KR20070076085A - Chemical Supply System and Method - Google Patents

Abstract

The present invention relates to a system and a method for supplying a chemical liquid, the chemical liquid supply system according to the present invention is a chemical liquid supply device for supplying a chemical liquid to the first processing chamber and the second processing chamber disposed above the first processing chamber, the chemical liquid supply A first chemical liquid supply line for transferring the chemical liquid from the apparatus to the first processing chamber, and a second chemical liquid supply line for transferring the chemical liquid from the chemical liquid supply device to the second processing chamber, wherein each of the first processing chamber and the agent The supply pressures of the chemical liquids supplied to the process chambers should be the same. The chemical liquid supply system and method according to the present invention can reduce the installation cost of the chemical liquid supply system.

Description

Chemical liquid supply system and method {SYSTEM AND METHOD FOR SUPPLING CHEMICAL}

1 is a configuration diagram schematically showing a chemical liquid supply system according to an embodiment of the present invention.

FIG. 2 is a flow chart showing the operation sequence of the waste liquid treatment system shown in FIG.

* Explanation of symbols for the main parts of the drawings

10: support building 140: second chemical supply line

20 process building 142 main supply line

22: first processing chamber 142a: valve

24: second processing chamber 142b: flow meter

100: chemical liquid supply system 142c: flow control member

110: chemical liquid supply device 144: auxiliary supply line

112: supply unit 144a: valve

114: storage container 144b: flow control member

120: first chemical liquid supply line 150: pressure gauge

122: valve 160: dispensing member

124: flow meter 170: control unit

130: distribution member

The present invention relates to a system for supplying a chemical liquid, and more particularly, to a chemical liquid supply system for use in semiconductor and flat panel display processes.

In general, various chemical liquids are used in the manufacturing process of semiconductors or flat panel displays, and the chemical liquids are supplied and recovered by a central chemical supply system (CCSS) provided in a semiconductor fabrication factory (FAB). Treatment of the waste liquid and mixing of the chemical liquid are performed.

A typical central chemical supply system is installed in the support building in the semiconductor fabrication plant (Fab). The central chemical liquid supply system includes a plurality of chemical liquid supply devices, and each chemical liquid supply device supplies a predetermined chemical liquid to each processing chamber of the process building. To this end, the central chemical liquid supply system is provided with a plurality of chemical liquid supply device. Usually, the chemical liquid supply device is installed in the support building, receives the chemical liquid from a tank lorry or a chemical drum, stores the chemical liquid, and supplies the stored chemical liquid to each processing chamber of the process building.

In general, a chemical liquid supply device is difficult to supply chemical liquids to the upper floor of a process building at a time. This is because the chemical liquid supply device installed in the lower floor must overcome the large pressure difference caused by the head difference in order to supply the chemical liquid to the upper floor of the process building. Therefore, in the related art, a chemical liquid supply device is installed on each of the lower and middle floors of the support building, and the chemical liquid is raised and stored one step from the lower floor of the support building to the middle floor. It was.

However, the central chemical liquid supply system having the above-described configuration has a problem in that the number of chemical liquid supply devices increases, so that the cost of constructing the chemical liquid supply system is increased, and the footprint of the chemical liquid supply device is also increased. In addition, when the chemical liquid supplying device supplies the chemical liquids to the processing chambers having different heights, the supply pressure of the chemical liquids supplied to the respective processing chambers may vary.

An object of the present invention for solving the above problems is to provide a chemical liquid supply system and method that can reduce the cost.

Another object of the present invention is to provide a chemical liquid supply system and method that can reduce the footprint.

It is still another object of the present invention to provide a chemical liquid supply system and method in which supply pressures of chemical liquids to which treatment chambers having different heights are supplied may be the same.

The chemical liquid supply system according to the present invention for achieving the above object is a chemical liquid supply device for supplying a chemical liquid to the first processing chamber and the second processing chamber disposed on the upper layer than the first processing chamber, from the chemical liquid supply device to the first processing chamber A first chemical liquid supply line through which the chemical liquid is transferred, and a second chemical liquid supply line through which the chemical liquid is transferred from the chemical liquid supply device to the second processing chamber, wherein each of the first processing chamber and the second processing chamber is supplied with the chemical liquid. The supply pressures are equal to each other.

According to an embodiment of the present invention, the second chemical liquid supply line is provided with a flow rate adjusting member, the flow rate adjusting member is provided along the supply flow rate of the chemical liquid conveyed along the first chemical liquid supply line and the second chemical liquid supply line The supply flow rates of the chemical liquids to be transferred are adjusted to be equal to each other.

According to an embodiment of the present invention, the chemical liquid supply device is installed at a lower position than the first processing chamber and higher than the second processing chamber.

According to an embodiment of the present invention, the chemical liquid supply device pressurizes the storage container by supplying an inert gas to the storage container for storing the chemical liquid and the storage container.

According to an embodiment of the present invention, the second chemical liquid supply line is supplied with the chemical liquid from the chemical liquid supply unit to the second processing chamber when the supply pressures of the chemical liquids supplied to the first processing chamber and the second processing chamber are the same. And a main supply line and an auxiliary supply line for supplying the chemical liquid from the chemical liquid supply unit to the second processing chamber when the supply pressures of the chemical liquids supplied to the first processing chamber and the second processing chamber are different from each other.

According to an embodiment of the present invention, a pressure gauge is installed in the main supply line, and the chemical liquid supply system stops supplying the chemical liquid in the main supply line when the pressure measured by the pressure gauge is out of a predetermined pressure value, It further comprises a control unit for starting the supply of the chemical liquid of the auxiliary supply line.

The chemical liquid supply method according to the present invention for achieving the above object includes a chemical liquid supply device for supplying a processing liquid to each of the first processing chamber and the second processing chamber installed at a lower position than the first processing chamber, the first The supply pressures of the processing liquids supplied to the processing chamber and the second processing chamber are equal to each other.

According to an embodiment of the present invention, the chemical liquid supply line for transferring the chemical liquid from the chemical liquid supply device to the second processing chamber is provided with a flow rate control member, the flow rate control member of the chemical liquid transferred along the first chemical liquid supply line The supply flow rate and the supply flow rate of the chemical liquid conveyed along the second chemical liquid supply line are adjusted to be equal to each other.

According to an embodiment of the present invention, the chemical liquid supply device supplies the chemical liquid by the pressurized method of the inert gas.

According to an embodiment of the present invention, when the supply pressures of the processing liquids supplied to the first processing chamber and the second processing chamber are different, the main supply line for supplying the processing liquid to the second processing chamber is closed and the second processing chamber is closed. Open the auxiliary supply line to supply the treatment liquid.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the invention to those skilled in the art. Portions denoted by like reference numerals denote like elements throughout the specification.

(Example)

1 is a configuration diagram schematically showing a chemical liquid supply system according to an embodiment of the present invention. Referring to FIG. 1, a semiconductor manufacturing plant (FAB) may be divided into a support building 10 and a process building 20. The support building 10 is for assisting the semiconductor process performed in the process building 20 of the semiconductor manufacturing factory Fab, and has various utility facilities and a chemical liquid supply system 100. The process building 20 is partitioned into lower floors and upper floors. Each floor of the process building 20 has at least one process chamber. The process chamber is equipped with facilities for performing a semiconductor manufacturing process. In the present embodiment, the upper layer of the process building 20 is referred to as the first processing chamber 22, and the lower layer of the process building 20 is referred to as the second processing chamber 24. In the present embodiment, the first processing chamber will be described as an example located above the second processing chamber.

The chemical liquid supply system 100 according to the present invention includes a chemical liquid supply device 110, first and second chemical liquid supply lines 120 and 140, a distribution member 130 and 160, a pressure gauge 150, and a controller 170. Include.

The chemical liquid supply device 100 stores a predetermined chemical liquid and supplies the chemical liquid to the first and second processing chambers 22 and 24 of the process building 20. The chemical liquid supply device 100 is installed in the support building 10. In addition, the chemical liquid supply apparatus 100 includes a supply unit 112 and a chemical liquid storage container 114. The supply unit 112 supplies the chemical liquid from the chemical liquid supply source (not shown) to the storage container 114, and supplies the chemical liquid stored in the storage container 114 to the first and second processing chambers 22 and 24. Here, the chemical liquid may include chemical, gas, and deionized water (DIW) used in the semiconductor and flat panel display fields. And, the chemical liquid source may be, for example, a small capacity container for storing a chemical drum and a smaller amount of the chemical liquid.

The storage container 114 receives and stores the chemical liquid from the supply unit 112. The storage container 114 may be, for example, a lining tank whose inner wall is treated with a fluororesin sheet and an EP Polishing tank (EP Tank) whose inner wall is electropolished. The storage container 114 is manufactured to be pressurized by a predetermined inert gas (eg, nitrogen gas). Therefore, the chemical liquid supply device 110 may be supplied with the chemical liquid by the pressure of the storage container 114.

The storage container 114 includes a first storage container 114a and a second storage container 114b. The first and second reservoirs 114a and 114b alternately supply chemical liquids. That is, when the chemical liquid is supplied from the first storage container 114a, the second storage container 114b waits after filling the chemical liquid. When the amount of the chemical liquid stored in the first storage container 114a falls below a predetermined amount, the supply of the chemical liquid in the first storage container 114a is stopped, and the second storage container 114b performs supply of the chemical liquid. Then, the first storage container (114a) is filled with the chemical liquid and waiting. Accordingly, the first and second storage containers 114a and 114b alternately supply the chemical liquid. Storage container 114 is provided with at least one, the quantity may be provided in various ways.

In the above-described embodiment, the chemical liquid supply device 100 receives the chemical liquid from a predetermined chemical liquid supply source, and has been described with an example of supplying the chemical liquid in a pressurized manner, but the chemical liquid supply device may be provided in various ways. For example, the chemical liquid supply apparatus 100 may receive the chemical liquid from a separate chemical liquid supply apparatus, and the chemical liquid stored in the storage container may be supplied by a pumping method.

The first chemical liquid supply line 120 supplies the chemical liquid from the chemical liquid supply device 110 to the distribution member 130. A valve 122 and a flow meter 124 are installed in the first chemical liquid supply line 120. The valve 122 opens and closes the first chemical liquid supply line 120, and the flow meter 124 measures the flow rate of the chemical liquid transferred through the first chemical liquid supply line 120 to display the operator.

The distribution member 130 distributes the chemical liquid supplied from the first chemical liquid supply line 120 to each semiconductor manufacturing facility 22a in the first processing chamber 22. The distribution member 130 may be, for example, a valve manifold box (VMB). The distribution member 130 may be disposed in the lower layer of the first processing chamber 22 and distributes the chemical liquid by a predetermined amount to each of the semiconductor manufacturing facilities 22a in the first processing chamber 22.

The second chemical liquid supply line 140 supplies the chemical liquid from the chemical liquid supply device 110 to the distribution member 160. The second chemical liquid supply line 140 includes a main supply line 142 and an auxiliary supply line 144. The main supply line 142 is a line through which the chemical liquid is supplied from the chemical liquid supply device 110 to the distribution member 160 during normal operation of the chemical liquid supply system 100, and the auxiliary supply line 144 is a chemical liquid supply system 100. ) Is a line in which the supply of the chemical liquid from the chemical liquid supply device 110 to the distribution member 160 when the abnormality occurs. Here, the abnormality of the chemical liquid supply system 100 is a case where the supply pressure of the chemical liquid supplied to the first chemical liquid supply line 120 and the second chemical liquid supply line 140 is out of a predetermined pressure.

The main supply line 142 is provided with a valve 142a, a flow meter 142b, and a flow control member 142c. The valve 142a opens and closes the main supply line 142. The valve 142a is an automatic valve that is opened and closed by an electrical signal, and is operated by the controller 170 in this embodiment. The flow meter 142b measures the flow rate of the chemical liquid transferred along the main supply line 142 and displays the operator so as to recognize it.

The flow regulating member 142c adjusts the flow rate of the chemical liquid transferred through the main supply line 142. The flow regulating member 142c may be, for example, a regulator. The operator may adjust the flow rate of the chemical liquid transferred through the main supply line 142 by adjusting the setting value of the flow control member 142c. In this case, the flow rate adjusting member 142c has a supply flow rate of the chemical liquid transferred along the first chemical liquid supply line 120 and a supply flow rate of the chemical liquid conveyed along the main supply line 142 of the second chemical liquid supply line 140. Are adjusted to be equal to each other.

The auxiliary supply line 144 is a line in which the chemical liquid is supplied when an abnormality occurs in the main supply line 142. The auxiliary supply line 144 is diverted from, for example, the front end of the flow meter 142b installed in the main supply line 142 and is connected to the rear end of the valve 142a. The auxiliary supply line 144 is provided with a valve 144a and a flow control member 144b. The valve 144a opens and closes the auxiliary supply line 144. The valve 144a is an automatic valve that is opened and closed by an electrical signal, and is operated by the controller 170 in this embodiment.

The flow control member 144b adjusts the flow rate of the chemical liquid which is transferred through the auxiliary supply line 144. The flow control member 144c may also have the same configuration as the flow control member 142b described above. That is, the operator may adjust the setting value of the flow control member (144b), to adjust the flow rate of the chemical liquid transferred through the auxiliary supply line (144). At this time, the flow rate adjusting member 144b has a supply flow rate of the chemical liquid transferred along the first chemical liquid supply line 120 and the supply flow rate of the chemical liquid conveyed along the auxiliary supply line 144 of the second chemical liquid supply line 140. Are adjusted to be equal to each other.

The pressure gauge 150 is installed in the main supply line 142. The pressure gauge 150 measures the supply pressure of the chemical liquid transferred through the main supply line 142, and transmits the measured data to the controller 170. In the present exemplary embodiment, the pressure gauge 150 is installed at the front end of the distribution member 160 as an example, but the pressure gauge 150 may be installed at various positions in the main supply line 142.

Here, in the present embodiment, since the chemical liquid supply device 110 is supplied with the chemical liquid by pressurization of the storage container 114, the storage container 114 is the chemical liquid to the first and second chemical liquid supply lines (120, 140) The pressure supplying may be the same. However, the pressure of the chemical liquid supplied to the first treatment chamber 22 at a relatively high position is lower than the pressure supplied to the second treatment chamber 24 due to the water head difference. Therefore, the chemical liquid supply device 110 pressurizes the storage container 114 to satisfy the supply pressure of the chemical liquid required by the first processing chamber 22, and the supply pressure of the chemical liquid supplied to the second processing chamber 24 is the main supply. The flow rate of the chemical liquid is controlled by the flow control member 142c installed in the line 142 so that the supply pressure of the chemical liquid supplied to the second processing chamber 24 is reduced. Therefore, the supply pressure of the chemical liquid supplied by the first processing chamber 22 and the supply pressure of the chemical liquid supplied by the second processing chamber 24 are the same.

The distribution member 160 may have the same configuration as the distribution member 150 described above. The distribution member 160 receives the chemical liquid from the second chemical liquid supply line 140 and distributes the supplied chemical liquid by the amount of chemical liquid required by each of the semiconductor manufacturing facilities 24a installed in the second processing chamber 24. .

In the present exemplary embodiment, the first and second chemical supply lines 120 and 140 supply chemicals from the chemical supply device 110 to the distribution members 130 and 160, respectively. Each of the supply lines 120 and 140 may be supplied to each of the semiconductor manufacturing facilities 22a and 24a without the distribution members 130 and 160.

The controller 170 receives data on the supply pressure of the chemical liquid transferred from the pressure gauge 150 through the main supply line 142. The controller 170 analyzes the pressure data and determines whether the supply pressure of the chemical liquid transferred through the main supply line 142 is out of a predetermined pressure value. If the supply pressure of the chemical liquid is out of the predetermined pressure value, the valve 142a is closed and the valve 144a is opened.

The chemical liquid supply system 100 having the above-described configuration has a lower layer of the support building 10 when the chemical liquid supply device 110 supplies the chemical liquid to the first processing chamber 22 and the second processing chamber 24 having different heights. There is no need for a separate chemical supply. That is, in the related art, a separate chemical liquid supply device is provided on the lower floor of the support building 10, and the chemical liquid supply device 110 is supplied after supplying the chemical liquid to the chemical liquid supply device 110 installed on the intermediate layer of the support building 10. Although the chemical liquid is supplied to the upper and lower layers of the process building 20, the present invention provides the chemical liquid supply apparatus 110 by arranging the chemical liquid supply apparatus 110 at an intermediate position of the first and second processing chambers 22 and 24. The chemical liquid may be supplied to the first and second processing chambers 22 and 24 at 110. Therefore, the quantity of the chemical liquid supply apparatus 100 can be reduced, thereby reducing the cost of installing the chemical liquid supply system 100.

Here, the present invention does not mean that the central chemical solution supply system (not shown) is installed on the middle floor of the support building 10, and the chemical solution is supplied from a tank lorry among chemical supply devices for supplying the chemical solution. In the case of a chemical liquid supply device that receives the chemical liquid from a chemical storage source such as a chemical drum and supplies the chemical liquid to the upper and lower layers of the process building 20, the first and second processing chambers in the support building 10 are provided. (22, 24) It aims at reducing the quantity of chemical liquid supply apparatus by being located in the middle. However, the present invention is not limited to the above-described embodiment, and the arrangement of the chemical liquid supply device may be variously modified and changed.

Hereinafter, the control method of the chemical | medical solution supply system which has the above-mentioned structure is demonstrated in detail.

FIG. 2 is a flow chart showing the operation sequence of the chemical liquid supply system shown in FIG. Referring to FIG. 2, when the process is started, the supply unit 112 receives the chemical liquid from a predetermined chemical liquid supply source (not shown) and stores the chemical liquid in the storage container 114. When the chemical liquid is stored in the storage container 114, the supply unit 112 supplies the chemical liquid to the first and second chemical liquid supply lines 120 and 140. At this time, the flow rate adjusting member (142b, 144b) installed in each of the main supply line 142 and the auxiliary supply line 144 has a flow rate of the chemical liquid and the second chemical liquid supply line ( The flow rate of the chemical liquid conveyed along 140 is adjusted to be the same. Accordingly, the supply pressures of the chemical liquids supplied from the first chemical liquid supply line 120 and the second chemical liquid supply line 140 to each of the distribution members 130 and 160 are maintained at the same pressure range.

The controller 170 receives data on the supply pressure of the chemical liquid transferred in the main supply line 142 of the second chemical liquid supply line 140 from the pressure gauge 150 installed in the main supply line 142 (S110). In addition, the controller 170 analyzes the data to determine whether the pressure sensed by the pressure gauge 150 is outside a preset pressure value (S120).

At this time, when the chemical liquid supply pressure of the second chemical liquid supply line 140 sensed by the pressure gauge 150 is out of a predetermined pressure value, the valve 142a of the main supply line 142 is closed and the report supply line 144 is provided. By opening the valve 144a, the chemical liquid supply to the main supply line 142 is stopped and the chemical liquid is supplied to the auxiliary supply line 144 (S130). In addition, the controller 170 displays the operator to recognize this. The operator performs maintenance to solve the problem occurring in the second chemical liquid supply line 140, and when the maintenance is completed, the chemical liquid supply to the main supply line 142 again starts, and the auxiliary supply line 144 Stop supply of medicine.

As described above, the chemical liquid supplying method according to the present invention includes a chemical liquid supply device 110 for supplying chemical liquids to the first and second processing chambers 22 and 24 having different heights, respectively. 24. The pressure of the chemical liquid supplied to the monitor can be monitored. Accordingly, the chemical liquid supply apparatus 110 may maintain the same supply pressure of the chemical liquid supplied to the first and second processing chambers 22 and 24 having different heights.

The chemical liquid supply system and method according to the present invention has been described in detail above. However, the present invention is not limited to the embodiments described above. The present invention may be variously applied and applied without departing from the spirit of the inventor.

As described above, the chemical liquid supply system and method according to the present invention can reduce the installation cost of the chemical liquid supply system for manufacturing semiconductor and flat panel display.

In addition, according to the present invention, the footprint of the chemical liquid supply system can be reduced.

In addition, according to the present invention, it is possible to reduce the configuration of the chemical liquid supply system to facilitate the operator's system operation management and maintenance.

In addition, according to the present invention, it is possible to maintain the same supply pressure of the chemical liquid supplied to the upper layer and the lower layer, respectively.

In addition, according to the present invention, it is possible to monitor the supply pressure of the chemical liquid supplied to the upper layer and the lower layer, respectively.

Claims (10)

In a system for supplying a chemical liquid, A chemical liquid supply device for supplying a chemical liquid to a first processing chamber and a second processing chamber disposed above the first processing chamber; A first chemical liquid supply line for transferring the chemical liquid from the chemical liquid supply device to the first processing chamber; And a second chemical liquid supply line through which the chemical liquid is transferred from the chemical liquid supply device to the second processing chamber. The chemical liquid supply system, characterized in that the supply pressure of the chemical liquid supplied to each of the first processing chamber and the second processing chamber is equal to each other. The method of claim 1, The second chemical supply line is provided with a flow rate control member, The flow control member, A chemical liquid supply system, characterized in that the supply flow rate of the chemical liquid transported along the first chemical liquid supply line and the supply flow rate of the chemical liquid transported along the second chemical liquid supply line are adjusted to be the same. The method of claim 1, The chemical liquid supply device, A chemical liquid supply system, characterized in that it is installed at a position lower than the first processing chamber and higher than the second processing chamber. The method of claim 1, The chemical liquid supply device, A storage container for storing a chemical liquid, Supplying an inert gas to the storage container to pressurize the storage container. The method according to any one of claims 1 to 4, The second chemical liquid supply line, A main supply line for supplying the chemical liquid from the chemical liquid supply unit to the second processing chamber when the supply pressures of the chemical liquids supplied to the first processing chamber and the second processing chamber are the same; And an auxiliary supply line for supplying the chemical liquid from the chemical liquid supply unit to the second processing chamber when the supply pressures of the chemical liquids supplied to the first processing chamber and the second processing chamber are different from each other. The method of claim 5, In the main supply line, A pressure gauge is installed, The chemical liquid supply system, And a controller for stopping supply of the chemical solution of the main supply line and starting supply of the chemical solution of the auxiliary supply line when the pressure measured by the pressure gauge is out of a predetermined pressure value. In the method of supplying a chemical liquid, And a chemical liquid supply device for supplying a processing liquid to each of the first processing chamber and the second processing chamber installed at a lower position than the first processing chamber, wherein the supply pressures of the processing liquids supplied to the first processing chamber and the second processing chamber are mutually different. Chemical liquid supply method characterized in that the same. The method of claim 7, wherein In the chemical liquid supply line for transferring the chemical liquid from the chemical liquid supply device to the second processing chamber is provided with a flow rate adjusting member, The flow control member, The chemical liquid supply method, characterized in that the supply flow rate of the chemical liquid transferred along the first chemical liquid supply line and the supply flow rate of the chemical liquid conveyed along the second chemical liquid supply line are the same. The method of claim 7, wherein The chemical liquid supply device, A chemical liquid supply method characterized by supplying a chemical liquid by pressurization of an inert gas. The method according to any one of claims 7 to 9, When the supply pressures of the processing liquids supplied to the first processing chamber and the second processing chamber are different, the main supply line for supplying the processing liquid to the second processing chamber is closed and the auxiliary supply for supplying the processing liquid to the second processing chamber. A chemical liquid supply method, characterized in that to open the line.

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