KR20070046657A - Electron emission device - Google Patents

Abstract

 The present invention relates to an electron emission device, and more particularly, the electron emission device includes: a first substrate and a second substrate disposed opposite to each other with an internal space of a vacuum interposed therebetween, an electron emission unit formed on the first substrate, At least one of the first substrate and the second substrate to fix the spacers, and a light emitting unit formed to face the electron emission unit facing the second substrate, the spacer disposed between the first substrate and the second substrate, and And an adhesive layer formed on the edge of the spacer on the adhesive layer, wherein the adhesive layer includes a glass frit and a filler.

The electron-emitting device according to the present invention can prevent arcing because the edges of the spacers are not exposed even after firing by bonding the spacers using the adhesive composition for spacers having excellent shape retention, thereby increasing the anode voltage and the electron-emitting device. Can improve the luminance.

 Electron emission device, adhesive layer, spacer.

Description

 Electron Emission Device {ELECTRON EMISSION DEVICE}

1 is a partially exploded perspective view of an electron emitting device according to an embodiment of the present invention.

2 is a partial cross-sectional view of an electron emitting device according to an embodiment of the present invention.

3 is an enlarged view of an adhesive layer of a spacer of the electron emission device illustrated in FIG. 2.

[Technical Field]

TECHNICAL FIELD The present invention relates to an electron emitting device, and more particularly, to an electron emitting device in which the occurrence of arcing around a spacer is reduced so that an anode voltage is increased and thus brightness is improved.

[Private Technology]

In general, the electron emission device may be classified into a method using a hot cathode and a cold cathode according to the type of the electron source.

Here, the electron emission device using the cold cathode is a field emitter array (FEA) type, a surface conduction emission type (SCE) type, a metal-insulator layer-metal-insulator- type. metal (MIM) type and metal-insulator-semiconductor (MIS) type and the like are known.

The MIM type and the MIS type electron emission device each form an electron emission portion formed of a metal / insulation layer / metal (MIM) and a metal / insulation layer / semiconductor (MIS) structure, and are disposed between two metals having an insulation layer therebetween, or When a voltage is applied between the metal and the semiconductor, electrons supplied from the metal or the semiconductor pass through the insulating layer to reach the upper metal by a tunneling phenomenon, and the electrons supplied from the metal or the semiconductor are higher than the work function of the upper metal. Electrons with energy are emitted from the upper electrode.

The SCE type electron emission device forms an electron emission portion by providing a conductive thin film between a first electrode and a second electrode disposed to face each other on a substrate and providing a micro crack in the conductive thin film, and applying a voltage to both electrodes. By using the principle that the electron is emitted from the electron emission portion when the current flows to the surface of the conductive thin film.

The FEA type electron emission device uses a principle that electrons are easily emitted by an electric field in vacuum when a material having a low work function or a large aspect ratio is used as the electron source, and molybdenum (Mo) Or, an example is developed in which a tip structure mainly made of silicon (Si) or the like is applied, or a carbon-based material such as carbon nanotubes, graphite, or diamond-like carbon as an electron source.

The above-described electron emitting devices have different structures depending on the type thereof, but basically include driving electrodes for controlling electron emission of the electron emitting unit together with an electron emitting unit on the first of the two substrates constituting the vacuum container. In addition, an anode electrode is provided on the second substrate to allow the electrons emitted from the first substrate side to be efficiently accelerated toward the fluorescent layer to perform a predetermined light emission or display function.

In addition, the above-described electron emitting devices include a plurality of spacers inside the vacuum vessel to maintain a constant distance between the first substrate and the second substrate, and suppress deformation and breakage of the substrates due to the compressive force applied to the vacuum vessel.

The spacer is generally made of glass or ceramic material and has various shapes such as a columnar shape and a wall shape. In addition, the spacer is generally fixed by the adhesive force of the adhesive layer on any one of the first substrate and the second substrate, for example, a structure provided on the first substrate.

It is an object of the present invention to provide an electron emitting device which can reduce the occurrence of arcing around a spacer to increase the anode voltage and thus improve the brightness.

In order to achieve the above object, according to an embodiment of the present invention, the first substrate and the second substrate disposed opposite to each other with an internal space of the vacuum therebetween, an electron emission unit formed on the first substrate, the first A light emitting unit formed opposite to the electron emission unit on a second substrate, a spacer disposed between the first substrate and the second substrate, and at least one of the first substrate and the second substrate to fix the spacers; An adhesive layer is formed surrounding the corners of the adhesive layer, wherein the adhesive layer comprises a glass frit and a filler.

Hereinafter, the present invention will be described in more detail.

Among the above-mentioned electron emission devices, in particular, the FEA type electron emission device which emits electrons using an electric field can achieve smooth driving only when the internal space is kept electrically stable. For this purpose, abnormal discharge such as arcing should not occur inside the vacuum chamber during operation. Arcing is more likely to occur when there are more local edges on the cathode side.

Typically, a spacer in a FEA type electron emission device uses a bar-shaped glass or ceramic spacer, and an adhesive layer is formed between the lower surface of the spacer and the upper surface of the structure provided on the first substrate to fix the spacer. As such, since the adhesive layer is mainly formed on the upper or lower surface of the spacer, the long edge portion of the spacer is exposed to the internal space of the vacuum. This causes arcing to occur by locally concentrating the field at the corners of the spacer when the electron emitting device acts.

As such, when arcing occurs, there is a restriction in applying a high voltage to the anode electrode, and as a result, there are difficulties in implementing effects such as luminance increase, which can be realized by increasing the anode voltage.

In contrast, the present invention uses an adhesive composition for spacers having an optimal composition to prevent the edge portion of the spacer from being exposed to the internal space of the vacuum to form an adhesive layer, thereby preventing arcing, increasing the anode voltage and increasing the luminance of the electron emitting device. Could improve.

That is, the electron emitting device according to the embodiment of the present invention

A first substrate and a second substrate disposed to face each other with an internal space of the vacuum interposed therebetween;

An electron emission unit formed on the first substrate;

A light emitting unit facing the electron emission unit on the second substrate;

A spacer disposed between the first substrate and the second substrate; And

An adhesive layer formed around at least one of the first substrate and the second substrate to surround the spacers, the adhesive layer being formed to fix the spacers;

The adhesive layer includes a glass frit and a filler.

More preferably, the adhesive layer includes 2 to 20 parts by weight of the glass frit and 30 to 70 parts by weight of the filler.

The adhesive layer is a glass frit; b) fillers; And c) a binder composition comprising a binder.

More preferably, the adhesive composition for the spacer may include 2 to 20 parts by weight of the glass frit, 30 to 70 parts by weight of the filler, and 10 to 30 parts by weight of the binder. Within the above content range, the adhesive composition is preferred because it can exhibit excellent shape retention after firing, and if it is outside the above content range, there is a possibility that the shape retention rate is lowered, which is not preferable.

In addition, the adhesive composition preferably has a viscosity of 10,000 cps to 200,000 cps. If the viscosity of the adhesive composition is less than 10,000 cps, the flowability is too high, which is not preferable. If the viscosity of the adhesive composition exceeds 200,000 cps, printability is lowered, which is not preferable.

Hereinafter, the constituent material of the adhesive composition for a spacer according to an embodiment of the present invention will be described in detail.

a) glass frit

The glass frit is one selected from the group consisting of PbO, ZnO, B ₂ O ₃ , Al ₂ O ₃ , SiO ₂ , SnO, P ₂ O ₅ , Sb ₂ O ₃ and Bi ₂ O _{3 which} are commonly used. or more is preferred, more preferably lead oxide-boron oxide-silicon oxide _{(PbO-B 2 O 3 -SiO} 2), lead oxide-boron oxide-silicon oxide-aluminum-oxide (PbO-B ₂ O ₃ - SiO ₂ -Al ₂ O ₃ ), zinc oxide-boron oxide-silicon oxide (ZnO-B ₂ O ₃ -SiO ₂ ), zinc oxide-boron oxide-silicon oxide-aluminum oxide (ZnO-B ₂ O _3- SiO ₂ -Al ₂ O ₃ ), lead oxide-zinc oxide-boron oxide-silicon oxide (PbO-ZnO-B ₂ O ₃ -SiO ₂ ), lead oxide-zinc oxide-boron oxide-silicon oxide-aluminum oxide (PbO-ZnO-B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ), bismuth oxide-boron oxide-silicon oxide system (Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ ), bismuth oxide-boron oxide-oxidation Silicon-aluminum oxide system (Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ), bismuth oxide-zinc oxide-boron oxide-silicon oxide system (Bi ₂ O ₃ -ZnO-B ₂ O ₃ -SiO ₂ ), and bismuth oxide-zinc oxide-boron oxide-silicon oxide-aluminum oxide-based (Bi ₂ O ₃ -ZnO-B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ) The above can be used.

Such glass frit is not particularly limited in shape, but is preferably spherical, and preferably has an average particle diameter of 0.1 to 5 탆, more preferably 0.5 to 2 탆. If the average particle diameter of the glass frit is out of the range, the surface of the adhesive layer formed after firing may be uneven and the straightness may decrease, which is not preferable.

b) filler

The filler serves to maintain the shape of the adhesive layer after baking, in addition to adjusting the thermal expansion coefficient of the adhesive layer, improving the strength of the adhesive layer, adjusting the shrinkage rate during firing, or adjusting the density of the adhesive layer. Examples of such fillers include metal materials including Ag, Ni, Al, Cr, Fe, Cu, Au, and the like, and oxides of these metals; And inorganic materials including alumina, zirconium oxide, zircon (ZrSiO ₄ ), cordierite, mullite, amorphous silica, alumina, folisterite, α-quartz or fluorspar, and the like. Preferably, at least one selected from the group consisting of alumina and zirconium oxide can be used.

The filler preferably has an average particle diameter of 0.5 to 10 μm, more preferably 1 to 8 μm. If the particle diameter of the filler is out of the above range, the surface of the adhesive layer formed after firing may be uneven and the straightness may decrease, which is not preferable.

c) binder

The binder serves to support the glass frit and is not present in the adhesive layer of the resulting electron emitting device, which is all removed in the firing step for the adhesive layer. Specific examples of such binders include cellulose resins including ethyl cellulose, hydroxy ethyl cellulose, nitrocellulose, and the like; Acrylate resins including polybutyl acrylate, polymethyl (meth) acrylate, polyethyl (meth) acrylate, and the like; Or these copolymers can be used, More preferably, 1 or more types chosen from the group which consists of cellulose resins can be used.

The adhesive composition further includes a solvent.

The solvent may be appropriately selected and used according to the solubility and coating property of the adhesive composition for the spacer, and specific examples include ester solvents including butyl cellosolve acetate, butyl carbitol acetate, and the like; Ether solvents such as butyl carbitol; And petroleum solvents such as naphtha and the like.

The solvent may be included in the amount of the balance in the adhesive composition for the spacer, preferably added in an appropriate amount to form an adhesive layer at an appropriate viscosity.

The spacer adhesive composition may further include an additive according to each purpose in addition to the above components. Such additives include a conductive material for flowing a charge charged to a spacer generated due to the collision of electrons to the outside through the focusing electrode, a sensitizer to improve sensitivity, and an improved electrode retention composition of the electrode forming composition. Polymerization inhibitors and antioxidants, ultraviolet light absorbers to improve resolution, antifoaming agents to reduce bubbles in the paste, dispersants to improve phase separation, leveling agents to improve film flatness in printing, or plasticizers to give thixotropic properties. Can be.

These additives are not necessarily used, but are used as necessary, and when added, generally used amounts are adjusted appropriately.

Since the adhesive composition for spacers having the composition as described above is excellent in shape retention and there is no fear of exposing the spacer edges even after firing, it is possible to prevent arcing, thereby increasing the anode voltage and improving the brightness of the electron emitting device.

An electron emission device according to an embodiment of the present invention includes an adhesive layer formed from the adhesive composition for the spacer.

An electron emitting device according to an embodiment of the present invention,

Preparing a first substrate on which an electron emission unit is formed and a second substrate on which a light emitting unit is formed;

Forming an adhesive layer by applying an adhesive composition to a spacer forming position on the first substrate or the second substrate;

Disposing a spacer on the adhesive layer;

Compressing the spacer and the adhesive layer and then baking the adhesive layer; And

It can be produced by a method of manufacturing an electron emitting device comprising the step of sealing, evacuating and sealing the first or second substrate on which the spacer and the adhesive layer are not formed.

In the manufacturing process of the electron emitting device, the method of manufacturing the electron emitting device other than the adhesive layer and the spacer forming method is well known in the art and can be fully understood by those skilled in the art. Omit.

In order to form an adhesive layer, first, a glass frit, a filler, a binder, and a solvent are used to prepare an adhesive composition.

Specifically, the glass frit and the filler are added to a vehicle including a binder resin and a solvent, and then dispersed into a disperser such as a three roll, a ball mill, a sand mill, or the like to prepare a slurry or paste-like adhesive composition.

The glass frit, the filler, the binder resin and the solvent are the same as described above.

The screen printing method, the spray coating method, the roll coating method, the table coating method, or the doctor blade is applied to the spacer formation position on the first substrate on which the electron emission unit is formed or on the second substrate on which the light emitting unit is formed using the prepared adhesive composition for spacers. An adhesive layer is formed using the coating method etc. which were used.

Thereafter, in the step of compressing the spacer onto the adhesive layer, an extension of the adhesive layer may be formed while the adhesive layer pushed out of the spacer by the pressing force contacts along the side surface of the spacer. Accordingly, it is desirable to apply the coating layer to a sufficient thickness so that an extension of the adhesive layer can be produced upon application of the adhesive composition.

The spacer is disposed on the formed adhesive layer, the spacer and the adhesive layer are compressed and then fired.

It is preferable to perform the said baking process at 400-650 degreeC, More preferably, it is preferable to carry out at 420-600 degreeC. In addition, the firing time is preferably performed for 3 to 25 hours, more preferably 5 to 20 hours. If the firing temperature and time is out of the above range, it is not preferable because complete solvent removal becomes difficult and there is a possibility that a preference may be generated because it is not a binder.

Moreover, it is preferable to perform the said baking in an atmospheric atmosphere.

The electron emitting device can then be fabricated by sealing, evacuating and sealing the first or second substrate on which the spacer and the adhesive layer are not formed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 are partially exploded perspective and partial cross-sectional views of an electron emitting device according to an embodiment of the present invention, and FIG. 3 is an enlarged view of a main portion of the electron emitting device shown in FIG.

Referring to the drawings, the electron emitting device comprises a first substrate 2 and a second substrate 4 which are disposed opposite each other at predetermined intervals. Side barrier ribs (not shown) are disposed at edges of the first substrate 2 and the second substrate 4 to form an inner space enclosed with the substrates 2 and 4. As a result, both substrates 2 and 4 and the side partitions constitute a vacuum container.

The first substrate 2 is provided with an electron emission unit 6 to emit electrons toward the second substrate 4, and the second substrate 4 is excited by the electrons to emit visible light ( 8) is provided. In this embodiment, the configuration of the electron emitting unit and the light emitting unit applied to the FEA type electron emitting device is shown as an example. The internal structure of the FEA type electron emission device will be briefly described with reference to the drawings.

The electron emission unit 6 includes cathode electrodes 10 formed in a stripe pattern along one direction (y-axis direction of the drawing) of the first substrate 2 on the first substrate 2, and the cathode electrodes ( 10 and the first insulating layer 12 formed over the entire first substrate 2 while covering the first insulating layer 12 along the direction orthogonal to the cathode electrode 10 (in the x-axis direction of the drawing). The gate electrodes 14 are formed, and the electron emitters 16 are formed on the cathode electrodes 10 at the intersections of the cathode electrodes 10 and the gate electrodes 14. The openings 141 and 121 are provided in the gate electrodes 14 and the first insulating layer 12 to expose the electron emission units 16 on the first substrate 2.

The second insulating layer 18 and the focusing electrode 20 are sequentially formed on the gate electrodes 14 and the first insulating layer 12, and the second insulating layer 18 and the focusing electrode 20 are sequentially formed. In one example, each of the openings 181 and 201 is provided per pixel area so that the focusing electrode 20 comprehensively focuses electrons emitted from one pixel.

Meanwhile, the structure in which the gate electrode 14 is positioned above the cathode electrode 10 with the first insulating layer 12 interposed therebetween has been described. In the opposite case, that is, the cathode electrode is positioned above the gate electrode. It is also possible to structure. In this structure, the electron emission part may be formed on the first insulating layer while contacting one side of the cathode electrode. In addition, in the present embodiment, the electron emission device having the focusing electrode has been described, but the focusing electrode may not be provided depending on the situation.

The electron emission unit 16 is formed of materials that emit electrons when an electric field is applied in a vacuum, such as a carbon-based material or a nanometer-sized material. On the other hand, the electron emission unit 18 may be formed of a tip structure (not shown) having a pointed tip mainly made of molybdenum (Mo) or silicon (Si).

In addition, the light emitting unit 8 includes the fluorescent layers 22 formed on the second substrate 4, the black layer 24 positioned between the respective fluorescent layers 22, the fluorescent layers 22 and the black color. An anode electrode 26 formed on the layer 24 and made of a metal film such as aluminum (Al). The anode electrode 26 receives a high voltage necessary for accelerating the electron beam from the outside, and reflects the visible light emitted toward the first substrate 2 of the visible light emitted from the fluorescent layer 22 toward the second substrate 4 side of the screen. It increases the brightness.

On the other hand, the anode electrode may be made of a transparent conductive film such as indium tin oxide (ITO) rather than a metal film. In this case, the anode electrode may be positioned on one surface of the fluorescent layer facing the second substrate and the black layer, and may be formed in plural in a predetermined pattern.

In addition, between the first substrate 2 and the second substrate 4, the non-light emitting region in which the black layer 24 is positioned is disposed so that a plurality of spacers 28 do not block electrons traveling toward the fluorescent layer 22. It arrange | positions and keeps the space | interval of both board | substrates 2 and 4 constant. 1 illustrates a wall-shaped spacer as an example, but may be applied to a spacer having an edge at an end such as a circular columnar, a square columnar, a cross column, and the like regardless of the shape.

In addition, the configuration of the electron emitting unit 6 and the light emitting unit 8 is not limited to the illustrated example, the electron emitting device of the present embodiment is also not limited to the FEA type, various applications such as SCE type, MIM type and MIS type It is possible.

The spacer 28 is fixed to the adhesive layer 30 on at least one of the first substrate 2 and the second substrate 4. More specifically, the spacer 28 is fixed by the bonding force of the adhesive layer 30 between the electron emission unit 6 formed on the first substrate 2 and the light emitting unit 8 formed on the second substrate 4.

Referring to FIG. 3, a structure in which the spacer 28 is fixed to the electron emission unit 6 formed on the first substrate 2 with the adhesive layer 30 is described. It is formed while wrapping. More specifically, the adhesive layer 30 is located between one surface of the spacer 28 and the focusing electrode 20, and a base portion 301 which provides mutual coupling force to the spacer 28 and the focusing electrode 20, and a part thereof. Is an extension 302 extending upward from the base 301 while in contact with the side of the spacer 28. The base 301 and the extension 302 are divided by dotted lines in FIG. 3.

In particular, the base 301 has a thickness d ₁ , and the adhesive layer 30 including the extension 302 has a thickness d ₂ so that d ₂ is always d _1. Is formed larger (d ₂ > d ₁ ). Therefore, since the lower edge of the spacer 28 is not exposed to the inner space of the vacuum by the extension 302, it is possible to block in advance arcing that may be concentrated on the edge of the local edge.

The extension part 302 of the adhesive layer 30 is formed while the adhesive is pushed out of the spacer 28 by the pressing force in the step of pressing the spacer 28 to the adhesive, along the side surface of the spacer 28. Accordingly, the thickness of the adhesive composition to be applied is preferably to have a sufficient thickness so that the extension 302 of the adhesive layer 30 can be produced.

The present invention is more effective when applied to a wall-shaped spacer having a long edge in terms of such anti-arking effect.

In addition, the adhesive layer 30 may be manufactured by the same adhesive composition for spacers and a manufacturing method using the same as described above.

In addition, the structure of the adhesive layer may be applied to the bonding of the light emitting unit 8 and the spacer 28 formed on the second substrate 4, and may be applied to an electron emission device without the focusing electrode 20. In the latter case, the spacer may be fixed to the first insulating layer over the gate electrode or in the region between the gate electrodes.

In particular, when the spacer is fixed on the gate electrode, as described above, the charge charged to the spacer is allowed to flow to the outside through the gate electrode using the adhesive layer containing the conductive material.

Hereinafter, preferred examples and comparative examples of the present invention are described. However, the following examples are only preferred embodiments of the present invention and the present invention is not limited to the following examples.

EXAMPLE

Paste adhesive composition was prepared by adding 10 parts by weight of glass frit of ZnO-SiO ₂ and 60 parts by weight of alumina having an average particle diameter of 5 μm to 5 parts by weight of ethyl cellulose and 25 parts by weight of butylcarbitol. At this time, the glass frit is ZnO: SiO ₂ 7: 3 It includes by weight ratio of and has an average particle diameter of 5 micrometers.

Next, the adhesive composition was applied to the spacer formation position of the first substrate on which the electron emission unit was formed by screen printing and dried. By repeatedly performing printing and drying of such an adhesive composition, the adhesive layer was formed in the thickness of 200 micrometers.

Next, the spacer was placed, pressurized at a pressure of 1 kgf / cm ² , and the spacer was pressed onto the adhesive layer, and then fired at 450 ° C. for 20 hours under an air atmosphere.

Next, an electron emission device was manufactured by going through the steps of assembling, sealing, exhausting, gas injection, and aging together with the second substrate on which the light emitting unit was formed.

Comparative Example 1

To 70 parts by weight of the glass frit of ZnO-SiO ₂ , 20 parts by weight of ethyl cellulose and 10 parts by weight of butylcarbitol were added to prepare a paste-like adhesive composition. At this time, the glass frit is ZnO: SiO ₂ 7: 3 It includes by weight ratio of and has an average particle diameter of 5 micrometers.

An electron emission device was manufactured in the same manner as in Example 1, except that the adhesive composition prepared above was used.

The number of spacers collapsed after firing was measured for the electron emitting devices prepared according to Example 1 and Comparative Example 1. The results are shown in Table 1 below.

Number of spacers collapsed after firing / total number of spacers Example 1 0/25 Comparative Example 1 5/25

As shown in Table 1, in the electron-emitting device of Example 1 bonded to the spacer by the adhesive composition of the present invention comprising a filler, the adhesive layer is formed around the edge of the spacer so that the edge of the spacer is not exposed. No spacer was observed. However, about 20% of the total spacers fell in the electron emission device of Comparative Example 1 in which the spacer was bonded using the adhesive layer composition containing no filler. From this, it was confirmed that the composition for forming an adhesive layer according to the present invention was excellent in shape retention and showed an excellent spacer adhesive effect. It can also be expected from this effect that the protection against arcing due to exposure of the spacer edges and the brightness enhancement effect of the electron emitting device are exhibited.

The electron-emitting device according to the present invention can prevent arcing because the edges of the spacers are not exposed even after firing by bonding the spacers using the adhesive composition for spacers having excellent shape retention, thereby increasing the anode voltage and the electron-emitting device. Can improve the luminance.

Claims (15)

A first substrate and a second substrate disposed to face each other with an internal space of the vacuum interposed therebetween; An electron emission unit formed on the first substrate; A light emitting unit facing the electron emission unit on the second substrate; A spacer disposed between the first substrate and the second substrate; And An adhesive layer formed around at least one of the first substrate and the second substrate to surround the spacers, the adhesive layer being formed to fix the spacers; Wherein said adhesive layer comprises a glass frit and a filler. The method of claim 1, And said adhesive layer is formed by an adhesive composition for spacers comprising a glass frit, a filler, and a binder. The method of claim 2, The adhesive composition for spacers is an electron emitting device comprising 2 to 20 parts by weight of glass frit, 30 to 70 parts by weight of filler and 10 to 30 parts by weight of binder. The method of claim 2, And the adhesive composition for the spacer has a viscosity of 10,000 cps to 200,000 cps. The method of claim 2, The glass frit is one or more electron emission selected from the group consisting of PbO, ZnO, B ₂ O ₃ , Al ₂ O ₃ , SiO ₂ , SnO, P ₂ O ₅ , Sb ₂ O ₃ and Bi ₂ O ₃ device. The method of claim 2, The glass frit is lead oxide-boron oxide-silicon oxide (PbO-B ₂ O ₃ -SiO ₂ ), lead oxide-boron oxide-silicon oxide-aluminum oxide (PbO-B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ), zinc oxide-boron oxide-silicon oxide (ZnO-B ₂ O ₃ -SiO ₂ ), zinc oxide-boron oxide-silicon oxide-aluminum oxide (ZnO-B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ), lead oxide-zinc oxide-boron oxide-silicon oxide (PbO-ZnO-B ₂ O ₃ -SiO ₂ ), lead oxide-zinc oxide-boron oxide-silicon oxide-aluminum oxide (PbO-ZnO- B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ), bismuth oxide-boron oxide-silicon oxide (Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ ), bismuth oxide-boron oxide-silicon oxide-aluminum oxide (Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ), bismuth oxide-zinc oxide-boron oxide-silicon oxide system (Bi ₂ O ₃ -ZnO-B ₂ O ₃ -SiO ₂ ), and which comprises at least one element selected from the group consisting of aluminum oxide-based _{(Bi 2 O 3 -ZnO-B} 2 O 3 -SiO 2 -Al 2 O 3) - bismuth oxide-zinc oxide-boron oxide-silicon oxide I'm Emitting device. The method of claim 2, The filler includes a metal material including Ag, Ni, Al, Cr, Fe, Cu and Au and oxides of these metals; And an inorganic material selected from the group consisting of inorganic materials including alumina, zirconium oxide, zirconium (ZrSiO ₄ ), cordierite, mullite, amorphous silica, alumina, folisterite, α-quartz and fluorspar. device. The method of claim 2, Wherein said filler has an average particle diameter of 0.5 to 10 μm. The method of claim 2, And said binder comprises at least one member selected from the group consisting of cellulose resins, acrylate resins and copolymers thereof. The method of claim 2, The binder is selected from the group consisting of ethyl cellulose, hydroxy ethyl cellulose, nitrocellulose, polybutyl (meth) acrylate, polymethyl (meth) acrylate, polyethyl (meth) acrylate, and copolymers thereof. An electron emitting device comprising at least one species. The method of claim 2, The adhesive composition for spacers further comprises at least one additive selected from the group consisting of a conductive material, a sensitizer, a polymerization inhibitor, an antioxidant, an ultraviolet light absorber, an antifoaming agent, a dispersant, a leveling agent, and a plasticizer. . The method of claim 1, The adhesive layer, A base portion formed between one surface of the spacer and the one substrate; And And an extension extending from the base to surround a side of the spacer. The method of claim 1, The electron emission unit, Cathode electrodes and gate electrodes formed on the first substrate so as to cross each other while being insulated from each other; And electron emission portions coupled to the cathode electrodes. The method of claim 13, The gate electrodes are formed on the cathode electrodes, And the spacer is fixed with the adhesive layer over the gate electrode portion corresponding to the non-emitting region. The method of claim 13, The electron emission unit further includes a focusing electrode formed on the cathode and the gate electrodes, And the spacer is fixed to the adhesive layer on the focusing electrode portion corresponding to the non-light emitting region.

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