KR20070077568A - Manufacturing process of electronic paper display device and electronic paper display device using the same - Google Patents

Abstract

A method of manufacturing an electronic paper display device and an electronic paper display device using the same are provided to prevent an adhesive material from spreading by accurately applying an adhesive material on an upper surface of a partition using a fine groove of a mold. A lower electrode is formed on a lower substrate(1) and an upper electrode is formed under an upper substrate. A plurality of partitions(4) for forming a pixel region are formed on the lower electrode. A mold(5) is prepared. The mold includes a groove smaller than a width of an upper surface of the partition. An adhesive material(7) is disposed in the groove. Particles(8) for displaying an image are injected into the pixel region formed by the partitions. The adhesive material disposed in the mold is put onto the upper surfaces of the partitions. The upper substrate including the upper electrode is attached to the upper surfaces of the partitions with the adhesive material put thereon.

Description

Manufacturing method of electronic paper display device and electronic paper display device using same {Manufacturing Process of Electronic Paper Display Device and Electronic Paper Display Device Using The Same}

1 is a perspective view showing a cell structure of a microcapsule type electronic paper display device according to the prior art,

2 is a perspective view illustrating a cell structure of a dry electronic paper display device according to the prior art;

3A and 3B are cross-sectional schematic diagrams illustrating the step of bonding the substrate and the partition wall of the electronic paper display device according to the prior art;

4 and 5 is a schematic diagram showing a manufacturing step of the substrate and the partition wall of the electronic paper display device in one embodiment according to the present invention,

Figure 6 is a schematic diagram showing the step of preparing a mold (mold) with an adhesive material in an embodiment according to the present invention,

7 to 9 are schematic views showing the step of bonding the substrate and the partition wall using the adhesive material provided in the mold according to an embodiment of the present invention.

** Brief description of the main parts of the drawing **

1: lower substrate 2: lower electrode

3: lower insulation layer 4: partition wall

5: mold 6: groove

7: adhesive material 8: particle

9: upper board

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic paper display device, and more particularly, to a method for bonding a substrate and a partition wall of an electronic paper. More specifically, the groove having a smaller size than the width of the plurality of partition walls, and the adhesive material provided in the mold is buried in the upper surface of the plurality of partition walls by using a mold in which the adhesive material is provided. It is characterized by consisting of; step including.

BACKGROUND ART Conventionally, an electronic paper device using an electrophoretic method, an electrochromic method, a thermal method, a two-color particle rotation method and the like has been proposed as an image display device replacing a liquid crystal (LCD). Such an electronic paper device is considered to be a technology that can be used in the next generation of inexpensive image display devices because of the advantages of having a wider viewing angle closer to a normal printed matter, smaller power consumption, and a memory function than LCDs. Development into terminal image displays, electronic papers, and the like is expected.

In particular, in recent years, electrophoresis-type electronic paper has been proposed, which encapsulates a dispersion liquid composed of dispersed particles and a colored solution and arranges them between opposing substrates. The display incorporates a unique concept of electrophoretic ink encapsulated in the technology. As shown in FIG. 1, the capsule-type electronic paper prepares transparent microcapsules contained in a dielectric fluid in which black fine particles 40 and white fine particles 30 have a color, and then mixed with a binder 50 to form a substrate ( Positioned between the upper and lower transparent electrodes 20 inscribed in 10) and applying a positive voltage, the negatively charged ink fine particles move to the surface to display the color of the fine particles. In addition, when a negative voltage is applied, the ink particles move downward to see the color of the fluid. In this way, the characters or images are displayed.

However, in the electrophoresis method, since the particles move in the liquid, there is a problem that the response speed is slow due to the viscosity resistance of the liquid. In addition, since the high specific gravity particles such as titanium oxide are dispersed in the low specific gravity solution, they tend to settle, are difficult to maintain the stability of the dispersed state, and suffer from the lack of image repeat stability. Even in the case of microencapsulation, the cell size is set to the microcapsule level so that the above-mentioned defects are not easily seen in appearance.

In the electrophoretic method using the behavior in such a solution, two or more kinds of particles having different colors and charging characteristics are enclosed between at least one transparent substrate without using a solution in recent years, and either one of the substrates or Electronic paper has been proposed to impart an electric field to the particles from an electrode pair formed of both electrodes, and to move the particles by coulomb force to display an image. The operation mechanism of such a dry electronic paper display device is to insert a mixture of two kinds of particles having different colors and charge polarities into an electrode disc, and apply a voltage to the electrode disc to generate an electric field between the pole discs to generate a polarity. It is used as a display element by making different charged particles fly in a different direction. These are dry display devices that consist of particles and substrates and utilize particle behavior in gas, and solve problems such as sedimentation and flocculation of particles, which have been a problem in electrophoresis because no solution is used. This has the advantage of being small and fast in response.

The cell structure of the dry electronic paper display device is shown in FIG. 2 and briefly described as follows. As shown, the structure is formed of upper and lower substrates 160 and 110 formed of plastic or glass, and transparent electrodes ITO to apply driving voltages of devices on the upper and lower substrates 160 and 110. The upper and lower electrodes 170 and 120, the partition wall 130 separating the cell from the cell, the black positive charged particles 140 and the white negative charged particles existing between the two electrodes. It consists of 150.

In the electronic paper display device having the above structure, when sufficient voltage is applied to the upper electrode 170 and the lower electrode 120, charged particles 130 and 140 charged according to the applied electrode polarity are attracted to each electrode. . For example, when-voltage is applied to the lower electrode 120 and + voltage is applied to the upper electrode 170, the black charged particles 140 positively charged by the coulomb force move toward the lower substrate 110. The charged white charged particles 150 move toward the upper substrate 160. Since the white charged particles 150 are located on the upper substrate 160 side, the white charged particles 150 appear to be white when viewed from the outside. On the contrary, when + voltage is applied to the lower electrode 120 and-voltage is applied to the upper electrode 170, the charged white charged particles 150 move toward the lower substrate 110, and the positively charged black charged particles ( 140 moves toward the upper substrate 160 to be displayed in black. Therefore, after applying a voltage so that all the cells appear white at first, only the desired cell is applied with the opposite voltage so that the cells appear black.

In such a dry electronic paper display device, the barrier rib 130 vertically connected to the opposing substrates 110 and 160 to prevent the charged particles 140 and 150 from moving in the parallel direction of the substrates 110 and 160. The display device is a flexible display device in which a display unit of the display device is formed by a plurality of display cells divided by the partition wall 130.

The partition wall 130 separates the pixel from the pixel, and serves to maintain a constant gap between the upper plate and the lower plate. In addition, in the flexible display apparatus, the partition wall 130 stacked between the upper and lower plates not only has to serve as a support for maintaining a constant space between the upper and lower plates, but may be bent in a flexible device that is particularly flexible. Even in this case, the partition wall 130 should be bonded to the upper plate and the lower plate without falling off. Otherwise, when the shape of the display device is deformed and bent, the partition 130 is frequently lifted apart from the upper substrate 160 and the lower substrate 110. This results in a decrease in the overall quality of the display device. The charged particles 140 and 150 disposed in the pixel spaces are moved to the cell spaces of different cautions, resulting in unstable image quality and inferior pixels. As a result, the defects of the product itself increase. Therefore, especially in the flexible display device that needs to be flexibly bent, the partition wall 130 should be well attached to the upper and lower plates.

3A and 3B are cross-sectional schematic diagrams illustrating the step of bonding the substrate and the partition wall of the electronic paper display device according to the related art. FIG. 3A illustrates a method of bonding the substrate and the barrier 130 to each other after applying an adhesive material to the top surface of the barrier 130, and FIG. 3B illustrates a method of bonding the adhesive material to the entire surface of the substrate. As shown here, the adhesive material 180 is applied to the upper surface of the partition 130 formed on the lower substrate 110 or the front surface of the upper substrate by using a roller, and the upper substrate 160 is laminated, and then the upper substrate 160 is formed. By irradiating UV light from above), the barrier rib 130 and the upper substrate 160 are bonded by the adhesive material 180.

However, in this bonding method, as shown in the circles of FIGS. 3A and 3B, the liquid adhesive material 180 spreads widely and spreads to the pixel space, and this phenomenon affects particle driving and image quality of the screen display part. Go crazy. Particles adhere to the adhesive material spread between the partition wall 130 and the upper substrate 160 or affect the state of charge of the particles 140 and 150 to make the driving of the particles 140 and 150 unstable. . This is because there is a technical problem that it is quite difficult to accurately apply the adhesive material 180 to the upper surface of the barrier rib 130 having a narrow area in a sufficient amount.

For this reason, in the method of manufacturing an electronic paper display device, there is an urgent need for a method in which adhesion between the upper and lower substrates and the partition wall does not easily fall, and the partition wall and the substrate can be easily bonded through the upper surface of the partition wall having a small area. It's happening.

The present invention has been made to solve the above problems, in the manufacturing method of the electronic paper display device, to provide a new method for bonding the substrate and the partition of the electronic paper. Particularly, according to the present invention, the plurality of partition walls are formed of adhesive materials provided in the mold by using a mold having a groove having a size smaller than a width of an upper surface of the plurality of partition walls, and in which the adhesive material is provided. It is an object of the present invention to provide a method for manufacturing an electronic paper display device comprising a;

According to the present invention as described above, it is to solve the problems such as adhesion of the particles and poor driving caused by the flow of the adhesive material between the substrate and the partition wall as in the prior art. In addition, by indirectly using a separate mold instead of applying the adhesive material directly to the partition wall, the adhesive material is precisely applied to the top surface of the very small partition wall by adjusting the groove size of the mold.

The present invention for achieving the above object relates to a method for bonding the substrate and the partition wall of the electronic paper, more specifically, forming a lower electrode on the lower substrate and forming an upper electrode below the upper substrate; Forming a plurality of barrier ribs for forming pixel spaces on the lower electrodes; Preparing a mold having a groove having a size smaller than a width of an upper surface of the plurality of partition walls, and in which the adhesive material is provided; Injecting particles for representing an image into the pixel space formed by the barrier ribs; Burying the adhesive material provided on the mold on the plurality of partition walls; Stacking and bonding the upper substrate on which the upper electrode is formed to the upper surface of the barrier rib on which the adhesive material is buried; and manufacturing an electronic paper display device.

In the present invention characterized by bonding the substrate and the partition wall by using a separate substrate for applying the adhesive material, the mold which is an indirect means for this is by a dry etching, wet etching or sanding process. Preferably, the groove is formed by forming a groove, and the adhesive material is formed in the groove, and the adhesive material is provided in the groove, wherein the groove is formed by contacting and detaching the mold having the groove. More preferably.

In addition, the groove of the mold having a semi-circular shape is most effective to apply the adhesive material, the groove size of the mold can be in the range of 0.1 times to 0.7 times the width of the upper surface of the partition wall. In addition, the number of grooves of the mold may be characterized in that two to 10 times more than the number of partitions.

As such, the present invention bonds the substrate and the partition wall using a separate mold, and prevents charged particles for image representation from moving to another cell when a voltage is applied to the electrode formed on the substrate, and thus the lower electrode according to the present invention. A lower insulating layer may be formed on the upper insulating layer, and an upper insulating layer may be formed below the upper electrode, and the particles used in the present invention may be any particles used to represent an image in the technical field to which the present invention pertains. Preferably, the method may be a method for manufacturing an electronic paper display device using a laser, characterized in that the chargeable or charged dry particles.

Furthermore, in order to achieve another object of the present invention, another embodiment of the present invention provides an electronic paper display device, which is manufactured by the manufacturing method as described above, wherein the adhesive material is present only at a portion where the upper substrate and the partition wall contact each other. It is also possible to make it.

Hereinafter, one preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. The invention can be better understood by the following examples, which are intended for the purpose of illustration of the invention and are not intended to limit the scope of protection defined by the appended claims.

First, according to the manufacturing method of the electronic paper display device according to the present invention, the lower electrode 2 is formed on the lower substrate 1, and the upper electrode is formed (not shown) under the upper substrate. In the present invention, forming the upper electrode on the upper substrate is the same as the method of forming the lower electrode 2 on the lower substrate 1, and thus, the method of forming the lower electrode 2 on the lower substrate 1 will be described. It replaces the description of the upper substrate and the upper electrode.

As shown in FIG. 4, a transparent lower electrode 2 and a lower insulating layer 3 are sequentially formed on the lower substrate 1. Since the basic electrode structure of the electronic paper display device according to the present invention is a matrix structure, the lower electrode 2 has a shape as shown in the right side of FIG. Preferably, the transparent lower electrode 2 is ITO, and there is no problem in driving even if the lower insulating layer 3 applied thereon is omitted. Is preferably applied since it can be difficult to preserve the image for a long time without applying new power.

Next, a plurality of barrier ribs 4 are formed on the lower electrode 2 to form the pixel space. That is, as shown in FIG. 5, a plurality of partition walls 4 are formed on the lower electrode 2 and the lower insulating layer 3 formed on the lower substrate 1. In FIG. 5, the partition wall 4 is formed on the lower insulating layer 3, but in the present invention, the lower insulating layer 3 may be omitted, as described above. 2) it is also possible to form a barrier rib 4 for forming a pixel space directly on.

Since the partition 4 is simply used to distinguish cell units, the material may be variously applied to a polymer, an inorganic material, and the like. In the present invention, a method for constructing the partition 4 is preferably a photolithography method using a photoresist, a method using a photosensitive polymer, a laminating method using a cut of a pre-made material, and the like. When the barrier ribs 4 are bonded to each other, a method such as an ultraviolet adhesive material and ultraviolet irradiation may be applied to the bottom plate which is formed. The partition 4 according to the present invention has a lattice structure as shown in the perspective view on the right side of FIG. 5.

Subsequently, a step of preparing a mold having a groove having a size smaller than the width of the plurality of partition walls and in which the adhesive material is provided is performed. Such a mold has a fine groove 6 as shown in FIG. 6, which may have a rectangular or semicircular shape so as to have an adhesive material. Figure 6 is a cross-sectional view showing a mold (5) used in the manufacturing method of the electronic paper display device in one embodiment according to the present invention.

In the present invention, the mold 5 refers to a mold for casting and casting, and is a concept including a template used for casting or formwork. In other words, as shown in FIG. 6, the mold 5 has a groove formed in the substrate so that the adhesive material 6 can be precisely attached to the upper surface of the partition wall. That is, in the present invention, the mold 5 for accurately depositing the adhesive material 7 on the upper surface of the partition wall is used to make a certain amount of the adhesive material 6 by injecting a liquid or powder type adhesive material. It can be called a framework.

In the present invention characterized by bonding the substrate and the partition wall using such a separate device, the mold 5, which is an indirect printing means for this, is subjected to a dry etching, wet etching or sanding process. It is preferable that the step of forming the groove, through the step of providing an adhesive material in the groove. That is, by forming a groove at an interval corresponding to the distance between the plurality of partition walls on the substrate using a photo etching process, it can be manufactured by forming an adhesive material 7 in the groove (6).

To this end, first, an appropriate heat-resistant material is prepared according to the temperature at which the substrate serving as the mold of the mold 5 is injected. Subsequently, a fine groove 6 as shown in FIG. 6 is formed on the substrate. That is, by forming the grooves 6 on the substrate, the mold 5 in which the grooves 6 are formed is prepared to include the adhesive material 7 in the grooves 6. In the present invention, the groove 6 is to bury the adhesive material on the upper surface of the partition wall, the groove size of the mold is preferably formed within the range of 0.1 times to 0.7 times the width of the upper surface of the partition wall, more preferably such a groove The number of (6) is preferably 2 to 10 times more than the number of the partitions.

The size of the groove 6 of the mold 5 within the range of 0.1 to 0.7 times the width of the upper surface of the partition wall is determined by the size of the adhesive material 7 applied. That is, when the size of the groove 6 of the mold 5 is less than 0.1 times the width of the upper surface of the partition wall, there is a problem in that the adhesion of the substrate and the partition wall is difficult because the amount of the adhesive material applied by the mold 5 is too small. This is because when the size of the groove 6 of the mold 5 is 0.7 times or more of the width of the upper surface of the partition wall, the adhesive substance 7 is likely to leak out by pressing the substrate and the partition wall.

The reason why the number of the grooves 6 is two to ten times larger than the number of the partition walls is for convenience of the manufacturing process. That is, the number of grooves should be equal to the number of partitions to be applied, but the present invention further provides a simple and easy product by moving only a mold or changing only a partition to apply an adhesive material in one manufacturing line. In order to manufacture the number of the grooves may be larger than the number of partitions. That is, according to the present invention, the number of the grooves 6 is twice as large as the number of the partition walls, so that the adhesive material may be continuously applied to the plurality of upper surfaces of the partition walls. In this case, the grooves that may be provided with the adhesive material should be in proportion to the number of partitions in multiples, and in the case of more than 10 times, there is a risk that the adhesive material may fall into the space other than the partition walls.

After the groove 6 is formed on the substrate to prepare the mold 5, the adhesive material 7 is provided in the groove 6. In another preferred embodiment of the present invention, the adhesive material 7 is provided in the groove 6 so that the mold 5 having the groove 6 formed thereon is brought into contact with the adhesive material 7 as shown in FIG. 6. It is most preferable to provide the adhesive substance 7 by drawing out. As such, when the mold 5 having the fine grooves 6 is in contact with the adhesive material 7 for a while, the liquid adhesive material 7 is buried like a drop on the flaw 6. Later, when it is placed on the partition wall, the liquid adhesive materials 7 may be easily separated from the mold 5, and the adhesive material may be easily buried on the partition wall surface. Therefore, the adhesive material 7 according to the present invention is preferably a polymer polymerization material or a liquid adhesive material, and in order to bury the adhesive material 7 like droplets, the fine grooves 6 formed in the mold 5 are semicircular. It is more preferable to have the shape of.

In the present invention, the mold 5 is used as a separate substrate for applying the adhesive material 7 on the partition wall. In other words, the adhesive material 7 is not directly applied onto the partition wall but is attached to the adhesive material 7 by a separate indirect printing substrate in an indirect manner. By applying the adhesive material 7 indirectly in this manner, it is possible to prevent the adhesive material from being shed or spilled on the side surface of the partition wall by a more accurate and clean method than the conventional method of applying the adhesive material directly to the partition wall by a roller.

In other words, the present invention intends to bond the substrate and the partition wall of the electronic paper using this indirect method. That is, a substrate having a groove having a size smaller than the width of the upper surface of the plurality of partition walls is formed, and the adhesive material is buried in the partition walls formed on the flexible substrate using the mold 5 having the adhesive material 7 in the grooves. It is. Thereafter, the flexible electronic paper device is completed by aligning and bonding with another flexible substrate again. Another advantage of this method is that it is possible to form a very small adhesive pattern, and also to reuse the mold 5, which is a separate substrate, repeatedly.

In addition, the indirect printing method can be applied to metals and glass that were impossible with the direct printing method, and because it uses a separate rubber blanket or a substrate, it is clearly printed on a rough surface and has a stronger printing force than direct printing.

Subsequently, particles 8 for displaying an image are injected into the pixel space formed by the partition wall 4. Particles 8 are for image representation, and two kinds of charged particles having different colors and charging characteristics may be mixed and injected, respectively. The particles 8 may be charged with charged or non-chargeable particles. The kind of the particles 8 is not particularly limited, and any particles used for image expression in the art may be used. That is, not only a solid but also particles of an electrolyte solution, a suspension, a sol, a gel, a capsule, and a twist ball may be included. Preferably, it is preferable to inject dry particles 8 having no viscous properties such as liquids, suspensions and the like. That is, after the uncharged particles 8 are injected, dry collision-charged particles having a charged type to form charged particles by applying a voltage to the upper and lower electrodes to collide the particles 8 with each other to be charged according to a collision ( 8) is preferred.

The method of injecting the particles 8 may use a general method of injecting charged particles into an electronic paper display device in the art. For example, particles can be injected into a cell in which a pixel space is formed by an injection method by a spray coating method, an injection method by an electrostatic coating method, or the like.

Thereafter, the adhesive material 6 provided in the mold 5 is buried in the upper surface of the plurality of partition walls 4. This is illustrated in detail in FIG. 7, which is a schematic diagram showing the step of burying the adhesive material 7 provided in the mold 5 on the upper surface of the plurality of partitions 4 in one embodiment according to the present invention.

The fine grooves 6 in the mold 5 are formed so as to correspond to the gaps between the plurality of partition walls 4, so that the adhesive material 7 in the grooves 6 is applied to the upper surface of the partition walls 4. will be. As shown in FIG. 7, the fine grooves 6 may be formed twice as many as the number of the partition walls 4, and in this case, the adhesive material 7 may be applied to the upper surfaces of the partition walls 4 positioned side by side. The adhesive material 7 may be sequentially applied to the top surfaces of the partition walls 4 of the cells in a row.

In the present invention, the step of burying the adhesive material 7 provided in the mold 5 on the upper surface of the plurality of partitions 4 may be performed in two embodiments. That is, after the adhesive material of the mold and the plurality of barrier ribs formed on the lower substrate abut, it is possible to rub the lower substrate with a roller to bury the adhesive material on the upper surface of the plurality of barrier ribs. It is also possible to deposit an adhesive material on the plurality of partition walls.

As such, when the adhesive material 7 is buried on the upper surface of the partition wall 4 by using the mold 5 having the adhesive material 7 described above, the adhesive material according to the present invention conforms to the gap between the partition walls in advance. Since the mold is provided in the mold position, only the adhesive material contained in the groove of the mold 5 can be accurately buried in the substrate.

Finally, after the particles are injected, the upper substrate 9 on which the pre-fabricated upper electrode (not shown) is formed, as shown in FIGS. 8 and 9, is formed on the upper surface of the partition 4 on which the adhesive material 6 is buried. Laminated to and bonded to the step. 8 is a cross-sectional view illustrating a state in which an adhesive material 7 is provided only on a part of an upper surface of the partition wall 4 by a mold in accordance with an embodiment of the present invention, and FIG. 9 is a state in which the upper substrate 9 is bonded thereto. It is sectional drawing which shows.

That is, as shown in FIG. 9, the upper substrate 9 and the lower substrate 1 on which the barrier ribs 4 are formed are positioned to face each other, and in this case, the upper electrode and the lower electrode (not shown) are perpendicular to each other. Laminate. The upper electrode and the lower electrode serve as a scan electrode and a data electrode to adjust the voltage of each cell.

As described above, since the adhesive material 7 according to the present invention has already been provided in the groove at the position corresponding to the gap between the partition walls 4, the adhesive material 7 contained in the groove of the mold 7 is provided. ) Can be accurately buried in the upper surface of the partition wall, and thus the substrate and the partition wall only by the adhesive material 6 on the top of the partition wall 4 to be aligned and bonded among the various bonding parts existing on the upper substrate 9. (4) can be united. In this case, when the upper substrate 9 and the partition wall 4 are joined by the adhesive material 7 already attached to the upper surface of the partition wall 4, the partition wall 4 already bonded to the other partition wall 4 is bonded. ) Is not melted, so alignment is maintained. Thus, as in the case of using conventional UV ultraviolet rays, when one partition 4 is bonded, it will not affect the other partition 4 that is already bonded.

When the substrate and the partition wall of the electronic paper are bonded to each other according to the present invention as described above, since the adhesive material does not leak and spread between the substrate and the partition wall as in the prior art, defects due to the leakage of the adhesive material can be reduced. There is an effect that can facilitate the movement of. In addition, since the present invention is based on an indirect method using a separate mold rather than directly applying the adhesive material to the partition wall, the adhesive material can be precisely applied to the top surface of the partition wall having a small size by adjusting the groove size of the mold. It is.

Furthermore, another embodiment for achieving the other object of the present invention may be an electronic paper display device is manufactured by the manufacturing method as described above, characterized in that the adhesive material is present only in the portion where the upper substrate and the partition wall abut. .

In the above description, it should be understood that those skilled in the present invention can only make modifications and changes to the present invention without changing the gist of the present invention as merely illustrative of a preferred embodiment of the present invention.

According to the present invention as described above, forming a lower electrode on the lower substrate and forming an upper electrode below the upper substrate; Forming a plurality of barrier ribs for forming pixel spaces on the lower electrodes; Preparing a mold having a groove having a size smaller than a width of an upper surface of the plurality of partition walls, and in which the adhesive material is provided; Injecting particles for representing an image into the pixel space formed by the barrier ribs; Burying the adhesive material provided on the mold on the plurality of partition walls; And stacking and attaching the upper substrate on which the upper electrode is formed to an upper surface of a partition wall on which the adhesive material is buried, and manufacturing the electronic paper display device.

According to the present invention, when the substrate and the partition wall of the electronic paper are bonded together, since the adhesive material is not applied to the entire upper surface of the partition wall as in the prior art, the blurring phenomenon of the pixel space due to the leakage of the adhesive material can be significantly reduced. In addition, since the present invention is based on an indirect method using a separate mold rather than directly applying the adhesive material to the partition wall, it is possible to precisely apply the adhesive material to the top surface of the very small partition wall by adjusting the groove size of the mold. It can be effective. In addition, the mold, which is a separate substrate for applying the adhesive material, can be reused continuously, and above all, the adhesive material does not adhere to the sides of the partition walls in a cleaner manner than the adhesive material is directly applied to the rollers. have.

Claims (9)

Forming a lower electrode on the lower substrate and forming an upper electrode below the upper substrate; Forming a plurality of barrier ribs for forming pixel spaces on the lower electrodes; Preparing a mold having a groove having a size smaller than a width of an upper surface of the plurality of partition walls, and in which the adhesive material is provided; Injecting particles for representing an image into the pixel space formed by the barrier ribs; Burying the adhesive material provided on the mold on the plurality of partition walls; Stacking and attaching an upper substrate on which the upper electrode is formed to an upper surface of a partition wall on which the adhesive material is buried; and manufacturing an electronic paper display device. The electronic paper of claim 1, wherein the mold is manufactured by forming a groove by a dry etching, a wet etching, or a sanding process, and providing an adhesive material in the groove. Method of manufacturing a display device. The method of claim 1, wherein the groove size of the mold is in a range of 0.1 to 0.7 times the width of the upper surface of the partition wall. The method of claim 1, wherein the number of grooves of the mold is two to ten times larger than the number of the partition walls. The method of claim 1, wherein the providing of the adhesive material in the groove comprises providing the adhesive material by contacting and detaching the grooved mold from the mold. The method of claim 1, wherein the groove of the mold has a semi-circular shape. The method of claim 1, wherein a lower insulating layer is formed on the lower electrode, and an upper insulating layer is formed below the upper electrode. The method of claim 1, wherein the particles are charged or chargeable dry particles. The electronic paper display device of claim 1, wherein the electronic paper display device is manufactured by the method for manufacturing the electronic paper display device according to claim 1, wherein the adhesive material is present only at a portion where the upper substrate and the partition wall contact each other.

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