KR20070102089A - Light emitting device module and manufacturing method thereof - Google Patents

Abstract

An LED(Light Emitting Diode) module and its manufacturing method are provided to enhance the efficiency of an emitted light by reducing the thickness and prevent the generation of a total internal reflection of the emitted light using a transparent optical film with a plurality of convexo concavities. An LED module includes a substrate, a light emitting element, and a transparent optical film. The substrate(110) has a predetermined structure capable of defining a light path. The light emitting element is applied to the light path structure of the substrate. The transparent optical film(130) is formed on the light path of the substrate to prevent the generation of a total internal reflection. The transparent optical film has a plurality of convexo-concave type structures(135).

Description

LIGHT EMITTING DEVICE MODULE AND MANUFACTURING METHOD THEREOF

1 is a perspective view and a cross-sectional view showing a structure of a general light emitting diode module.

2 is a cross-sectional view of a light receiving device showing an example in which a general micro lens sheet is applied.

Figure 3 is a perspective view showing the structure of a light emitting diode module unit according to an embodiment of the present invention.

4 is a cut perspective view of the structure of FIG. 3;

5 is a cross-sectional view of FIG. 3.

Figure 6 is an exploded perspective view showing a manufacturing process of an embodiment of the present invention.

Figure 7 is a block diagram showing the structure of a micro lens sheet of an embodiment of the present invention.

8 is a conceptual diagram showing a manufacturing process of another embodiment of the present invention.

9 is an electron micrograph showing a microlens of an embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

100: LED lower module 110: substrate

111: mirror layer 120: LED element

121: adhesive layer 125: filler

130: transparent optical film 135: microlens

140: opposing transparent optical film 150: silicon wafer

155: unit light emitting device module

The present invention relates to a light emitting device module and a method of manufacturing the same, and more particularly, to a light emitting device module including an optical structure to increase the luminous efficiency.

As various light sources are developed, various types of light emitting devices are used in real life, and most commonly, from light bulbs that emit light through a filament in a vacuum, to light emitting diodes that produce high luminance emission light of various colors with small power. Light emitting devices have been used in various areas.

Among these, light emitting diodes (hereinafter, referred to as LEDs) are basically semiconductor PN junction diodes, and various materials and structures have been studied to commercialize high-brightness LEDs at various wavelengths. It is rapidly replacing other kinds of light emitting means with high efficiency and long life.

In particular, LEDs can be driven at low voltage, have a wide wide-angle, and can be mass-produced in a thin form, thereby broadening their application areas to various types of light emitting means, display panels, as well as traffic lights, general lighting, and camera flashes.

Among various applications using these LEDs, the camera flash, which is increasing in demand, is one of the applications requiring the highest light efficiency. In general, the flash of the camera requires instantaneous light output of high luminance, and therefore must operate at a limited power to be suitable for portable devices, and thus higher light output efficiency for a limited input power is required. In addition, in the case of a camera flash, the scattering light emission characteristic emitted in all directions of the light emitting diode is concentrated in the emission angle range so that the emission angle area to be illuminated is concentrated in the field of view angle of the camera lens, thereby increasing the brightness of the illumination area. Since it is preferable to construct an LED module in which optical means for converging the light is used, it is used as a camera flash element.

FIG. 1 is an exploded perspective view and a cross-sectional view of a typical LED module which is generally used as a camera flash device. As shown in FIG. 1, a substrate is formed by removing a portion of a single LED device 20 to form a cavity. And a dome-shaped convex lens 30 corresponding to the light emitting area of the LED element 20 is further attached to the lower surface of the cavity area of the 10). The cavity in which the LED device 20 is formed has an inclination, and a metal mirror layer for reflecting side light to the front may be further formed on the inner surface of the cavity. Since the structure of the electrode wiring to be formed under the LED element 20 is self-explanatory, it is omitted.

In the above structure, the domed convex lens 30 is bonded to the optical axis of the LED element 20, and bonded to each other, it is necessary to form a constant height (H) in order to increase the light condensing characteristics. Since the thickness H of the domed convex lens 30 is generally greater than or equal to the thickness of the substrate 10, the thickness of the entire LED module is increased, thereby minimizing the size of the device. In addition, the manufacturing yield is lowered because the dome-shaped convex lens 30 must be aligned with the correct optical axis when manufacturing each LED module.

An object of the embodiment of the present invention as compared to the prior art as described above is to place a light emitting device inside the optical path structure formed on the silicon sub-mount, and at least two or more uneven structures on the upper front of the transparent optical sheet The present invention provides a light emitting device module and a method of manufacturing the same, which reduce the thickness increase and suppress total internal reflection of emitted light to increase the efficiency of emitted light.

An object of another embodiment of the present invention is to arrange a plurality of transparent hemispherical micro-lenses on a transparent optical film to suppress the total internal reflection of the LED formed at the bottom so that all the emitted light is emitted to the front, thereby improving the efficiency of the emitted light It is to provide a light emitting device module.

Another object of the present invention is to form a cavity having an inclined side surface on the substrate, to form a reflective layer on the inclined surface and to place one or more light emitting elements therein to fill the cavity with a refractive index matching filler. In addition, by providing a plurality of micro lens array sheet on the upper portion, to provide a light emitting device module capable of emitting the front light and side light of the light emitting device to the full front.

It is another object of the present invention to provide a light emitting device module which suppresses total internal reflection as much as possible by arranging an optical sheet including a micro semicircular lens arranged in a hexagonal closest structure on an upper part of an LED lower module.

An object of another embodiment of the present invention is to form a cavity in a substrate, place an LED therein, and then fill the cavity with a filler to match the refractive index, wherein the filler is mixed with a phosphorescent material to shift the emission wavelength of the LED. Or by stacking in a separate phosphorescent layer, to provide a high-efficiency light emitting device module that can easily set the desired color.

An object of another embodiment of the present invention is to apply a microlens array sheet formed on the LED lower module by applying two or more two-dimensional semi-circular micro-lens formed in the radiation region of the LED module so that the height and radius of the lens are the same, It is to provide a light emitting device module that maximizes emission efficiency.

It is an object of another embodiment of the present invention to provide a microlens optical sheet having two-dimensional array of semicircular microlenses smaller than the size of an LED element on a transparent optical film, and bonding it to the front surface of a module substrate structure before cutting in which the LEDs are placed inside. Or after bonding, by cutting to each unit module unit defined in the module substrate structure, to provide a light emitting device module manufacturing method that can mass-produce a high-efficiency light emitting diode module of low thickness without a separate alignment.

In order to achieve the above object, a light emitting device module according to an embodiment of the present invention includes a substrate having a structure defining an optical path; A light emitting device applied to the optical path structure of the substrate; It includes a transparent optical film formed on the optical path of the substrate is formed with a plurality of uneven structure for suppressing total internal reflection.

According to another aspect of the present invention, there is provided a light emitting device module, including: a substrate having a cavity formed in a partial region; A light emitting element disposed inside the cavity of the substrate; The light emitting device includes a transparent micro lens array sheet formed on an upper part of the cavity in which two or more micro lens structures are disposed in two dimensions with respect to the cavity area.

In addition, the method of manufacturing a light emitting device module according to the present invention comprises the steps of forming an optical path structure on the substrate; Disposing a light emitting device inside the light path structure on the substrate; Bonding or bonding the transparent optical sheets on which the plurality of transparent concave-convex structures having a size smaller than or equal to the light emitting surface of the light emitting element are formed on the light path structure on which the light emitting element is formed without alignment.

When described in detail with reference to the accompanying drawings and embodiments of the present invention as follows.

Figure 2 is a cross-sectional view showing an example of applying a conventional micro lens array sheet for explaining the characteristics of the micro lens array sheet applied to an embodiment of the present invention, Figures 3 to 5 is the light emission formed through the embodiment of the present invention A perspective view, a cut perspective view, and a cross-sectional view of the device module are shown.

First, the structure of the light emitting device module according to an embodiment of the present invention shown in Figures 3 to 5 shows a separate structure of a single module, a plurality of the front surface of the light emitting device lower module 100, the light emitting device 120 is formed It will be appreciated that the transparent optical film 130 in which the micro lenses 135 are densely arranged is applied. That is, the present embodiment is characterized in that at least two or more two-dimensional micro lenses having a size smaller than the light emitting surface of the light emitting device on the light emitting surface of the single light emitting device module, thereby reducing the height of the device and the efficiency of the light emitted in full To improve.

The structure is such that the microlens 135 shown, that is, the transparent optical film 130 having the transparent concave-convex structure is formed on the light emitting surface to suppress total internal reflection of the light emitted by the light emitting device by the concave-convex structure, It is a light emitting device module structure to which an optical means for increasing efficiency is added.

Thus, an optical module employing a conventional microlens array sheet in contrast to an embodiment of the present invention in which a plurality of transparent uneven structures microlenses 135 are disposed on a path of light emitted from the light emitting device 120 is shown in FIG. 2. Is shown.

The optical module 40 to which the conventional microlens array sheet 60 shown in FIG. 2 is applied is an image sensor (CCD or photodiode, etc.) that is a light receiving element. It is configured to obtain a large amount of light while preventing the boundary light receiving distortion within a limited light receiving time, although it uses a microlens array sheet 60 that appears to be a microlensed arrangement of the light receiving element, It is as if the structure in which the dome-shaped lens 60 is arranged one by one is reduced and arranged. That is, since the size of the sensor is small, only the microlens array sheet 60 is applied, and the structure is the same as that of the light emitting diode module having the single dome lens shown in FIG. In this structure, since the size of the microlenses is configured to correspond to the size of the light receiving unit cell area, precise alignment with respect to the optical axis is required, which is a light to which a transparent optical film similar to the present invention shown in FIGS. 3 to 5 is applied. Although it looks like an element module, it is noted that the technical idea itself is different from the present application.

Now, a light emitting device module constructed according to an exemplary embodiment of the present invention illustrated in FIGS. 4 and 5 will be described with reference to specific examples.

4 and 5 is composed of a light emitting element lower module and an optical film. First, a cavity having an inclination, which is a kind of light path structure, is formed on the surface of the silicon or ceramic substrate 110, and an LED element 120, which is a kind of light emitting element, is disposed therein. Configure In this case, the substrate having the optical path structure may be referred to as a submount. Here, an electrode for supplying power to the LED device 120 may be formed in the cavity lower region of the substrate 110 on which the LED device 120 is to be disposed. The structure associated with such an electrode is configured to configure the LED element 120 as a front emission type and to connect a pair of electrodes exposed on the upper part by wire bonding, or to configure the LED element 120 as a vertical structure and the lower electrode. Is connected to the electrode provided on the substrate 110 and the upper electrode may be different depending on the application method of the LED device 120, such as to be connected to the outside by wire bonding, as shown in the transparent microlens 135 Since the transparent optical film 130 is disposed on the light path will be formed above the LED element 120 is a back-emitting type and configured to enable flip chip bonding, accordingly, the electrode is also disposed inside the light path It is desirable to configure so as to extend to the outside.

The cavity formed on the substrate 110 should naturally have a lower area than the LED device 120 to be mounted. And, the depth is preferably configured to be deeper than the height of the LED element 120. The LED element 120 and the substrate 110 (or an electrode (not shown) formed on the substrate 110) are bonded by the adhesive layer 121, which is preferably conductive. Note that in some cases, more than one light emitting device may be disposed in the cavity area.

Since the LED device 120 exemplified as the light emitting device emits light to front and rear and side surfaces, the cavity region may be configured to have an inclined side surface in order to concentrate the emitted light in the formed optical path direction. The reflective layer 111 may be further formed to reflect light on the inclined side surface and the cavity lower surface. When the reflective layer 111 is made of metal, the electrodes for providing external power to the LED device 120 may be collectively formed through one patterning process after forming the same material.

The LED device 120 mounted on the light path structure (cavity) having the reflective layer 111 provides most of the emitted light to the front side, but a part of the light emitted from the LED device 120 exits the device. The difference in refractive index with the air, which is the outer space, does not escape the flat surface. That is, the scattered light component that emits light above a critical angle between two mediums having a large refractive index difference is not emitted to the outside and is lost due to total internal reflection, thereby reducing light emission efficiency.

Accordingly, in order to solve this problem, in the present embodiment, the transparent optical film 130 having the microlens 135 having a size smaller than the light emitting area of the light emitting device 120 as described above is used to prevent total internal reflection. In this case, the height h of the microlens 135 at this time is several to several tens of micrometers, and its width is several to several hundreds of micrometers.

The transparent optical film 130 and the LED device 120 to effectively apply the transparent optical film 130 on the light path of the light emitting device 120 to suppress the total internal reflection of the light emitting device 120 In order to prevent refraction in the spaced apart area, the light path between the region, that is, the LED element 120 and the transparent optical film 130, is filled with the filler 125 for refractive index matching so that light is not directly emitted into the air. Do not However, when the LED element 120 applied to the optical path structure is in direct contact with the transparent optical film 130 at the light emitting surface, the filler 125 if the optical path of the LED element 120 is limited in the front direction. ) May be omitted, but when the side light is generated, it is preferable to apply the filler 125. The filler 125 may be a transparent resin such as epoxy or a transparent dielectric.

Therefore, the light emitted from the LED device 120 by the filler 125 reaches the transparent optical film 130 without difference in refractive index, and the micro lens 135 formed on the transparent optical film 130 When the light is emitted while being refracted through the air having a large difference in refractive index, the critical angle is large enough to reach total internal reflection, thereby increasing the emission efficiency. Therefore, the microstructures formed on the transparent optical film 130 do not necessarily have the shape of the microlens 135, and may have various polygonal structures. For example, even if a polyhedral structure that can be defined as a triangular polycone, a polygonal pyramid structure, a topped portion in a polygonal pyramid structure, or a polyhedral structure having a cube or more than a hexahedron having a different upper and lower area is applied. Since the total internal reflection can be slightly reduced, efficiency improvement can be expected, and the emission efficiency can be increased even if the size is not uniform. However, in order to maximize the efficiency and provide the light collecting effect, it is preferable to form the micro lens having a shape close to an ellipse.

In general, when a single light emitting device is used, it is difficult for the light emitting device to emit white light by itself, and in order to provide light of a desired color as required, it is necessary to have various kinds of light emitting devices designed to provide a wavelength of a desired emission light. Therefore, this can be achieved through the transition of the light wavelength through the phosphorescent material. Therefore, when the phosphorescent material is mixed with the filler 125, the emitted light wavelength can be easily shifted, and various output colors can be determined. Alternatively, the phosphorescent material may be applied between the filler 125 and the transparent optical film 130 in the form of a thin film, or may be formed under the transparent optical film 130. In some cases, a thin film including a phosphorescent material may be formed between the light emitting device 120 and the filler 125.

For example, when a single light emitting device that outputs blue light is disposed on an optical path and filled with a filler including phosphorescent material, output light close to white light may be generated by wavelength transition, and other high brightness light emitting devices may be applied. By further applying a phosphorescent material, it is possible to form a high-brightness light emitting device module transitioned to a desired color. In addition, in order to obtain white light, a plurality of light emitting devices having wavelengths of blue, green, and red may be disposed on the optical path, and when the size of the module is large, a plurality of light emitting devices having the same wavelength may be disposed. Embodiments of the present invention are not limited to the type or arrangement of light emitting elements.

FIG. 6 is an exploded perspective view illustrating a simple assembly process of the light emitting device module illustrated in FIGS. 3 to 5. As illustrated, the transparent optical film 130 having the microlens 135 array formed on the light emitting device lower module 100 is illustrated. ) Shows the process of forming through bonding or laminating. The microlens 135 formed on the transparent optical film 130 has a smaller size than the light emitting surface of the light emitting device 120 disposed on the lower optical path, and two or more two-dimensional images on a single optical path are two-dimensional. These two-dimensional arrays can be arranged as simple orthogonal arrays, rhombus arrays, hexagonal arrays, etc. In particular, when formed into hexagonal closely packed, the bottom surface is a hemispherical shape with a hexagon of uniform size. It is possible to form micro lens structures without gaps between lenses, which is called having a full-fill factor. A fixing adhesive used for bonding or bonding the transparent optical film 130 to the lower module 100 of the light emitting device is a transparent optical adhesive (for example, epoxy, etc.) having the same or similar refractive index as that of the filler 125. Resin) can be used.

7A to 7C are perspective views, plan views, and side views of the microlens structure. In this case, the semi-circular microlens 135 having a uniform size has a hexagonal dense structure at a lower surface thereof. As shown in FIG. 2, the compact structure without gaps can be confirmed. Since the amount of emitted light of the light emitting device totally internally reflected by the gapless, compact two-dimensional array is reduced to the maximum efficiency, the structure becomes a two-dimensional arrangement structure that can effectively increase the emission light efficiency. In this case, the microlens 135 and the transparent optical film 130 may be made of the same material.

Even in this case, a difference in actual light collecting performance or light efficiency occurs depending on the height of each microlens 135. In theory, the height h of the best spherical microlens 135 is equal to the width of the microlens 135. When viewed in half (d / 2), that is, in a plan view, the maximum emission efficiency can be obtained when the radius of each lens is reached. In addition, although the lower surface has a polygonal structure as shown, when the upper protrusion is formed in a spherical shape, the reflection angle of the emitted light is focused on the front direction, so that the emitted light gathers to the front to increase the amount of light for the front region. You can do it. However, it is not necessary to perform separate alignment with the light emitting element to be formed at the bottom for focusing such light.

That is, when constituting several to several dozen micro lenses or irregularities of various shapes on the light emitting surface on a single optical path, the wide-angle alignment of each lens or protrusions becomes practically meaningless. Since the transparent optical film 130 having the uneven portion is formed to be larger than the area of the light emitting device lower module 100, and then it is arbitrarily cut and bonded or bonded to the top surface of the light emitting device lower module 100. There is no need for the alignment process, it is advantageous in the manufacture and application of the transparent optical film 130.

This may be applied as a manufacturing process of the method shown in FIG. 8, wherein FIG. 8 illustrates a case where a silicon substrate is used as the substrate 110 for forming the light emitting device lower module 100. After forming a structure such as an electrode or a reflective film including a plurality of optical paths on the light emitting device is disposed, and a large transparent optical film 140 having a concave-convex structure corresponding to the size of the silicon wafer 150 is formed thereon at the top ) Is a unit consisting of a unit transparent optical film 130 and a unit light emitting element lower module 100 cut at an arbitrary position by bonding or bonding) at a time, and cutting the entire structure to the size of each individual module (aka dicing). The light emitting device module 155 can be manufactured in large quantities. Even in this case, alignment according to the wide angle of the large transparent optical film 140 and the silicon wafer 150 is not required, and only simple position alignment is required.

9 is a micrograph of the transparent optical film in which the microlenses are arranged in the closest dense form, and the thickness of the transparent optical film including the microlenses is suitably about several to several tens of micrometers, and the maximum thickness is not greater than 100 micrometers. It is possible to provide a light emitting device module that can suppress the thickness of the light emitting device module to the thickness of the substrate while increasing the amount of light and adjusting the emission angle of the light. In addition, in some cases, the light emission color can be adjusted by mixing the phosphorescent material, so that the utility is high.

As described above, the light emitting device module and the method of manufacturing the same according to the exemplary embodiment of the present invention may include a light emitting device disposed in an optical path structure formed on a silicon sub-mount, and at least two uneven structures on the front surface thereof may be two-dimensionally arranged. By forming the transparent optical sheet, it is possible to suppress the total internal reflection of the emitted light while reducing the thickness increase, thereby increasing the efficiency of the emitted light.

The light emitting device module according to the embodiment of the present invention emits light by emitting all emitted light to the front surface by suppressing total internal reflection of a light emitting device such as an LED formed at the bottom by arranging a plurality of transparent hemispherical micro lenses on a transparent optical film. There is an effect to increase the efficiency of the light and to concentrate the emission angle of the light to the front.

The light emitting device module according to an embodiment of the present invention forms a cavity having an inclined side surface on the substrate, forms a reflective layer on the inclined surface, and then arranges one or more LED elements therein to fill the cavity with a refractive index matching filler. By filling and having a plurality of micro lens array sheet on the top, there is an effect that the front light and side light of the LED can be emitted to the front as possible without total internal reflection.

The light emitting device module according to the embodiment of the present invention has an effect of suppressing total internal reflection and adjusting the light converging region by disposing the optical sheet constituting the micro semicircular lens in the hexagonal dense structure on the upper part of the LED lower module.

A light emitting device module and a method of manufacturing the same according to an embodiment of the present invention form an optical path on a substrate, and place an LED therein, and then fill the cavity with a filler to match the refractive index, wherein the filler has an emission wavelength of the LED. By mixing the phosphorescent material that transitions or by laminating in a separate phosphorescent layer, there is an effect that can easily provide a high-efficiency light emitting device module that can easily set the desired color.

The method of manufacturing a light emitting device module according to an embodiment of the present invention provides a microlens optical sheet having two-dimensional arrays of semicircular microlenses smaller than the size of an LED element on a transparent optical film, and a module substrate structure before cutting in which the LEDs are disposed. After bonding or bonding to the front surface, by cutting each unit module unit defined in the module substrate structure, there is an effect that can mass-produce a low-efficiency high-efficiency light emitting diode module with low cost and high yield without a separate alignment.

Claims (33)

A substrate having a structure defining an optical path; A light emitting device applied to the optical path structure of the substrate; And a transparent optical film formed on the optical path of the substrate, the transparent optical film having a plurality of concavo-convex structures for suppressing total internal reflection. The light emitting device of claim 1, wherein the transparent optical film having the concave-convex structure has two or more concave-convex structures having a size smaller than a light emitting area of the light emitting device in the optical path region of the substrate. Device module. The light emitting device module according to claim 1, wherein the height of the protrusion of the uneven structure formed on the transparent optical film is 100 µm or less. The light emitting device module according to claim 1, wherein the uneven structure formed on the transparent optical film is a semi-circular micro lens structure. The light emitting device module according to claim 1, wherein the uneven structure formed on the transparent optical film is a polyhedron structure of any shape that can be configured based on a triangle. The light emitting device module according to claim 1, wherein the uneven structure formed on the transparent optical film is two-dimensionally arranged in a shape including an orthogonal array, a rhombus array, and a hexagonal closest array. The light emitting device module according to claim 1, wherein the uneven structure formed in the transparent optical film is disposed so as to have a full filling rate so that there is no gap area between the protrusions. The light emitting device module according to claim 1, wherein the uneven structure formed in the transparent optical film has the same height as that of the protrusion and the radius of the protrusion. The light emitting device module according to claim 1, further comprising a filler filling the space between the light emitting device formed on the optical path structure of the substrate and the transparent optical film to match the refractive index. 10. The light emitting device module according to claim 9, wherein the filler is made of a transparent resin material, and a phosphorescent material for shifting the light wavelength of the light emitting device is mixed. 10. The light emitting device module according to claim 9, wherein a thin film layer of phosphor is further formed between the filler and the light emitting device or between the filler and the transparent optical film to shift the light wavelength of the light emitting device. The light emitting device module of claim 1, wherein the light path structure formed on the substrate is a cavity having an inclined side surface having a depth greater than or equal to the thickness of the light emitting device and a lower area than the area of the light emitting device. The light emitting device module of claim 12, further comprising a reflective layer formed on an inner surface of the cavity including the inclined surface of the cavity having the inclined side surface. The light emitting device module of claim 1, wherein the light emitting device is at least one light emitting diode. A substrate having a cavity formed in a portion of the region; A light emitting element disposed inside the cavity of the substrate; And a transparent micro lens array sheet formed on the cavity in which the light emitting element is formed, and having two or more micro lens structures two-dimensionally disposed with respect to the cavity region. The light emitting device module of claim 15, wherein the light emitting device is one or more light emitting diodes of one or more colors. The method of claim 15, wherein the transparent micro-lens array sheet is a semi-circular micro-lens having a diameter less than the light emitting area of the light emitting device while being arranged in a rectangular, rhombus, or hexagonal dense structure on the transparent optical film and the transparent optical film Light emitting device module, characterized in that made. 16. The light emitting device module according to claim 15, wherein the microlens structure two-dimensionally disposed on the transparent microlens array sheet is arranged to have a full filling rate without a gap area between adjacent microlenses. The light emitting device module according to claim 15, wherein the protruding height of the microlens structure two-dimensionally disposed on the transparent microlens array sheet is 100 µm or less. 16. The light emitting device module according to claim 15, wherein the protruding height of the semi-circular microlens two-dimensionally arranged on the transparent microlens array sheet coincides with a radius of the microlens. 16. The light emitting device module according to claim 15, wherein the size of the semicircular microlens two-dimensionally arranged on the transparent microlens array sheet is uniform. The light emitting device module of claim 15, wherein the cavity in which the light emitting device is formed is filled with a filler for matching the refractive index. 23. The light emitting device module according to claim 22, wherein the filler is made of a transparent resin material, and a phosphorescent material for shifting the light wavelength of the light emitting device is mixed. The light emitting device module according to claim 15, further comprising a phosphor thin film layer for shifting the light wavelength of the light emitting device under the transparent micro lens array sheet. The light emitting device module of claim 15, wherein the cavity formed on the substrate has an inclined side, and a reflective layer is further formed on a portion of the inclined side and the lower surface. Forming a lightpath structure on the substrate; Disposing a light emitting device inside the light path structure on the substrate; Light-emitting device comprising the step of bonding or bonding a transparent optical sheet having a plurality of transparent concave-convex structures having a size less than the light emitting surface of the light-emitting device on the light path structure on which the light-emitting device is formed without alignment; Module manufacturing method. The method of claim 26, wherein the step of bonding or bonding the transparent optical sheet without alignment, And cutting or bonding any region of the transparent optical sheet to the size of the unit substrate, and then bonding or bonding the region to the light emitting region of the substrate on which the optical path is formed. The method of claim 26, wherein the step of bonding or bonding the transparent optical sheet without alignment, A method of manufacturing a light emitting device module, the method comprising: bonding or bonding the transparent optical sheet to a front surface of a substrate on which a plurality of light path structures on which the light emitting devices are disposed are formed, and cutting the light guide structures into unit substrates based on the light path structures. Way. 27. The method of claim 26, wherein forming an optical path structure on the substrate comprises: Etching away the upper portion of the substrate to form a cavity having an inclined side; Forming a reflective film on the entire surface of the cavity. 27. The method of claim 26, wherein disposing a light emitting device inside the light path structure on the substrate, Disposing one or more light emitting elements; And filling a light path structure in which the light emitting device is disposed with a filler for refractive index matching. The method of claim 30, wherein filling the optical path structure with filler for refractive index matching, And filling the optical path structure with the mixture after mixing a phosphorescent material and a filler for shifting the wavelength of emitted light of the light emitting device. The method of claim 30, wherein bonding or bonding the transparent optical sheet to the light path structure on which the light emitting device is formed is performed. And fixing the transparent optical sheet on the optical path structure by using a resin having the same refractive index as the filler. The method of claim 26, wherein the bonding or bonding of the transparent optical sheet on the light path structure on which the light emitting device is formed, And forming a thin film of phosphorescent material for shifting the wavelength of emitted light of the light emitting device between the transparent optical sheet and an upper portion of the light path structure.

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