KR20060078098A - Detection method of existence of disconnect and/or short circuit at flat panel display and circuit board, and the device used thereto - Google Patents

Abstract

The present invention is a device for inspecting the disconnection of the metal wiring of the flat panel display and the circuit board, and non-contact inspection of the potential change caused by applying a test signal to the wiring pattern, the sensor element at least one carbon nanotube field effect Detecting means for detecting a potential change in each portion of the wiring pattern by using a transistor; And a selection means for outputting a selection signal for selecting the sensor element, wherein each sensor element is formed on a single crystal semiconductor or a flat plate. To provide a sensor.

Carbon Nanotubes, FETs, Wiring

Description

Detection method of disconnection and / or short circuit at flat panel display and circuit board, and the device used             

1 is a view for explaining a process of inspecting the disconnection of metal wiring of a conventional flat panel display and a circuit board.

2 is a block diagram of a system for inspecting disconnection of metal wiring of a flat panel display and a circuit board according to the present invention.

3 is a block diagram of an inspection apparatus according to the present invention

4 is a block diagram of a sensor element used in the apparatus of the present invention;

<Description of Signs of Major Parts of Drawings>

11: circuit board 12: wiring pattern

13: Inspection device 14: computer

15: probe 16: selector

17: sensor element group 18: control unit

19: vertical selector 20: horizontal selector                 

21: timing generator 22: signal processor

23: A / D converter 24: power supply circuit

The present invention relates to a device for inspecting the disconnection of metal wiring of a flat panel display and a circuit board, and a sensor used therein, wherein the power consumption is reduced when inspecting the disconnection of the metal wiring of a flat panel display and a circuit board, and the reaction speed is reduced. The present invention relates to an inspection apparatus for disconnection of metal wiring of a flat panel display and a circuit board, which is advantageous for arraying by improving the size and improves spatial resolution through miniaturization, and a sensor used therein.

There are two types of methods for inspecting the disconnection of the metal wiring of the flat panel display and the circuit board. In the case of the non-contact type, the generation of a signal at one position on the metal wire and the detection of the signal at the other position are performed without touching a probe to the substrate, and the contact type is used for a probe in which one or both of them are in contact with the substrate. It is made by.

A method of determining whether a wire is disconnected by fixing a probe at one position of a metal wiring and applying a signal thereto to determine whether the signal is detected using a MOSFET at another position has been disclosed. The above method is described in more detail with reference to FIG. 1 as follows. The sensor element 1 shown in FIG. 1 includes a MOSFET, and the diffusion layer of the MOSFET having a large surface area functions as a passive element and lies in the opposite direction to the wiring pattern. Passive elements are successively formed as source terminals of MOSFETs that are electrically connected. The gate terminal of the MOSFET is connected to the vertical selector 2, and the drain terminal is connected to the horizontal selector 3. When the sensor element 1 is selected by the timing generator 4, a signal is transferred from the vertical selector 2 to the gate to operate the MOSFET. At this time, when the detection signal comes from the probe 5, the potential at the wiring pattern 7 is changed. As a result, current flows from the source terminal to the drain terminal, and the current is transmitted to the signal processing unit 8 through the horizontal selection unit 3. By analyzing the position of the sensor element outputting the detection signal, it is possible to distinguish the position of the wiring pattern 7 on the circuit board 6.

However, according to the method according to the prior art, it is pointed out the disadvantage that the power consumption is large, the reaction rate is slow. This problem is due to the implementation using a conventional MOSFET in signal detection. Therefore, it is urgent to replace new devices to overcome the disadvantages of MOSFETs that have been used traditionally. Such a device is particularly required to be a device that can be replaced for the purpose of reducing the power consumption, improving the reaction speed to the array (array) and improve the spatial resolution through miniaturization.

As described above, the present invention is proposed to overcome the limitations of the prior art, and in an apparatus for inspecting the disconnection of metal wiring of a flat panel display and a circuit board, the power consumption is reduced, and the response speed is improved. The present invention provides an apparatus for inspecting the disconnection of a metal wiring of a flat panel display and a circuit board, which is advantageous for array size and improves spatial resolution through miniaturization.

Another object of the present invention is to provide a sensor for disconnection of metal wiring of a flat panel display and a circuit board, which is advantageous in arraying by reducing power consumption, improving reaction speed, and improving spatial resolution through miniaturization. have.

In order to achieve the above object, the inspection apparatus according to the present invention is a device for inspecting the disconnection of the metal wiring of the flat panel display and the circuit board, and the non-contact inspection of the potential change caused by applying the inspection signal to the wiring pattern. Detecting means for detecting a potential change at each part of the wiring pattern using at least one carbon nanotube field effect transistor as a sensor element; And a selection means for outputting a selection signal for selecting the sensor element, wherein each sensor element is formed on a single crystal semiconductor or a flat plate. .

According to the invention, the sensor element is preferably an inspection device having a two-dimensional or three-dimensional array at regular intervals.

In addition, the present invention is a sensor for inspecting the disconnection of the metal wiring of the flat panel display and the circuit board, the non-contact inspection of the potential change caused by applying the test signal to the wiring pattern, each of the sensor element is carbon nano A passive element formed as a tube field effect transistor on a single crystal semiconductor and operating as a counter electrode coupled capacitively with the wiring pattern to detect a potential change in the wiring pattern; And a transistor adapted to output a detection signal output from the passive element in response to an input selection signal. The sensor for inspecting disconnection of metal wiring of a flat panel display and a circuit board is provided.

According to the invention, the sensor element is preferably a sensor having a two-dimensional or three-dimensional array at regular intervals.

Hereinafter, the content of the present invention will be described in detail with reference to the accompanying drawings.

A system for inspecting the disconnection of metal wiring of a flat panel display and a circuit board is shown in FIG. An inspection system 10 is provided for inspecting the wiring pattern 12 formed on the circuit board 11. The inspection system 10 includes a inspection device 13, a computer 14, a plurality of probes 15 for supplying the inspection signal to the associated wiring pattern 12, and an inspection supplied to at least one of the probes. And a selector 16 for switching the signal. For example, the selector 16 may be configured as a multiplexer or a duplexer.

The computer 14 supplies a selector 16 with a control signal for selecting at least one or more of the probes and a test signal supplied to the associated wiring pattern 12. The computer 14 also supplies a synchronizing signal to the inspecting apparatus 13 such that the inspecting apparatus 13 is operated in synchronization with a control signal supplied to the selector 16. The computer 14 receives the detection signal from the inspection device 13 to form image data, and detects disconnection, short circuit, chipping, and the like on the wiring pattern based on the image data.

The computer 14 also has a function of displaying an image of the wiring pattern inspected on the display 14a of the computer 14 on the basis of the detection signal from each sensor element 17a of the inspection apparatus 13.

Each probe 15 has a tip in contact with an end of the associated wiring pattern 12 on the circuit board 11.

The selector 16 is switched to select at least one probe from which the test signal is output. In particular, the selector 16 is controlled based on a control signal supplied from a computer so that an inspection signal is individually provided to each of a plurality of unique wiring patterns on the circuit board 11.

The inspection apparatus 13 is located opposite to the pattern 12 on the circuit board by a non-contact method, detects a potential change on the wiring pattern 12 caused by the inspection signal supplied from the probe 15, and detects it. The detected potential change is output to the computer 14 as a signal. The distance between the inspection device 13 and the wiring board is preferably 0.05 mm or less. However, the detection signal can be obtained by a distance of 0.5 mm or less.

In the inspection system of FIG. 2, the circuit board 11 having the wiring pattern 12 formed on only one side is illustrated, but the inspection can be performed even when the wiring pattern is provided on both sides. In this case, the inspection process may be performed by preparing a pair of inspection devices 13 and a circuit board sandwiched therebetween.

3 is a block diagram showing an electronic design of the inspection apparatus 13. The inspection device 13 is a structure having a sensor chip having an electronic design as shown in FIG. 3 mounted on a package. The inspection apparatus 13 includes a control unit 18, a sensor element group 17 having a plurality of sensor elements 17a, a vertical selection unit 19 for selecting the lateral sensor element 17a, and a longitudinal sensor element ( A horizontal selector 20 for selecting 17a and picking up a signal, a timing generator 21 for generating a signal for selecting each sensor element 17a, and a signal received from the horizontal selector 20 Power supply for supplying power used to drive the signal processor 22, the A / D converter 23 for converting the signal received from the signal processor 22 from analog to digital signal, and the inspection device 13 And a circuit section 24.

The control unit 18 is provided for controlling the operation of the inspection apparatus 13 based on the control signal received from the computer 14.

The sensor elements 17a are arranged in a matrix (e.g., 480 X 640) and have a potential on the wiring pattern 12 caused by a test signal supplied from the probe 15 to the wiring pattern 12 in a non-contact manner. Detect a change.

The timing generator 21 receives the vertical synchronization signal Vsync, the horizontal synchronization signal Hsync, and the reference signal Dclk from the computer 14, and supplies the sensors to the vertical selector 19 and the horizontal selector 20. The timing signal for selecting the element 17a is supplied.

Based on the timing signal received from the timing generator 21, the vertical selector 19 continuously selects at least one or more columns from the sensor element group 17. FIG. Each sensor element 17a belonging to the column selected by the vertical selection unit 19 simultaneously outputs a detection signal, and the detection signal is input to the horizontal selection unit 20. The horizontal selector 20 amplifies and temporarily stores the analog detection signal output received from the 640 terminal. Then, in response to the timing signal received from the timing generator 21, the horizontal selector 20 continuously sends a detection signal to the signal processor 22 through a selection circuit composed of a multiplexer or the like.

The signal processing unit 22 performs analog signal conditioning on the detection signal received from the horizontal selection unit 20, and sends the detection signal to the A / D converter.

The A / D converter 23 converts the detection signal input received in the analog form from the signal processor 22 into a digital signal, for example, 8 bits, and outputs the converted digital signal.

Although the A / D converter is integrated in the inspection device 13, the analog signal provided in the analog signal conditioning can be sent out to the computer 14 as it is.

Hereinafter, an operation process of the sensor element 17a will be described. 4 is an explanatory diagram of one of the sensor elements 17a.

As the sensor element 17a, a field effect transistor using carbon nanotubes is used. 4 shows a simple structure in which metal electrodes are attached to both ends and a silicon substrate is used as a gate. Further, the carbon nanotubes are not limited to those shown in Fig. 4 described above, and transistors produced by either the horizontal growth method or the vertical growth method are also suitable for the present invention. Field effect transistors using these carbon nanotubes have an excellent effect of reducing channel length, thereby reducing power consumption and making the reaction rate very fast.

A passive element can be preferably provided at a position opposite to the wiring pattern 12. The passive element is electrically connected to the source portion of the transistor. In addition, even if the passive device is not provided separately, the source terminal itself adopting the nanotube may also perform the same function as the passive device.

The transistor includes a gate coupled to the vertical selector 19 and a drain terminal connected to the horizontal selector 20.

Discharge potential walls are provided for dissipating unwanted charge in a diffusion layer provided as a passive element. When the sensor element 17a is selected by the timing generator 21 via the vertical selector 19, a signal is transmitted from the vertical selector 19 to the gate and turns on the sensor element 17a.

At this time, when the test signal is output from the probe 15, the potential of the wiring pattern 12 changes, and current flows from the source to the drain. This current is provided as a detection signal and is transmitted to the signal processor 22 via the horizontal selector 20. If the wiring pattern 12 is not present at the position opposite to the sensor element 17a, no current flows. In addition, if there is a disconnection in a particular wiring, current does not flow in the same way, and it is possible to check whether the wiring is disconnected.

Therefore, the wiring pattern 12 related to the electrode contacted with the probe 15 by analyzing the position of the sensor element 17a having the output current as the detection signal can be easily confirmed whether the metal wiring on the substrate is disconnected. The position on the circuit board on which) is positioned can be determined.

The sensor elements 17a are arranged in two dimensions integrally with the circuit board 12 in the inspection apparatus 13, but three-dimensional arrangement is also possible. As shown in Fig. 3, the sensor element 17a is preferably uniform in shape, which allows the sensor element 17a to supply a test signal to the wiring pattern and to receive the signal from the wiring board without deviation. Because.

Further, as shown in Fig. 3, the sensor elements 17a are preferably arranged at regular intervals in a deterministic manner, and the sensor elements 17a composed of only one column depending on the wiring pattern. ) Is also good. For accurate inspection, the size and space of each sensor element 17a between adjacent sensor elements 17a is preferably determined according to the line width of the wiring pattern.

In particular, when several wires are connected to the shorting bar before cutting, such as data lines or gate lines of the LCD panel, the measurement time is further increased by using a sensor in which a plurality of transistors are arranged by a voltage applied by one probe. Can be reduced. In addition, since the sensor element according to the present invention has much smaller power consumption than conventional MOSFETs, the spatial resolution through miniaturization has a great advantage.

As described above, according to the present invention, in the method and apparatus for inspecting the disconnection of the metal wiring of the flat panel display and the circuit board, the power consumption during the inspection of the disconnection is reduced as compared with the conventional method, and the reaction speed is improved to improve the array (array). It is advantageous in size reduction and it is possible to improve the spatial resolution through miniaturization.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the present invention described in the claims below. It will be appreciated that it can be changed.

Claims (4)

In the device for inspecting the disconnection of the metal wiring of the flat panel display and the circuit board, and non-contact inspection of the potential change caused by applying a test signal to the wiring pattern, using at least one carbon nanotube field effect transistor as a sensor element Detecting means for detecting a change in potential at each portion of the wiring pattern; And selecting means for outputting a selection signal for selecting the sensor element, wherein each sensor element is formed on a single crystal semiconductor or a flat plate. The inspection apparatus according to claim 1, wherein the sensor elements have a two-dimensional or three-dimensional array at regular intervals. In the sensor for inspecting the disconnection of the metal wiring of the flat panel display and the circuit board, and non-contact inspection of the potential change caused by applying a test signal to the wiring pattern, Each of the sensor elements is formed on a single crystal semiconductor as a carbon nanotube field effect transistor, A passive element operating as a counter electrode coupled capacitively with the wiring pattern to detect a potential change in the wiring pattern; And Sensor for checking disconnection of metal wiring of a flat panel display and a circuit board, characterized in that it comprises a transistor which is adapted to output a detection signal output from the passive element in response to an input selection signal. 4. The sensor according to claim 3, wherein the sensor elements have a two-dimensional or three-dimensional array at regular intervals.

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