쇄공정과; 상기 조악부와 인쇄되어진 패턴부를 가지는 베이스를 무전해 도금액을 통하여 무전해도금하는 무전해도금공정과; 상기의 무전해도금공정 이후에, 인쇄법에 의한 패턴부를 제거하는 패턴제거공정을 포함하는 것을 특징으로 한다.In particular, the present invention provides an electroless plating method, comprising: a surface roughening process for roughening a surface of a base as a whole by a chemical method on a base; A pattern printing step of printing a pattern on the surface of the coarse base as a whole by a printing method; An electroless plating process of electroless plating the base having the coarse portion and the printed pattern portion through an electroless plating solution; After the electroless plating step, a pattern removing step of removing the pattern portion by the printing method is characterized in that it comprises.

본원 발명은 상기의 무전해 도금방법에 의한 무전해도금체를 보호대상으로 한다. The present invention is intended to protect the electroless plated body by the electroless plating method described above.

본 발명을 상술하면 다음과 같다.The present invention is described in detail as follows.

전자분야에서 폴리에마이드 필름, PCB기판 등에 미세한 회로를 형성하는 경우에 종래에는 주로 에칭법을 사용하여 미세한 회로를 형성하여 왔다. In the case of forming a fine circuit in a polyimide film, a PCB substrate and the like in the electronic field, conventionally, a fine circuit has been mainly formed by using an etching method.

본 발명은 무전해도금방법을 사용하여 베이스 상에 미세회로를 직접적으로 바로 형성을 할 수가 있게 한다. The present invention makes it possible to directly form a microcircuit directly on the base using an electroless plating method.

미세회로를 얇은 폴리에마이드에 형성하는 방법으로 가장 대표적인 것으로는 에칭에 의한 방법이 있다. 이는 폴리에마이드 필름에 얇은 동박을 스파트링 방법에 의하여 붙인 후, 상기 동박에 감광재를 도포하고, 상기 감광재에 필름을 통한 노광 및 현상을 한다. 상기 노광 및 현상 작업 후에는 다시 에칭을 통하여 폴리에마이드에 붙어 있는 동박을 선택적으로 제거하여 필요한 회로부만 남기게 하는 것이다.As a method of forming a microcircuit on thin polyamide, the most representative method is an etching method. It attaches a thin copper foil to a polyamide film by the spattering method, apply | coats a photosensitive material to the said copper foil, and exposes and develops through a film to the said photosensitive material. After the exposure and development work, the copper foil adhering to the polyamide is selectively removed by etching to leave only necessary circuit parts.

본 발명은 이러한 복잡한 공정을 거치지 아니하며 베이스에 무전해도금을 통하여 필요한 미세회로만을 형성하게 한다.The present invention does not go through such a complicated process and allows only the necessary microcircuits to be formed through electroless plating on the base.

본 발명에서 베이스란 폴리에마이드 필름과 PCB기판 등의 무전해도금을 실시하여 패턴을 형성하고자 하는 대상물체를 의미하며 그 대상물은 얇든지 두껍던지 상관하지 않고 모든 것을 총칭하여 베이스라 칭한다.In the present invention, the base means an object to form a pattern by performing electroless plating such as a polyamide film and a PCB substrate, and the object is generically referred to as a base regardless of whether it is thin or thick.

또한 본 발명에서 패턴이란 다양한 형태의 미세한 회로 또는 문양을 의미한다. 또한 표현의 편리상 패턴 문양의 반대형상 역시 패턴이라는 용어로 사용한다.In the present invention, the pattern refers to various types of fine circuits or patterns. Also, for convenience of expression, the opposite shape of the pattern pattern is also used as the term pattern.

무전해도금을 실시하기 위하여 베이스에 화학적 조악작업을 실시한다. 조악베이스는 무전해도금이 가능한 상태가 되어진다. 베이스의 조악부는 무전해도금욕 조에 침지 또는 무전해도금액의 살포에 의하여 도금이 되어져, 필요로 하는 미세 회로부를 구성을 할 수가 있게 된다.Chemical coarsening is performed on the base for electroless plating. The coarse base is in a state capable of electroless plating. The coarse portion of the base is plated by being immersed in an electroless plating bath bath or sprayed with an electroless plating solution, so that the necessary fine circuit portion can be constituted.

본원 발명은 인쇄법에 의한 무전해 도금방법과 그 방법에 의한 무전해도금체에 관한것이다. The present invention relates to an electroless plating method by a printing method and an electroless plating body by the method.

본 발명은 먼저 베이스위에 화학적 방법으로 베이스 표면을 전체적으로 조악하게 하는 표면조악공정을 실시한다. The present invention first performs a surface roughening process to roughen the base surface as a whole by a chemical method on the base.

그 후 전체적으로 조악이 되어진 상기 베이스 표면에 인쇄법에 의하여 패턴을 인쇄하는 패턴인쇄공정을 거친다. 인쇄법의 실시예로서는 롤러등을 통하여 정교하며 미세하게 형성이 되어진 패턴의 문양을 상기 조악되어진 베이스의 상부에 인쇄를 하는 것을 들 수가 있다. 물론 인쇄 후 건조 등의 후속 작업을 통하여 인쇄되어진 패턴이 조악되어진 베이스에 확실하게 안착할 수가 있는 안정화 공정을 거침은 물론이다.Thereafter, a pattern printing process is performed to print a pattern on the surface of the base, which is generally coarse, by a printing method. As an example of the printing method, the printing of the pattern of the elaborate and finely formed pattern through a roller etc. is printed on the said rough base. Of course, through the subsequent work such as drying after printing, the printed pattern goes through a stabilization process that can be reliably seated on the coarse base.

본 발명에서 조악공정이란, 화학적 방법으로 표면을 가공하는 것으로서, 표면에 극히 미세한 크기로 무수한 요철을 형성시키는 것을 의미한다. 즉 조악공정이란 무전해도금액에서의 표면에 금속의 석출을 용이하게 하도록 하기위한 공정으로서, 석출핵의 형성을 도와주며 금속성분의 성장핵이 되는 역할을 하도록 하는 공정으로 정의한다.In the present invention, the coarse process is to process a surface by a chemical method, and means to form a myriad of irregularities on the surface with an extremely fine size. In other words, the coarse process is a process for facilitating the deposition of metal on the surface of the electroless solution, and is defined as a process to assist in the formation of precipitate nuclei and to serve as growth nuclei of metal components.

그 후, 상기 조악부와 인쇄되어진 패턴부를 가지는 베이스를 무전해 도금액을 통하여 무전해도금하는 무전해도금공정을 실시한다. 무전해 도금은 무전해액이 담긴 탱크에 침지를 하거나 또는 무전해액을 살포하여 도금을 실시할 수가 있다. 인쇄법에 의하여 인쇄가 되어진 베이스의 면에는 무전해도금이 시행이 되어지지 않는다.Thereafter, an electroless plating step of electroless plating the base having the coarse portion and the printed pattern portion through the electroless plating solution is performed. Electroless plating may be performed by immersing in a tank containing an electroless solution or by spraying an electroless solution. Electroless plating is not applied to the surface of the base printed by the printing method.

적당한 시간이 경과 한 후에는 무전해도금공정을 마친다.After a reasonable time, the electroless plating process is completed.

그 후, 상기의 무전해도금공정 이후에, 인쇄법에 의한 패턴부를 제거하는 패턴제거공정을 실시한다.Then, after said electroless plating process, the pattern removal process which removes the pattern part by a printing method is performed.

이러한 공정들을 통하여 상기 베이스에는 필요한 패턴의 형상으로 미세회로가 형성이 되어진다. Through these processes, a microcircuit is formed in the shape of a required pattern on the base.

본 발명에서의 베이스는 극히 평활한 표면을 가진 것이 주로 사용이 되어진다. 또한 상기의 공정설명에 있어서, 일반적으로 공지가 되어진 부분을 생략을 하였다. In the present invention, the base having an extremely smooth surface is mainly used. In addition, in the above process description, generally well-known part was abbreviate | omitted.

본 발명에서 조악공정은 베이스에 화학적 처리방법으로서 민감화용액과 활성화 용액에 침지시키어 석출핵의 형성을 돕우며 성장핵이 되도록 하는 과정을 의미한다. In the present invention, the coarse process refers to a process of immersing in a sensitizing solution and an activating solution as a chemical treatment method on a base to help the formation of precipitate nuclei and to become a growth nucleus.

일반적으로 무전해도금을 위하여, 베이스 표면에 묻어 있는 이물질을 깨끗히 제거하고 건조시키는 과정을 거친 후, 민감화용액(Sensitizing용액), 활성화용액, 도금용액의 순으로 진행을 한다.In general, for electroless plating, after removing the foreign matter on the surface of the base to clean the process of drying and then proceed to the sensitizing solution (Sensitizing solution), activating solution, plating solution in this order.

민감화용액은 베이스의 도금막의 얼룩을 없애주고, 석출핵의 형성을 도와주는 역할을 하며 이의 실시예로서는 염화제1주석의 산성용액이나 염화제1티탄의 산성용액 등 다양한 종류가 있다.The sensitizing solution serves to remove stains of the plated film of the base and to assist in the formation of precipitate nuclei. Examples of the sensitizing solution include acidic solutions of stannous chloride and acidic solutions of titanium chloride.

활성화용액은 도금하고자 하는 금속성분의 성장핵이 되고 도금반응의 촉매역 할을 한다. 활성화 용액은 주로 팔라듐, 은, 금의 염류용액이 이용된다.The activation solution becomes a growth nucleus of the metal component to be plated and serves as a catalyst for the plating reaction. The activation solution is mainly a salt solution of palladium, silver and gold.

도금액은 금속용액과 환원제액을 적당히 배합하여 사용하고 도금금속으로는 금, 은, 동, 코발트, 니켈 등이 이용된다.The plating solution is used by appropriately mixing a metal solution and a reducing agent solution, and gold, silver, copper, cobalt, nickel and the like are used as the plating metal.

무전해 도금이란 화학도금 또는 자기촉매도금이라고 한다. Electroless plating is referred to as chemical plating or self-catalyst plating.

수용액 내의 포름알데히드나 하이드리진 같은 환원제가, 금속이온이 금속분자로 환원되도록 전자를 공급하는데, 이 반응은 촉매표면에서 일어난다. 가장 상용화 되어진 도금제는 구리, 니켈-인, 니켈-보론 합금 등이 있다. Reducing agents such as formaldehyde and hydrazine in aqueous solutions supply electrons to reduce metal ions to metal molecules, which occur on the surface of the catalyst. The most commonly used plating agents include copper, nickel-phosphorus and nickel-boron alloys.

무전해 도금은 전기도금에 비해 도금층이 치밀하고 대략 25미크론 정도의 균일한 두께를 가진다.Electroless plating is more dense and has a uniform thickness of approximately 25 microns compared to electroplating.

베이스 상에 스파트링 방법으로 얇은 동박을 형성한 후, 상기 동박에 감광재를 도포하고, 상기 감광재에 필름을 통한 노광 및 현상을 하고, 상기 노광 및 현상 작업 후에는 다시 에칭을 통하여 베이스 상에 원하는 패턴을 형성하는 것에 비하여, 본 발명은 공정자체가 간단할 뿐만 아니라 제작 코스트가 현격하게 줄어든다.After forming a thin copper foil on the base by a spattering method, a photosensitive material is applied to the copper foil, and the photosensitive material is exposed and developed through a film, and after the exposure and developing operations, the etching is performed on the base again. Compared with forming a desired pattern, the present invention not only makes the process itself simple, but also significantly reduces the manufacturing cost.

무전해도금은 도금의 안정성이 뛰어나며 전기도금에 비하여 작업을 간단하면서도 효율적으로 수행을 할 수가 있는 장점이 있다. 본 발명은 베이스 위에 원하는 형태의 패턴을 에칭의 과정이 없이 바로 무전해도금으로 형성을 할 수가 있는 장점을 제공한다.Electroless plating has the advantage of excellent plating stability and can perform a simple and efficient operation compared to electroplating. The present invention provides the advantage of being able to form a desired pattern on the base by electroless plating directly without etching.

Claims (2)

무전해 도금방법에 있어서,In the electroless plating method, 베이스에 화학적 방법으로 베이스 표면을 전체적으로 조악하게 하는 표면조악공정과;A surface coarsening process for roughening the base surface as a whole by a chemical method on the base; 전체적으로 조악이 되어진 베이스 표면에 인쇄법에 의하여 패턴을 인쇄하는 패턴인쇄공정과;A pattern printing step of printing a pattern on the surface of the coarse base as a whole by a printing method; 상기 조악부와 인쇄되어진 패턴부를 가지는 베이스를 무전해 도금액을 통하여 무전해도금하는 무전해도금공정과;An electroless plating process of electroless plating the base having the coarse portion and the printed pattern portion through an electroless plating solution; 상기의 무전해도금공정 이후에, 인쇄법에 의한 패턴부를 제거하는 패턴제거공정을; A pattern removing step of removing the pattern portion by the printing method after the electroless plating step; 포함하는 것을 특징으로 하는 무전해도금방법.Electroless plating method comprising a. 베이스에 화학적 방법으로 베이스 표면을 전체적으로 조악하게 하는 표면조악공정과;A surface coarsening process for roughening the base surface as a whole by a chemical method on the base; 전체적으로 조악이 되어진 베이스 표면에 인쇄법에 의하여 패턴을 인쇄하는 패턴인쇄공정과;A pattern printing step of printing a pattern on the surface of the coarse base as a whole by a printing method; 상기 조악부와 인쇄되어진 패턴부를 가지는 베이스를 무전해 도금액을 통하여 무전해도금하는 무전해도금공정과;An electroless plating process of electroless plating the base having the coarse portion and the printed pattern portion through an electroless plating solution; 상기의 무전해도금공정 이후에, 인쇄법에 의한 패턴부를 제거하는 패턴제거공정을을 포함하는 무전해도금방법으로 제작되어진 것을 특징으로 하는 무전해도금체.An electroless plating body produced after the electroless plating step by an electroless plating method including a pattern removing step of removing a pattern portion by a printing method.
KR1020060036871A 2006-04-24 2006-04-24 Electroless plating method by printing process and electroless plating articles the same KR20070104791A (en)

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