KR20070071553A - Apparatus and method for manufacturing display device - Google Patents

Abstract

An apparatus and a method for manufacturing a display device are provided to shorten the manufacturing time, by constituting the apparatus to include a coating member and a UV(Ultraviolet) irradiation member so as to continuously perform a coating process and a UV irradiation process. A coating member(20) applies a hardening solution containing a UV hardening agent on a display substrate to be coated through relative movement with the display substrate. A UV irradiation member(30) forms a passivation layer by hardening solution using UV rays while the UV irradiation member moves along the hardening solution through relative movement with the display substrate. A moving unit relatively moves the coating member with respect to the display substrate and the UV irradiation member with respect to the display substrate.

Description

Display apparatus manufacturing method and manufacturing method {APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE}

1 is a layout view of a display device manufactured by an apparatus for manufacturing a display device according to a first embodiment of the present invention;

2 is a cross-sectional view taken along the line II-II of FIG. 1;

3 and 4 are a perspective view and a front view of a manufacturing apparatus of a display device according to a first embodiment of the present invention, respectively;

5A and 5B are cross-sectional views sequentially illustrating a method of manufacturing a display device using a display device manufacturing device according to a first embodiment of the present invention, and

6 is a rear view of an apparatus for manufacturing a display device according to a second embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

1, 2: manufacturing apparatus of display device

20: coating member 22: storage unit

24: nozzle 26: curing solution

27: protective film 30, 31: UV-irradiation member

32: main body 34: LED fastening portion

36: LED 37: Lamp

38: lamp holder 40: distance measuring sensor

50: connection means 100: display device

150: liquid crystal display panel 200: thin film transistor substrate

202: non-display area 300: color filter substrate

400: COF 500: Circuit Board

600: anisotropic conductive film 700: sealant

800: liquid crystal layer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing apparatus and a manufacturing method of a display apparatus, and more particularly, to a manufacturing apparatus of a display apparatus for forming a protective film for protecting a signal line or the like provided in a display apparatus.

Recently, flat panel display devices such as liquid crystal displays or organic light emitting diodes (OLEDs) have been used in place of existing CRTs.

The liquid crystal display includes a liquid crystal display panel in which liquid crystal is injected between the thin film transistor substrate and the color filter substrate, and includes a driving chip and a circuit board (PCB) for applying a driving signal to the gate line and the data line, which are signal lines. It includes more.

The driving chip is electrically connected to the gate pad and the data pad, which are signal line pads provided on the liquid crystal display panel, specifically, in the non-display area outside the display area on the thin film transistor substrate.

The driving chip is usually mounted on a film, that is, connected to the signal line pad in a TAB-IC manner. Specific types of TAB-IC include a tape carrier package (TCP) having a driving chip attached to a polymer film, and a chip on film (COF) having a driving chip mounted on a flexible printed circuit board.

When a TAB IC is used, a lead connected to a driving chip and a signal line pad of a thin film transistor substrate are connected to each other through bonding using an anisotropic conductive film.

The method of bonding the lead and the signal line pad is as follows. First, an anisotropic conductive film is placed on the signal line pad of the thin film transistor substrate. Then, the lead of the driving chip is positioned to correspond to the signal line pad. At this time, the anisotropic conductive film is located between the signal line pad and the lead. Thereafter, when the signal line pad and the lead are pressed together, the conductive particles in the anisotropic conductive film are compressed to electrically connect the lead and the signal line pad.

The signal line pad electrically connected to the lead by the anisotropic conductive film is provided in a bar shape in the non-display area at regular intervals from the display area. When the anisotropic conductive film is attached to the upper part of the signal line pad due to the color filler substrate which is fixed to the thin film transistor substrate by the sealant, the anisotropic conductive part is located on the part of the signal line pad near the display area and the upper part of the non-display area near the sealant. The film will not adhere. This problem also occurs in the case of the COG (Chip On Glass) method, which transmits an electrical signal by directly mounting a driving chip with an anisotropic conductive film interposed between the input line and the output pad of the thin film transistor substrate. .

If a part of the signal line pad or the upper portion of the non-display area near the sealant is directly exposed to the outside, the signal line wiring of the metal line or the metal oxide formed in the non-display area of the thin film transistor substrate, the signal line wiring such as the signal line and the electrode, etc. There is a problem of corrosion. In order to solve this problem, a protective film including a silicon material is formed on a portion of the signal line pad exposed to the outside and the non-display area near the sealant.

Referring to the process of forming the protective film, first, a curing solution containing an ultraviolet curing agent is applied using a coating member along a portion of the signal line pad exposed to the outside of the liquid crystal display and an upper portion of the non-display area near the sealant. . Then, the process of curing the curing solution by moving to a device equipped with an ultraviolet irradiation member by irradiating ultraviolet rays to the curing solution.

In order to form the protective film, the application process and the ultraviolet irradiation process are performed separately at different locations, and thus, a large amount of travel time is required, and a work time is further increased because the display device stops moving during the irradiation process. In addition, since the vertical separation interval between the curing solution and the ultraviolet irradiation member is wide, it takes a lot of ultraviolet irradiation time for curing, and as a result, the manufacturing time of the display device increases, resulting in a decrease in manufacturing efficiency.

Accordingly, an object of the present invention is to provide a manufacturing apparatus and a manufacturing method of a display apparatus which can shorten the manufacturing time of the display apparatus and improve the manufacturing efficiency.

According to the present invention, there is provided a coating member for applying a curing solution including an ultraviolet curing agent to a portion requiring application of a display device substrate through relative movement with the display device substrate; An ultraviolet irradiation member which moves relative to the substrate for the display device along the applied curing solution and irradiates the curing solution with ultraviolet rays to cure the curing solution to form a protective film; It is achieved by an apparatus for manufacturing a display device, further comprising moving means for relatively moving the coating member, the display device substrate, and the ultraviolet irradiation member and the display device substrate, respectively.

The ultraviolet irradiation member is characterized in that it comprises an ultraviolet light source for emitting ultraviolet light.

The ultraviolet light source preferably includes at least one of an LED and a lamp.

The apparatus may further include a distance measuring sensor for measuring a vertical separation distance between the display device substrate and the ultraviolet irradiation member.

The apparatus may further include distance adjusting means for adjusting a vertical separation distance between the display device substrate and the ultraviolet irradiation member based on the measurement result of the distance measuring sensor.

The coating member and the ultraviolet irradiation member may maintain a predetermined interval and move relative to the display substrate.

The relative moving speed of the ultraviolet irradiation member and the substrate for the display device is preferably 50 to 100 mm / sec.

The irradiation time per unit area of the applied curing solution by the ultraviolet irradiation member is preferably 0.1 to 0.3sec.

On the other hand, according to the present invention, the step of applying a curing solution containing an ultraviolet curing agent to the portion requiring the application of the display device substrate by relative movement with the display device substrate; It is also achieved by a method of manufacturing a display device, comprising the step of irradiating ultraviolet light to the curing solution by using a UV irradiation member relative to the display device substrate along the applied curing solution.

The method may further include measuring a vertical separation distance between the display device substrate and the ultraviolet irradiation member between the coating step and the ultraviolet irradiation step.

The method may further include adjusting a vertical separation distance between the display device substrate and the ultraviolet irradiation member based on the measurement result of the vertical separation distance between the vertical distance measurement step and the ultraviolet irradiation step.

The ultraviolet irradiation member is characterized in that it comprises an ultraviolet light source for emitting ultraviolet light.

The ultraviolet light source preferably includes at least one of an LED and a lamp.

The coating member and the ultraviolet irradiation member may maintain a predetermined interval and move relative to the display substrate.

The relative moving speed of the ultraviolet irradiation member and the substrate for the display device is preferably 50 to 100 mm / sec.

The irradiation time per unit area of the applied curing solution by the ultraviolet irradiation member is preferably 0.1 to 0.3sec.

Hereinafter, the present invention will be described with reference to the accompanying drawings.

In various embodiments, like reference numerals refer to like elements, and like reference numerals refer to like elements in the first embodiment and may be omitted in other embodiments.

Prior to describing an apparatus for manufacturing a display device according to a first embodiment of the present invention, a display device manufactured by the manufacturing device will be described with reference to FIGS. 1 and 2. 1 is a layout view of a display device manufactured by an apparatus for manufacturing a display device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1. Note that the display device shown in the figure is a liquid crystal display device and a COF (chip on film) is used as the TAB-IC.

The liquid crystal display device 100 includes a liquid crystal display panel 150 including a thin film transistor substrate 200 and a color filter substrate 300, and a COF attached to a non-display area 202, which is an outer side of the thin film transistor substrate 200. 400 and a circuit board 500 connected to the COF 400. In addition, the liquid crystal display device 100 may include a liquid crystal layer 800 positioned between the thin film transistor substrate 200 and the color filter substrate 300. In some cases, the backlight unit may be disposed on the rear surface of the thin film transistor substrate 200. It may further include (not shown).

Hereinafter, the thin film transistor substrate 100 will be described with reference to a configuration for driving the data line 221 connected to the data pad 222, which is a gate line 211 connected to the gate pad 212. It can also be applied to the configuration for driving).

In the display area (not shown) of the thin film transistor substrate 200, a plurality of thin film transistors T disposed near the intersection of the gate line 211 and the data line 221 are formed. The thin film transistor T shown here is in the form of using five masks. The thin film transistor T receives a driving signal from the COF 400 through the gate pad 212 of the non-display area 202. The COF 400 connected to the gate pad 212 is connected to a circuit board 500 adjacent to the data pad 222 by a separate signal line (not shown). When the thin film transistor T is turned on according to the driving signal, a voltage is applied to the pixel electrode 247 connected thereto.

Gate lines 211, gate pads 212, and gate electrodes 215, which are gate wirings 211, 212, and 215, are formed on an insulating substrate 205 made of glass, plastic, or the like. The gate wirings 211, 212, and 215 may be formed in multiple layers to compensate for the disadvantages of each metal or alloy and to obtain desired physical properties. For example, it is to form a double layer using aluminum or an aluminum alloy as the lower layer and using chromium, molybdenum, molybdenum-tungsten or molybdenum-tungsten nitride as the upper layer.

The semiconductor layer 218 and the ohmic contact layer 219 are formed on the gate electrode 215, and the ohmic contact layer 219 is divided into two regions around the gate electrode 215.

The gate pad 212 extends the gate line 211 and is wider than the gate line 211.

The data line 221, the data pad 222, the source electrode 226, and the drain electrode 227, which are data lines, are formed on the gate insulating layer 216 or the ohmic contact layer 219. The data wires 221, 222, 226, and 227 may be formed in multiple layers to compensate for the disadvantages of each metal or alloy and to obtain desired physical properties.

The data pad 222 extends from the data line 221 and is wider than the data line 221.

The passivation layer 234 is formed on the data lines 221, 222, 226, and 227, and the pixel electrode 247 is electrically connected to the drain electrode 227 through the drain contact hole 235 formed in the passivation layer 234. Can be contacted. The pixel electrode 247 is made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

Looking at the color filter substrate 300 as follows.

The black matrix 320 and the color filter layer 330 are formed on the insulating substrate 305.

The black matrix 320 generally distinguishes between the red, green, and blue color filter layers 330, and serves to block direct light irradiation to the thin film transistor T. The black matrix 320 may be formed of a photosensitive organic material to which a black pigment is added. As the black pigment, carbon black or titanium oxide is used.

The color filter layer 330 is formed by repeating the red filter, the green filter, and the blue filter with the black matrix 320 as the boundary. The color filter layer 330 serves to impart color to light emitted from the backlight unit (not shown) and passed through the liquid crystal layer 800. The color filter layer 330 is usually made of a photosensitive organic material.

An overcoat layer 340 is formed on the color filter layer 330 and the black matrix 320 not covered by the color filter layer 330. The overcoat layer 340 serves to protect the color filter layer 330, and an acrylic epoxy material is commonly used.

The common electrode layer 350 is formed on the overcoat layer 34. The common electrode layer 35 is made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The common electrode layer 350 directly applies a voltage to the liquid crystal layer 800 together with the pixel electrode layer 247 of the thin film transistor substrate 200.

The liquid crystal layer 800 is formed in the space surrounded by the two substrates 200 and 300 and the edges of the two substrates 200 and 300 and surrounded by the sealant 700 for bonding the two substrates 200 and 300 to each other. The alignment state changes according to the driving signal of the COF 400.

Hereinafter, the connection between the COF 400, the liquid crystal panel 150, and the circuit board 500 will be described.

The COF 400 includes a wiring layer such as an input lead 404 and an output lead 402, a driving chip 403, and a film 401 on which they are mounted.

The driving chip 403 is connected to both the input lead 404 and the output lead 402. The input lead 404 is connected to a signal line pad (not shown) of the circuit board 500, and the output lead 402 is connected to the gate pad 212 and the data pad 222, respectively. Each of the leads 402 and 404 and the signal line pads 212 and 222 are in electrical contact with each other by an anisotropic conductive film (ACF) 600.

 The anisotropic conductive film 600 is composed of an epoxy resin layer 601 excellent in insulation and adhesiveness and conductive particles 602 dispersed therein. Each of the leads 402 and 404 and the signal line pads 212 and 222 is electrically bonded to each other by the conductive particles 602 in contact with the leads 402 and 404 and the signal line pads 212 and 222. The peripheral area of the leads 402 and 404 and the signal line pads 212 and 222 may be insulated by the epoxy resin layer 601 which is a main component of the anisotropic conductive film 600. Here, the anisotropic conductive film 600 also includes a moisture absorbent (not shown) dispersed in the resin layer 601. The signal line wirings 211, 212, 215, 221, and 222 are more effectively prevented from infiltrating moisture into the thin film transistor substrate 200 by the epoxy resin layer 601 and the moisture absorbent (not shown) of the anisotropic conductive film 600. , 226, 227) can be prevented from being corroded by moisture as much as possible.

In addition, the liquid crystal display 100 further includes a sealant 700 provided between the display area of the thin film transistor substrate 200 and the color filter substrate 300 to bond the thin film transistor substrate 200 and the color filter substrate 300 to each other. Include.

An edge portion of the color filter substrate 300, which is fixed to the thin film transistor substrate 200 of the liquid crystal display device 100 by the sealant 700 and is disposed to face the edge, is fixed to the outside of the sealant 700. Therefore, in the process of attaching the anisotropic conductive film 600 to the upper part of the signal line pads 212 and 222 formed on the thin film transistor substrate 200, the edge portion of the color filter substrate 300 interferes with the signal line close to the display area. The anisotropic conductive film 600 is not adhered to a portion of the pads 212 and 222 and an upper portion of the non-display area ('A' region) near the sealant 700. As a result, moisture is penetrated into the thin film transistor substrate 200 and the signal line wirings 211, 212, 215, 221, 222, 226, and 227 are sealed from the outside in the 'A' area to prevent corrosion of the signal lines. It is necessary to form a protective film 27 made of a silicon material and cured by ultraviolet light, and the present invention relates to a manufacturing apparatus for forming such a protective film 27.

Hereinafter, an apparatus for manufacturing a display device according to a first exemplary embodiment of the present invention will be described with reference to FIGS. 3 and 4. 3 and 4 are a perspective view and a front view of a manufacturing apparatus of a display device according to a first embodiment of the present invention, respectively.

The apparatus 1 for manufacturing a display device according to the first exemplary embodiment of the present invention includes a fixing part 10, an application member 20, an ultraviolet irradiation member 30, a distance measuring sensor 40, and a connecting means 50. It comprises a moving means (not shown) connected to.

The fixing part 10 fixes the coating member 20, the ultraviolet irradiation member 30, and the distance measuring sensor 40 at regular intervals on the back, and is connected to a moving means (not shown) at the center of the upper surface. The moving means coupling part 50 is being fixed. Accordingly, the coating member 20, the ultraviolet irradiation member 30, and the distance measuring sensor 40, which are attached to the fixed portion 10 by the driving means (not shown), are formed on the thin film transistor substrate of the liquid crystal display panel 150. Relative movement with respect to 200.

The application member 20 is composed of a reservoir 22 and a nozzle 24.

The storage unit 22 stores a curing solution 26 containing a composition of an ultraviolet curing agent and a silicone material that forms the protective film 27 through curing, and the curing solution 26 is applied to the nozzle 24 for application. Supply.

The nozzle 24 receives the curing solution 26 stored in the storage unit 22 and moves along the area 'A' on the thin film transistor substrate 200 by driving a moving means (not shown). The curing solution 26 is applied to the area 'A' of the line 200.

The ultraviolet irradiation member 30 is fixed to the fixing portion 10 at regular intervals from the coating member 20, and is fastened to the main body portion 32, the LED fastening portion 34 and the LED fastening portion 34. LED 36 is composed.

The main body 32 receives and fixes a portion of the LED fastening portion 34 therein, and moves the LED fastening portion 34 to the outside so that the LED 36 can be approached and spaced apart from the liquid crystal display panel 250. Expand or contract.

The LED fastening part 34 fastens the LED 36 as a point light source, and supplies an external power source to the LED 36 so that the LED 36 can emit light.

The LED 36 is a point light source that emits ultraviolet rays, and is spaced at the rear of the coating member 20 along the curing solution 26 applied by the coating member 20 in the 'A' region of the thin film transistor substrate 200. With relative movement with respect to the thin film transistor substrate 200, ultraviolet rays are irradiated to the curing solution 26 to cure the curing solution 26 to form a cured protective film 27.

In other words, by providing the application member 20 and the ultraviolet irradiation member 30 disposed at a constant interval behind the protective member 27 by the curing of the curing solution 26 almost simultaneously with the application of the curing solution 26. Can be formed. Therefore, the manufacturing time of the display device 100 may be shortened as compared with the application process and the ultraviolet irradiation process performed at different locations to form the protective layer 27. In addition, by reducing the irradiation interval between the curing solution 26 and the ultraviolet irradiation member 30 to increase the ultraviolet irradiation intensity it can shorten the curing time to shorten the manufacturing time of the display device 100.

The distance measuring sensor 40 used is provided between the application member 20 and the ultraviolet irradiation member 30.

When the distance measuring sensor 40 measures the distance to the applied curing solution 26 and transmits the measurement result to the control unit (not shown), the control unit (not shown) based on the LED of the ultraviolet irradiation member 30 By expanding or contracting the fastening part 34, the intensity of ultraviolet light emitted from the LED 34 to the curing solution 26 can be adjusted. By correcting the height error of the thin film transistor substrate 200 of each display device 100 seated on the lower part of the manufacturing apparatus 1 for manufacturing, by a constant distance at a constant distance with respect to the applied curing solution 26 Ultraviolet rays can be irradiated to make the characteristics of the protective film 27 cured uniform.

A moving means (not shown) connected to the fixed portion 10 by the moving means connecting portion 50 moves the coating member 20 and the ultraviolet irradiation member 30 relative to the substrate 200 for the display device, respectively. . The moving means (not shown) may be provided by known means such as a cylinder or a motor.

The ultraviolet irradiation member 30 in the moving means (not shown) is preferably moved at a speed of 50 to 100mm / sec with respect to the substrate 200 for the display device. The reason is that if the moving speed is too fast, the curing solution 26 is not hardened properly, and if it is too long, the manufacturing time is increased. For the same reason, the irradiation time per unit area of the curing solution by the ultraviolet irradiation member 30 is preferably 0.1 to 0.3.

According to the manufacturing apparatus 1 of the display device according to the first embodiment of the present invention, the coating process and the ultraviolet irradiation process for forming the protective film 27 are performed in one place at about the same time rather than being performed separately at different places. You lose. Therefore, the manufacturing time of the display device 100 can be shortened to improve the manufacturing efficiency.

Hereinafter, a method of manufacturing a display device using the display device manufacturing apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 5A to 5B. 5A and 5B are cross-sectional views sequentially illustrating a method of manufacturing a display device using the manufacturing apparatus of the display device according to the first embodiment of the present invention, respectively.

A method of manufacturing a display device using the display device manufacturing apparatus according to the first embodiment of the present invention first requires the application of the thin film transistor substrate 200 of the display device 100 mounted on a seating portion (not shown). The application member 20 starts by applying the curing solution 26 containing the ultraviolet curing agent by the driving means (not shown) in the area 'A'.

First, the coating member 20 is applied to the 'A' region on the long side of the thin film transistor substrate 200 to apply the curing solution 26 through the nozzle 24 from one end to the other end.

Thereafter, the fixing member 10 moves relative to the application member 10 along the cured solution to which the ultraviolet irradiation member 30, which is arranged at a rearward in a direction opposite to the relative movement direction, is applied. Ultraviolet rays irradiated from 36 harden the curing solution 26 to form the protective film 27 directly in the 'A' region on the long side of the thin film transistor substrate 200.

After the irradiation of ultraviolet rays, the manufacturing apparatus 1 is moved back to its original position.

Then, the mounting part (not shown) is rotated 90 degrees to irradiate the coating member 20 and ultraviolet light of the manufacturing apparatus 1 with respect to the area 'A' on the short side of the thin film transistor substrate 200 of the display device 100. The protective film 27 is formed by applying and curing while the member 30 moves relatively at regular intervals.

Meanwhile, if necessary, measuring the vertical separation distance between the display device substrate 200 and the ultraviolet irradiation member 30 using the distance measuring sensor 40 between the coating step and the ultraviolet irradiation step, and the measurement result of the vertical separation distance. The method may further include adjusting a vertical separation distance between the display device substrate 200 and the ultraviolet irradiation member 30 based on the control.

As a result, ultraviolet rays of a predetermined intensity may be irradiated to the cured solutions 26 applied to the respective display device substrates 200 at a predetermined distance so that the characteristics of the protective film 27 to be cured may be uniform.

In the present embodiment, a plurality of apparatuses for manufacturing a display device 1 may be provided. That is, one manufacturing apparatus 1 may be disposed above the long side of the thin film transistor substrate 200, and one manufacturing apparatus 1 may also be disposed above the short side. As a result, the coating and UV irradiation processes are simultaneously applied to each 'A' region of the long side and the short side of the thin film transistor substrate 200, thereby further shortening the manufacturing time. In addition, two manufacturing apparatuses 1 may be arranged in the upper part of the long side, and one manufacturing apparatus 1 may be arranged in the upper part of the short side.

Hereinafter, an apparatus for manufacturing a display device according to a second exemplary embodiment of the present invention will be described with reference to FIG. 6. 6 is a rear view of an apparatus for manufacturing a display device according to a second embodiment of the present invention.

The manufacturing apparatus 2 of the display device according to the second exemplary embodiment of the present invention is provided with a lamp 37 which is a line light source for irradiating ultraviolet rays by the ultraviolet irradiation member 31 and a lamp holder 38 for fixing the lamp 37. Except for that, it is the same as the manufacturing apparatus 1 of the display device which concerns on 1st Embodiment of this invention. That is, as the light source for irradiating ultraviolet rays, not only the LED 36 which is a point light source but also a small lamp 37 capable of irradiating ultraviolet rays with a linear light source may be used.

The manufacturing apparatus 2 of the display device according to the second embodiment of the present invention also has the same effect as the manufacturing apparatus 1 of the display device according to the first embodiment of the present invention.

The above embodiments can be variously modified. In the above embodiment, the coating member 20 and the ultraviolet irradiation member 30 is fixed at regular intervals by the fixing portion 10 so that the coating and irradiation process is made at substantially the same time at regular intervals, but the fixing portion 10 Can be driven separately. In addition, although the display device 100 has been described with reference to a liquid crystal display device in the above embodiment, the present invention is not limited thereto, and the display device 100 may be applied to a display device such as an OLED or a PDP. On the other hand, unlike the above embodiment, the mounting method of the driving chip of the liquid crystal display device can be applied to the case of a tape carrier package (TCP) with TAB-IC and a chip on film (COG) rather than the TAB-IC mounting method. Do.

In addition, the use of the protective film 27 is not necessarily formed to prevent the occurrence of corrosion due to moisture or the like in the signal line pads 212 and 222 and the signal lines 211 and 221 of the non-display area. That is, of course, even when the protective film 27 is formed to prevent corrosion or sealing of other parts, the manufacturing apparatus according to the present invention can be used.

Although some embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that modifications may be made to the embodiment without departing from the spirit or spirit of the invention. . Accordingly, the scope of the invention will be defined by the appended claims and equivalents thereof.

As described above, according to the present invention, there is provided a manufacturing apparatus and a manufacturing method of a display apparatus which can shorten the manufacturing time of the display apparatus and improve the manufacturing efficiency.

Claims (16)

An application member for applying a curing solution containing an ultraviolet curing agent to a portion requiring application of the display device substrate through relative movement with the display device substrate; An ultraviolet irradiation member which moves relative to the substrate for the display device along the applied curing solution and irradiates the curing solution with ultraviolet rays to cure the curing solution to form a protective film; And moving means for relatively moving said coating member, said display device substrate, and said ultraviolet irradiation member and said display device substrate, respectively. The method of claim 1, The ultraviolet irradiation member is an apparatus for manufacturing a display device, characterized in that it comprises an ultraviolet light source for emitting ultraviolet light. The method of claim 2, The ultraviolet light source includes at least one of an LED and a lamp. The method according to any one of claims 1 to 3, And a distance measuring sensor for measuring a vertical separation distance between the display device substrate and the ultraviolet irradiation member. The method of claim 4, wherein And a distance adjusting means for adjusting a vertical separation distance between the display device substrate and the ultraviolet irradiation member based on the measurement result of the distance measuring sensor. The method of claim 5, And said coating member and said ultraviolet irradiation member move at a constant interval and move relative to said display substrate. The method of claim 6, And a relative movement speed of the ultraviolet irradiation member and the substrate for the display device is 50 to 100 mm / sec. The method of claim 6, And an irradiation time per unit area of the applied curing solution by the ultraviolet irradiation member is 0.1 to 0.3 sec. Applying a curing solution containing an ultraviolet curing agent to a portion requiring application of a display device substrate by relative movement with the display device substrate; And irradiating ultraviolet rays to the curing solution using an ultraviolet irradiation member while moving relative to the substrate for the display device along the applied curing solution. The method of claim 9, Between the applying step and the ultraviolet irradiation step, And measuring a vertical separation distance between the display device substrate and the ultraviolet irradiation member. The method of claim 10, Between the vertical distance measurement step and the ultraviolet irradiation step, And adjusting a vertical separation distance between the display device substrate and the ultraviolet irradiation member based on the measurement result of the vertical separation distance. The method according to any one of claims 9 to 11, The ultraviolet irradiation member is a manufacturing method of a display device characterized in that it comprises an ultraviolet light source for emitting ultraviolet light. The method of claim 12, The ultraviolet light source includes at least one of an LED and a lamp. The method of claim 13, And the coating member and the ultraviolet ray irradiation member maintain a constant distance and move relative to the substrate for the display device. The method of claim 14, The relative movement speed of the ultraviolet irradiation member and the substrate for a display device is 50 to 100mm / sec manufacturing method of the display device. The method of claim 14, The irradiation time per unit area of the applied curing solution by the ultraviolet irradiation member is a manufacturing method of the display device, characterized in that 0.1 to 0.3sec.

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