KR20060076459A - Apparatus of exposure for semiconductor fabrication - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for manufacturing a semiconductor, which can efficiently cool a stepper device forming a fine circuit pattern and improve the performance of a lens.

An exposure apparatus for manufacturing a semiconductor according to the present invention includes a lens module having a light source for generating light, a plurality of lenses for condensing the light irradiated from the light source to a predetermined size, and an exposure light emitted from the lens module. And a substrate and at least two water controllers for supplying water into the lens module.

By such a configuration, the present invention can minimize the change in the focus of each lens and fixation of each lens by circulating water to cool the stepper lens. Accordingly, the present invention does not cause a difference in the pattern size between the substrates due to the fixing of the lens and the minimization of the focus change, and it is possible to improve the characteristics of the semiconductor device by uniformizing the critical dimension of the pattern.

Stepper, lens, water, nitrogen, focus, cooling

Description

Apparatus of exposure for semiconductor fabrication

1 is a view showing an exposure apparatus for manufacturing a general semiconductor.

2 illustrates an exposure apparatus for manufacturing a semiconductor according to an embodiment of the present invention.

<Explanation of symbols for main parts of drawing>

10, 110: light source 12, 112: light

20, 120: lens module 22, 122: lens

30, 130: substrate 40: nitrogen gas controller

140: water circulation system 142, 144: water controller

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for semiconductor manufacturing, and more particularly, to an exposure apparatus for semiconductor manufacturing which enables to efficiently cool a stepper device forming a fine circuit pattern and to improve the performance of a lens.

In general, semiconductor devices have a form in which various types of films (for example, a silicon film, an oxide film, a field oxide film, a polysilicon film, a metal wiring film, etc.) are stacked in a multilayer structure. Such a multilayer semiconductor device is manufactured by various processes such as a deposition process, an oxidation process, a photolithography process (photoresist film coating, exposure, development process, etc.) or a patterning process, an etching process, a cleaning process, a rinsing process, and the like. . At this time, the patterning of any film is formed by applying a photoresist (photosensitive film) on the film by spin coating or the like, and then exposing and developing a mask pattern having a desired shape on the film. It is performed by selectively removing (etching) the underlying film using the formed mask pattern. One of the semiconductor manufacturing equipment required for such a patterning process is an exposure apparatus.

In recent years, as semiconductor devices have been highly integrated, circuit line widths have been miniaturized to 0.13 μm and 0.09 μm or less, and an exposure apparatus using an argon fluoride (ArF) laser is used to obtain the resolution of such fine lines.

A photo device for realizing a fine circuit line width in a semiconductor device manufacturing process includes a track device for coating and developing a photoresist on a substrate, and a stepper device for exposing a micro circuit pattern on a substrate.

The stepper device exposes a microcircuit in a semiconductor production apparatus and patterns it to pattern an integrated circuit on a substrate. Such a stepper device is a device which is important enough to distinguish generations of semiconductors and is so precise.

In order to form a desired pattern using various lenses, a stepper device transmits light to a disk called a mask and exposes the substrate by selectively transmitted light, and then forms a semiconductor microcircuit on the substrate through a process called development. Done.

1 is a diagram showing a stepper device of a conventional exposure apparatus for semiconductor manufacturing.

Referring to FIG. 1, a stepper apparatus of a conventional exposure apparatus for manufacturing a semiconductor includes a lens module 20 that focuses a light source 10 generating light 12 and a light 12 emitted from the light source 10 to a predetermined size. ), A substrate 30 exposed by light emitted from the lens module 20, and a nitrogen gas controller 40 for circulating nitrogen gas in the lens module 20.

The light source 10 generates light 12 such as halogen and laser as UV and irradiates the lens module 20.

The lens module 20 includes a plurality of lenses 22 for focusing the light 12 emitted from the light source 10 to a predetermined size, and nitrogen (N 2) gas that is filled and circulated in the space between the lenses 22. do.

Nitrogen (N2) gas is injected and discharged by the nitrogen gas controller 40 to maintain a constant distance between the plurality of lenses 22 installed in the lens module 20.

Each of the plurality of lenses 22 serves to irradiate the substrate 30 by focusing the incident light 12 to a predetermined size.

The nitrogen gas controller 40 is heated when light 12 passes through each lens 22 to circulate nitrogen (N2) gas to prevent the lens 22 from being deformed.

The light source 12 used in the stepper device of the exposure apparatus for the conventional semiconductor manufacturing uses a halogen and a laser as UV and passes through a mask (not shown) to reach the substrate 30 while passing through various lenses 22. do. At this time, the intensity of the light 12 is high, the lens 22 is heated to a high temperature of 700 ~ 800 ℃ to expand the nitrogen (N2) gas between the lens 22 and each lens 22 is precisely fixed Distortion occurs.

In order to prevent this, the nitrogen (N2) gas is inserted between each lens 22 while being precisely controlled to prevent each lens 22 from being twisted even when heated to a high temperature to prevent the pattern from being formed properly.

However, in the conventional stepper device, a source of contamination in nitrogen (N2) between each lens 22 is attached to each lens 22, and when used for a long time, a film is formed on the surface of each lens 22 to transmit the desired light 12. There are also factors that hinder. In addition, in the conventional stepper device, when the nitrogen (N2) control between the lenses 22 is not properly performed, when the process proceeds, as the temperature gradually increases, the focus of each lens 22 is shifted to form a desired pattern. It becomes impossible to expose on the board | substrate 30. As a result, in the conventional stepper device, the lens module 20 may not be cooled efficiently and the performance of the lens is reduced, so that the light 12 is slightly out of focus during the exposure of the actual substrate 30. There is a problem that the size of the pattern is changed.

Accordingly, an object of the present invention is to solve the problems of the prior art, the semiconductor manufacturing for improving the performance of the lens while cooling the stepper device forming a fine circuit pattern efficiently It is to provide an exposure apparatus.

In order to achieve the above object, an exposure apparatus for manufacturing a semiconductor according to an embodiment of the present invention comprises a lens module having a light source for generating light, a plurality of lenses to focus the light irradiated from the light source to a predetermined size; And a substrate exposed by the light emitted from the lens module, and at least two water controllers for supplying water into the lens module.

In the exposure apparatus for semiconductor manufacturing, each lens is fixed to have a predetermined interval by the water circulated from the water controller and is cooled by the water.

The exposure apparatus for manufacturing a semiconductor may further include a circulation system configured to adjust the temperature of the water and to control the respective water controllers so that the water is circulated between the lens module and the water controllers.

Hereinafter, with reference to the accompanying drawings, the configuration and operation according to a preferred embodiment of the present invention.

2 is a diagram illustrating a stepper device of an exposure apparatus for manufacturing a semiconductor according to an embodiment of the present disclosure.

Referring to FIG. 2, a stepper device of an exposure apparatus for manufacturing a semiconductor according to an embodiment of the present invention focuses a light source 110 generating light 112 and a light 112 emitted from the light source 110 to a predetermined size. First and second water controllers for supplying water to the lens module 120, the substrate 130 exposed by the light emitted from the lens module 120, and the lens module 120. 142 and 144 and a water circulation system 140 for controlling the temperature of the water and circulating it to the first and second water controllers 142 and 144.

The light source 110 generates light 112 such as halogen and laser as UV and irradiates the lens module 120.

The lens module 120 includes a plurality of lenses 122 for focusing the light 112 emitted from the light source 110 to a predetermined size, and water circulated by being filled in the space between the lenses 122. .

Each of the plurality of lenses 122 serves to irradiate the substrate 130 by focusing the size of the incident light 112 to a predetermined size.

Water is injected and discharged by the first and second water controllers 142 and 144 to maintain a constant distance between the plurality of lenses 122 installed in the lens module 120.

The first and second water controllers 142, 144 are heated from the water circulation system 140 to prevent the lens 122 from deforming as it is heated when light 112 passes through each lens 122. The water circulates in the lens module 120.

The water circulation system 140 adjusts the temperature of the water supplied from the outside and supplies the water to the first and second water controllers 142 and 144. In addition, the water circulation system 140 may be configured to circulate the temperature-controlled water to the first water controller 142, the lens module 120, and the second water controller 144. 142, 144.

As such, the light source 112 used in the stepper device of the exposure apparatus for manufacturing a semiconductor according to an embodiment of the present invention uses halogen and laser as UV and passes through various lenses 122 through a mask (not shown). 130) above. At this time, the intensity of the light 112 is strong, the lens 122 is heated to a high temperature of 700 ~ 800 ℃ so that the water (Water) between the lenses 122 to cool the temperature of each lens 122, each lens 122 ) Is prevented from changing the focus.

That is, the stepper device of the exposure apparatus for semiconductor manufacturing according to the embodiment of the present invention fixes the lens 122 of each lens 122 of the lens module 120 using water to cool the lens 122. It is possible to maintain a constant temperature in the lens module 120 by circulating the water to prevent the change in focus and less sensitive to changes in temperature (Water). Accordingly, since the lens 122 is less likely to be out of focus, a pattern having a desired shape is formed on the substrate 130 to form a pattern size between the substrate 130 on which the first exposure process is performed and the substrate 130 on which the exposure process is performed later. No difference occurs. In addition, the stepper device of the exposure apparatus for manufacturing a semiconductor according to the embodiment of the present invention uses water that does not generate a pollution source that contaminates the surface of the lens 122 so that the contamination source is not adsorbed to the lens 122 for a long time. (122) can be protected.

Meanwhile, since the exposure apparatus for manufacturing a semiconductor according to the embodiment of the present invention has a refractive index different from that of water and air, it is possible to expect better lens characteristics by changing the design method of each lens 122.

As described above, the exposure apparatus for manufacturing a semiconductor according to the embodiment of the present invention can minimize the fixation of each lens and the focus change of each lens by circulating water to cool the stepper lens. Accordingly, the present invention does not cause a difference in the pattern size between the substrates due to the fixing of the lens and the minimization of the focus change, and it is possible to improve the characteristics of the semiconductor device by uniformizing the critical dimension of the pattern. In addition, the present invention can develop an efficient stepper device by redesigning the lens due to the refractive index difference.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

Claims (3)

A light source for generating light, A lens module having a plurality of lenses for condensing the light emitted from the light source to a predetermined size; A substrate exposed by the light emitted from the lens module; And at least two water controllers for supplying water into the lens module. The method of claim 1, And each lens is fixed to have a predetermined interval by the water circulated from the water controller and cooled by the water. The method of claim 1, And a circulation system for adjusting the temperature of the water and controlling the water controller so that the water is circulated between the lens module and the water controllers.

Images