KR20060116123A - Package apparatus for flat display panel pcb - Google Patents

Package apparatus for flat display panel pcb Download PDF

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Publication number
KR20060116123A
KR20060116123A KR1020050038638A KR20050038638A KR20060116123A KR 20060116123 A KR20060116123 A KR 20060116123A KR 1020050038638 A KR1020050038638 A KR 1020050038638A KR 20050038638 A KR20050038638 A KR 20050038638A KR 20060116123 A KR20060116123 A KR 20060116123A
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KR
South Korea
Prior art keywords
package
display panel
circuit board
flat panel
panel display
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KR1020050038638A
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Korean (ko)
Inventor
하종수
김복룡
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엘지전자 주식회사
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Priority to KR1020050038638A priority Critical patent/KR20060116123A/en
Publication of KR20060116123A publication Critical patent/KR20060116123A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/127Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using rigid or semi-rigid sheets of shock-absorbing material
    • B65D81/133Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using rigid or semi-rigid sheets of shock-absorbing material of a shape specially adapted to accommodate contents, e.g. trays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2581/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D2581/02Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D2581/05Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/051Details of packaging elements for maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/052Materials
    • B65D2581/055Plastic in general, e.g. foamed plastic, molded plastic, extruded plastic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2581/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D2581/02Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D2581/05Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/051Details of packaging elements for maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/052Materials
    • B65D2581/056Other materials, e.g. metals, straw, coconut fibre

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

A package for packing a printed circuit board is provided to prevent generations of carbon and impurities by coating the package with a high molecular substance with conductivity and distinguish product easily by forming package using transparent material. A package body(300) has an inserting groove(310) formed in a shape of a circuit board(320) for insertedly seating the circuit board into the inserting groove. The package for packing the flat plasma display panel substrate is coated with a high molecular substance with conductivity. The package is made of plastic resins. The circuit board is selected from at least one of X, Y, Z, and control boards which drive the plasma display panel. The package is made of a transparent material.

Description

평판 표시 패널 회로기판용 포장물{Package Apparatus for Flat Display Panel PCB}Package Apparatus for Flat Display Panel PCB

도 1은 평판 표시 패널의 포장물을 개략적으로 나타낸 도면.1 is a view schematically showing a package of a flat panel display panel;

도 2는 종래 평판 표시 패널 배면에 형성된 각종 회로기판들을 나타낸 도면.2 is a diagram illustrating various circuit boards formed on a rear surface of a conventional flat panel display panel;

도 3은 본 발명에 따른 평판 표시 패널 회로기판용 포장물을 나타낸 사시도.3 is a perspective view showing a package for a flat panel display panel according to the present invention.

도 4는 본 발명에 따른 평판 표시 패널 회로기판이 포장물에 삽입된 상태를 나타낸 단면도.4 is a cross-sectional view showing a state in which a flat panel display panel circuit board according to the present invention is inserted into a package.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

300 : 포장물 본체300: package body

310 : 삽입홈310: insertion groove

320 : 회로기판320: circuit board

본 발명은 포장물에 관한 것으로서, 더욱 자세하게는 평판 표시 패널에 형성되는 인쇄회로기판을 전자파나 정전기로부터 차단하면서 보관 또는 운반하기 위하여 포장하는 평판 표시 패널 회로기판용 포장물에 관한 것이다.The present invention relates to a package, and more particularly, to a package for a flat panel display panel circuit board for packaging or storing the printed circuit board formed on the flat panel display panel while blocking from electromagnetic waves or static electricity.

일반적으로, 평판 표시 패널은 LCD(Liquid Crystal Display), FED(Field Emission Display), 유기EL(Electroluminescense), 플라즈마 표시 패널(PDP) 등과 같이 여러 가지 종류가 있으며 특히, 플라즈마 표시 장치는 소다라임(Soda-lime) 글라스로 된 전면 기판과 후면 기판 사이에 존재하는 불활성 가스가 고주파 전압에 의해 방전이 될 때, 진공자외선(Vacuum Ultraviolet rays)이 발생되어 내부에 형성된 형광체를 발광시켜 화상을 구현하는 장치이다. Generally, there are various types of flat panel displays such as liquid crystal displays (LCDs), field emission displays (FEDs), organic electroluminescense (EL), plasma display panels (PDPs), and the like. -lime) When an inert gas existing between a glass front substrate and a rear substrate is discharged by a high frequency voltage, vacuum ultraviolet rays are generated to emit a phosphor formed therein, thereby realizing an image. .

도 1은 평판 표시 패널의 포장물을 개략적으로 나타낸 도면이다.1 is a view schematically illustrating a package of a flat panel display panel.

도시된 바와 같이, 종래 평판 표시 패널의 포장물(200)은 패널을 지지하기 위하여 다수의 바(bar)로 이루어진 지지부재(201)와 지지부재의 외주면에 상기 지지부재 전체를 지지하기 위하여 철재봉(202)이 용접되어 고정된다.As shown in the drawing, the package 200 of the conventional flat panel display panel includes a support member 201 formed of a plurality of bars to support the panel, and an iron rod to support the entire support member on the outer circumferential surface of the support member. 202 is welded and fixed.

지지부재(201)는 운송시 유동되어 이탈되지 않도록 상, 하, 좌, 우에 형성된 바(bar)가 'ㄴ'자 형상으로 이루어진다. 이렇게 이루어진 포장물(200)에 평판 표시 패널(120)이 결합되어 운송된다.The support member 201 has a bar formed on the upper, lower, left, and right sides so as not to be separated by flow during transportation. The flat panel display panel 120 is coupled to the package 200 thus formed and transported.

이와 같이, 종래에 평판 표시 패널(120)을 안전하게 운송하기 위한 포장물(200)은 대부분이 금속재질, 예컨대 상대적으로 무거운 철재로 이루어져 있기 때문에 패널을 운반하기 어렵다. As described above, since the package 200 for safely transporting the flat panel display panel 120 is made of a metal material, for example, a relatively heavy steel, it is difficult to transport the panel.

한편, 일반적으로 인쇄회로기판(Printed Circuit Board: PCB)이란 집적 회로, 저항기 또는 스위치 등의 전기적 부품들이 납땜되는 얇은 판으로, 다양한 전자 기기에 사용되고 있다.In general, a printed circuit board (PCB) is a thin plate on which electrical components such as integrated circuits, resistors, or switches are soldered, and is used in various electronic devices.

도 2는 종래 평판 표시 패널 배면에 형성된 각종 회로기판들을 나타낸 도면 으로서, 패널의 상하로 X보드(210)(211)가 배치되고, 그 가운데로 Y보드(220), 콘트롤보드(230), Z보드(240) 등의 인쇄회로기판이 배치된다. 또한, 상기 각각의 보드상에는 각종 회로소자가 실장되며, 그 테두리로 TCP(또는 COF)(250) 등이 연결된다.FIG. 2 is a diagram illustrating various circuit boards formed on a rear surface of a conventional flat panel display panel, in which X boards 210 and 211 are disposed above and below the panel, and a Y board 220, a control board 230, and Z are arranged in the center of the panel. A printed circuit board such as a board 240 is disposed. In addition, various circuit elements are mounted on each board, and TCP (or COF) 250 is connected to the edge thereof.

한편, 종래에는 상기와 같은 다수의 회로기판(210)(211)(220)(230)(240)을 보관 또는 운반하기 위하여 예로서, 트레이(Tray)와 같은 특정 케이스를 포장물로 사용하고 있다.Meanwhile, in the related art, in order to store or transport the plurality of circuit boards 210, 211, 220, 230, and 240 as described above, a specific case such as a tray is used as a package.

상기 포장물은 보통 플라스틱 사출물로 성형되는데, 외부에서 침투할수 있는 전자파나 정전기 등을 차단하고, 외부의 충격이나 고온에서도 잘 보호될수 있도록 계면활성제 및 카본을 첨가하여 설계, 제조된다.The package is usually molded into a plastic injection molding, and is designed and manufactured by adding a surfactant and carbon so as to block electromagnetic waves or static electricity that can penetrate from the outside, and to be well protected even from external impact or high temperature.

그러나, 상기와 같이 계면활성제 및 카본을 첨가한 종래의 포장물은, 혼합재를 사용하므로 카본 및 불순물이 발생하고, 시간의 경과에 따라 대전방지 성능이 저하되며, 불투명한 특성에 의하여 포장후 외부로부터 제품의 식별이 곤란한 문제점이 있었다.However, in the conventional packaging material added with the surfactant and carbon as described above, carbon and impurities are generated because of the mixed material, and the antistatic performance is deteriorated with time. There was a problem that was difficult to identify.

따라서, 본 발명은 상기와 같은 문제점들을 해결하기 위한 것으로, 평판 표시 패널 회로기판용 포장물을 전도성 고분자 물질로 코팅함으로써, 카본 및 불순물 발생을 방지하고, 시간 경과에 따른 대전방지 성능 저하가 없으며, 투명체로 구성하여 포장후에도 바코드 인식등 외부로부터 제품의 식별이 용이하게 하는 평판 표시 패널 회로기판용 포장물을 제공함에 그 목적이 있다.Accordingly, the present invention is to solve the above problems, by coating the packaging for the flat panel display circuit board with a conductive polymer material, to prevent the generation of carbon and impurities, there is no deterioration of the antistatic performance over time, the transparent body The purpose of the present invention is to provide a package for a flat panel display panel circuit board which enables easy identification of products from the outside, such as barcode recognition even after packaging.

상기 목적을 달성하기 위하여 본 발명에 따른 평판 표시 패널 회로기판용 포장물은, 평판 표시 패널에 형성되는 회로기판을 포장하는 포장물에 있어서, 상기 포장물은 전도성 고분자 물질로 코팅되는 것을 특징으로 한다.In order to achieve the above object, the package for a flat panel display circuit board according to the present invention is a package for packaging a circuit board formed on the flat panel display panel, characterized in that the package is coated with a conductive polymer material.

또한, 상기 포장물은 가소성 수지인 것이 바람직하며, 상기 회로기판은 플라즈마 표시 패널을 구동하는 X, Y, Z 또는 콘트롤보드 중 적어도 어느 하나 이상의 구동회로기판이 적용된다.In addition, the package is preferably made of a plastic resin, and the circuit board may include at least one driving circuit board of X, Y, Z, or a control board for driving the plasma display panel.

상기 포장물은 투명체로 형성되며, 폴리티오펜을 포함하는 것이 더욱 바람직하다.The package is formed of a transparent body, more preferably containing polythiophene.

따라서, 혼합재를 사용하지 않으므로 카본 및 불순물의 발생을 방지하고, 시간 경과에 따른 대전방지 성능 저하가 없으며, 포장물을 투명체로 구성하여 포장후에도 바코드 인식등 외부로부터 제품의 식별이 용이하게 하며, 세정후 수회 반복 사용이 가능하다.Therefore, it does not use a mixture material to prevent the generation of carbon and impurities, there is no deterioration of antistatic performance over time, the packaging is made of a transparent body to facilitate the identification of products from the outside, such as barcode recognition even after packaging, after cleaning Can be used repeatedly.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 설명한다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

도 3은 본 발명에 따른 평판 표시 패널 회로기판용 포장물을 나타낸 사시도이고, 도 4는 본 발명에 따른 평판 표시 패널 회로기판이 포장물에 삽입된 상태를 나타낸 단면도이다.3 is a perspective view illustrating a package for a flat panel display panel according to the present invention, and FIG. 4 is a cross-sectional view illustrating a state in which the flat panel panel according to the present invention is inserted into a package.

도시된 바와 같이, 본 발명은 평판 표시 패널에 형성되는 회로기판을 포장하는 포장물에 있어서, 상기 포장물은 전도성 고분자 물질로 코팅되는 것을 특징으로 한다.As shown, the present invention is a package for packaging a circuit board formed on a flat panel display panel, characterized in that the package is coated with a conductive polymer material.

즉, 본 발명의 포장물 본체(300)에는 회로기판(320)의 형상에 맞게 삽입홈(310)이 형성되어 있어서, 상기 삽입홈(310)에 각각의 회로기판(320)이 삽입, 안착된다.That is, the insert body 310 is formed in the package main body 300 of the present invention in accordance with the shape of the circuit board 320, and each circuit board 320 is inserted and seated in the insert groove 310.

이때, 상기 포장물 본체(300)는 통상의 플라스틱 재질로 성형될 수도 있으나, 본 발명에서는 가소성 수지로 성형되는 것이 바람직하다.At this time, the package body 300 may be molded of a conventional plastic material, but in the present invention, it is preferable to be molded of a plastic resin.

따라서, 상기 가소성 수지로 성형된 본체(300)를 전도성 고분자 물질로 코팅시킨다. 이때, 본 발명의 제조방법은 플리스틱 시트 또는 필름을 소재로 한 전도성 폴리머 코팅법을 사용한다.Therefore, the main body 300 formed of the plastic resin is coated with a conductive polymer material. At this time, the manufacturing method of the present invention uses a conductive polymer coating method based on the plastic sheet or film.

즉, 본 발명의 일실시예로서, 코팅법에 의해 표면에 대전방지성이 부여된 전도성쉬트를 이용하여 전자부품 운반용기인 트레이를 제조하는 경우, 진공성형 또는 압공성형 후 4면을 일정 크기로 잘라내어 회로기판용 포장물을 제조하게 된다.That is, as an embodiment of the present invention, in the case of manufacturing a tray, which is a container for transporting electronic components, by using a conductive sheet provided with antistatic property on a surface by coating, four sides after vacuum molding or pressure forming are cut to a predetermined size. The package for the circuit board will be manufactured.

이와같이, 본 발명의 전도성 고분자 재료는 플라스틱의 분자구조를 변형하여 전도체로 사용할 수 있게 하는 것으로, 정전기 피해에 민감한 각종 전자부품 운반용 트레이 등의 제조용 재료로 이용된다.As described above, the conductive polymer material of the present invention can be used as a conductor by modifying the molecular structure of plastic, and is used as a material for manufacturing various electronic component transport trays and the like which are sensitive to static damage.

또한, 상기 회로기판(320)은 통상의 인쇄회로기판(PCB)으로서 특히, 플라즈마 표시 패널을 구동하는 X, Y, Z 또는 콘트롤보드 중 적어도 어느 하나 이상의 구동회로기판이 적용된다.In addition, the circuit board 320 is a conventional printed circuit board (PCB), in particular, the driving circuit board of at least one of X, Y, Z or a control board for driving the plasma display panel is applied.

상기 포장물 본체(300)는 투명체로 형성되며, 폴리티오펜을 포함하는 것으로 무독성 재질로 형성하는 것이 더욱 바람직하다.The package body 300 is formed of a transparent body, it is more preferably formed of a non-toxic material containing polythiophene.

따라서, 본 발명의 포장물 본체(300)는 혼합재를 사용하지 않으므로 카본 및 불순물의 발생을 방지하고, 시간 경과에 따른 대전방지 성능 저하가 없다.Therefore, since the package body 300 of the present invention does not use a mixed material, it prevents generation of carbon and impurities, and there is no deterioration in antistatic performance over time.

또한, 포장물을 투명체로 구성하여 포장후에도 바코드 인식등 외부로부터 제품의 식별이 용이하게 하며, 세정후 수회 반복 사용이 가능하다.In addition, the package is made of a transparent body, and even after packaging, it is easy to identify the product from the outside such as barcode recognition, and can be used repeatedly after cleaning.

이와 같은 본 발명의 포장물은, 정전기 및 대전방지 기능성 전자부품 트레이(공정용, 출하용), 각종 스페이스 테이프 및 캐리어 테이프, 디스플레이 스크린 보호필름 등으로 다양하게 사용될 수 있다.Such a package of the present invention can be used in a variety of electrostatic and antistatic functional electronic component tray (for processing, shipping), various space tape and carrier tape, display screen protective film and the like.

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 또한 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능하며, 이와 같은 변경 또는 변형된 실시형태는 당연히 본 발명의 범위에 포함되는 것으로 해석되어야 함이 바람직하다.In the above has been shown and described with respect to the preferred embodiment of the present invention, the present invention is not limited to the above-described embodiment without departing from the gist of the invention claimed in the claims, the common knowledge in the field to which the present invention belongs. Anyone having a variety of modifications can be carried out, and it is preferable that such a modified or modified embodiment should be interpreted as being included in the scope of the present invention.

이상에서 설명한 바와 같이 본 발명에 따른 평판 표시 패널 회로기판용 포장물은, 평판 표시 패널 회로기판용 포장물을 전도성 고분자 물질로 코팅함으로써, 혼합재를 사용하지 않으므로 카본 및 불순물의 발생을 방지하고, 시간 경과에 따른 대전방지 성능 저하가 없으며, 포장물을 투명체로 구성하여 포장후에도 바코드 인식등 외부로부터 제품의 식별이 용이하게 하며, 세정후 수회 반복 사용이 가능한 매우 다양한 효과가 있다.As described above, the package for flat panel display circuit board according to the present invention is coated with a conductive polymer material for the flat panel display panel circuit board package, so that the mixture is not used, preventing generation of carbon and impurities, and over time There is no deterioration of antistatic performance, and the packaging is made of a transparent body to facilitate the identification of products from the outside, such as barcode recognition even after packaging, there are a variety of effects that can be repeatedly used after cleaning.

Claims (5)

평판 표시 패널에 형성되는 회로기판을 포장하는 포장물에 있어서,In a package for packaging a circuit board formed on a flat panel display panel, 상기 포장물은 The package is 전도성 고분자 물질로 코팅되는 것을 특징으로 하는 평판 표시 패널 회로기판용 포장물.A package for a flat panel display panel, characterized in that coated with a conductive polymer material. 제 1항에 있어서,The method of claim 1, 상기 포장물은 The package is 가소성 수지인 것을 특징으로 하는 평판 표시 패널 회로기판용 포장물.It is a plastic resin, The package for flat panel display circuit boards characterized by the above-mentioned. 제 1항에 있어서,The method of claim 1, 상기 회로기판은The circuit board is 플라즈마 표시 패널을 구동하는 X, Y, Z 또는 콘트롤보드 중 적어도 어느 하나 이상의 구동회로기판인 것을 특징으로 하는 평판 표시 패널 회로기판용 포장물.A package for a flat panel display panel, characterized in that the drive circuit board of at least one of X, Y, Z or a control board for driving the plasma display panel. 제 1항에 있어서,The method of claim 1, 상기 포장물은The package is 투명체로 형성된 것을 특징으로 하는 평판 표시 패널 회로기판용 포장물.A package for a flat panel display panel, characterized in that formed of a transparent body. 제 1항에 있어서,The method of claim 1, 상기 포장물은The package is 폴리티오펜을 포함하는 것을 특징으로 하는 평판 표시 패널 회로기판용 포장물.A package for a flat panel display panel comprising polythiophene.
KR1020050038638A 2005-05-09 2005-05-09 Package apparatus for flat display panel pcb KR20060116123A (en)

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