KR20070096160A - Substrate detecting apparatus - Google Patents

Substrate detecting apparatus Download PDF

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KR20070096160A
KR20070096160A KR1020060025526A KR20060025526A KR20070096160A KR 20070096160 A KR20070096160 A KR 20070096160A KR 1020060025526 A KR1020060025526 A KR 1020060025526A KR 20060025526 A KR20060025526 A KR 20060025526A KR 20070096160 A KR20070096160 A KR 20070096160A
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South Korea
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substrate
light
chamber
shielding member
light receiving
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KR1020060025526A
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Korean (ko)
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KR100782058B1 (en
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노태우
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브룩스오토메이션아시아(주)
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A substrate detecting apparatus of a vacuum processing chamber is provided to minimize errors through an opaque shielding member to sense indirectly a transparent substrate. A substrate detecting apparatus includes a light emitting unit(31) and a light receiving unit(32). The light emitting unit and the light receiving unit are installed at a lateral part of the chamber. The substrate detecting apparatus further includes a light shielding member. The light shielding member is positioned between the light emitting unit and the light receiving unit in order to shield the light in a loading state of the substrate. The light shielding member is rotatably coupled with a fixing part fixed to the chamber. An elevating direction of one end of the light shielding member is opposite to that of the other end of the light shielding member.

Description

진공처리용 챔버의 기판 검출장치{SUBSTRATE DETECTING APPARATUS}Substrate detection device of vacuum processing chamber {SUBSTRATE DETECTING APPARATUS}

도 1은 종래 진공처리용 챔버의 구조를 나타내는 개략도이다. 1 is a schematic view showing the structure of a conventional vacuum processing chamber.

도 2는 본 발명에 의한 진공처리용 챔버의 구조를 나타내는 개략도이다. 2 is a schematic view showing the structure of a vacuum processing chamber according to the present invention.

도 3은 본 발명에 따른 다른 실시예를 나타낸 것이다. 3 shows another embodiment according to the present invention.

도 4 및 도 5는 본 발명에 따른 또 다른 실시예의 구성 및 사용상태를 나타낸 것이다. 4 and 5 show the configuration and use of another embodiment according to the present invention.

**도면의 주요부분에 대한 부호의 설명**** Description of the symbols for the main parts of the drawings **

1: 로드락 챔버 10: 본체 1: load lock chamber 10: main body

11: 고정부 20: 덮개11: fixing part 20: cover

31: 발광부 32: 수광부 31: light emitting portion 32: light receiving portion

31a, 32a: 배선 40: 차폐부재 31a, 32a: wiring 40: shielding member

본 발명은 진공처리용 챔버의 기판 검출장치에 관한 것으로서, 보다 상세하게는 챔버 내부의 기판 로딩상태를 정확히 검출할 수 있는 기판 검출장치에 관한 것이다.The present invention relates to a substrate detection apparatus of a chamber for vacuum treatment, and more particularly, to a substrate detection apparatus capable of accurately detecting a substrate loading state in a chamber.

최근 정보 통신 기술의 비약적인 발전과 시장의 팽창에 따라 디스플레이 소자로 평판표시소자(Flat Panel Display)가 각광받고 있다. 이러한 평판표시소자로는 액정 표시소자(Liquid Crystal Display), 플라즈마 디스플레이 소자(Plasma Display Panel), 유기 발광 소자(Organic Light Emitting Diodes) 등이 대표적이다. Recently, with the rapid development of information and communication technology and the expansion of the market, flat panel displays have been in the spotlight as display devices. Such flat panel displays include liquid crystal displays, plasma display panels, organic light emitting diodes, and the like.

이 중에서 액정표시소자를 제조하기 위하여는 유리 기판상에 유전체 물질 등을 박막으로 증착하는 증착공정, 감광성 물질을 사용하여 이들 박막 중 선택된 영역을 노출 또는 은폐시키는 포토리소그라피 (Photolithography)공정, 선택된 영역의 박막을 제거하여 목적하는 대로 패터닝(Patterning)하는 식각공정, 잔류물을 제거하기 위한 세정공정 등을 수차례 반복하여야 하는데, 이들 각 공정은 해당 공정을 위해 최적의 환경이 조성된 챔버 내부에서 진행된다.Among them, in order to manufacture a liquid crystal display device, a deposition process for depositing a dielectric material or the like on a glass substrate as a thin film, a photolithography process for exposing or hiding selected areas of the thin films using a photosensitive material, The etching process of removing the thin film and patterning it as desired is repeated several times. Each process is performed in a chamber having an optimal environment for the process. .

기판의 진공처리를 위하여 로드락 챔버, 이송챔버 및 공정챔버들이 요구되는데, 이러한 챔버들의 배열형태에 따라 인라인 타입 또는 클러스터 타입으로 분류된다. Loadlock chambers, transfer chambers and process chambers are required for vacuuming the substrate, which is classified as an inline type or a cluster type according to the arrangement of these chambers.

도 1을 참조하여 종래의 로드락 챔버(1)의 구조를 설명한다. 로드락 챔버(1)는 측벽과 하판으로 구성되는 본체(110)와 덮개(120,Lid)로 구성되어, 공정 진행에 따라 기판(S)이 반입 및 반출된다. 또한, 기판(S)의 로딩여부를 검출하는 검출장치 가 구비된다. The structure of the conventional load lock chamber 1 will be described with reference to FIG. 1. The load lock chamber 1 is composed of a main body 110 composed of sidewalls and a bottom plate and a lid 120, and the substrate S is carried in and out as the process proceeds. In addition, a detection device for detecting whether the substrate (S) is loaded is provided.

상기 검출장치는 수광부(132)와 발광부(131)로 구성되는 수발광센서로 이루어지며, 각각 상기 챔버(1)의 덮개(120)와, 하판에 설치된다. 기판(S)의 검출방법은 수광부(132)에서 검출된 광의 세기에 따라 기판(S)의 로딩상태를 확인한다. 예를 들어, 기판(S)이 로딩되면 수광부(132)에서는 광이 검출되지 아니하고, 반대로 기판(S)이 언로딩되면 수광부(132)에서 광이 검출되는 것이다. The detection device includes a light receiving sensor including a light receiving unit 132 and a light emitting unit 131, and is installed on a cover 120 and a lower plate of the chamber 1, respectively. The detection method of the substrate S checks the loading state of the substrate S according to the intensity of the light detected by the light receiving unit 132. For example, when the substrate S is loaded, the light is not detected by the light receiving unit 132. On the contrary, when the substrate S is unloaded, light is detected by the light receiving unit 132.

그러나 로드락 챔버(1)를 포함한 진공처리용 챔버는 정기적, 비정기적으로 유지 보수를 하여야 하며, 그 방법은 덮개(Lid)를 크레인으로 들어 올려 개방한 후, 작업을 수행하는 것이다. However, the vacuum chamber including the load lock chamber 1 should be maintained regularly and irregularly, the method is to lift the lid (Lid) by lifting the crane, then to perform the work.

따라서 위와 같이 수발광센서가 챔버의 덮개(120)와 하판에 설치되어 있으면, 덮개(120)를 들어 올리기에 앞서 선행작업으로 수발광센서에 연결되어 있는 배선(131a,132a)들을 먼저 제거해야 하는 문제점이 있었다. Therefore, if the light emitting sensor is installed on the cover 120 and the lower plate of the chamber as described above, prior to lifting the cover 120, the wires 131a and 132a connected to the light emitting sensor should be removed first. There was a problem.

더 큰 문제는 검출대상인 기판이 투명체인 유리재질이라는 것에 있다. 즉, 투명체를 감지하는 것은 불투명체에 비하여 매우 난해한 공정이고, 검출오차도 크고, 또한 매우 고가이다. The bigger problem is that the substrate to be detected is a glass material which is a transparent body. That is, sensing the transparent body is a very difficult process compared to the opaque body, the detection error is large, and is very expensive.

또한 챔버에 진동이 발생하면, 상기 센서가 유동하게 되는데, 이러한 센서의 유동은 바로 검출오차를 크게 하는 문제점이 있다. In addition, when the vibration occurs in the chamber, the sensor flows, there is a problem that the flow of such a sensor immediately increases the detection error.

본 발명은 상술한 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목 적은 챔버의 측부에 설치되어 챔버의 유지 보수가 매우 편리하고, 또한 불투명체인 차폐부재를 이용하여 투명체인 기판을 간접적으로 감지함으로써, 오차를 최소화할 수 있는 진공처리용 챔버의 기판 검출장치를 제공함에 있다. The present invention has been made to solve the above-mentioned problems, the object of the present invention is installed on the side of the chamber is very convenient to maintain the chamber, and also by indirectly detecting the transparent substrate using a shield member which is an opaque body In addition, the present invention provides a substrate detection apparatus of a vacuum processing chamber that can minimize errors.

위와 같은 기술적 과제를 해결하기 위하여 본 발명에 의한 진공처리장치의 기판 검출센서는 상기 기판 검출장치는 발광부와 수광부를 포함하여 이루어지되, 특히 상기 발광부와 수광부는 상기 진공처리장치의 측부에 설치된다. In order to solve the above technical problem, the substrate detection sensor of the vacuum processing apparatus according to the present invention includes the light emitting unit and the light receiving unit. do.

또한 상기 기판 검출장치는 상기 발광부와 수광부 사이에 위치하여 상기 기판이 로딩되면 그 일단은 하강하고, 타단은 상승함으로써 광을 차단하는 불투명재질의 차폐부재가 더 구비되는 것이 바람직하다. In addition, the substrate detecting device is located between the light emitting portion and the light receiving portion, when the substrate is loaded, one end thereof is lowered, the other end is preferably further provided with an opaque shielding member for blocking light.

이 때, 상기 차폐부재는 상기 진공처리장치에 고정형성된 고정부에 회동가능하게 결합되어 일단부가 승강하면 타단부는 반대로 승강하도록 구성할 수 있다. At this time, the shielding member may be rotatably coupled to a fixed part fixedly formed in the vacuum processing apparatus so that when one end is lifted, the other end is lifted in reverse.

이하, 첨부된 도면을 참조하여 본 발명의 구성 및 작용을 구체적으로 설명한다. Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the present invention.

도 2를 참조하면, 본 발명에 따른 기판 검출장치는 수광부(32)와 발광부(31)를 포함하여 이루어지는 수발광센서이고, 상기 수광부(32)와 발광부(31)는 각각 로드락 챔버(1)의 본체(10), 구체적으로는 측벽의 대응위치에 설치된다. 이 경우, 수광부(32) 또는 발광부(31)가 덮개(20)에 설치되지 아니하기 때문에, 챔버(1) 의 유지 보수를 위해 덮개(20)를 들어 올리는 경우에도 선행작업으로 배선(31a,32a)들을 미리 제거할 필요가 없는 것이다. Referring to FIG. 2, the apparatus for detecting a substrate according to the present invention is a light receiving sensor including a light receiving unit 32 and a light emitting unit 31, and the light receiving unit 32 and the light emitting unit 31 are each a load lock chamber ( The main body 10 of 1), specifically, is provided in the corresponding position of a side wall. In this case, since the light receiving portion 32 or the light emitting portion 31 is not installed in the lid 20, even when the lid 20 is lifted for the maintenance of the chamber 1, the wiring 31a, 32a) there is no need to remove them beforehand.

도 3을 참조하면, 수광부(32)와 발광부(31)가 챔버(1)의 측벽에 설치되되, 수평선상에 설치되지 아니하고, 기판(S)을 사이에 두고 경사를 갖도록 설치된다. 이와 같이 설치함으로써 도 2에 도시된 실시예보다 센싱 정밀도를 향상시킬 수 있다. 본 실시예에서 기판(S)을 검출하는 방법을 설명하면, 기판(S)이 챔버(1) 내에서 언로딩되면, 수광부(32)에는 강한 광이 검출된다. 반대로 기판(S)이 챔버(1) 내로 로딩되면, 발광부(31)에서 조사된 광은 기판(S)에 의해 반사 또는 굴절되기 때문에 수광부(32)에 의해 검출되는 광의 세기는 약하다. 이와 같은 특성에 의해 기판의 로딩여부를 감지할 수 있는 것이다. Referring to FIG. 3, the light receiving unit 32 and the light emitting unit 31 are installed on the sidewall of the chamber 1, but not on the horizontal line, but are inclined with the substrate S interposed therebetween. In this way, the sensing accuracy can be improved compared to the embodiment shown in FIG. In the present embodiment, a method of detecting the substrate S is described. When the substrate S is unloaded in the chamber 1, strong light is detected by the light receiving unit 32. On the contrary, when the substrate S is loaded into the chamber 1, since the light irradiated from the light emitting part 31 is reflected or refracted by the substrate S, the intensity of the light detected by the light receiving part 32 is weak. By such a characteristic it is possible to detect whether the substrate is loaded.

도 4를 참조하면, 수광부(32)와 발광부(31)가 챔버(1)의 측벽에 수평선상 또는 기판을 사이에 두고 소정의 경사를 두고 설치된다는 것은 앞선 실시예와 동일하다. 다만, 검사 정밀성 향상을 위하여 차폐부재(40)가 더 부가되어 있는 것을 알 수 있다. Referring to FIG. 4, the light receiving unit 32 and the light emitting unit 31 are installed on the sidewall of the chamber 1 on a horizontal line or at a predetermined inclination with the substrate interposed therebetween. However, it can be seen that the shielding member 40 is further added to improve inspection precision.

상기 차폐부재(40)는 대략 'ㄷ'형상으로 절곡된 판상의 플레이트이며, 금속등의 불투명재질로 형성된다. 상기 차폐부재(40)는 챔버(1)의 하부 등에 고정 형성된 고정부(11)에 회동가능하도록 힌지결합된 축부(42)와, 상기 축부(42)를 중심으로 일단에는 기판(S)에 의해 가압되는 가압부(41)와, 타단에는 광을 차단하는 차폐부(43)로 구성된다. 상기 가압부(41)와 차폐부(43)는 상기 축부(42)를 중심으로 서로 반대로 승강하는 운동을 한다. The shielding member 40 is a plate-shaped plate bent in an approximately 'c' shape, and is formed of an opaque material such as metal. The shielding member 40 has a shaft portion 42 hinged to be rotatable to a fixed portion 11 fixed to a lower portion of the chamber 1, and a substrate S at one end about the shaft portion 42. It is composed of a pressing portion 41 to be pressed, and a shielding portion 43 for blocking light at the other end. The pressing part 41 and the shielding part 43 move upward and downward with respect to the shaft part 42.

도 5 및 6을 참조하여 본 실시예의 작용을 설명한다. 기판(S)의 언로딩 상태에서는 도 5와 같이 수광부(32)에서는 강한 광이 검출된다. 5 and 6 will be described the operation of this embodiment. In the unloading state of the substrate S, strong light is detected in the light receiving portion 32 as shown in FIG. 5.

그러나 기판(S)이 로딩되면 도 6과 같이, 기판(S)이 차폐부재(40)의 일단인 가압부(41)를 가압하게 되고, 상기 가압부(41)는 기판(S)의 무게에 의해 하강하게 된다. 이와 동시에 고정부(11)에 힌지결합된 축부(42)를 중심으로 차폐부재(40)의 타단인 차폐부(43)는 상승하게 된다. 따라서 발광부(31)에서 조사된 광은 상기 차폐부(43)에 의해 차단되어 수광부(32)에는 약한 광이 검출되는 것이며, 이와 같은 방법으로 기판(S)의 로딩여부를 판별하는 것이다. 다시 기판(S)이 언로딩되면, 상기 가압부(41)는 상승하고, 반대로 상기 차폐부(43)는 하강한다. However, when the substrate S is loaded, as shown in FIG. 6, the substrate S presses the pressing portion 41, which is one end of the shielding member 40, and the pressing portion 41 is applied to the weight of the substrate S. FIG. Descend by At the same time, the shielding portion 43, which is the other end of the shielding member 40, is raised about the shaft portion 42 hinged to the fixing portion 11. Therefore, the light irradiated from the light emitting part 31 is blocked by the shielding part 43 so that weak light is detected in the light receiving part 32. In this way, the loading of the substrate S is determined. When the substrate S is again unloaded, the pressing part 41 is raised, and the shielding part 43 is lowered.

이와 같은 동작을 반복할 수 있도록 상기 차폐부재(40)에는 기판(S)이 언로딩되면 가압부(41)는 상승하고, 차폐부(43)는 하강하도록 하는 탄성체(미도시)가 구비되는 것이 더욱 바람직하다. The shielding member 40 is provided with an elastic body (not shown) to raise the pressing portion 41 when the substrate (S) is unloaded so that the operation can be repeated, the shielding portion 43 is lowered. More preferred.

물론 상기 차폐부재(40)는 다양한 형태로 수정 및 변형이 가능한 것이다. 예를 들어, 가압부(41)와 차폐부(43)가 절곡형성되지 아니하고 선형으로 형성될 수도 있는 것이다. Of course, the shield member 40 can be modified and modified in various forms. For example, the pressing part 41 and the shielding part 43 may be formed linearly without being bent.

본 발명에 따르면 기판 검출장치가 챔버의 측부에 형성되기 때문에, 챔버의 유지 보수가 매우 편리하다. According to the present invention, since the substrate detecting device is formed on the side of the chamber, the maintenance of the chamber is very convenient.

더욱이, 불투명 기구물인 차폐부재를 이용하여 간접적으로 감지하기 때문에 검출오차가 현저히 줄어드는 효과가 있다. Moreover, the detection error is remarkably reduced because it is indirectly sensed using a shield member that is an opaque device.

또한 챔버의 진동에 의하여 센서가 유동하더라도 상기 차폐부재를 충분히 크게 함으로써, 진동에 의한 오차를 방지할 수 있다. In addition, even if the sensor flows due to the vibration of the chamber, by sufficiently increasing the shielding member, it is possible to prevent the error due to the vibration.

Claims (3)

진공처리용 챔버의 기판 검출장치에 있어서,In the substrate detection apparatus of the vacuum processing chamber, 상기 기판 검출장치는 발광부와 수광부를 포함하여 이루어지되, 상기 발광부와 수광부는 상기 챔버의 측부에 설치되는 것을 특징으로 하는 기판 검출센서. The substrate detecting apparatus includes a light emitting unit and a light receiving unit, wherein the light emitting unit and the light receiving unit are installed at the side of the chamber. 제 1 항에 있어서,The method of claim 1, 상기 발광부와 수광부 사이에 위치하여 상기 기판이 로딩되면 광을 차단하는 차폐부재가 더 구비되는 것을 특징으로 하는 기판 검출장치. And a shielding member positioned between the light emitting portion and the light receiving portion to block light when the substrate is loaded. 제 2 항에 있어서,The method of claim 2, 상기 차폐부재는,The shield member, 상기 챔버에 고정형성된 고정부에 회동가능하게 결합되어 일단부가 승강하면 타단부는 반대로 승강하는 것을 특징으로 하는 기판 검출장치. And rotatably coupled to a fixed portion fixed to the chamber so that when one end is lifted, the other end is lifted in reverse.
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KR101036297B1 (en) * 2009-04-01 2011-05-23 포아텍 주식회사 Arrival apparatus for wafer
KR20170100481A (en) * 2014-12-26 2017-09-04 액셀리스 테크놀러지스, 인크. Wafer clamp detection based on vibration or acoustic characteristic analysis

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JPH09289240A (en) * 1996-04-22 1997-11-04 Sony Corp Particle measuring device
KR20010036248A (en) * 1999-10-07 2001-05-07 윤종용 Wafer Slip Detection System of A Apparatus for Manufacturing Semiconductor
KR100387525B1 (en) * 2001-02-05 2003-06-18 삼성전자주식회사 system for detecting position of semiconductor wafer and method of detecting wafer position
KR20040059883A (en) * 2002-12-30 2004-07-06 동부전자 주식회사 Bake oven

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101036297B1 (en) * 2009-04-01 2011-05-23 포아텍 주식회사 Arrival apparatus for wafer
KR20170100481A (en) * 2014-12-26 2017-09-04 액셀리스 테크놀러지스, 인크. Wafer clamp detection based on vibration or acoustic characteristic analysis

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