KR20070009091A - Socket device for testing a semi-conductor - Google Patents

Abstract

A socket device for testing a semiconductor chip is provided to enable an electrical element to be selectively connected to a plurality of contact pins, equipped with a contact part, and to be detached from a space part, thereby easily testing semiconductor chips of various types without adding a special electrical element to the test board of the semiconductor chip. A socket device(101) for testing a semiconductor chip comprises the followings: a socket body(102) in which a cradle(105) of a predetermined form, where the semiconductor chip(107) is detached, is formed in one side of the upper side and a predetermined space part(M1) is formed in one side of the inside; a contact part(103) which is located at the bottom of the socket body(102) and is configured by a plurality of contact pins(103a) electrically connecting the semiconductor chip(107) with a test board(106); and an electrical element(104) which is selectively connected to the plurality of contact pins(103a), equipped with the contact part(103), and can be detached from the space part(M1).

Description

Test socket device for semiconductor chip {SOCKET DEVICE FOR TESTING A SEMI-CONDUCTOR}

In order to more fully understand the drawings used in the detailed description of the invention, a brief description of each drawing is provided.

1 is a side cross-sectional view showing a cross-sectional structure of a test socket device according to an embodiment of the present invention.

2 is an exploded perspective view illustrating a connection structure between a test socket device, a semiconductor chip, and a test board.

3 is a view for explaining a connection form between the socket body and the circuit element shown in FIG.

FIG. 4 is a diagram for describing a connection structure between a contact unit and a circuit element illustrated in FIG. 1.

FIG. 5 is a circuit diagram illustrating a case in which a test socket device according to an embodiment of the present invention is connected to a semiconductor chip and a test board, respectively, and uses a chip capacitor as a circuit element of the test socket device.

＊ Description of symbols for main parts of the drawings ＊

101: test socket device 102: socket body

103 contact portion 104 circuit element

104a, 104b: electrodes of the circuit elements 108a, 108b: metal terminals

111: chip capacitor 112: arrival time to the DC voltage (DC V)

The present invention relates to a socket device, and more particularly to a test socket device for testing the normal operation of the semiconductor chip.

After the package of the semiconductor chip is completed, a predetermined test is performed to determine whether the semiconductor chip is normally operated. For the test of the semiconductor chip, a socket (hereinafter referred to as a "test socket device") for electrical and physical connection between the semiconductor chip and the test board is used. In this case, the test board is a very expensive device in which a plurality of circuit elements are complicated. The circuit element serves to improve the quality of a test signal generated from the test board or to attenuate noise generated by a test voltage. In addition, the measurer directly installs the circuit element on the test board to improve the quality of the test signal or to control noise generated by the test voltage.

However, the circuit element is soldered to the test board, and the solder ball is very fine so that it is not easy for non-experts to replace the circuit element. Therefore, it is cumbersome for the tester to directly attach a circuit element to the test board because there is a risk of hardware damage and an arbitrary circuit element must be connected to the test board for each semiconductor chip to be tested. Follow.

Accordingly, there is a need for a method of easily testing a semiconductor chip without connecting a separate circuit element to a test board.

It is an object of the present invention to provide a test socket device capable of performing a test of a semiconductor chip even without a separate circuit element connected to a test board.

One aspect of the present invention for achieving the above technical problem relates to a test socket device for electrically connecting a semiconductor chip and a test board for testing the driving of the semiconductor chip.

The test socket device of the present invention has a socket body, a contact and an electrical element. The socket body is a portion in which a predetermined semiconductor chip to be tested is mounted and protects the semiconductor chip from external pressurization. And a predetermined holder is formed on one side of the upper surface so that the semiconductor chip is mounted on the test socket of the present invention. The contact portion is formed on the bottom of the socket body and has a plurality of contact pins for electrically connecting with the test board. The electrical element is electrically connected to at least one of the plurality of contact pins provided in the contact portion.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings. In understanding the drawings, it should be noted that like elements are intended to be represented by like reference numerals as much as possible. Detailed descriptions of well-known functions and configurations that are determined to unnecessarily obscure the subject matter of the present invention will be omitted.

Hereinafter, the semiconductor chip test socket device of the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings.

First, in the present specification, the semiconductor chip mounted in the test socket device of the present invention is described as adopting a package of a pin grid array (PGA) type.

However, for convenience of description, the test socket device of the present invention is not limited to the PGA type semiconductor chip.

1 is a side cross-sectional view showing a cross-sectional structure of a test socket device according to an embodiment of the present invention, Figure 2 is an exploded perspective view showing a connection structure between the test socket device, the semiconductor chip and the test board.

1 and 2, the test socket device 101 of the present invention includes a socket body 102, a contact 103, and a circuit element 104. The socket body 102 is provided with a predetermined holder 105 on one side of the upper surface of the semiconductor chip 107 to protect the semiconductor chip 107 to be tested from external pressure and to be mounted on the semiconductor chip 107. ) To prevent separation. In particular, the socket body 102 has a space M1 having a predetermined size and shape so that the circuit element 104 of a predetermined standard is detachable therein.

The contact portion 103 has a plurality of contact pins (103a) is formed in a two-dimensional square array. The top of the contact pin 103a is in electrical contact with the probe pin 107a of the semiconductor chip 107 and the bottom of the contact pin 103 is provided on the test board 106. (Not shown). Thus, transmission and reception of test signals and test voltage supply are possible between the semiconductor chip 107 and the test board 106.

The circuit element 104 is an essential component of the test socket device 101 of the present invention, and is provided with at least one inside the socket body 102 and is electrically transmitted and received between the semiconductor chip 107 and the test board 106. It is involved in the flow of signals (test signals). In addition, the circuit element 104 is preferably composed of passive elements such as resistors or capacitors, but the size and shape of the circuit elements 104 may include chip resistors or chip capacitors that can be loaded into the socket body 102.

3 is a view for explaining a connection form between the socket body and the circuit element shown in FIG.

Referring to FIG. 3, the circuit element 104 is preferably manufactured in a mold case type in which electrodes 104a and 104b are formed, so that the space portion of the socket body 102 shown in FIG. M1) is configured to be removable. In this case, predetermined metal terminals 108a and 108b are provided on the inner surface of the space M1 of the socket body 102 to be in electrical contact with the electrodes 104a and 104b of the circuit element 104.

4 is a view for explaining a connection structure between the contact portion 103 and the circuit element 104 shown in FIG.

Referring to FIG. 4, predetermined conductive wires 109a and 109b are drawn out from the anode 108a and the cathode 108b of the metal terminals 108a and 108b provided in the space M1, respectively, and the contact portion 103 is provided. ) Is electrically connected to at least two contact pins 103a and 103b of the plurality of contact pins. The conductive wires 109a and 109b may include the contact pins 103a and 103b selected to transmit the test signal and the test voltage transmitted by the test board 106 to a designated probe pin of the semiconductor chip 107. Is electrically connected to the

Hereinafter, the operation of the test socket of the present invention will be described.

FIG. 5 is a circuit diagram illustrating a case in which a test socket device according to an embodiment of the present invention is connected to a semiconductor chip and a test board, respectively, and uses a chip capacitor as a circuit element of the test socket device.

First, the measurer applies a DC test voltage 110 to the Vcc pin (not shown) and the Vss pin (not shown) of the semiconductor chip 107 to measure the current inside the semiconductor chip 107 to supply power inside the chip. Assume that the wiring stability, current consumption and leakage current are measured. At this time, when the DC voltage is applied from the test board 106, a large current change may occur instantaneously in the power supply circuit (not shown) of the semiconductor chip 107, thereby generating a potential difference noise. Accordingly, the measurer places a chip capacitor 111 of a specific capacity in order to adjust the power slope of the DC voltage 110 applied from the test board 106 to the space portion of the socket body 102 shown in FIG. Mount on (M1). Then, the DC voltage 110 applied from the test board 106 is applied to both ends of the positive electrode (+) and the negative electrode (−) of the chip capacitor 111 through the contact pins selected among the contact pins shown in FIGS. 1 to 4. do.

Therefore, the DC voltage 110 applied from the test board 106 increases the arrival time 112 up to the initial DC voltage DC V according to the charging and discharging of the chip capacitor 111, thereby rapidly increasing the voltage. To control. Therefore, by supplying a stable DC voltage 113 to the semiconductor chip 107, it is possible to prevent malfunction of the test by the sudden DC voltage 110. In addition, by measuring and testing the various capacities of the chip capacitor 111 in the space M1 in the socket body 102 shown in FIG. 1, the measurer can easily change the input characteristics of the test voltage and based on this, The test of the semiconductor chip is easily carried out.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. For example, in the detailed description of the present specification, a predetermined space portion M1 is formed inside the socket body 102 to describe a structure in which the chip capacitor 111 is detachable. However, the chip capacitor 111 may be formed by molding together with the socket body 102. In addition, it is also possible to configure a predetermined electrical circuit that is equipped with a chip resistor (not shown) in the socket body 102 to adjust the test current applied from the test board 106, or to lower the test voltage. will be.

Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described above, according to the present invention, various kinds of semiconductor chips can be easily tested without adding a separate circuit element to the test board of the semiconductor chip. Further, according to the present invention, unnecessary damage to the semiconductor chip test board can be prevented by attaching a circuit element in consideration of the characteristics of the semiconductor chip to the test socket device. In addition, it is possible to easily control the change of characteristics such as a test signal and a test voltage applied from the test board by a predetermined circuit element mounted in the test socket device of the present invention.

Claims (6)

In the test socket device for electrically connecting the semiconductor chip and the test board for testing the driving of the semiconductor chip, A socket body having a cradle having a predetermined shape in which the semiconductor chip is attached and detached, formed on one side of an upper surface, and having a predetermined space portion formed on one side thereof; A contact part disposed on a bottom surface of the socket body, the contact part including a plurality of contact pins electrically connecting the semiconductor chip and the test board; And And a circuit element selectively connected to a plurality of contact pins provided at the contact portion and detachable from the space portion. The method of claim 1, wherein the space portion A test socket device for a semiconductor chip comprising a lead metal terminal and a cathode metal terminal formed on the inner side of each lead wire withdrawn. The method of claim 1, wherein the circuit element A test socket device for a semiconductor chip, characterized in that the chip capacitor is a mold case type chip capacitor. The method of claim 1, wherein the circuit element A test socket device for a semiconductor chip, which is a chip resistor of a mold case type. In the test socket device for electrically connecting the semiconductor chip and the test board for testing the driving of the semiconductor chip, A socket body on which a cradle of a predetermined shape to which the semiconductor chip is attached and detached is formed on one side of an upper surface thereof; A contact part disposed on a bottom surface of the socket body, the contact part including a plurality of contact pins electrically connecting the semiconductor chip and the test board; And And a circuit element selectively connected to a plurality of contact pins provided in the contact portion and molded at one side of the socket body. The method of claim 5, wherein the circuit element It is a predetermined passive element, The test socket device of a semiconductor chip.

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