KR20070000517A - Semiconductor manufacturing apparatus having suck-back valve - Google Patents

Abstract

A semiconductor manufacturing apparatus is provided to prevent the malfunction of a suction valve due to air hunting and to restrain a coating failure by checking the air hunting in a chemical supply pipe using an air detecting sensor. A semiconductor manufacturing apparatus includes a supply pipe for supplying chemicals, a suction valve in the supply pipe, and a nozzle for spraying the chemicals onto a wafer at one end portion of the supply pipe. The suction valve is composed of a first air speed controller(132), a second air speed controller(135) spaced part from the first air speed controller, air detecting sensors, and a control unit. The air detecting sensors(133,136) are installed adjacent to the first and second air speed controllers in order to detect an air flow rate of the supply pipe. The control unit is used for determining the generation of air hunting in the supply pipe by comparing the air flow rate of the supply pipe with a reference air flow rate.

Description

Semiconductor manufacturing apparatus having a suck valve {Semiconductor manufacturing apparatus having suck-back valve}

1 is a schematic view showing a suction valve structure of a general semiconductor film applying apparatus.

2 is a schematic view showing a semiconductor film applying apparatus having a suction valve according to an embodiment of the present invention.

3 is a schematic view showing the internal structure of the suction valve of FIG.

<Explanation of symbols for the main parts of the drawings>

120: supply pipe 130: suction valve

132,135: Air speed controller 133,136: Air detection sensor

140: discharge nozzle

The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor film coating apparatus having a suction valve.

In recent years, with the rapid spread of information media such as computers, the functions of semiconductor devices such as semiconductor memories have also developed remarkably. In the case of modern semiconductor products, high integration of products is essential to achieve low cost and high quality. Such high integration involves scaling down the gate oxide film thickness and the channel length of the transistor device to be thin and short, and accordingly, semiconductor manufacturing processes and manufacturing equipment have been developed in various forms. In particular, as users demand high performance devices, the function and operational performance of manufacturing equipment for manufacturing such semiconductor devices are very important.

Usually, as a process of manufacturing said semiconductor element, the process of forming a semiconductor film largely and the process of etching and patterning the said semiconductor film are mentioned. In addition, a process of forming a semiconductor film may include a deposition method and a coating method, and by the deposition method, a film obtained by a chemical reaction such as an oxide film, a nitride film, and a metal film is formed, and the coating method is a glass material or a resist. Membranes obtained by a single chemical, such as materials, for example flowable materials are formed.

The applicator for forming the flowable substance is provided with a suction valve, also known as a suck back valve, in the chemical supply pipe in order to control the precise chemical amount. As shown in FIG. 1, the suction valve 10 includes a first air speed controller 15 and a second air speed controller 20 installed to be spaced apart by a predetermined distance. These air speed controllers 15 and 20 control the pressure in the supply pipe as the chemical passes through the suction valve 10 so that the chemical at the correct flow rate is delivered to the wafer. In the figure, reference numeral 30 denotes the flow of the chemical in the supply pipe, and 40 denotes the flow of air.

However, the above-described conventional suction valve only measures the hydraulic pressure of the chemical supply pipe 30, and is not provided with a means for measuring the supply state of the inflowing air, and thus, uneven air such as air hunting. At the time of supply, there is a problem of not predicting the pressure change of the nozzle caused thereby. This causes the suction valve to malfunction, making it difficult to form the thickness or width of the flowable material to be applied onto the wafer as desired.

Accordingly, the technical problem to be achieved by the present invention is to provide a semiconductor manufacturing apparatus capable of accurately detecting a supply state of air introduced into a chemical supply pipe and preventing a malfunction of the suction valve by air.

Other objects and novel features as well as the objects of the present invention will become apparent from the description of the specification and the accompanying drawings. Among the inventions disclosed herein, an outline of representative features is briefly described as follows.

In order to achieve the above technical problem, the present invention provides a supply pipe for delivering a chemical, a suction valve installed in the pipe, and a nozzle installed at one end of the supply pipe to discharge the chemical on the wafer. A semiconductor manufacturing apparatus comprising: the suction valve is a first air speed controller installed on the container side in which the chemical is accommodated, a second air speed installed on the nozzle side and spaced apart from the first air speed controller by a predetermined distance. An air detection sensor disposed adjacent to the controller, the first and second air speed controllers to detect the air supply amount of the supply pipe, and the amount detected from the air detection sensor and the set air amount are compared to determine whether air hunting occurs in the supply pipe. It includes a control unit for determining.

The air detection sensor is installed in front of the first air speed controller and the rear end of the second air speed controller.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and the like of the elements in the drawings are exaggerated to emphasize a more clear description, and the elements denoted by the same reference numerals in the drawings means the same elements. In addition, where a layer is described as being "on" another layer or semiconductor substrate, a layer may exist in direct contact with the other layer or semiconductor substrate, or a third layer therebetween. Can be done.

The semiconductor manufacturing apparatus of this invention is characterized by providing the air detection sensor which measures the supply amount of air in a suction valve. The air detection sensor detects the air amount of the suction valve and the supply pipe, thereby making it possible to measure whether the air is hunted, thereby preventing the malfunction of the suction valve due to the air hunting.

Such a semiconductor manufacturing apparatus of the present invention will be described in more detail.

2 is a schematic view showing a semiconductor film applying apparatus having a suction valve according to an embodiment of the present invention, Figure 3 is a schematic view showing the internal structure of the suction valve of FIG.

Referring to FIG. 2, the semiconductor coating apparatus 100 includes a supply pipe 120 for delivering the chemical 110, a suction valve 130 for controlling a flow rate of the chemical 110, and a chemical 110 for the stage 150. And a nozzle 140 for ejecting the surface of the wafer 160 seated thereon.

In addition, the container 115 containing the chemical 110 is provided with a helium (He) gas inlet line 125, the helium gas is provided to the container through the inlet line 125, bubbles are removed The chemical in the state is to be supplied through the pipe (120).

The suction valve 130 is installed in the supply pipe 120 to control the flow rate of the chemical flowing in the supply pipe 120. As shown in FIG. 3, the suction valve 130 of the present invention includes a first air speed controller 132 and a nozzle 140 side supply pipe which measure and control the pressure of the vessel 110 side supply pipe 130. And a second air speed controller 135 for measuring and controlling the pressure of 130. In addition, the suction valve 130 is positioned at the front end of the first air speed controller 132 and located at the rear ends of the first air detection sensor 133 and the second air speed controller 135 that detect the air supply amount. And a second detection sensor 136 for detecting. In addition, the suction valve 130 compares the amount of air detected by the first and second air detection sensors 133 and 136 with a normal air supply amount which is already set, and determines whether or not an air hunting has occurred. 170). Here, reference numeral 180 denotes a chemical flow in the supply pipe, 190 denotes a flow of air.

The semiconductor manufacturing apparatus having such a configuration detects the supply amount of air flowing into the chemical supply pipe 120 by providing the air detection sensors 133 and 136 before or after the air speed controller of the suction valve 130.

In addition, the control unit compares the air amount detected by the air detection sensors 133 and 136 with the normal air amount to determine whether the air hunting, and outputs a signal or a warning signal for controlling the suction valve to notify the operator when the air hunting occurs do.

Accordingly, the operator can determine whether the air hunting is in the suction valve, thereby preventing the malfunction of the suction valve, that is, the normal operation even when the air hunting occurs, to form a film of non-uniform thickness.

As described in detail above, according to the present invention, an air detection sensor for detecting the supply amount of air is provided in the suction valve provided in the chemical supply pipe.

Accordingly, it is possible to determine the air hunting in the chemical supply pipe, thereby preventing malfunction of the suction valve due to the air hunting. Furthermore, the coating failure of the semiconductor film coating device can be prevented.

Although the present invention has been described in detail with reference to preferred embodiments, the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention. .

Claims (2)

A semiconductor manufacturing apparatus comprising a supply pipe for delivering a chemical, a suction valve installed in the pipe, and a nozzle disposed at one end of the supply pipe to discharge the chemical onto the wafer. The suction valve, A first air speed controller installed at a container side in which the chemical is accommodated; A second air speed controller installed at a distance from the first air speed controller and installed at the nozzle side; An air detection sensor disposed adjacent to the first and second air speed controllers and detecting an air supply amount of a supply pipe; And And a controller for comparing the amount detected from the air detection sensor with a set amount of air to determine whether air hunting occurs in the supply pipe. The semiconductor manufacturing apparatus according to claim 1, wherein the air detection sensor is provided at the front end of the first air speed controller and the rear end of the second air speed controller, respectively.

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