KR20070032463A - Liquid crystal display comprising semiconductor chip and flexible printed circuit board attached on liquid crystal panel by using one anisotropic conductive film - Google Patents

Liquid crystal display comprising semiconductor chip and flexible printed circuit board attached on liquid crystal panel by using one anisotropic conductive film Download PDF

Info

Publication number
KR20070032463A
KR20070032463A KR1020050086726A KR20050086726A KR20070032463A KR 20070032463 A KR20070032463 A KR 20070032463A KR 1020050086726 A KR1020050086726 A KR 1020050086726A KR 20050086726 A KR20050086726 A KR 20050086726A KR 20070032463 A KR20070032463 A KR 20070032463A
Authority
KR
South Korea
Prior art keywords
liquid crystal
bonding
crystal panel
driving
fpcb
Prior art date
Application number
KR1020050086726A
Other languages
Korean (ko)
Other versions
KR100735683B1 (en
Inventor
정민재
Original Assignee
(주)하호테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)하호테크 filed Critical (주)하호테크
Priority to KR1020050086726A priority Critical patent/KR100735683B1/en
Publication of KR20070032463A publication Critical patent/KR20070032463A/en
Application granted granted Critical
Publication of KR100735683B1 publication Critical patent/KR100735683B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/54—Arrangements for reducing warping-twist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)

Abstract

An LCD including a semiconductor chip attached to a liquid crystal panel using one ACF(anisotropic conductive film) and an FPCB(flexible printed circuit board), and a method of fabricating the same are provided to improve the productivity and bonding performance by reducing a process time for bonding a driver IC(integrated circuit) and the FPCB to the liquid crystal panel. A liquid crystal panel(10) includes a bonding region(11a) where a circuit pattern is formed. One ACF is attached to the bonding region. A driver IC for a liquid crystal panel and an FPCB are bonded to an upper surface of the ACF such that they are spaced apart from each other.

Description

하나의 이방성 전도필름을 이용하여 액정패널에 부착되는 반도체칩 및 플렉시블 인쇄회로기판을 포함하는 액정표시장치 및 그 제조방법{Liquid crystal display comprising semiconductor chip and flexible printed circuit board attached on liquid crystal panel by using one anisotropic conductive film} Liquid crystal display comprising semiconductor chip and flexible printed circuit board attached on liquid crystal panel by using one anisotropic conductive film anisotropic conductive film}

도 1은 액정패널에 구동 IC와 FPCB가 접합된 모습을 나타낸 도면1 is a view showing a state in which a driving IC and an FPCB are bonded to a liquid crystal panel;

도 2는 도 1의 Ⅰ-Ⅰ선에 따른 단면도2 is a cross-sectional view taken along line II of FIG. 1.

도 3은 이방성 도전필름을 이용하여 구동 IC와 액정패널을 연결하는 모습을 나타낸 도면3 is a view showing a state in which a driving IC and a liquid crystal panel are connected by using an anisotropic conductive film.

도 4a 내지 도 4d는 종래에 액정패널에 구동 IC와 FPCB를 접합하는 과정을 순서대로 나타낸 도면4A to 4D are diagrams sequentially illustrating a process of bonding a driving IC and an FPCB to a liquid crystal panel according to the related art.

도 5a 내지 도 5c는 본 발명의 실시예에 따라 액정패널에 구동 IC와 FPCB를 접합하는 과정을 순서대로 나타낸 도면5A through 5C are diagrams sequentially illustrating a process of bonding a driving IC and an FPCB to a liquid crystal panel according to an exemplary embodiment of the present invention.

도 6은 본딩 스테이지가 분리된 모습을 나타낸 도면6 is a view illustrating a state in which a bonding stage is separated.

*도면의 주요부분에 대한 부호의 설명** Explanation of symbols for main parts of drawings *

10 : 액정패널 11 : TFT 어레이 기판10 liquid crystal panel 11 TFT array substrate

11a : 본딩영역 12 : 컬러필터 기판11a: bonding area 12: color filter substrate

14 : 본딩패드 20 : 구동 IC14: bonding pad 20: drive IC

22 : 칩패드 30 : 화상표시부22: chip pad 30: image display unit

40 : FPCB 50 : 구동 IC용 이방성 도전필름40: FPCB 50: Anisotropic conductive film for driving IC

60 : FPCB용 이방성 도전필름 70 : 스테이지60: anisotropic conductive film for FPCB 70: stage

80 : 본딩헤드80: bonding head

본 발명은 액정표시장치(LCD: Liquid Crystal Display)에서 구동 IC와 플렉시블 인쇄회로기판(FPCB: Flexible Printed Circuit Board)을 액정패널에 접합하는 방법에 관한 것으로서, 구체적으로는 하나의 이방성 도전필름(ACF: Anisotropic Conductive Film)을 이용하여 구동 IC와 FPCB를 액정패널에 접합하는 방법에 관한 것이다.The present invention relates to a method of bonding a driving IC and a flexible printed circuit board (FPCB) to a liquid crystal panel in a liquid crystal display (LCD), and specifically, an anisotropic conductive film (ACF). The present invention relates to a method of bonding an IC and a FPCB to a liquid crystal panel using an anisotropic conductive film.

일반적으로 액정표시장치는 액정패널, 액정패널을 구동하는 구동 IC, 구동 IC에 호스트 시스템의 영상정보를 전달하는 구동회로, 액정패널에 빛을 공급하는 백라이트유닛 및 이들을 고정하는 프레임을 포함한다.In general, a liquid crystal display device includes a liquid crystal panel, a driving IC for driving the liquid crystal panel, a driving circuit for transmitting image information of the host system to the driving IC, a backlight unit for supplying light to the liquid crystal panel, and a frame fixing the same.

액정패널은 게이트 배선 및 데이터 배선에 의해 정의된 화소 영역에 박막트랜지스터(TFT: Thin Film Transistor)와 화소전극을 구비하는 TFT 어레이기판, 컬 러필터층과 공통전극을 구비하는 컬러필터 기판, 두 기판 사이에 충진되는 액정층으로 구성된다.The liquid crystal panel includes a TFT array substrate having a thin film transistor (TFT) and a pixel electrode in a pixel region defined by gate wiring and data wiring, a color filter substrate having a color filter layer and a common electrode, and a gap between two substrates. It consists of a liquid crystal layer filled in.

이러한 액정패널은 구동 IC의 제어신호 및 비디오신호에 따라 액정의 배열을 변화시켜 소정의 화상을 표시하며, 구동 IC는 일반적으로 액정패널의 게이트라인을 구동하는 게이트 구동 IC와 데이터라인(또는 소스라인)을 구동하는 데이터 구동 IC로 구분된다. 양자는 별개로 제작되기도 하지만 소형 액정패널에서는 하나의 구동 IC를 이용하여 게이트라인 및 데이터라인을 구동하기도 한다.Such a liquid crystal panel displays a predetermined image by changing an arrangement of liquid crystals according to a control signal and a video signal of a driving IC. A driving IC generally includes a gate driving IC and a data line (or a source line) for driving a gate line of a liquid crystal panel. ) Is divided into data driving ICs. Although both are manufactured separately, a small liquid crystal panel may drive a gate line and a data line using a single driving IC.

이러한 구동 IC가 액정패널에 신호를 전달하기 위해서는 액정패널과 전기적으로 연결되어야 하는데, 액정패널과 구동 IC를 연결하는 방법에는 TAB(Tape Automated Bonding) 방식과 COG(Chip On Glass) 방식 등이 있다.In order to transmit a signal to the liquid crystal panel, the driving IC must be electrically connected to the liquid crystal panel. A method of connecting the liquid crystal panel and the driving IC includes a tape automated bonding (TAB) method and a chip on glass (COG) method.

TAB방식은 구동 IC를 실장한 TCP(Tape Carrier Package)를 액정패널에 접합하는 방식이고, COG방식은 액정패널의 상면에 직접 구동 IC를 실장하는 방식이다. COG방식은 실장면적을 최소화할 수 있기 때문에 제품의 경박단소가 요구되는 소형 전자제품의 액정표시장치에 많이 사용된다.The TAB method is a method in which a TCP (Tape Carrier Package) in which a drive IC is mounted is bonded to a liquid crystal panel, and the COG method is a method in which a drive IC is directly mounted on an upper surface of the liquid crystal panel. Since COG method can minimize the mounting area, it is widely used in the liquid crystal display device of small electronic products requiring light and small size of the product.

도 1은 액정패널(10)에 COG 방식으로 구동 IC(20)를 실장한 모습을 나타낸 도면으로서, TFT 어레이 기판(11)과 컬러필터 기판(12)을 적층한 액정패널(10)과 액정패널(10)에 부착된 구동 IC(20) 및 FPCB(40)를 나타내고 있다. FIG. 1 is a view showing a state in which the driving IC 20 is mounted on the liquid crystal panel 10 in a COG method, wherein the liquid crystal panel 10 and the liquid crystal panel in which the TFT array substrate 11 and the color filter substrate 12 are stacked. The driving IC 20 and the FPCB 40 attached to (10) are shown.

액정패널(10)에서 게이트라인과 데이터라인이 교차하는 영역은 화상표시부(30)이고, 화상표시부(30)의 주변부는 본딩영역(11a)으로서 TFT 어레이 기판(11)과 컬러필터 기판(12)의 전극라인과 연결되는 본딩패드(미도시)가 형성되어 있다.In the liquid crystal panel 10, the region where the gate line and the data line intersect is the image display unit 30, and the periphery of the image display unit 30 is the bonding region 11a as the TFT array substrate 11 and the color filter substrate 12. Bonding pads (not shown) connected to the electrode lines are formed.

본딩영역(11a)에 실장된 2개의 구동 IC(20)는 각각 게이트 구동 IC 와 데이터 구동 IC를 나타내며, 본딩영역(11a)에서 각 구동 IC(20)와 소정 거리 이격된 위치에는 외부 구동회로의 영상신호를 전달받아 구동 IC(20)로 전달하는 FPCB(40)가 접합된다. Each of the two driving ICs 20 mounted in the bonding region 11a represents a gate driving IC and a data driving IC, and each of the driving ICs 20 in the bonding region 11a is spaced apart from each of the driving ICs 20 by a predetermined distance. The FPCB 40 that receives the video signal and delivers it to the driving IC 20 is bonded.

FPCB(40)는 액정패널(10)의 본딩영역(11a)에 형성되어 있는 회로패턴에 의해 인접한 구동 IC(20)와 전기적으로 연결된다.The FPCB 40 is electrically connected to the adjacent driving ICs 20 by a circuit pattern formed in the bonding region 11a of the liquid crystal panel 10.

도 2는 도 1의 Ⅰ-Ⅰ선에 따른 단면을 도시한 것으로서, 액정패널(10)의 본딩영역(11a)에 구동 IC(20)와 FPCB(40)가 접합된 모습을 나타내며, 이때 접합매개물로 주로 이용되는 것이 이방성 도전필름(ACF: Anisotropic Conductive Film, 50,60)이다.FIG. 2 is a cross-sectional view taken along the line I-I of FIG. 1 and shows a state in which the driving IC 20 and the FPCB 40 are bonded to the bonding region 11a of the liquid crystal panel 10. In this case, the bonding medium Anisotropic conductive film (ACF: 50,60) is mainly used.

이방성 도전필름(50)은 접합부위를 확대한 도 3에 도시된 바와 같이, 열경화성 에폭시수지 등의 절연성수지로 이루어지는 접착제에 금속재질 또는 폴리머입자에 금속피막을 코팅한 재질의 도전볼(52)을 분산시켜 제조한 것이다.The anisotropic conductive film 50 is a conductive ball 52 made of a metal material or a polymer particle coated with a metal film on an adhesive made of an insulating resin such as a thermosetting epoxy resin, as shown in FIG. It is prepared by dispersing.

액정패널(10)의 본딩영역(11a)에 이러한 이방성 도전필름(50)을 부착하고 그 위에 본딩장치를 이용하여 구동 IC(20)를 가열하면서 압착하면, 구동 IC(20)의 저면과 액정패널(10) 사이에 접착제가 충진되어 양자가 접합하는 한편, 구동 IC의 칩패드(22)와 액정패널(10)의 본딩패드(14) 사이에서 도전볼(52)이 융착하면서 칩패드(22)와 본딩패드(14)가 전기적으로 연결된다.When the anisotropic conductive film 50 is attached to the bonding region 11a of the liquid crystal panel 10 and pressed while heating the driving IC 20 using a bonding apparatus thereon, the bottom surface of the driving IC 20 and the liquid crystal panel Adhesive pads are filled between the two to bond the two, while the conductive pads 52 are fused between the chip pad 22 of the driving IC and the bonding pad 14 of the liquid crystal panel 10. And the bonding pad 14 are electrically connected.

이러한 이방성 도전필름은 FPCB(40)를 액정패널(10)에 접합하는 경우에도 동 일하게 이용되는데, 다만 구동 IC용 ACF(50)에는 FPCB용 ACF(60)에 비해 도전볼의 직경이 작고 밀도가 더 큰 제품이 사용된다. 일반적으로는 구동 IC의 칩패드(22)가 FPCB(40)의 본딩패드에 비하여 훨씬 더 미세한 피치를 가지기 때문이다. The anisotropic conductive film is used in the same case when the FPCB 40 is bonded to the liquid crystal panel 10. However, the drive IC ACF 50 has a smaller diameter and density of the conductive balls than the FPCB ACF 60. The larger product is used. This is because the chip pad 22 of the driving IC generally has a much finer pitch than the bonding pad of the FPCB 40.

이하에서는 도 4a 내지 도 4d를 참조하여 액정패널(10)에 구동 IC(20) 및 FPCB(40)를 접합하는 과정을 설명한다.Hereinafter, a process of bonding the driving IC 20 and the FPCB 40 to the liquid crystal panel 10 will be described with reference to FIGS. 4A to 4D.

먼저 본딩장치의 스테이지(70) 위에 액정패널(10)을 안치시키고 액정패널(10)의 본딩영역(11a)에 구동 IC용 ACF(50)를 부착한다.(도 4a)First, the liquid crystal panel 10 is placed on the stage 70 of the bonding apparatus, and the driving IC ACF 50 is attached to the bonding region 11a of the liquid crystal panel 10 (FIG. 4A).

본딩헤드(80)를 이용하여 구동 IC용 ACF(50)의 상부에 구동 IC(20)를 가열 압착하면 구동 IC(20)가 액정패널(10)의 상면에 접합되는 한편, 도전볼이 칩패드와 본딩패드 사이에서 융착되면서 양자를 전기적으로 연결시킨다.(도 4b)When the driving IC 20 is heat-compressed on the ACF 50 for the driving IC using the bonding head 80, the driving IC 20 is bonded to the upper surface of the liquid crystal panel 10, while the conductive ball is chipped. Is electrically bonded between the bonding pad and the bonding pad (FIG. 4B).

이어서 구동 IC(20)를 외부의 구동회로와 연결시키는 FPCB(40)를 본딩영역(11a)에 접합시켜야 하므로 이를 위해 구동 IC(20)의 외측으로 소정거리 이격된 위치에 FPCB용 ACF(60)를 부착한다.(도 4c)Subsequently, the FPCB 40 connecting the driving IC 20 to the external driving circuit should be bonded to the bonding region 11a. For this purpose, the ACF 60 for the FPCB is positioned at a position spaced a predetermined distance to the outside of the driving IC 20. Attach (Fig. 4c).

그리고 본딩헤드(80)를 이용하여 FPCB(40)를 ACF(60)의 상부에서 가열 압착하면 FPCB(40)가 액정패널(10)의 상면에 접합되는 한편, 도전볼이 FPCB(40)의 본딩부와 액정패널(10)의 본딩패드 사이에서 융착되면서 양자를 전기적으로 연결시킨다.(도 4d)When the FPCB 40 is heat-compressed on the top of the ACF 60 using the bonding head 80, the FPCB 40 is bonded to the upper surface of the liquid crystal panel 10, while the conductive balls are bonded to the FPCB 40. It is fused between the bonding pad and the bonding pad of the liquid crystal panel 10 to electrically connect the two (Fig. 4d).

그런데 구동 IC(20)와 FPCB(40)의 접합위치가 매우 근접되어 있음에도 불구 하고 이러한 방식으로 구동 IC(20)와 FPCB(40)를 접합하면 다음과 같은 문제점이 있다.However, even though the junction position of the driver IC 20 and the FPCB 40 is very close to each other, when the driver IC 20 and the FPCB 40 are bonded in this manner, there are the following problems.

즉, 구동 IC용 ACF(50)와 FPCB용 ACF(60)를 각각 별개의 접합공정을 통해 부착하므로 공정시간을 지연시키는 요인이 된다.In other words, the ACF 50 for the driver IC and the ACF 60 for the FPCB are attached to each other through a separate bonding process, thereby delaying the process time.

또한, 구동 IC용 ACF(50)와 FPCB용 ACF(60)는 통상 도전볼의 직경 및 밀도뿐만 아니라 접착제의 성분도 약간씩 다르기 때문에, 구동 IC(20)를 접합할 때와 FPCB(40)를 접합할 때는 본딩헤드(80)의 온도 및 압력을 약간씩 달리하여야 하는데 이를 조정하는 시간도 공정시간을 지연시키는 요인이 된다.In addition, since the ACF 50 for the driving IC and the ACF 60 for the FPCB usually have slightly different diameters and densities of the conductive balls as well as components of the adhesive, the bonding of the FPCB 40 and the bonding of the driving IC 20 are performed. When the temperature and pressure of the bonding head 80 should be slightly different, the time for adjusting it also causes a delay in the process time.

본 발명은 이러한 문제점을 해결하기 위한 것으로서, 액정패널에 구동 IC와 FPCB를 접합하는 공정시간을 단축함으로써 생산성을 높이는 한편, 이전보다 접합성능을 향상시키는 방안을 제공하는데 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to provide a method of improving productivity while reducing productivity by shortening a process time for bonding a driving IC and an FPCB to a liquid crystal panel.

본 발명은 상기 목적을 달성하기 위하여, 회로패턴이 형성된 본딩영역을 구비하는 액정패널; 상기 본딩영역에 부착된 1매의 이방성 도전필름; 상기 이방성 도전필름의 상면에 서로 이격되어 접합되는 액정패널 구동 IC와 플렉시블 인쇄회로기판(FPCB)을 포함하는 액정표시장치를 제공한다.In order to achieve the above object, the present invention provides a liquid crystal panel comprising a bonding region in which a circuit pattern is formed; One anisotropic conductive film attached to the bonding region; Provided is a liquid crystal display including a liquid crystal panel driver IC and a flexible printed circuit board (FPCB) bonded to the top surface of the anisotropic conductive film spaced apart from each other.

상기 이방성 도전필름에는 5㎛ 이내의 직경을 가지는 도전볼이 100만 개/㎣ 의 밀도로 분산되어 있는 것이 바람직하다.In the anisotropic conductive film, conductive balls having a diameter of 5 µm or less are preferably dispersed at a density of 1 million pieces / cc.

또한 본 발명은, 본딩장치의 스테이지에 액정패널을 안치하는 단계; 상기 액정패널의 본딩영역에 1매의 이방성 도전필름을 부착하는 단계; 상기 이방성 도전필름의 상면에 액정패널 구동 IC를 접합시키는 단계; 상기 이방성 도전필름의 상면에서 상기 구동 IC와 이격된 위치에 플렉시블 인쇄회로기판을 접합시키는 단계를 포함하는 액정표시장치의 제조방법을 제공한다.In addition, the present invention, the step of placing the liquid crystal panel on the stage of the bonding apparatus; Attaching one anisotropic conductive film to the bonding region of the liquid crystal panel; Bonding a liquid crystal panel driver IC to an upper surface of the anisotropic conductive film; A method of manufacturing a liquid crystal display device comprising bonding a flexible printed circuit board to a position spaced apart from the driving IC on an upper surface of the anisotropic conductive film.

또한 본 발명은, 액정패널의 본딩영역에 구동 IC와 플렉시블 인쇄회로기판을 접합시키는 본딩장치에 있어서, 상기 액정패널을 안치하는 스테이지는 구동 IC의 본딩영역을 지지하는 제1 영역과 플렉시블 인쇄회로기판의 본딩영역을 지지하는 제2 영역으로 구분되고, 상기 제1,2 영역은 서로 이격되어 설치되는 칩온글래스 본딩장치를 제공한다.The present invention also provides a bonding apparatus for bonding a driving IC and a flexible printed circuit board to a bonding area of a liquid crystal panel, wherein the stage in which the liquid crystal panel is placed includes a first area and a flexible printed circuit board for supporting a bonding area of the driving IC. The chip-on-glass bonding apparatus is divided into a second region supporting the bonding region of the second region, and the first and second regions are spaced apart from each other.

이하에서는 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 5a 내지 도 5c는 본 발명의 실시예에 따라 액정패널(10)에 구동 IC(20)와 FPCB(40)를 접합하는 과정을 순서대로 나타낸 도면으로서, 먼저 도 5a에 도시된 바와 같이 본딩장치의 스테이지(70) 위에 액정패널(10)을 안치시키고 액정패널(10)의 본딩영역(11a)에 1매의 ACF(50)를 부착한다. 5A to 5C are diagrams sequentially illustrating a process of bonding the driving IC 20 and the FPCB 40 to the liquid crystal panel 10 according to the exemplary embodiment of the present invention. First, as shown in FIG. 5A, a bonding apparatus is illustrated. The liquid crystal panel 10 is placed on the stage 70, and one ACF 50 is attached to the bonding region 11a of the liquid crystal panel 10.

상기 ACF(50)는 구동 IC의 본딩영역뿐만 FPCB의 본딩영역까지 한꺼번에 커버할 수 있을 정도의 면적을 가져야 하며, 그 상면에 구동 IC를 부착하여야 하기 때문에 종래에 구동 IC용으로 사용되던 ACF와 같은 정도의 접합성능과 도전볼 특성을 가지는 것이 바람직하다. 구체적으로는 도전볼의 직경은 5㎛ 이하이고, 밀도는 100만개/㎣인 것이 바람직하다.The ACF 50 should have an area that can cover not only the bonding area of the driving IC but also the bonding area of the FPCB at once, and the driving IC should be attached to the upper surface thereof, such as the ACF used in the past. It is desirable to have a degree of joining performance and conductive ball characteristics. Specifically, it is preferable that the diameter of the conductive ball is 5 µm or less, and the density is 1 million pieces / sq.

다음에 도 5b에 도시된 바와 같이, 본딩헤드(80)를 이용하여 구동 IC(20)를 ACF(50)의 상부에서 가열 압착하면 액정패널(10)의 상면에 구동 IC(20)가 접합되는 한편, 도전볼이 칩패드와 본딩패드 사이에서 융착되면서 양자를 전기적으로 연결시킨다. Next, as shown in FIG. 5B, when the driving IC 20 is heat-compressed on the ACF 50 using the bonding head 80, the driving IC 20 is bonded to the upper surface of the liquid crystal panel 10. Meanwhile, the conductive ball is fused between the chip pad and the bonding pad to electrically connect the two.

본딩헤드(80)는 약 200℃ 정도의 온도에서 약 10초간 구동 IC(20)를 가열압착하게 되는데, 이때 고온의 본딩헤드(80)와 가열된 구동 IC(20)로 인해 FPCB 본딩영역의 ACF(50)가 변성되어 FPCB의 접합성능을 약화시킬 수 있다는 우려가 있었으나, 실험결과 고열로 인해 ACF(50)가 변성되는 영역의 폭은 구동 IC(20)로부터 최대 0.25mm에 불과했다. 따라서 구동 IC(20)와 FPCB(50)의 간격이 통상 0.5mm 이상인 접합공정에서는 이러한 문제는 고려하지 않아도 무방하다.The bonding head 80 heat-compresses the driving IC 20 at a temperature of about 200 ° C. for about 10 seconds. At this time, the ACF of the FPCB bonding region is caused by the high temperature bonding head 80 and the heated driving IC 20. There was a concern that the (50) could be modified to weaken the bonding performance of the FPCB. However, as a result of the experiment, the width of the region where the ACF 50 was modified due to high heat was only 0.25 mm at the maximum from the driver IC 20. Therefore, this problem may not be considered in the bonding process in which the distance between the driver IC 20 and the FPCB 50 is usually 0.5 mm or more.

구동 IC(20)를 접합한 이후에는 FPCB(40)를 접합하게 되는데, 도 5c에 도시된 바와 같이 구동 IC(20)로부터 소정거리 이격된 위치에 FPCB(40)의 단부를 위치시킨 후 역시 본딩패드(80)를 이용하여 FPCB(40)를 가열 압착하면, FPCB(40)가 액정패널(10)의 상면에 접합되는 한편, 도전볼이 FPCB(40)의 본딩부와 액정패널(10)의 본딩패드 사이에서 융착되면서 양자를 전기적으로 연결한다.After the driving IC 20 is bonded, the FPCB 40 is bonded. As shown in FIG. 5C, the end of the FPCB 40 is positioned at a position spaced apart from the driving IC 20 by a predetermined distance, and then bonded. When the FPCB 40 is heat-compressed using the pad 80, the FPCB 40 is bonded to the upper surface of the liquid crystal panel 10, while the conductive ball is bonded to the bonding portion of the FPCB 40 and the liquid crystal panel 10. The two are electrically connected while bonding between the bonding pads.

본 발명에서는 1매의 ACF(50)를 이용하여 구동 IC(20)와 FPCB(40)를 부착함으로써 종래에 비해 FPCB용 ACF를 별도로 부착하는 공정이 줄어들게 되므로 공정시간을 크게 단축시킬 수 있다. 또한 관련 설비와 인건비를 절감하여 생산성을 향상 시킬 수 있다.In the present invention, by attaching the driving IC 20 and the FPCB 40 by using one ACF 50, the process of attaching the ACPC for FPCB separately is reduced compared to the conventional method, thereby greatly reducing the process time. In addition, productivity can be improved by reducing related equipment and labor costs.

또한 종래에는 FPCB(40)를 접합할 때 직경이 10㎛ 정도이고 밀도가 2-3만 개/㎣ 정도인 도전볼이 분산되어 있는 ACF를 주로 이용하였었는데, 본 발명의 실시예에서는 구동 IC(20)를 접합하기 위해 사용되는 고품질의 ACF를 이용하여 FPCB(40)까지 접합하기 때문에 FPCB(40)의 접합성능이 종래에 비해 훨씬 개선되는 효과가 있으며, 얼라인미스로 인해 발생하는 제품불량도 종래에 비해 크게 줄어들게 된다.In addition, conventionally, when joining the FPCB 40, ACF having a conductive ball having a diameter of about 10 μm and a density of about 2-30,000 / μm is dispersed, the driving IC ( 20) Since the bonding to the FPCB 40 by using a high quality ACF used for bonding, there is an effect that the bonding performance of the FPCB (40) is much improved compared to the conventional, product defects caused by alignment miss It is greatly reduced compared to the conventional.

한편 도 6은 액정패널(10)을 안치하는 칩온 글래스 본딩장치의 스테이지(70)가 2개의 영역으로 분리된 모습을 나타낸 것으로서, 구체적으로는 스테이지(70)를 구동 IC(20)가 접합되는 제1 영역(70a)과 FPCB(40)가 접합되는 제2 영역(70b)으로 분리하고 있다.6 illustrates a state in which the stage 70 of the chip-on glass bonding apparatus for arranging the liquid crystal panel 10 is separated into two regions. Specifically, the stage 70 is bonded to the driving IC 20. The first region 70a and the FPCB 40 are separated into a second region 70b.

이와 같이 스테이지(70)를 2개 영역으로 분리하는 것은 구동 IC(20)를 접합하는 과정에서 스테이지를 통해 인접영역으로 열전달이 일어나면 FPCB 접합영역의 ACF(50)가 변성될 우려가 있기 때문에 열전달 가능성을 차단하기 위한 것이다.The separation of the stage 70 into two areas in this way is possible because the ACF 50 in the FPCB junction region may be denatured if heat transfer occurs to the adjacent region through the stage in the process of bonding the driving IC 20. Is to block.

본 발명에 따르면, 액정패널에 구동 IC와 FPCB를 접합하는 공정시간을 단축함으로써 생산성을 높일 수 있고, 종래에 비해 제품의 접합성능을 향상시킬 수 있고 제품불량률을 줄일 수 있다.According to the present invention, productivity can be increased by shortening the process time for bonding the driving IC and the FPCB to the liquid crystal panel, and the bonding performance of the product can be improved and the product defective rate can be reduced as compared with the related art.

Claims (4)

회로패턴이 형성된 본딩영역을 구비하는 액정패널;A liquid crystal panel having a bonding region in which a circuit pattern is formed; 상기 본딩영역에 부착된 1매의 이방성 도전필름;One anisotropic conductive film attached to the bonding region; 상기 이방성 도전필름의 상면에 서로 이격되어 접합되는 액정패널 구동 IC와 플렉시블 인쇄회로기판(FPCB)Liquid crystal panel driver IC and flexible printed circuit board (FPCB) bonded to the top surface of the anisotropic conductive film spaced apart from each other 을 포함하는 액정표시장치Liquid crystal display comprising a 제1항에 있어서,The method of claim 1, 상기 이방성 도전필름에는 5㎛ 이내의 직경을 가지는 도전볼이 100만 개/㎣의 밀도로 분산되어 있는 액정표시장치In the anisotropic conductive film, a liquid crystal display device in which conductive balls having a diameter of 5 µm or less are dispersed at a density of 1 million pieces / ㎣. 본딩장치의 스테이지에 액정패널을 안치하는 단계;Placing a liquid crystal panel on the stage of the bonding apparatus; 상기 액정패널의 본딩영역에 1매의 이방성 도전필름을 부착하는 단계;Attaching one anisotropic conductive film to the bonding region of the liquid crystal panel; 상기 이방성 도전필름의 상면에 액정패널 구동 IC를 접합시키는 단계;Bonding a liquid crystal panel driver IC to an upper surface of the anisotropic conductive film; 상기 이방성 도전필름의 상면에서 상기 구동 IC와 이격된 위치에 플렉시블 인쇄회로기판을 접합시키는 단계Bonding a flexible printed circuit board to a position spaced apart from the driving IC on an upper surface of the anisotropic conductive film; 를 포함하는 액정표시장치의 제조방법Method of manufacturing a liquid crystal display device comprising a 액정패널의 본딩영역에 구동 IC와 플렉시블 인쇄회로기판을 접합시키는 본딩장치에 있어서,A bonding apparatus for bonding a driving IC and a flexible printed circuit board to a bonding area of a liquid crystal panel, 상기 액정패널을 안치하는 스테이지는 구동 IC의 본딩영역을 지지하는 제1 영역과 플렉시블 인쇄회로기판의 본딩영역을 지지하는 제2 영역으로 구분되고, 상기 제1,2 영역은 서로 이격되어 설치되는 칩온글래스 본딩 장치The stage in which the liquid crystal panel is placed is divided into a first region supporting a bonding region of a driving IC and a second region supporting a bonding region of a flexible printed circuit board, and the first and second regions are spaced apart from each other. Glass bonding device
KR1020050086726A 2005-09-16 2005-09-16 Liquid crystal display comprising semiconductor chip and flexible printed circuit board attached on liquid crystal panel by using one anisotropic conductive film KR100735683B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020050086726A KR100735683B1 (en) 2005-09-16 2005-09-16 Liquid crystal display comprising semiconductor chip and flexible printed circuit board attached on liquid crystal panel by using one anisotropic conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050086726A KR100735683B1 (en) 2005-09-16 2005-09-16 Liquid crystal display comprising semiconductor chip and flexible printed circuit board attached on liquid crystal panel by using one anisotropic conductive film

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020070006529A Division KR100787051B1 (en) 2007-01-22 2007-01-22 Bonding apparatus having stage of liquid crystal panel separated into two areas

Publications (2)

Publication Number Publication Date
KR20070032463A true KR20070032463A (en) 2007-03-22
KR100735683B1 KR100735683B1 (en) 2007-07-04

Family

ID=41560455

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050086726A KR100735683B1 (en) 2005-09-16 2005-09-16 Liquid crystal display comprising semiconductor chip and flexible printed circuit board attached on liquid crystal panel by using one anisotropic conductive film

Country Status (1)

Country Link
KR (1) KR100735683B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8940621B2 (en) 2011-06-30 2015-01-27 Samsung Electronics Co., Ltd. Methods of forming semiconductor modules including flexible panels
US9142602B2 (en) 2013-10-17 2015-09-22 Samsung Display Co., Ltd. Display device having anisotropic conductive film and manufacturing method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3356079B2 (en) * 1998-10-12 2002-12-09 ソニーケミカル株式会社 Light-blocking anisotropic conductive adhesive film and liquid crystal display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8940621B2 (en) 2011-06-30 2015-01-27 Samsung Electronics Co., Ltd. Methods of forming semiconductor modules including flexible panels
US9142602B2 (en) 2013-10-17 2015-09-22 Samsung Display Co., Ltd. Display device having anisotropic conductive film and manufacturing method thereof

Also Published As

Publication number Publication date
KR100735683B1 (en) 2007-07-04

Similar Documents

Publication Publication Date Title
US6089442A (en) Electrode connection method
US6456353B1 (en) Display driver integrated circuit module
US10971465B2 (en) Driving chip, display substrate, display device and method for manufacturing display device
US20050162603A1 (en) Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
US10747074B2 (en) Chip on film package and display apparatus having the same
KR100640208B1 (en) Bump structure for testing tft-lcd
KR100447233B1 (en) A Liquid Crystal Display Device
US7265804B2 (en) Liquid crystal display module with a filled wiring structure having square shaped pads distributed like a matrix
US20050185127A1 (en) Method of manufacturing liquid crystal display
KR101499120B1 (en) Display device and method of manufacturing the same
KR100735683B1 (en) Liquid crystal display comprising semiconductor chip and flexible printed circuit board attached on liquid crystal panel by using one anisotropic conductive film
KR20070102048A (en) Liquid crystal display
KR20040087452A (en) Liquid crystal display module
KR20060134662A (en) Chip on glass type liquid crystal display device
KR100266213B1 (en) Cog-type lcd panel
KR100787051B1 (en) Bonding apparatus having stage of liquid crystal panel separated into two areas
US20140132895A1 (en) Liquid crystal display device and production method thereof
JP2004087940A (en) Electronic component mounted board, electro-optical device, method of manufacturing the same, and electronic apparatus
KR20130066844A (en) Liquid crystal display device and method for fabricating the same
JPH08304845A (en) Liquid crystal display device
TW201034543A (en) Display apparatus, display module and flexible circuit board
JPH05313178A (en) Packaging method and packaging structure for panel
JP2005191596A (en) Mounting component, liquid crystal display panel using it, and manufacturing method of the liquid crystal display panel
KR101034683B1 (en) liquid crystal display device
JP2002344097A (en) Mounting substrate and display device having the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
A107 Divisional application of patent
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
G170 Publication of correction
LAPS Lapse due to unpaid annual fee