KR20070043244A - Method of manufacturing a multi-layer ceramic substrate and multi-layer ceramic substrate using the same - Google Patents

Abstract

A method of manufacturing a multilayer ceramic substrate and a multilayer ceramic substrate manufactured using the same are disclosed. In the method of manufacturing a multilayer ceramic substrate, first, a plurality of green ceramic sheets are stacked to form a green multilayer ceramic substrate having a plurality of through holes. On the upper and lower surfaces of the green multi-layer ceramic substrate, the micro-shrinkage prevention sheets for suppressing the shrinkage of the green multi-layered ceramic substrate are respectively disposed. After sintering the microcrystalline multilayer ceramic substrate to form a multilayer ceramic substrate, the non-shrink shrink-resistant sheets are removed from the multilayer ceramic substrate, and the through holes are reworked to form via holes.

Description

METHOD OF MANUFACTURING A MULTI-LAYER CERAMIC SUBSTRATE AND MULTI-LAYER CERAMIC SUBSTRATE USING THE SAME

1 is a cross-sectional view illustrating a micro multilayered ceramic substrate formed by a method of manufacturing a multilayer ceramic substrate according to an exemplary embodiment of the present invention.

FIG. 2 is a process diagram illustrating a process of manufacturing the green multilayer ceramic sheet shown in FIG. 1.

FIG. 3 is a cross-sectional view illustrating the formation of a through hole formed through a green ceramic sheet manufactured by the process illustrated in FIG. 2 using a drill apparatus.

4 is a cross-sectional view illustrating the formation of a through hole formed through a green ceramic sheet manufactured by the process illustrated in FIG. 2 using a laser beam.

5 is a cross-sectional view illustrating the alignment of the green ceramic sheets illustrated in FIG. 3 or 4 by using an alignment key.

FIG. 6 is a cross-sectional view illustrating the alignment of the green ceramic sheets illustrated in FIG. 3 or 4 using an alignment hole and an alignment rod.

7 is a cross-sectional view illustrating the formation of a multi-layered ceramic substrate according to another embodiment of the present invention.

FIG. 8 is a cross-sectional view illustrating disposing a shrinkage preventing sheet on both sides of the green multilayer ceramic substrate illustrated in FIG. 1.

FIG. 9 is a cross-sectional view illustrating the sintering of a green multilayer ceramic substrate on which the green shrink shrink prevention sheet shown in FIG. 8 is mounted.

FIG. 10 is a cross-sectional view illustrating removing a micro shrink shrink sheet attached to the multilayer ceramic substrate illustrated in FIG. 9.

FIG. 11 is a cross-sectional view illustrating reworking holes in the multilayer ceramic substrate illustrated in FIG. 10.

12 is a plan view of a portion of FIG. 11.

13 is a cross-sectional view illustrating a multilayer ceramic substrate according to an embodiment of the present invention.

The present invention relates to a method of manufacturing a multilayer ceramic substrate and a multilayer ceramic substrate manufactured using the same. More specifically, the present invention relates to a method of manufacturing a multilayer ceramic substrate suitable for forming a hole having a precise size at a designated position, and a multilayer ceramic substrate manufactured using the same.

In general, ceramic substrates are widely used in the field of semiconductor devices, electric-electronics, and the like. For example, a ceramic substrate may be a guide plate for guiding a probe pin of a probe card to a predetermined position, which is applied to an electrical die sorting (EDS) process for inspecting wafers in semiconductor manufacturing. It can be used as a guide plate. The probe pins are coupled to minute holes formed in the ceramic plate used as the guide plate. Alternatively, the ceramic substrate may be applied to an injection head that injects a process gas in a chemical vapor deposition (CVD) process in the semiconductor manufacturing field. In addition, the ceramic substrate may be widely used in various fields.

In order to manufacture a conventional ceramic substrate, a molded body is formed by using a mold.

The molded body is then sintered at a sintering temperature suitable for the material properties, and the sintered sintered body is processed to suit dimensions such as area, thickness, width, length and the like. In general, the surface of the sintered body is subjected to lapping or polishing.

Subsequently, a plurality of holes are formed in the sintered compact by using drilling or laser processing.

However, when holes are formed by drilling after forming the sintered body, the drill for forming the holes may slip from the surface of the smooth or sintered body which is wrapped or polished, and damage may occur on the surface of the sintered body.

In addition, when drilling the sintered body, the drill is easily worn by the high hardness sintered body.

In addition, when a thin film sintered body having a thickness of about several hundred μm has weak strength or high brittleness, cracks or cracks may occur in the thin film sintered body by holes formed through the thin film sintered body. have. In order to prevent this, when holes are formed in the thin film sintered body by laser processing, the initial investment cost, processing cost and processing time are greatly increased.

On the other hand, thick foil sintered bodies having a thick thickness of about several mm or more are difficult to process holes having a fine diameter by a drill process. Moreover, when forming the hole which penetrates the thick foil sintered compact by a drill process, it takes a long time to form a hole. In addition, when the hole penetrating the thick foil sintered compact is formed by drill processing, the drill bit is severely worn by the thick foil thick sintered compact.

In order to overcome this problem, a thick foil sintered body having a thick thickness of about several millimeters can be formed of a ceramic having excellent workability, but the manufacturing cost for manufacturing a thick ceramic substrate is greatly increased.

On the other hand, in the case of a thick thin sintered body having a thickness of about several mm or more, it is difficult to form a hole by laser processing instead of drilling. In addition, when the thick sintered body is processed by laser processing, the processing time is greatly increased. In addition, when processing a thick foil sintered compact by laser processing, the shape of the hole formed through the thick foil sintered compact is not uniform, and the magnitude | size of a hole is also not uniform. Moreover, when processing a thick thin sintered compact by laser processing, there also exists a problem that the size of the hole in the upper surface of a ceramic substrate differs from the size of the hole in the lower surface of a ceramic substrate.

Therefore, a ceramic substrate having a thick thickness of about several mm or more is difficult to form a hole formed through the ceramic substrate by drilling or laser processing.

Embodiments of the present invention provide a method of manufacturing a multilayer ceramic substrate capable of precisely forming a hole having a designated size at a designated position.

Embodiments of the present invention provide a multilayer ceramic substrate manufactured by the method of manufacturing the multilayer ceramic substrate described above.

In the multilayer ceramic substrate manufacturing method for realizing one object of the present invention, first, a plurality of green ceramic sheets are stacked to form a green multilayer ceramic substrate having a plurality of through holes. On the upper and lower surfaces of the green multi-layer ceramic substrate, the micro-shrinkage prevention sheets for suppressing the shrinkage of the green multi-layered ceramic substrate are respectively disposed. After sintering the microcrystalline multilayer ceramic substrate to form a multilayer ceramic substrate, the non-shrink shrink-resistant sheets are removed from the multilayer ceramic substrate, and the through holes are reworked to form via holes.

Optionally, through lamination of the green ceramic sheet in the process of forming a green multilayer ceramic substrate, through holes may be formed in each green ceramic sheet.

Optionally, in the process of forming the green multilayer ceramic substrate, after the green ceramic sheet is formed, a through hole may be formed in the green multilayer ceramic substrate.

Preferably, the green multilayer ceramic substrate is sintered at a first temperature, and the anti-shrink sheets may be sintered at a second temperature higher than the first temperature.

Optionally, in the process of forming a green multilayer ceramic substrate, the through holes may be formed by any one of punching by punch, laser processing by laser beam, and drilling by drill.

Optionally, in the process of removing the anti-shrink sheet, the anti-shrink sheet may be removed by ultrasonic waves or a brush.

Optionally, in the step of forming the via hole, the through hole is processed by a boring process for processing the surface of the through hole and expanding the diameter of the through hole to form the via hole.

Preferably, the spacing between the via holes may be at least 1.5 of the diameter of the via holes. More preferably, the spacing between the via holes may be 1.0 to 1.5 times the diameter of the via holes.

Optionally, the process of forming the green multilayer ceramic substrate is performed by aligning the through holes formed in each green multilayer ceramic sheet by an alignment key formed in each green multilayer ceramic sheet.

Optionally, the process of forming a green multilayer ceramic substrate is performed by aligning through holes formed in each green multilayer ceramic sheet by inserting alignment holes formed in each green multilayer ceramic sheet into an alignment rod.

Optionally, in the process of forming a green multilayer ceramic substrate having through holes formed therein, the first diameter of the through holes is formed smaller than the second diameter of the via holes.

Optionally, the process of forming the microcrystalline multilayer ceramic sheet may be performed by first mixing the ceramic powder, the dispersant and the solvent to prepare a primary ceramic mixture, and the secondary ceramic by secondary mixing the binder and the plasticizer having adhesive property to the ceramic mixture. Prepare the mixture. Subsequently, the air bubbles contained in the secondary ceramic mixture are defoamed, and the degassed secondary ceramic mixture is processed into a sheet form.

A multi-layered ceramic substrate for realizing another object of the present invention includes a multi-layered ceramic body consisting of a plurality of stacked ceramic sheets and a plurality of via holes formed through the multi-layered ceramic body, wherein the spacing between adjacent via holes is the diameter of the via hole. 1.0 to 1.5 times.

Hereinafter, a method of manufacturing a multilayer ceramic substrate and a multilayer ceramic substrate using the same according to preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited thereto. Those skilled in the art may implement the present invention in various other forms without departing from the technical spirit of the present invention. In the accompanying drawings, for example, the dimensions of the substrates, layers (films), regions, pads, patterns, or structures are shown to be larger than actual for clarity of the invention. In the present invention, for example, each layer (film), region, pad, pattern or structures may be "on", "top" or "bottom" of the substrate, each layer (film), region, pad or patterns. When referred to as being formed in, for example, that each layer (film), region, pad, pattern or structure is formed directly over or below the substrate, each layer (film), region, pad or patterns Alternatively, other layers (films), other regions, different pads, different patterns or other structures may be additionally formed on the substrate. In addition, if each layer (film), region, pad, electrode, pattern or structure is referred to, for example, as "first", "second", "third" and / or "fourth", It is not intended to limit the members, but merely to distinguish each layer (film), region, pad, pattern or structure. Thus, "first", "second", "third" and / or "fourth" may be used selectively or interchangeably for each layer (film), region, electrode, pad, pattern or structure, respectively. Can be.

Manufacturing method of multilayer ceramic substrate

1 is a cross-sectional view illustrating a micro multilayered ceramic substrate formed by a method of manufacturing a multilayer ceramic substrate according to an exemplary embodiment of the present invention. FIG. 2 is a process diagram illustrating a process of manufacturing the green multilayer ceramic sheet shown in FIG. 1.

Referring to FIG. 1, a green multi-layer ceramic substrate 10 is manufactured by stacking a plurality of green ceramic sheets 1.

Referring to FIG. 2, in order to manufacture a plurality of microcrystalline ceramic sheets 1, first, a ceramic powder, a dispersant and a solvent for uniformly dispersing the ceramic powder are first mixed. Or agitated) to prepare a first ceramic mixture.

Subsequently, a secondary ceramic mixture is prepared by secondary mixing (or stirring) of a binder and a plasticizer having adhesion to the primary ceramic mixture.

The secondary ceramic mixture may contain a large amount of bubbles by introducing air during mixing (or stirring). When the secondary ceramic mixture containing bubbles is formed into a sheet shape, a recess may be formed by bubbles on the surface of the green ceramic sheet, and voids may be generated inside the green ceramic sheet by bubbles. ) May be formed.

To prevent this, after the secondary ceramic mixture is formed, bubbles contained in the secondary ceramic mixture are removed. The secondary ceramic mixture containing bubbles is loaded into a chamber having a pressure lower than atmospheric pressure to completely remove bubbles contained in the secondary ceramic mixture.

Bubble-free secondary ceramic mixtures are processed into thin plates by various methods to produce microcrystalline ceramic sheets 1.

FIG. 3 is a cross-sectional view illustrating the formation of a through hole formed through a green ceramic sheet manufactured by the process illustrated in FIG. 2 using a drill apparatus.

Referring to FIG. 3, after the green ceramic sheet 1 is manufactured, a through hole 2 is formed through the green ceramic sheet 1. In this embodiment, the through hole 2 may have a diameter of several tens of micrometers to several hundreds of micrometers. For example, the through hole 2 may be a drill equipped with a drill 2a having a diameter of several tens of micrometers to several hundreds of micrometers. It can be formed using the device (2b). In the present embodiment, when the through hole 2 is formed before the green ceramic sheet 1 is sintered through the drill 2a mounted to the drill device 2b, the green ceramic sheet 1 having a weak hardness is formed. ) Cracking and cracks around the through hole 2 can be suppressed. In the present embodiment, the through hole 2 penetrating the microcrystalline ceramic sheet 1 is formed by using the drill 2a of the drill device 2b. Alternatively, in the present embodiment, a recess having a predetermined depth may be formed in the green ceramic sheet 1 by using the drill 2a of the drill apparatus 2b.

4 is a cross-sectional view illustrating the formation of a through hole formed through a green ceramic sheet manufactured by the process illustrated in FIG. 2 using a laser beam.

Referring to FIG. 4, after the green ceramic sheet 1 is manufactured, a through hole 2 is formed through the green ceramic sheet 1. In the present embodiment, the through hole 2 may have a diameter of several tens of micrometers to several hundred micrometers. For example, the through hole 2 may be formed using a laser beam generator 3b that emits a laser beam 3a having a diameter of several tens of micrometers to several hundreds of micrometers.

In the present embodiment, when the through hole 2 is formed before the green ceramic sheet 1 is sintered through the laser beam 3a emitted from the laser beam generator 3b, the green ceramic having a weak hardness It is possible to suppress cracking of the sheet 1 and generation of cracks around the through hole 2.

In the present embodiment, the through hole 2 penetrating the green ceramic sheet 1 is formed by using the laser beam 3a emitted from the laser beam generator 3b. Alternatively, in this embodiment, a recess having a predetermined depth may be formed in the green ceramic sheet 1 by using the laser beam 3a emitted from the laser beam generator 3b.

Referring again to FIG. 1, a plurality of sheets of a green ceramic sheet 1 having a through hole 2 or a recess formed therein through which the green ceramic sheet 1 is formed are stacked to form a green ceramic substrate 10. . At this time, the through holes 2 formed in each of the green ceramic sheets 1 are aligned with each other to form a hole 4 penetrating the green ceramic substrate 10.

5 is a cross-sectional view illustrating the alignment of the green ceramic sheets illustrated in FIG. 3 or 4 by using an alignment key.

Referring to FIG. 5, in order to form the holes 4 in the green ceramic substrate 10 by aligning the through-holes 2 formed in each of the green ceramic sheets 1, the green ceramic sheet 1 may be formed. An alignment key 5 may be formed in an unused area, for example, an edge of the green ceramic sheet 1. Preferably, at least two alignment keys 5 may be formed at the edge of the green ceramic sheet 1.

The align key 5 formed at the edge of the green ceramic sheet 1 is imaged by a visual unit 5 such as a CCD (Charged Coupled Device Camera), and then processed by an image processing method. The through holes 2 formed in each of the green ceramic sheets 1 are aligned with each other.

FIG. 6 is a cross-sectional view illustrating the alignment of the green ceramic sheets illustrated in FIG. 3 or 4 using an alignment hole and an alignment rod.

Referring to FIG. 6, in order to form the holes in the green ceramic sheet 10 by aligning the through-holes 2 formed in the green ceramic sheet 1, each of the green ceramic sheets 1 is not used. At least two align holes 7 are formed in the region, for example at the edge of each green ceramic sheet 1, and the align holes 7 are arranged in the align rod 7a. The through holes 2 formed in the plurality of green ceramic sheets 1 may be aligned to form holes 4 in the green ceramic substrate 10.

7 is a cross-sectional view illustrating the formation of a multi-layered ceramic substrate according to another embodiment of the present invention.

Referring to FIG. 7, after stacking a plurality of micro multilayer ceramic sheets 1 manufactured by the method shown in FIG. 2, the micro multilayer ceramics are then drilled by a drill 2a or a laser beam having a fine diameter. The through-holes 2 may be formed at designated positions of the substrate 10 to form the microcrystalline multilayer ceramic substrate 10.

FIG. 8 is a cross-sectional view illustrating disposing a shrinkage preventing sheet on both sides of the green multilayer ceramic substrate illustrated in FIG. 1.

Referring to FIG. 8, the green multilayer ceramic substrate 10 having the holes 4 penetrating through the green multilayer ceramic substrate 10 may be shrunk by a subsequent sintering process, thereby The position may be uneven.

To prevent this, the micro-shrinkage prevention sheets 21, 23 and 20 are respectively disposed on the upper and lower surfaces of the green multi-layered ceramic substrate 10, respectively. The micro-shrinkage prevention sheet 20 includes ceramics, respectively, and suppresses shrinkage of the multi-layered ceramic substrate 10 during the sintering of the multi-layered ceramic substrate 10. For example, when the micro-shrinkage preventive sheets 20 are disposed on both sides of the micro-multilayer ceramic substrate 10, the micro-multilayer ceramic substrate 10 may shrink by about 5 μm to about 8 μm per inch. have.

On the other hand, when the green multilayer ceramic substrate 10 is sintered at the first temperature, the green shrink shrink prevention sheets 20 are not sintered at the first temperature. Preferably, the micro-shrinkage prevention sheet 20 is sintered at a second temperature higher than the first temperature. Thus, even when the green multilayer ceramic substrate 10 having the holes 4 is sintered at the first temperature, the green shrink-resistant sheet 20 is not sintered and as a result is caused by the sintering of the green multilayer ceramic substrate 10. One contraction can be suppressed.

FIG. 9 is a cross-sectional view illustrating the sintering of a green multilayer ceramic substrate on which the green shrink shrink prevention sheet shown in FIG. 8 is mounted.

Referring to FIG. 9, the multi-layered multilayer ceramic substrate 10 having the micro-shrinkage preventing sheets 20 disposed on both sides is loaded into the sintering furnace 30 and the first temperature in the sintering furnace. After sintering, a multilayer ceramic substrate 40 having holes 4 is produced. On the other hand, the micro-shrinkage prevention sheet 20 disposed on both sides of the multilayer ceramic substrate 40 sintered in the sintering furnace 30 is not sintered in the sintering furnace 30.

FIG. 10 is a cross-sectional view illustrating removing a micro shrink shrink sheet attached to the multilayer ceramic substrate illustrated in FIG. 9.

Referring to FIG. 10, the multilayer ceramic substrate 40 slowly cooled in the sintering furnace 30 is unloaded from the inside of the sintering furnace 30 to the outside. After the sintered multilayer ceramic substrate 40 is unloaded from the sintering furnace 30, the micro-shrinkage prevention sheets 20 disposed on both sides of the sintered multilayer ceramic substrate 40 are sintered multilayer ceramic substrate 40. Is removed from. In the present embodiment, the micro-shrinkage prevention sheet 20 may be removed by an ultrasonic method or a method of rubbing with a brush.

Meanwhile, during the sintering of the microcrystalline multilayer ceramic substrate 10 in the sintering furnace 30, an interfacial reaction may occur at the interface between the unsintered multilayer ceramic substrate 10 and the non-shrinkage shrinkage preventing sheet 20. Due to this, even if the micro shrink shrink protection sheet 20 is removed from the multilayer ceramic substrate 40, a part of the micro shrink shrink prevention sheet 20 may remain.

In order to smoothly process the surface of the multilayer ceramic substrate 40 and remove the anti-shrinkage shrinkage sheet 20 remaining on the surface of the multilayer ceramic substrate 40, for example, the surface of the multilayer ceramic substrate 40 may be a slurry. It may be treated by a chemical mechanical polishing (CMP) process using a slurry. After the CMP process is finished, the sintered multilayer ceramic substrate 40 is cleaned through a cleaning process.

In the present embodiment, preferably, the surface of the multilayer ceramic substrate 40 is subjected to a CMP process or the like before the hole reprocessing process of increasing the diameter of the hole after the sintered multilayer ceramic substrate 10 is sintered in the sintering furnace 30. Alternatively, the surface of the multilayer ceramic substrate 40 may be processed after forming via holes in the multilayer ceramic substrate 40.

FIG. 11 is a cross-sectional view illustrating reworking holes in the multilayer ceramic substrate illustrated in FIG. 10. 12 is a plan view of a portion of FIG. 11.

11 and 12, the multilayer ceramic substrate 40 sintered in the sintering furnace 30 may be somewhat shrunk, although shrinkage is suppressed by the non-shrinkage shrinkage preventing sheet. In order to further improve the function of the holes 4 formed in the multilayer ceramic substrate 40, after the multilayer ceramic substrate 40 is manufactured, the holes 4 are reworked to produce via holes 8. .

The hole 4 of the multilayer ceramic substrate 40 is processed by a hole expansion process such as, for example, a boring process for smoothing the inner surface of the hole 4 or increasing the diameter of the hole 4, thereby forming a via hole. (8) is formed.

In this embodiment, for example, the holes 4 of the multilayer ceramic substrate 40 sintered in the sintering furnace 30 have a diameter of D1 and the via holes 8 of the reprocessed multilayer ceramic substrate 40. ) Has a diameter of D greater than D1. In the present embodiment, the surface of the inner surface of the hole 4 is also smoothed while the diameter of the hole 4 of the multilayer ceramic substrate 40 is expanded, so that the multilayer ceramic substrate 40 having the via hole 8 is obtained. ) Is manufactured.

In this embodiment, the spacing between the via holes 8 may be about 1.5 times the diameter D of the via holes 8. Preferably, the spacing between the via holes 8 may be about 1.0 to about 1.5 times the diameter D of the via holes 8.

The multilayer ceramic substrate 40 having the via holes 8 manufactured as described above is provided with a guide plate for guiding probe pins mounted in a probe system, which is one of semiconductor inspection equipment, and a chemical vapor deposition (CVD) device. It can be applied to a wide range of electric, electronic, semiconductor device fields such as a spraying head for spraying.

Multilayer ceramic substrate

13 is a cross-sectional view illustrating a multilayer ceramic substrate according to an embodiment of the present invention.

Referring to FIG. 13, the multilayer ceramic substrate 200 includes a multilayer ceramic body 210 having via holes 215.

The multilayer ceramic body 210 is formed by stacking a plurality of ceramic sheets 205.

Specifically, the via holes 215 formed in the multilayer ceramic body 210 first form through holes in the plurality of green ceramic sheets having a sheet shape, and then stack the plurality of green ceramic sheets having the through holes. After sintering by attaching the micro-shrinkage preventing sheet to both sides of the laminated green ceramic sheets, the through-holes formed in the sintered ceramic sheet may be expanded.

Alternatively, the via holes 215 formed in the multilayer ceramic body 210 are formed by stacking a plurality of green ceramic sheets having a sheet shape, and then forming through holes in the green ceramic sheets by a laser beam or a drill. Thereafter, after sintering by attaching the micro-shrinkage prevention sheet to both sides of the laminated green ceramic sheets, the through-holes formed in the sintered ceramic sheet may be expanded and formed.

In the present embodiment, the via holes 215 formed in the multilayer ceramic body 210 have, for example, a diameter D2 of several tens of micrometers to several hundreds of micrometers, and the spacing D3 between adjacent via holes 215 is the via hole 215. It is preferably about 1.0 to 1.5 times the spacing between the shells. In the present embodiment, when the distance between the via holes 215 is about 1.5 times or less, specifically 1.0 times or less, it is difficult to process the via holes 215 having a diameter of only tens of micrometers to several hundreds of micrometers.

According to the present embodiment, after the through-hole is formed in the multi-layered ceramic body made of the multi-layered ceramic sheet, the multi-layered ceramic body is sintered using a shrinkage preventing sheet, and then the through-hole is expanded to extend the through-hole ( By forming the 215, the via holes 215 having a diameter of only a few micrometers to several hundred micrometers and a distance between the via holes 215 of about 1.0 to 1.5 times can be precisely formed at a designated position.

Meanwhile, when laminating fine multilayer ceramic sheets, alignment keys or alignment holes may be formed in the green multilayer ceramic sheets to align the positions of the through holes.

As described in detail above, the via hole having a fine pitch and a fine diameter can be precisely formed at a designated position of the multilayer ceramic substrate having a very high hardness.

In the detailed description of the present invention described above with reference to a preferred embodiment of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge in the scope of the invention described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

Claims (15)

Stacking a plurality of green ceramic sheets to form a green multilayer ceramic substrate having a plurality of through holes; Disposing micro-shrinkage preventing sheets for suppressing shrinkage of the multi-layered multilayer ceramic substrate, respectively, on upper and lower surfaces of the multi-layered multilayer ceramic substrate; Sintering the microcrystalline multilayer ceramic substrate to form a multilayer ceramic substrate; Removing the green shrink-resistant sheets from the multilayer ceramic substrate; And Processing the through-holes to form via holes. The method of claim 1, wherein in the forming of the green multilayer ceramic substrate, before laminating the green ceramic sheet, each of the green ceramic sheets is formed with a through hole. . The method of claim 1, wherein in the forming of the green multilayer ceramic substrate, after the green ceramic sheet is formed, the through ceramic hole is formed in the green multilayer ceramic substrate. . The method of claim 1, wherein the microcrystalline multilayer ceramic substrate is sintered at a first temperature, and the anti-shrink sheet is sintered at a second temperature higher than the first temperature. The method of claim 1, wherein in the step of forming the microcrystalline multilayer ceramic substrate, the through holes are formed by any one of a punching process by a punch, a laser process by a laser beam, and a drilling process by a drill. The manufacturing method of the multilayer ceramic substrate. The method of claim 1, wherein in the removing of the anti-shrink sheet, the anti-shrink sheet is removed by ultrasonic waves or a brush. The method of claim 1, wherein in the forming of the via hole, the through hole is processed by a boring process for processing the surface of the through hole and expanding the diameter of the through hole, so that the via hole is formed. The manufacturing method of the multilayer ceramic substrate. The method of claim 1, wherein the gap between the via holes is at least 1.5 times the diameter of the via holes. The method of claim 1, wherein the forming of the green multilayer ceramic substrate comprises arranging through holes formed in each of the green multilayer ceramic sheets by an alignment key formed in each of the green multilayer ceramic sheets. The manufacturing method of the multilayer ceramic substrate characterized by the above-mentioned. The method of claim 1, wherein the forming of the multi-layered ceramic substrate comprises: aligning through holes formed in each of the multi-layered ceramic sheets by inserting alignment holes formed in each of the multi-layered ceramic sheets into an alignment rod. Method for producing a multilayer ceramic substrate comprising the step of. The method of claim 1, wherein in the forming of the multi-layered ceramic substrate having the through holes, the first diameter of the through holes is smaller than the second diameter of the via holes. . The method of claim 1, wherein forming the green multilayer ceramic sheet Primary mixing the ceramic powder, the dispersant, and the solvent to prepare a primary ceramic mixture; Preparing a secondary ceramic mixture by secondly mixing a binder and a plasticizer having adhesion to the ceramic mixture; Defoaming bubbles contained in the secondary ceramic mixture; And The method of manufacturing a multilayer ceramic substrate comprising the step of processing the defoamed secondary ceramic mixture in the form of a sheet. It includes a multilayer ceramic body consisting of a ceramic sheet laminated a plurality of sheets and a plurality of via holes formed through the multilayer ceramic body, Wherein the spacing between adjacent via holes is 1.0 to 1.5 times the diameter of the via hole. The multilayer ceramic substrate of claim 12, wherein an alignment key for aligning the through holes formed in each of the ceramic sheets is formed in the ceramic sheet. The multilayer ceramic substrate of claim 12, wherein an alignment hole for aligning the through holes formed in each of the ceramic sheets is formed in the ceramic sheet.

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