KR20070073496A - Plasma display panel - Google Patents

Abstract

A plasma display panel is provided to lower a firing voltage by widening a surface area of a protective layer and improving a discharge coefficient and a response speed of secondary electrons. A plasma display panel includes a protective layer having at least one or more grain orientation. The protective layer is formed with a first protective layer having (1,1,1) grain orientation and a second protective layer having (2,0,0) grain orientation. The first protective layer has a thickness of 2000 angstrom to 3000 angstrom. The second protective layer has a thickness of 5000 angstrom to 6000 angstrom. The protective layer is formed by using an E-beam deposition method.

Description

Plasma Display Panel {Plasma display panel}

1 is a perspective view showing the structure of a conventional plasma display panel;

2 is a view showing a crystal structure of a protective film of a plasma display panel according to the prior art;

3 is a diagram illustrating a response characteristic according to a temperature of a protective film and a conventional protective film of a plasma display panel according to the present invention;

4 is a diagram illustrating secondary electron emission coefficients according to temperatures of a protective film and a conventional protective film of a plasma display panel according to the present invention;

5A is a view showing a method of manufacturing a first protective film of a plasma display panel according to the present invention;

5B is a diagram illustrating a method of manufacturing a second protective film of a plasma display panel according to the present invention.

<Explanation of symbols on main parts of the drawings>

10: front substrate 11: scan electrode

12: sustain electrode 13: dielectric

14a: first protective film 14b: second protective film

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, to a plasma display panel in which a protective layer formed to protect a dielectric is formed to have at least one crystal structure to increase the discharge efficiency of the plasma display panel.

1 is a perspective view showing the configuration of a conventional plasma display panel.

As shown in FIG. 1, the plasma display panel according to the related art is composed of a front substrate A and a rear substrate B. As shown in FIG.

The front substrate (A) is composed of a scan electrode 1 and a sustain electrode 2, a dielectric 3 stacked to cover the scan electrode and the sustain electrode, and a protective film 4 for protecting the dielectric. .

When a driving signal for driving the plasma display panel is supplied to the scan electrode 1 and the sustain electrode 2, wall charges are accumulated in the dielectric 3, and the protective film 4 is formed of the dielectric by sputtering. 3) prevent damage and increase the emission efficiency of secondary electrons.

An address electrode 6 is formed on the double substrate B, and a dielectric 8 in which wall charges are accumulated is sequentially formed on the address electrode. On the dielectric, a partition 7 partitioning the discharge space and a phosphor 9 applied to the discharge space to generate visible light upon discharge are applied.

The protective film 4 is not only transparent so that visible light can be transmitted therethrough, but also provides MgO having excellent protection of the dielectric 3 and excellent secondary electron emission performance.

The protective film 4 made of MgO has a sputtering property that can mitigate the effects of ion bombardment of the discharge gas during the plasma display panel operation, thereby protecting the dielectric 3 from ion collision and emitting secondary electrons. It is a transparent protective thin film that serves to lower the discharge voltage. The protective film is formed by stacking the dielectric to cover the dielectric material in a thickness of typically 3000 to 7000 Å.

The protective film 4 typically has a crystal orientation as shown in FIG. 2, wherein the protective film has excellent (1,1,1) orientation in its thickness direction, that is, excellent sputtering property in the thickness direction of the protective film ( 1,1,1) surface is an oriented film.

At this time, if the protective film 4 is not densely formed, the electron emission property is low, and it is not possible to effectively prevent the dielectric 3 from being damaged by ion collision.

Therefore, it is preferable that the protective film 4 having the (1,1,1) crystal orientation is formed to have a plurality of cylindrical crystals in order to enhance electron emission. As shown in FIG. 4) is not formed densely over a certain interval, there is a limit to increase the secondary electron emission characteristics and sputtering characteristics of the protective film.

In particular, when the protective film 4 is not densely formed, the protective film does not effectively protect the dielectric material 3, and impurities such as metal and moisture flow into the dielectric material by discharge, resulting in poor discharge characteristics of the plasma display panel. There is a problem of deterioration.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art, and its purpose is to allow a protective film formed on a plasma display panel to have a (1,1,1) + (2,0,0) crystal orientation. The purpose is to increase the surface area of the protective film to increase the discharge efficiency of the plasma display panel.

The plasma display panel according to the present invention for solving the above problems is characterized in that it is formed including a protective film having at least one or more crystal orientation.

The passivation film includes a first passivation film having a (1,1,1) crystal orientation and a second passivation film having a (2,0,0) crystal orientation, wherein the first passivation film is within a range of 2000 Hz to 3000 Hz. It is formed to a thickness, the second protective film is characterized in that it is formed to a thickness within the range of 5000 kPa to 6000 kPa.

In this case, the first protective film is formed by an E-beam deposition method, and the second protective film is formed by a screen printing method.

In addition, the plasma display panel according to the present invention is further characterized in that a first passivation layer formed on a substrate and a second passivation layer having a crystal orientation different from the crystal orientation of the first passivation layer are formed on the first passivation layer. .

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

3 is a diagram illustrating a response characteristic according to a temperature of a protective film and a conventional protective film of the plasma display panel according to the present invention, Figure 4 is a secondary according to the temperature of the protective film and a conventional protective film of the plasma display panel according to the present invention 5 is a diagram illustrating a method of manufacturing a first passivation film of a plasma display panel according to the present invention, and FIG. 5b is a method of manufacturing a second passivation film of a plasma display panel according to the present invention. Figure shown.

The plasma display panel includes a front substrate and a rear substrate on which a plurality of line-shaped electrodes are arranged in a row, and discharge gas is sealed between the front substrate and the rear substrate to be bonded.

The front substrate is covered with a dielectric 13 covering the electrodes 11 and 12 on a surface facing the rear substrate, and a protective film 14 is formed on the dielectric. When the plasma display panel is driven, address discharge is generated between the electrodes formed on the front substrate and the rear substrate to form charge on the surface of the protective film 14 of the cell to be lit.

In this case, the protective layer 14 protects the dielectric and the electrode from ion bombardment (sputtering) generated during discharge, and simultaneously discharges secondary electrons during discharge to maintain charge.

Therefore, the protective film 14 is composed mainly of magnesium oxide (hereinafter referred to as MgO) having excellent anti-sputtering properties and secondary electron emission properties.

In this case, when the passivation layer 14 is formed to have one or more crystal structures, the response characteristic according to the temperature of the passivation layer is improved and the surface area of the passivation layer is widened, thereby increasing secondary electron emission at the passivation layer surface.

When the protective film 14 is configured to have a first protective film 14a having a (1,1,1) crystal orientation and a second protective film 14b having a (2,0,0) crystal orientation, a protective film having a net pattern Can be formed.

That is, not only the crystals of the formed protective film 14 are densely formed, but also the size of the crystal grains becomes larger than conventionally, so that the surface of the protective film is flat and the surface area is increased.

When the crystal of the protective film 14 is dense, the amount of impurities adsorbed on the protective film is reduced, thereby reducing the amount of impurities flowing into the dielectric 13, thereby increasing the discharge efficiency of the plasma display panel.

When the protective film is formed by the E-beam deposition method, a protective film having a (1,1,1) crystal orientation is formed. When the protective film is formed by screen printing using liquid MgO, a protective film having a (2,0,0) crystal orientation is formed. do.

In general, since the thickness of the protective film is about 8000 kPa, the first protective film 14a is preferably formed within the range of 2000 kPa to 3000 kPa, and the second protective film 14b is preferably formed within the range of 5000 kPa to 6000 kPa.

In particular, the first protective film 14a having the (1,1,1) crystal orientation is formed on the dielectric, and the second protective film 14b having the (2,0,0) crystal orientation is formed on the first protective film. Forming sequentially improves the jitter characteristic according to temperature, thereby increasing the response speed.

That is, as shown in FIG. 3, when the second protective film 14b having the (2,0,0) crystal orientation is formed on the first protective film 14a having the (1,1,1) crystal orientation, the room temperature The response speed is improved about 0.3㎲ ~ 0.4㎲, and the response speed at low temperature is also improved about 1.5㎲ ~ 2㎲.

The response speed is a time taken until the discharge is generated after the voltage is applied, and generally means the response speed at the address discharge. When the response speed increases, the width of the scan pulse applied to the electrode in order to generate the address discharge can be reduced.

The plasma display panel has a relatively long address period for writing cells to be turned on to display a screen. Therefore, as the width of the scan pulse decreases, the address period also decreases, making it easier to secure the maintenance interval of the sustain pulse and increasing the number of sustain pulses applied during one frame period, thereby increasing the sustain discharge efficiency. It becomes possible.

In particular, the response speed becomes particularly weak as the temperature increases, and as shown in the present invention, the second protective film (2,0,0) having the (2,0,0) crystal orientation on the first protective film 14a having the (1,1,1) crystal orientation is used. When 14b) is formed, since the change in the jitter characteristic with temperature is small, it is possible to form a protective film having the jitter characteristic not affected by the temperature.

In addition, when the second protective film 14b having the (2,0,0) crystal orientation is formed on the first protective film 14a having the (1,1,1) crystal orientation as in the present invention, as shown in FIG. As described above, the secondary electron emission coefficient γ may also be increased to lower the discharge start voltage.

The discharge gas injected into the plasma display panel collides with gas molecules to form priming particles, and the priming particles collide with the protective film 14 to generate secondary electrons.

Therefore, when the generation of secondary electrons in the passivation layer 14 is increased, discharge may occur even when a low voltage is applied, thereby improving driving efficiency of the plasma display panel. In general, when the secondary electron emission coefficient γ is increased by about 20%, the discharge start voltage may be lowered by about 10 V. Thus, when the protective films 14a and 14b having two crystal orientations are implemented as in the present invention, the discharge start voltage is achieved. The effect of lowering can be obtained.

Since the plasma display panel is a device driven under high voltage, power consumption is considerable for displaying a screen. As described above, when the secondary electron emission coefficient γ is increased to reduce the discharge start voltage, power consumption of the plasma display panel may be reduced.

The method of manufacturing the plasma display panel formed as described above will be described with reference to FIGS. 5A to 5B.

As shown in FIG. 5A, the first passivation layer 14a having the (1,1,1) crystal orientation has an oxygen atmosphere formed in the vacuum chamber, and then irradiates an MgO fillet (p) with an electron beam. A protective film is formed on the dielectric 13.

After the electrodes 11 and 12 and the dielectric 13 are sequentially formed on the substrate g (1 and 2), when the electron beam is irradiated onto the MgO fillet p, the crystal orientation of the (1,1,1) crystals is formed on the dielectric. A first protective film 14a having a film is deposited (3). In this case, the first passivation layer is formed to a thickness of 2000 kPa to 3000 kPa.

That is, when the electron beam is irradiated with the MgO fillet p using the electron gun 30, MgO is separated from the MgO fillet and deposited on the dielectric 13.

As described above, the method of forming the protective film having the (1,1,1) crystal orientation may be formed by an ion plating method, a thick film printing method, a sputtering method, etc. in addition to the above-described E-beam deposition method.

As shown in Fig. 5B, the second protective film 14b having the (2,0,0) crystal orientation is formed using the screen printing method.

According to the second protective film pattern to be formed on the substrate g on which the first protective film 14a is formed as described above, the screen mask sm having a mesh structure is covered and liquid MgO (m) containing MgO as a main component is applied. .

After application of the liquid MgO (m), the liquid MgO is scraped off using a mechanism such as squeeze (s) to form the second protective film 14b by printing.

As shown in FIG. 5B, the second protective film 14b having the daughter net structure is formed in the pattern of the screen mask sm used on the first protective film 14a formed by the E-beam deposition method. In this case, the second passivation layer is formed to a thickness of 5000 kPa to 6000 kPa.

As described above, the plasma display panel according to the present invention has been described with reference to the illustrated drawings, but the present invention is not limited by the embodiments and the drawings disclosed herein, and may be applied within the scope of the technical idea.

In the plasma display panel according to the present invention, the protective film is formed to have a (1,1,1) crystal orientation and a (2,0,0) crystal orientation in forming the protective film of the panel. It is effective to increase the efficiency of the plasma display panel, such as lowering the discharge start voltage of the plasma display panel by widening and improving the discharge coefficient and response speed of the secondary electrons.

Claims (8)

And a protective film having at least one or more crystal orientations. The method according to claim 1, And the passivation layer comprises a first passivation layer having a (1,1,1) crystal orientation and a second passivation layer having a (2,0,0) crystal orientation. The method according to claim 2, And the first passivation layer has a thickness within a range of 2000 kV to 3000 kV. The method according to claim 2, And the second passivation layer has a thickness within a range of 5000 kV to 6000 kV. The method according to claim 1, The protective film is formed by the E-beam deposition method. The method according to claim 1, The protective film is formed by a screen printing method. A first protective film formed on the substrate, And a second passivation layer having a crystal orientation different from that of the first passivation layer on the first passivation layer. The method according to claim 7, Wherein the first passivation layer is formed to a thickness within a range of 2000 mW to 3000 mW, and the second passivation layer is formed to a thickness within a range of 5000 mW to 6000 mW.

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