KR20070009282A - Manipulator aligner - Google Patents

Abstract

A manipulator aligner is provided to prevent an installation error of a manipulator when re-controlling the manipulator with a controller by sensing the constant position of the manipulator with a sensing unit set in advance. A manipulator aligner comprises extract and ground electrodes(242,244) formed with a hole(246) where a positive ion is extracted at each center; a driving unit(260) moving the position of the manipulator; and a sensing unit(300) detecting whether or not the manipulator is placed at the constant position. The sensing unit comprises a first sensing unit(310) mounted at one side of the manipulator; and a second sensing unit(320) installed out of the manipulator and corresponded to the first sensing unit. The sensing unit is connected to a control unit generating a predetermined electrical signal, corresponding to the sensed data and the control unit is connected to a display member allowing a user to recognize the electrical signal.

Description

Manipulator Aligner {MANIPULATOR ALIGNER}

1 is a block diagram showing a general ion source unit provided with a manipulator.

2 is a perspective view showing the configuration of a manipulator aligner according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: ion source portion 280: driving portion

200: manipulator 282: controller

220: connection member 300: detection unit

240 extraction electrode 310 first detection unit

260: ground electrode 320: second sensing unit

The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a manipulator aligner of a semiconductor ion implantation apparatus.

Ion implantation technology is a technique used to inject impurity ions into a wafer for semiconductor manufacturing together with a thermal diffusion technology.

The field of ion implantation technology requires more precise control of impurity introduction, improvement of reproducibility, and improvement of processing capability in response to high integration and high density of semiconductor devices, which cannot be realized by heat diffusion technology, or low concentration impurity introduction. However, the area is gradually expanded in that the doping through the insulating film is possible, in particular, the number of ions injected into the wafer can be controlled by the current, and the depth of implantation of ions can be arbitrarily controlled by the control of the acceleration voltage. .

The principle of ion implantation technology is a method of physically embedding high-energy ions on a wafer as a substrate and boron (B), phosphorus (P), or arsenic (As) of group 3 or 5 on a group 4 silicon wafer. ) And impurity ions such as antimony (Sb) are implanted.

An ion implanter that plays this role includes an ion source that generates an ion beam, a classifier that allows only an ion beam of a desired mass to pass through, and an accelerator that accelerates to the energy enough to inject ions selected from the classifier into the wafer to a desired depth. It is composed of a concentrator which prevents the ion beam from being spread by the repulsive force, a syringe for moving the direction of the ion beam up, down, left, and right to uniformly distribute the ion beam on the wafer, and an end station where the wafer is loaded.

 Here, the ion source portion of the ion implanter is an arc chamber, which is an ion reaction chamber that serves to generate ions, and an extraction electrode that controls the amount, shape, and direction of the ion beam generated from the arc chamber. A manipulator having a suppression electrode and a ground electrode is provided.

1 is a block diagram showing a conventional ion source unit provided with a manipulator. Referring to FIG. 1, the structure of a conventional ion source unit 10 will be described. An arc chamber 12 generating ions, an extraction electrode 24 sequentially formed in a direction in which ions exit the arc chamber 12, and The ground electrode 26 and the drive part 28 which adjusts the angle of these electrodes are comprised. The manipulator 20 including the extraction electrode 24 and the ground electrode 26 is moved or moved up, down, left or right by the driving unit 28. In this case, the driving unit 28 and the manipulator 20 are coupled to each other by the connecting member 22.

In the manipulator 20, it is important to accurately align each axis of the extraction electrode 24 and the ground electrode 26 in order to adjust the amount, shape and direction of the ion beam generated from the arc chamber 12. Thus, the driving unit 28 for aligning the manipulator 20 is provided, and the general manipulator 20 uses the controller provided by the operator outside the manipulator 20 to extract the extraction electrode 24 and the ground electrode 26. Guides the ion beam while moving in the X, Y, and Z directions. In this case, the position of each axis can be checked in a display such as a microcomputer or a screen provided outside the facility. The position is indicated by the resistance value as the potentiometer moves along the flag of each drive shaft of the drive unit.

To date, the alignment of these electrometers has been done without operator reference and tools by the operator's involvement. Therefore, precise alignment of the manipulator was difficult to be achieved, and there was a problem in that the alignment work time was long.

The present invention is to solve the above conventional problems, an object of the present invention is to provide a manipulator aligner for minimizing the equipment error and time loss due to rework due to the angular miss position of the manipulator during maintenance work.

Manipulator aligner of the ion implantation apparatus according to the present invention for achieving the above object is a disk model, disposed in parallel to face each other, a manipulator including an extraction electrode and a ground electrode formed with a hole in which the cation is extracted at each center And a driving unit to move the positions of the extraction electrode and the ground electrode, a connection member interconnecting the extraction electrode and the ground electrode, and the driving unit, a first sensing unit provided in the connection member, and an external side of the connection member. It is provided in, and disposed so as to correspond to the first sensing unit includes a second sensing unit for detecting it when the connection member is in position.

The first sensing unit is a light receiving sensor that receives an optical signal, and the second sensing unit is a light emitting sensor that emits the optical signal to the light receiving sensor.

The first sensing unit is connected to a control unit that generates a predetermined electrical signal in response to the sensing of the first sensing unit, and the control unit is connected to a display member that can recognize the electrical signal by an operator.

The display member may be a display such as a microcomputer and a touch screen, and the X, Y, and Z axes of the manipulator are displayed on the display member.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail. Embodiment of the present invention may be modified in various forms, the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art, that is, those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated to emphasize a clearer description.

(Example)

2 is a perspective view illustrating a configuration of a manipulator aligner of an ion source unit according to an exemplary embodiment of the present invention.

Referring to FIG. 2, the manipulator aligner 200 of the ion source unit 100 according to an embodiment of the present invention may include an extraction electrode 242 and a ground electrode. A manipulator 240 including a 244, a connecting member 220, a driver 260, and a detector 300 are included.

The manipulator 240 includes a disc electrode model and an extraction electrode 242 and a ground electrode 244 facing each other and positioned at a predetermined distance apart from each other. In the extraction electrode 242 and the ground electrode 244, holes 246 through which cations are extracted are formed. The ions generated in the arc chamber (not shown) pass through the slit (not shown) into an ion beam, which passes through the hole 246 formed in the extraction electrode 242 and the ground electrode 244. In this case, the ground electrode 244 extracts positive ions toward the extraction electrode 242, and the extraction electrode 242 functions to neutralize electrons that are negatively extracted with the positive ions so as not to pass.

The connecting member 220 has a shaft shape and couples the electrodes 242 and 244 and the driving unit 260 between the extraction and ground electrodes 242 and 244 and the driving unit 260 to be interlocked together. That is, when the driving unit 260 operates, the connection member 220 connected to the driving unit 260 transfers the operation to the extraction electrode 242 and the ground electrode 244.

The driving unit 260 functions to move the extraction electrode 242 and the ground electrode 244. That is, the driving unit 260 has an X, Y, and Z axes so that the cations can be focused and extracted to a desired focal point when passing through holes 246 formed at the center of the extraction electrode 242 and the ground electrode 244. To align the focus angle. The driving unit 260 includes a driving means such as a motor, and a controller 280 is provided outside the facility for operation of the driving unit 260 to be manually operated by an operator. The operator adjusts the extraction electrode 242 and the ground electrode 244 using the controller 280.

In addition, the driver 260 is provided with a potentiometer (not shown) capable of reading the movement of the X, Y, and Z axes of the extraction electrode 242 and the ground electrode 244. The electrometer moves along a flag of each drive shaft of the drive unit to a display member (not shown) such as a microcomputer or a screen provided outside the facility to allow a worker to recognize movement of the extraction electrode 242 and the ground electrode 244. Indicates. Thus, the operator can recognize the positions of the extraction electrode 242 and the ground electrode 244 according to the movement of the electrometer shown on the display.

The detector 300 includes a first detector 310 and a second detector 320. The first sensing unit 310 is coupled to one side of the connection member 220, and moves together with the movement of the connection member 220. In one embodiment, the first sensing unit 310 may be a light emitting sensor including at least one optical sensor and emitting an optical signal.

The second detector 320 includes first and second sensors 322 and 324 and is provided outside the menu plater aligner 200. The first and second sensors 322 and 324 may be light receiving sensors that receive an optical signal in one embodiment. That is, the first and second sensors 322 and 324 detect the optical signals emitted from the first detector 310. Here, the first detector 310 and the second detector 320 correspond to each other when the extraction electrode 242 and the ground electrode 244 are aligned at a desired position in the ion implantation process by the driver 280. To be located. That is, when the extraction electrode 242 and the ground electrode 244 are adjusted to the optimal position in the process, the optical signal emitted from the first sensing unit 310 is the first and second sensors of the second sensing unit 320 ( 322 and 324 are arranged to be accommodated.

Alternatively, as another embodiment, the first sensing unit 310 may be a light receiving sensor, and the second sensing unit 320 may be a light emitting sensor. That is, when the extraction electrode 242 and the ground electrode 244 are aligned at the position set in the process, the second detector 320 emits an optical signal to the first detector 310 and the first detector 310. ) Is to receive the optical signal emitted from the second detector 320 to detect it.

Data sensed by the first detector 310 or the second detector 320 may be received by a controller (not shown) provided outside the facility, and the controller generates a predetermined electrical signal to allow the operator to It is shown on the display member (not shown) so as to be understood.

The manipulator aligner 200 having the above configuration operates in the following order. First, the operator operates the controller 280 to adjust the extraction electrode 242 and the ground electrode 244 to the optimum position in the process. The alignment operation is performed while the operator checks the movement positions of the X, Y, and Z axes of the manipulator 240 displayed on the display member (not shown) provided outside the facility.

In this case, the first and second sensing units 310 and 320 are set to correspond to each other. For example, the first sensing unit 310 is a light emitting sensor provided in the connecting member 220 and the second sensing unit 320 is a light receiving sensor provided outside the manipulator aligner 200. Receive the optical signal emitted from the light emitting sensor.

Thus, when the operator readjusts the manipulator 240 with the controller 282 during a maintenance operation such as a replacement operation of the manipulator 240, the preset sensing unit 300 may detect the correct position of the manipulator 240. Can be.

 As described above, the manipulator aligner according to the present invention can precisely align the positions of extraction and ground electrodes in a short time during the maintenance work of the manipulator, and thus, loss of time due to equipment error and rework due to angular misposition of the manipulator. Can be minimized.

Claims (6)

In the manipulator aligner disposed in parallel with each other, and aligning the manipulator including an extraction electrode and a ground electrode formed with a hole in which the cation is extracted at each center, A driving unit for moving the position of the manipulator; Manipulator aligner characterized in that it comprises a sensing unit for detecting whether the manipulator is located in the correct position. The method of claim 1, The sensing unit comprises a first sensing unit provided at one side of the manipulator; The manipulator aligner which is provided outside the manipulator and is disposed to correspond to the first sensing unit. The method according to claim 1 or 2, The sensing unit is connected to a control unit for generating a predetermined electrical signal in response to the data sensed by the sensing unit, the control unit is a manipulator aligner, characterized in that connected to the display member that can be recognized by the operator. The method of claim 2, And the first sensing unit is at least one light receiving sensor receiving an optical signal, and the second sensing unit is at least one light emitting sensor emitting the optical signal to the light receiving sensor. A manipulator including an extraction electrode and a ground electrode for extracting cations; At least one light receiving sensor provided at one side of the manipulator; And at least one light emitting sensor provided outside the manipulator to emit an optical signal to the light receiving sensor when the manipulator is positioned at the correct position. The method of claim 5, The manipulator aligner is provided with a driving unit for moving the positions of the extraction electrode and the ground electrode, the driving unit includes a manipulator for recognizing the movement in all directions of the extraction electrode and the ground electrode Aligner.

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