KR20070056318A - Liquid crystal display device and method of manufacturing the same - Google Patents

Abstract

An LCD(Liquid Crystal Display) and a method for manufacturing the same are provided to prevent the push-down defect, by forming a first column spacer contacted with a lower substrate and a second column spacer distanced from the lower substrate so that the first column spacer is restored to an original state even though the first column spacer is pushed down. A first substrate(200) and a second substrate(100) face each other. A first column spacer(50a) is formed on the second substrate and contacted with the first substrate. A second column spacer(50b) is formed on the second substrate and distanced from the first substrate, wherein the second column spacer has the same height as the first column spacer. A liquid crystal layer is formed between the first substrate and the second substrate. A spacer groove(52) is formed in the first substrate correspondingly to the second column spacer.

Description

Liquid Crystal Display Device and method of manufacturing the same

1 is an exploded perspective view showing a general liquid crystal display device

2 is a plan view illustrating a liquid crystal display device having a column spacer according to the related art.

3 is a structural cross-sectional view taken along line II ′ of FIG. 2.

4 is a cross-sectional view schematically illustrating a protrusion structure of the liquid crystal display device.

5 is a schematic view of a liquid crystal display device having a spacer hole according to the present invention;

6 is a plan view of a liquid crystal display according to a first exemplary embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along line II-II ′ of FIG. 6.

8A through 8D are cross-sectional views illustrating a method of forming drain contact holes and spacer holes in a liquid crystal display according to an exemplary embodiment of the present invention.

9 is a plan view of a liquid crystal display according to a second exemplary embodiment of the present invention.

* Description of the symbols showing the main parts of the drawings

100 second substrate 31 black matrix layer

34: common electrode 200: first substrate

41 gate line 41a gate electrode 42 data line 42a source electrode 42b drain electrode 43 pixel electrode

45 gate insulating film 46 protective film 47 common line 52 spacer hole 55 liquid crystal layer 50a, 50b column spacer

The present invention relates to a liquid crystal display device and a manufacturing method, and more particularly, to a liquid crystal display device and a manufacturing method that can prevent the failure of pressing.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELD), and vacuum fluorescent (VFD) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is the most widely used as the substitute for CRT (Cathode Ray Tube) for mobile image display device because of its excellent image quality, light weight, thinness, and low power consumption. In addition to the use of the present invention has been developed in various ways such as a television and a computer monitor for receiving and displaying broadcast signals.

In order to use such a liquid crystal display as a general screen display device in various parts, it is a matter of how high quality images such as high definition, high brightness and large area can be realized while maintaining the characteristics of light weight, thinness and low power consumption. Can be.

Hereinafter, a liquid crystal display according to the related art will be described with reference to the accompanying drawings.

1 is an exploded perspective view showing a general liquid crystal display.

As shown in FIG. 1, a liquid crystal display device includes a liquid crystal injected between a first substrate 1 and a second substrate 2 bonded to each other with a predetermined space, and between the first substrate 1 and the second substrate 2. It consists of layer (3).

In more detail, the first substrate 1 has a plurality of gate lines 4 in one direction and constant in a direction perpendicular to the gate lines 4 at regular intervals to define the pixel region P. FIG. A plurality of data lines 5 are arranged at intervals. In addition, a pixel electrode 6 is formed in each pixel region P, and a thin film transistor T is formed at a portion where the gate line 4 and the data line 5 cross each other, so that the thin film transistor is formed. The data signal of the data line is applied to each pixel electrode according to the signal of the gate line.

In addition, a black matrix layer 7 is formed on the second substrate 2 to block light in portions other than the pixel region P, and portions R corresponding to the respective pixel regions are formed to express colors. , G, B color filter layers 8 are formed, and a common electrode 9 for realizing an image is formed on the color filter layers 8.

In the liquid crystal display as described above, the liquid crystal layer 3 formed between the first and second substrates 1 and 2 is oriented by an electric field formed between the pixel electrode 6 and the common electrode 9, The amount of light passing through the liquid crystal layer 3 may be adjusted according to the degree of alignment of the liquid crystal layer 3 to express an image.

Such a liquid crystal display is called a twisted nematic (TN) mode liquid crystal display, and the TN mode liquid crystal display has a disadvantage of having a narrow viewing angle, and an in-plane switching (IPS) mode to overcome the disadvantage of the TN mode. Liquid crystal display devices have been developed.

In the IPS mode liquid crystal display, a pixel electrode and a common electrode are formed parallel to each other at a predetermined distance in a pixel area of the first substrate so that a horizontal electric field is generated between the pixel electrode and the common electrode and the horizontal electric field is generated. This is to align the liquid crystal layer.

Meanwhile, spacers are formed between the first and second substrates of the liquid crystal display device formed as described above to maintain a constant gap between the liquid crystal layers. Such spacers are divided into ball spacers or column spacers according to their shape.

The ball spacer has a spherical shape, is distributed and manufactured on the first and second substrates, the movement is relatively free even after the bonding of the first and second substrates, and the contact area with the first and second substrates is small.

On the other hand, the column spacer is formed in the array process on the first substrate or the second substrate, it is fixed is formed in a column shape having a predetermined height on a predetermined substrate. Therefore, the contact area with the 1st, 2nd board | substrate is relatively large compared with a ball spacer.

FIG. 2 is a plan view illustrating a liquid crystal display device having a column spacer according to the related art, and FIG. 3 is a cross-sectional view taken along line II ′ of FIG. 2.

2 and 3, in the array area of the conventional liquid crystal display device, the gate line 4 and the data line 5 are arranged perpendicularly to each other to define the pixel area, and the respective gate lines 4 are arranged. ) And a thin film transistor TFT are formed at a portion where the data line 5 crosses each other, and a pixel electrode 6 is formed in each pixel region. In addition, column spacers 20 are formed to maintain a cell gap at regular intervals. In FIG. 2, one column spacer 20 is disposed every three subpixels, that is, every one pixel (one pixel, R, G, and B subpixels constitute one pixel). .

Here, the column spacer 20 is formed in a portion corresponding to the upper side of the gate line 4, as shown in FIG. That is, the gate line 4 is formed on the first substrate 1, the gate insulating layer 15 is formed on the entire surface of the substrate including the gate line 4, and the passivation layer 16 is formed on the gate insulating layer 15. Is formed.

The second substrate 2 includes a black matrix layer 7 for covering non-pixel regions (gate lines, data lines, and thin film transistor regions) other than the pixel region, and a color filter substrate including the black matrix layer 7. A color filter layer 8 formed by corresponding R, G, and B pigments in turn on each of the pixel regions and a common electrode 14 formed on the entire surface of the second substrate 2 including the color filter layer 8 are formed on (2). Is formed.

The column spacer 20 is formed on the common electrode 14 of the portion corresponding to the gate line 4 so that the two substrates 1 and 2 are positioned so that the column spacer 20 is positioned on the gate line 4. Are coalesced.

However, the following problem occurs in the liquid crystal display device in which the column spacer is formed as described above.

In the conventional liquid crystal display including the column spacer, when the surface of the liquid crystal panel 10 is touched in a predetermined direction by using a hand or other object, spots are generated at the touched portion. Such spots are referred to as spot spots generated at the time of touch, and are referred to as touch spots, and are also referred to as touch defects because spots are observed on the screen. Such a touch failure is considered to be large because the contact area between the column spacer 20 and the first substrate 1 facing the column spacer 20 is larger than the structure of the previous ball spacer. That is, since the column spacer 20 formed in a cylindrical shape compared to the ball spacer has a large contact area with the first substrate 1, after being shifted between the first and second substrates 1 and 2 due to the touch, Because it takes a long time to restore to the original state, the stain remains until the original state is restored.

Accordingly, an object of the present invention is to provide a liquid crystal display device and a manufacturing method which can prevent touch defects, which are devised to solve the above problems.

The liquid crystal display according to the present invention for achieving the above object is a first column spacer facing each other, the first column spacer formed on the second substrate and in contact with the first substrate, the second substrate And a second column spacer formed on the same height as the first column spacer and spaced apart from the first substrate, and a liquid crystal layer formed between the first substrate and the second substrate.

Preferably, a spacer hole is formed on the first substrate to correspond to the second column spacer.

The first substrate includes a black matrix layer formed on a predetermined portion on the first substrate and the color filter layer formed on the first substrate including the black matrix layer.

The first substrate further includes a common electrode formed on an entire surface of the first substrate including the color filter layer and the black matrix layer.

The second substrate may include a gate line and a data line intersecting each other vertically on the second substrate to define a pixel region, a thin film transistor formed at an intersection of the gate line and the data line, and between the gate line and the data line. A gate insulating film interposed between the layers, a pixel electrode formed in the pixel region, and a protective film interposed between the data line and the pixel electrode.

The second substrate further includes a common electrode formed to alternate with the pixel electrode.

The spacer hole may be formed by removing a portion of the gate insulating layer and the protective layer.

Preferably, the spacer hole is formed to be wider than the width of the first column spacer.

According to an embodiment of the present invention, a method of manufacturing a liquid crystal display device may include preparing first and second substrates facing each other, forming a gate line and a gate electrode on the first substrate, and a first including the gate line and the gate electrode. Forming a gate insulating film on the substrate; forming a semiconductor layer on the gate insulating film above the gate electrode; and forming a data line in a direction crossing the gate line at a predetermined portion on the gate insulating film including the semiconductor layer. Forming a pixel region and forming a source electrode protruding from the data line and a drain electrode spaced apart from the predetermined line; forming a passivation layer on the entire surface of the gate insulating film including the data line and the source / drain electrode; The protective film and the gate insulating film of the site are removed to expose the drain electrode. Forming a drain contact hole, forming a spacer hole in a predetermined region above the gate line, forming a pixel electrode in the pixel region to be in contact with the drain electrode through the drain contact hole, and the second substrate Forming a color filter array on the substrate, forming a first column spacer to be in contact with the first substrate, and simultaneously forming a second column spacer to correspond to the spacer hole, a liquid crystal between the first and second substrates Forming a layer and bonding the first and second substrates together.

The spacer hole may be formed to be wider than the width of the second column spacer. The forming of the drain contact hole and the spacer hole may include forming a photoresist on the passivation layer, exposing the passivation layer on the drain electrode while leaving a portion of the photoresist at a position corresponding to the second column spacer. Exposing and developing a photoresist; etching the exposed protective layer using the photoresist as a mask to form a drain contact hole; and performing an ashing process on the photoresist to correspond to the second column spacer. The method may further include exposing a passivation layer, and patterning the exposed passivation layer and the gate insulating layer using the ashed photoresist as a mask.

Exposing and developing the photoresist is preferably performed using a diffraction mask.

The spacer hole may be formed by removing a portion of the gate insulating layer and the protective layer.

The color filter array may include forming a black matrix layer on the second substrate, forming a color filter layer on a second substrate on which the black matrix layer is formed, and the second substrate including the black matrix layer and a color filter layer. Forming a common electrode on the front surface.

According to still another aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, the method comprising: preparing a first and a second substrate facing each other; Forming a protruding common electrode, forming a gate insulating film on the first substrate including the gate line and the gate electrode, forming a semiconductor layer on the gate insulating film to cover the gate electrode; Defining a pixel region by forming a data line in a direction crossing the gate line on a predetermined portion of the gate insulating layer including a semiconductor layer, and forming a source electrode protruding from the data line and a drain electrode spaced apart from the predetermined interval And a protective film on the entire gate insulating film including the data line and the source / drain electrodes Forming a drain contact hole exposing the drain electrode by removing the passivation layer and the gate insulating layer of a predetermined portion, and forming a spacer hole in a predetermined region above the gate line; Forming a pixel electrode in the pixel region to be in contact with the drain electrode, forming a color filter array on the second substrate, and forming a first column spacer to be in contact with the first substrate while simultaneously corresponding to the spacer hole Forming a second column spacer so as to form a liquid crystal layer between the first and second substrates; and bonding the first and second substrates to each other.

The spacer hole may be formed to be wider than the width of the second column spacer.

The forming of the drain contact hole and the spacer hole may include forming a photoresist on the passivation layer, exposing the passivation layer on the drain electrode and simultaneously leaving a portion of the photoresist at a position corresponding to the second column spacer. Exposing and developing the resist; etching the exposed protective layer using the photoresist as a mask to form a drain contact hole; and performing an ashing process on the photoresist, where the second column spacer corresponds to Exposing the passivation layer, and patterning the exposed passivation layer and the gate insulating layer using the ashed photoresist as a mask.

Exposing and developing the photoresist is preferably performed using a diffraction mask.

The spacer hole may be formed by removing a portion of the gate insulating layer and the protective layer.

The color filter array may include forming a black matrix layer on the second substrate and forming a color filter layer on the second substrate on which the black matrix layer is formed.

One of the efforts to improve the touch failure is a liquid crystal display device having a projection structure.

4 is a cross-sectional view schematically illustrating the protrusion structure of the liquid crystal display device.

As shown in FIG. 4, the liquid crystal display of the present invention including the protrusion structure includes a first substrate 70 and a second substrate 60 facing each other, and a column spacer 80 formed at a predetermined portion on the second substrate 60. ) And a protrusion 85 formed on the first substrate 70 to have a relatively small volume relative to the upper surface (protrusion corresponding surface) of the column spacer 80 and to partially contact the column spacer 80. And a liquid crystal layer (not shown) filled between the first and second substrates 60 and 70.

As such, when the protrusion 85 is included, the first substrate 60 or the second substrate 60 may be touched when the surface of the first substrate 60 or the second substrate 70 is touched (or rubbed in one direction). When the substrate 70 is shifted relative to the counter substrate, the contact area between the column spacer 80 and the protrusion 85 is formed on the upper surface of the column spacer 80 (the second substrate 60 having the column spacer formed thereon). In this case, the surface corresponding to the column spacer on the surface of the second substrate 60 is reduced to the upper area of the relatively small protrusion 85 as compared to the lower surface, and the friction area decreases. The friction force between the column spacer 80 and the second substrate 70 that is the opposite substrate is reduced. Therefore, when the first substrate 60 or the second substrate 70 is pushed in one direction by the touch, restoration to the original state is easy. Therefore, touch defects that may occur in the liquid crystal display device to which the protrusion structure is applied may be improved.

In the structure including the protrusions 85, when the first and second substrates 60 and 70 are bonded to each other, the change of the shape of the column spacer 80 corresponding to the protrusions 85 will be described. The force of 80 is concentrated only on the portion corresponding to the protrusion 85 so that a color filter layer (not shown) and a black matrix layer (not shown), which are lower layers including the column spacer 80, are pressed together. As such, when a single or a plurality of layers are pressed, when the cell gap is increased by thermal expansion of the liquid crystal when the liquid crystal panel is placed in a high temperature environment, the column spacer 80 and the following layers are pressed again to the extent that the layers are pressed. It can be restored to the original state and can support between the first and second substrates 60 and 70, so that the gravity failure caused by the liquid crystal sag downward can be improved as compared to the structure without the projections.

However, in the case of using a projection having a small volume and surface area corresponding to the center of such a column spacer, when the column spacer and the lower layers are pressed by the projection, the portion of the column spacer 80 to which the projection 85 corresponds. Is concentrated and the contact pressure between the first and second substrates 60 and 70 becomes excessive at the time of contact (when the pressing force on the rear surface of one of the first and second substrates is excessive), The column spacer 80 is pressed by the protrusions 85 and deforms, which does not return to its original state.

Hereinafter, it looks at the embodiments according to the present invention that solved the problems of the above-described pressing failure (pegging failure) and the like.

5 is a schematic diagram of a liquid crystal display device having a spacer hole according to the present invention.

As shown in FIG. 5, the liquid crystal display of the present invention having the spacer hole is provided at a predetermined portion on the first substrate 200 and the second substrate 100 and the second substrate 100 facing each other. The first column spacer 50a and the second column spacer 50b, which are formed at the same height at intervals, and the second column spacer 50b is wider than the width of the second column spacer at a predetermined position at a corresponding position. And a liquid crystal layer (not shown) filled between the spacer hole 52 formed between the first and second substrates 100 and 200.

The spacer hole 52 is formed by patterning a predetermined thickness of the gate insulating layer 45 formed on the glass substrate 40, which is the first substrate 200, and a predetermined position of the passivation layer 46. Only a predetermined thickness of the gate insulating layer 45 is removed so that the gate electrode 41 positioned at is not exposed.

When the spacer hole 52 is formed, when no pressure is applied to the surface of the first substrate 100 or the second substrate 200, the first column spacer 50a may be formed on the second substrate 200. The second column spacer 50b, which is in contact with the passivation layer 46 and corresponds to the spacer hole 52, has a gap between the spacer hole 52 and the second column spacer relative to the first column spacer 50a. (gap) is maintained.

Meanwhile, the lower area of the first column spacer 50a in contact with the second substrate 200 is formed to be the same as or similar to the lower area of the protrusion in the liquid crystal display device having the protrusion structure.

Therefore, according to the present invention having the spacer hole, when the pressure is applied to the surface of the first substrate 100 or the second substrate 200, the second column spacer 50b is inserted into the spacer hole 52. At the same time, even if the first column spacer 50a in contact with the second substrate is pressed, the first column spacer may be restored to its original state, thereby preventing the pressing phenomenon.

In addition, the lower area of the first column spacer in contact with the second substrate is formed to be the same or similar to the lower area of the protrusion in the liquid crystal display device having the protrusion structure, so that the frictional force with the second substrate, which is the opposite substrate, is reduced. It can be reduced to similarly have a reduction in touch failure which is an effect that can be obtained in the liquid crystal display device to which the projection structure is applied.

On the other hand, in the liquid crystal display device to which the projection structure is applied, the film thickness nonuniformity is generated by the formation of the projection structure, and the probability of occurrence of rubbing scratches generated at the nonuniformity of the film thickness during the alignment film rubbing process is increased. However, as in the present invention, the liquid crystal display device to which the spacer hole is applied does not have a protrusion so that the uniformity of the film thickness is secured, thereby reducing the occurrence probability of rubbing scratches.

6 is a plan view of a liquid crystal display according to a first exemplary embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along line II-II 'of FIG. 6.

6 and 7, the liquid crystal display according to the first exemplary embodiment of the present invention is driven in the IPS mode, and the first substrate 100 and the second substrate 200 facing each other, and The liquid crystal layer 55 is filled between the first and second substrates.

A black matrix layer 31 is formed on the color filter substrate, which is the first substrate 100, to block light of portions (gate lines, data line regions, and thin film transistor regions) other than the pixel region on the glass substrate 30. R, G, and B color filter layers (not shown) are formed to correspond to the pixel regions, and the front overcoat layer is formed on the black matrix layer 31 and the color filter layer (not shown). 33 is formed.

The first column spacer 50a and the second column spacer 50b are formed of a material such as a photosensitive resin on a predetermined portion of the overcoat layer 33.

The first column spacer 50a and the second column spacer 50b are formed at the same height.

The TFT substrate, which is the second substrate 200, which faces the color filter substrate 100, crosses the glass substrate 70 vertically and defines a plurality of gate lines 41 and data lines 42 defining pixel regions. The common line 47 is formed in a direction parallel to the gate line. The common line 47 protrudes from the common line 47 to each pixel area to form a common electrode 47a at a predetermined interval. A thin film transistor (TFT) having source / drain electrodes 42a and 42b is formed at a portion where the gate line 41 and the data line 42 cross each other, and the drain electrode 42b of the thin film transistor is formed. Pixel electrodes 43 are formed in the pixel area between the common electrodes in parallel with the common electrode 47a.

In addition, a spacer hole 52 is formed at a predetermined portion of a position where the second column spacer 50a corresponds to the gate line of the first substrate. The width of the spacer hole 52 is formed wider than the width of the corresponding second column spacer 50a.

The spacer hole 52 is formed by patterning a predetermined thickness of the gate insulating layer 45 formed on the glass substrate 40, which is the first substrate 200, and a predetermined position of the passivation layer 46. Only a predetermined thickness of the gate insulating layer 45 is removed so that the gate electrode 41 positioned at is not exposed.

When the spacer hole 52 is formed, when no pressure is applied to the surface of the first substrate 100 or the second substrate 200, the first column spacer 50a may be formed on the second substrate 200. The second column spacer 50b, which is in contact with the passivation layer 46 and corresponds to the spacer hole 52, has a gap between the spacer hole 52 and the second column spacer relative to the first column spacer 50a. (gap) is maintained.

In addition, the lower area of the first column spacer 50a in contact with the second substrate is formed to be the same as or similar to the lower area of the protrusion in the liquid crystal display device having the protrusion structure.

Here, the manufacturing of the thin film transistor, the pixel electrode and the spacer hole will be described in detail.

After depositing a metal material such as Mo, Al or Cr on the glass substrate 40 and patterning the metal material through a photolithography process, a plurality of gate lines 41, gate electrodes 41a and the common line 47 and the common electrode 47a are formed at the same time.

The gate electrode 41a is formed at a predetermined position of the pixel area in a shape protruding from the gate line 41.

Next, an insulating material such as SiNx is deposited on the glass substrate 40 on which the gate line 41, the common line 47, the gate electrode 41a, and the common electrode 47a are formed to form a gate insulating layer 45. Form. A semiconductor layer is deposited on the gate insulating layer 45 and then patterned to form a semiconductor layer 44 on the gate insulating layer above the gate electrode 41a.

In this case, the semiconductor layer 44 is formed by continuously depositing an amorphous silicon layer or a polysilicon layer and a silicon layer heavily doped with impurities, and then the amorphous silicon layer (or polysilicon layer) and the doped silicon layer. Are formed by patterning at the same time.

After depositing a metal material such as Mo, Al or Cr, the metal material is patterned through a photolithography process to form a data line 42 in a direction perpendicular to the gate line 41. (44) The source electrode 42a and the drain electrode 42b are formed so as to be in contact with both sides, and the doped silicon layer is removed between the source electrode 42a and the drain electrode 42b.

The source electrode 42a is formed to protrude from the data line 42.

Subsequently, a passivation film 46 is deposited on the entire surface of the substrate including the source electrode 42a and the drain electrode 42b.

In this case, an inorganic material such as SiNx is mainly applied to the passivation layer, and an organic material having a low dielectric constant such as BCB (BenzoCycloButene), SOG (Spin On Glass), or acrylic (Acryl) has been recently used to improve the opening ratio of the liquid crystal cell. .

A portion of the passivation layer 46 on the drain electrode 42b is selectively etched to form a drain contact hole (54 of FIG. 8B) exposing a portion of the drain electrode 42b, and a gate pad part (not shown). A gate contact hole (56 of FIG. 8B) is formed in the gate hole, and the second column spacer 50a removes a predetermined depth of the passivation layer 46 and the gate insulating layer 45 at a corresponding position. 52 of 8d.

On the other hand, the gate pad portion (not shown) is a pad portion for supplying a gate signal for controlling the TFT from the gate driver IC to the gate line 41 of the image display portion.

8A through 8D are cross-sectional views sequentially illustrating a method of forming the drain contact hole and the spacer hole of the liquid crystal display according to the present invention, which will be described below.

Part IV-IV 'of FIG. 8A is a cross-sectional view taken along line IV-IV' of FIG. 6, part III-III 'of FIG. 8A is a cross-sectional view taken along line III-III' of FIG. 6, and part A of FIG. Although not shown, it is a cut surface of the gate pad portion.

As shown in FIG. 8A, the photoresist PR is coated on the passivation layer 46, and the diffraction mask M is aligned on the photoresist PR.

The diffraction mask M includes a blocking portion M1 for blocking light, a diffraction portion M3 composed of a plurality of slits for transmitting a portion of light and blocking a portion thereof, and a transmitting portion M2 for passing all of the light. It is.

Therefore, the transmission part M2 of the diffraction mask M is located in the region where the gate contact hole and the drain contact hole are to be formed, the diffraction unit M3 is located in the region where the spacer hole is to be formed, and the diffraction unit M3 ) And the blocking portion M1 are positioned in the diffraction mask M except for the region where the transmitting portion M2 is formed.

That is, since a diffraction mask has a light exposure amount irradiated through a region in which the slits are formed, it is smaller than a light exposure amount irradiated to a transmissive portion that transmits all light, and after diffusing the photoresist, the diffraction portion and the transmissive portion are partially provided on the photoresist. When exposed using a mask, the thickness of the photoresist remaining in the diffractive portion and the thickness of the photoresist remaining in the transmissive portion are formed differently. Further, in the case of the positive photoresist, the thickness of the photoresist irradiated with light through the diffraction portion is formed thicker than that of the transmissive portion, whereas in the case of the negative photoresist, the thickness of the photoresist remaining in the transmissive portion is formed thick.

Therefore, the spacing between the slits of the diffractive portion can be adjusted according to the depth of the spacer hole to be formed. The present invention sets the spacing between the slits of the diffractive portion to 1.2 to 1.5 占 퐉, thereby irradiating light, thereby performing the process of the desired spacer holes. Depth can be obtained.

Subsequently, as shown in FIG. 8B, the photoresist PR is exposed and developed using the diffraction mask M. FIG. Due to the exposure and development processes, the photoresist PR is removed in the region corresponding to the transmission portion M2 of the diffraction mask M to expose the protective film 46, and the photoresist in the region corresponding to the diffraction portion M1. About 10 to 50% of the original thickness of the PR remains, and the photoresist PR corresponding to the original thickness remains in the region corresponding to the blocking portion M1. Subsequently, the exposed protective layer 46 is selectively removed using the patterned photoresist PR as a mask to form a drain contact hole 54 and a pad contact hole 56.

Subsequently, as illustrated in FIG. 8C, an ashing process is performed on the patterned photoresist PR to lower the overall height of the patterned photoresist PR. This is to expose the passivation layer 46 in the region where the spacer hole is to be formed.

Subsequently, as shown in FIG. 8D, the gate insulating layer 45 and the passivation layer 46 are patterned by a dry etching process using the ashed photoresist PR as an etching mask to form a spacer hole 52. . Subsequently, an ashing process of removing all remaining photoresist PR is performed.

Therefore, the formation of the spacer hole 52 corresponding to the second column spacer 50b is completed.

Subsequently, after the spacer hole 52 and the drain contact hole 54 are formed, a transparent conductive film is deposited on the passivation layer 46 to be electrically connected to the drain electrode 42b through the drain contact hole 54. The pixel electrode 43 is formed in the pixel area to be selectively removed to be connected to the drain electrode 42b and positioned between the common electrode in parallel with the common electrode 47a. In addition, the pad electrode is formed by leaving the transparent conductive layer on the pad contact hole 56.

Although not shown in the drawings, the TFT array substrate 200 having the upper portion of the color filter array 100 including the first and second column spacers 50a and 50b and the spacer hole 52 formed in the TFT array process and the color filter array process. The upper portion of the) may further include a step of forming an alignment layer, respectively.

Therefore, according to the present invention having the spacer hole, when the pressure is applied to the surface of the first substrate 100 or the second substrate 200, the second column spacer 50b is inserted into the spacer hole 52. At the same time, even if the first column spacer 50a in contact with the second substrate is pressed, the first column spacer may be restored to its original state, thereby preventing the pressing phenomenon.

In addition, the lower area of the first column spacer in contact with the second substrate is formed to be the same or similar to the lower area of the protrusion in the liquid crystal display device having the protrusion structure, so that the frictional force with the second substrate, which is the opposite substrate, is reduced. It can be reduced to similarly have a reduction in touch failure which is an effect that can be obtained in the liquid crystal display device to which the projection structure is applied.

On the other hand, in the liquid crystal display device to which the projection structure is applied, the film thickness nonuniformity is generated by the formation of the projection structure, and the probability of occurrence of rubbing scratches generated at the nonuniformity of the film thickness during the alignment film rubbing process is increased. However, as in the present invention, the liquid crystal display device to which the spacer hole is applied does not have a protrusion so that the uniformity of the film thickness is secured, thereby reducing the occurrence probability of rubbing scratches.

In the above description, the column spacer is formed in the color filter substrate and the spacer hole is formed in the TFT substrate. However, the present invention is not limited thereto, and the column spacer may be formed in the TFT substrate and the spacer hole may be formed in the color filter substrate.

Although the first embodiment of the present invention shows a liquid crystal display device in the IPS mode, the present invention is not limited thereto and may be applied to the liquid crystal display device in the TN mode.

9 is a plan view of a TN mode liquid crystal display according to a second exemplary embodiment of the present invention.

9 is a cross sectional view taken along the line II-II 'of the IPS mode liquid crystal display device according to the first embodiment of the present invention.

As shown in FIGS. 7 and 9, the color filter substrate, which is the first substrate 100, receives light of portions (gate lines, data line regions, and thin film transistor regions) on the glass substrate 30 except for pixel regions. A black matrix layer 31 for blocking is formed, and R, G, and B color filter layers (not shown) are formed to correspond to each pixel area to express color. The common electrode 34 is formed on the entire upper surface of the color filter layer (not shown). First and second column spacers 50a and 50b are formed of a material such as a photosensitive resin on a predetermined portion of the common electrode 34.

In this case, the lower area of the first column spacer 50a to be in contact with the second substrate 200 is formed to be the same as or similar to the lower area of the protrusion in the liquid crystal display device having the protrusion structure.

The TFT substrate, which is the second substrate 200, which faces the color filter substrate 100, crosses the glass substrate 40 vertically and defines a plurality of gate lines 41 and data lines 42 defining pixel regions. The pixel electrodes 43 are formed in the pixel regions, and thin film transistors are formed at portions where the gate lines 41 and the data lines 42 cross each other.

In addition, a spacer hole 52 is formed at a predetermined portion of a position where the second column spacer 50a corresponds to the gate line of the first substrate. The width of the hole 52 is wider than that of the corresponding second column spacer 50a.

Here, the manufacturing of the thin film transistor, the pixel electrode and the spacer hole will be described in detail.

After depositing a metal material such as Mo, Al or Cr on the glass substrate 40, the metal material is patterned through a photolithography process to form a plurality of gate lines 41 and gate electrodes 41a.

The gate electrode 41a is formed at a predetermined position of the pixel area in a shape protruding from the gate line 41.

Next, an insulating material such as SiNx is deposited on the glass substrate 40 on which the gate line 41 and the gate electrodes 41a are formed to form a gate insulating layer 45. A semiconductor layer is deposited on the gate insulating layer 45 and then patterned to form a semiconductor layer 44 on the gate insulating layer above the gate electrode 41a.

In this case, the semiconductor layer 44 is formed by continuously depositing an amorphous silicon layer or a polysilicon layer and a silicon layer heavily doped with impurities, and then the amorphous silicon layer (or polysilicon layer) and the doped silicon layer. Are formed by patterning at the same time.

After depositing a metal material such as Mo, Al or Cr, the metal material is patterned through a photolithography process to form a data line 42 in a direction perpendicular to the gate line 41. (44) The source electrode 42a and the drain electrode 42b are formed so as to be in contact with both sides, and the doped silicon layer is removed between the source electrode 42a and the drain electrode 42b.

The source electrode 42a is formed to protrude from the data line 42.

Subsequently, a passivation film 46 is deposited on the entire surface of the substrate including the source electrode 42a and the drain electrode 42b.

In this case, an inorganic material such as SiNx is mainly applied to the passivation layer, and an organic material having a low dielectric constant such as BCB (BenzoCycloButene), SOG (Spin On Glass), or acrylic (Acryl) has been recently used to improve the opening ratio of the liquid crystal cell. .

In addition, a portion of the passivation layer 46 on the drain electrode 42b is selectively etched to form a drain contact hole (54 of FIG. 8C) exposing a part of the drain electrode 42b, and a gate pad part (not shown). A gate contact hole (56 of FIG. 8C) positioned at the second gate spacer 50 is formed, and a predetermined depth of the passivation layer 46 and the gate insulating layer 45 at the position where the second column spacer 50a corresponds is removed to remove the spacer hole 52. ).

On the other hand, the gate pad part (not shown) is a part that serves to supply a gate signal for controlling the TFT from the gate driver IC to the gate line 41 of the image display part.

Meanwhile, the method for forming the spacer hole is the same as the method for forming the spacer hole applied to the liquid crystal display of the IPS mode, that is, the method for forming the spacer hole shown in FIGS. 8A to 8C, which is the first embodiment of the present invention. do.

Subsequently, a transparent conductive film is deposited on the passivation layer 46 to be electrically connected to the drain electrode 42b through the drain contact hole 54, and then selectively removed so as to remain only in the pixel region. To form 43.

Although not shown in the drawings, the TFT array substrate on which the upper portion of the color filter array 100 including the first and second column spacers 50a and 50b and the spacer hole 52 are formed in the TFT array process and the color filter array process. The upper portion of the 200 may further include forming an alignment layer, respectively.

Therefore, according to the present invention having the spacer hole, when the pressure is applied to the surface of the first substrate 100 or the second substrate 200, the second column spacer 50b is inserted into the spacer hole 52. At the same time, even if the first column spacer 50a in contact with the second substrate is pressed, the first column spacer may be restored to its original state, thereby preventing the pressing phenomenon.

In addition, the lower area of the first column spacer in contact with the second substrate is formed to be the same or similar to the lower area of the protrusion in the liquid crystal display device having the protrusion structure, so that the frictional force with the second substrate, which is the opposite substrate, is reduced. It can be reduced to similarly have a reduction in touch failure which is an effect that can be obtained in the liquid crystal display device to which the projection structure is applied.

In addition, in the liquid crystal display device to which the projection structure is applied, film thickness nonuniformity is generated by the formation of the protrusion structure, and thus the probability of occurrence of rubbing scratches generated at the nonuniformity of the film thickness during the alignment film rubbing process is increased. However, as in the present invention, the liquid crystal display device to which the spacer hole is applied does not have a protrusion so that uniformity of the film thickness is secured, thereby reducing the probability of occurrence of rubbing scratches.

In the above description, the column spacer is formed in the color filter substrate and the spacer hole is formed in the TFT substrate. However, the present invention is not limited thereto, and the column spacer may be formed in the TFT substrate and the spacer hole may be formed in the color filter substrate.

According to the liquid crystal display and the manufacturing method according to the present invention, by forming a first column spacer and a second column spacer, forming a spacer hole so as to correspond to the first column spacer, on the surface of the first substrate or the second substrate When the pressure is applied, even if the first column spacer is inserted into the spacer hole and the second column spacer in contact with the substrate is pressed, the second column spacer may be restored to its original state, thereby preventing the pressing phenomenon. It has an effect.

In addition, according to the liquid crystal display device and the manufacturing method to which the spacer hole according to the present invention is applied, the uniformity of the film thickness is secured during the alignment film rubbing process, thereby reducing the probability of occurrence of rubbing scratches.

Claims (20)

A first substrate and a second substrate facing each other; A first column spacer formed on the second substrate and in contact with the first substrate; A second column spacer formed on the second substrate at the same height as the first column spacer and spaced apart from the first substrate; And And a liquid crystal layer formed between the first substrate and the second substrate. According to claim 1, And a spacer hole formed on the first substrate to correspond to the second column spacer. The method of claim 1, wherein the first substrate A black matrix layer formed on a predetermined portion on the first substrate; And And the color filter layer formed on the first substrate including the black matrix layer. The method of claim 3, wherein the first substrate And a common electrode formed on an entire surface of the first substrate including the color filter layer and the black matrix layer. The method of claim 1, wherein the second substrate is A gate line and a data line crossing the second substrate perpendicularly to each other to define a pixel area; A thin film transistor formed at an intersection of the gate line and the data line; A gate insulating film interposed between the gate line and the data line; A pixel electrode formed in the pixel region; And And a passivation layer interposed between the data line and the pixel electrode. The method of claim 5, wherein the second substrate And a common electrode alternately formed with the pixel electrode. The method of claim 2 or 5, wherein the spacer hole And a portion of the gate insulating layer and the protective layer is removed. The method of claim 2, wherein the spacer hole And a width greater than the width of the first column spacer. Preparing first and second substrates facing each other; Forming a gate line and a gate electrode on the first substrate; Forming a gate insulating film on the first substrate including the gate line and the gate electrode; Forming a semiconductor layer on the gate insulating film above the gate electrode; Defining a pixel region by forming a data line in a direction crossing the gate line in a predetermined portion on the gate insulating layer including the semiconductor layer, and forming a source electrode protruding from the data line and a drain electrode spaced apart from the predetermined distance step; Forming a protective film on an entire surface of the gate insulating film including the data line and the source / drain electrodes; Removing a passivation layer and a gate insulating layer at a predetermined portion to form a drain contact hole exposing the drain electrode, and forming a spacer hole in a predetermined region above the gate line; Forming a pixel electrode in the pixel region to be in contact with the drain electrode through the drain contact hole; Forming a color filter array on the second substrate; Forming a first column spacer to be in contact with the first substrate and simultaneously forming a second column spacer to correspond to the spacer hole; Forming a liquid crystal layer between the first and second substrates; And And bonding the first and second substrates together. The method of claim 9, wherein the spacer hole And forming a width wider than the width of the second column spacer. The method of claim 9, wherein the forming of the drain contact hole and the spacer hole is performed. Forming a photoresist on the passivation layer; Exposing and developing the photoresist to expose a portion of the photoresist at a position corresponding to the second column spacer while exposing the passivation layer on the drain electrode; Etching the exposed passivation layer using the photoresist as a mask to form a drain contact hole; Performing an ashing process on the photoresist to expose a protective film at a position corresponding to the second column spacer; And And patterning the exposed passivation layer and the gate insulation layer using the ashed photoresist as a mask. The method of claim 11, wherein exposing and developing the photoresist is performed. A method of manufacturing a liquid crystal display device, characterized in that performed using a diffraction mask. The method of claim 9, wherein the spacer hole And a partial depth of the gate insulating film and the protective film are removed to form the liquid crystal display device. The method of claim 9, wherein the color filter array Forming a black matrix layer on the second substrate; Forming a color filter layer on a second substrate on which the black matrix layer is formed; And And forming a common electrode on the entire surface of the second substrate including the black matrix layer and the color filter layer. Preparing first and second substrates facing each other; Forming a gate line, a gate electrode, a common line parallel to the gate line, and a common electrode protruding from the common line on the first substrate; Forming a gate insulating film on the first substrate including the gate line and the gate electrode; Forming a semiconductor layer on the gate insulating layer to cover the gate electrode; Defining a pixel area by forming a data line in a direction crossing the gate line in a predetermined portion on the gate insulating layer including the semiconductor layer, and forming a source electrode protruding from the data line and a drain electrode spaced apart from the predetermined distance step; Forming a protective film on an entire surface of the gate insulating film including the data line and the source / drain electrodes; Removing a passivation layer and a gate insulating layer at a predetermined portion to form a drain contact hole exposing the drain electrode, and forming a spacer hole in a predetermined region above the gate line; Forming a pixel electrode in the pixel region to be in contact with the drain electrode through the drain contact hole; Forming a color filter array on the second substrate; Forming a first column spacer to be in contact with the first substrate and simultaneously forming a second column spacer to correspond to the spacer hole; Forming a liquid crystal layer between the first and second substrates; And And bonding the first and second substrates together. The method of claim 15, wherein the spacer hole And forming a width wider than the width of the second column spacer. The method of claim 15, wherein the forming of the drain contact hole and the spacer hole is performed. Forming a photoresist on the passivation layer; Exposing and developing the photoresist to expose a portion of the photoresist at a position corresponding to the second column spacer while exposing the passivation layer on the drain electrode; Etching the exposed passivation layer using the photoresist as a mask to form a drain contact hole; Performing an ashing process on the photoresist to expose a protective film at a position corresponding to the second column spacer; And And patterning the exposed passivation layer and the gate insulation layer using the ashed photoresist as a mask. 18. The method of claim 17, wherein exposing and developing the photoresist A method of manufacturing a liquid crystal display device, characterized in that performed using a diffraction mask. The method of claim 15, wherein the spacer hole And a partial depth of the gate insulating film and the protective film are removed to form the liquid crystal display device. The method of claim 15, wherein the color filter array Forming a black matrix layer on the second substrate; And And forming a color filter layer on the second substrate on which the black matrix layer is formed.

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