KR20060070692A - Conductive polyolefin resins, and wrapping instruments and sheet employing thereof - Google Patents

Abstract

Electroconductive resin composition, in particular one selected from the group consisting of high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene vinyl acetate copolymer, ethylene acrylate copolymer, polypropylene, chlorinated polyethylene, ethylene propylene copolymer or ethylene octene copolymer 10 to 30 weight parts of polymethylstyrene resin (C) based on 50 to 110 parts by weight of the thermoplastic resin (A) and 5 to 50 parts by weight of carbon black (B) and 100 parts by weight of the total amount of (A) and (B). Parts and / or additionally contains 1 to 10 parts by weight of hydrogenated styrene / butadiene copolymer (D) and 1 to 10 parts by weight of styrene / butadiene / styrene block copolymer (E), and has a surface resistance of 10 ² to 10 ¹⁰ Ω. An electrically conductive resin composition is provided, and when contacted with an electronic device such as an IC, it prevents contamination due to the release of carbon black due to abrasion. It can be reduced thoroughly, and is excellent in mechanical properties.

Electrically Conductive Resin Composition, Carbon Black, Polymethylstyrene

Description

Conductive polyolefin resins, and wrapping instruments and sheet employing

The present invention relates to a conductive polyolefin resin composition having excellent electrical conductivity, and an electronic component packaging container and sheet employing the same. The conductive polyolefin resin composition may be usefully used in electronic component packaging, automobile parts, and advanced material parts. In general, the polymer material has a high volume resistivity, and due to this property, electrostatic phenomena are caused to cause contamination and malfunction in the packaging of various electronic components. Therefore, in order to solve these problems, research is being actively conducted to manufacture polymer materials having excellent electrical conductivity while maintaining excellent physical properties of polymer materials, and many of them have been commercialized. In particular, electrically conductive polymer materials are used in the form of trays or carrier tapes for packaging electronic components such as ICs.

Common methods of imparting electrical conductivity include adding carbon black to impart conductivity and coating conductive polymer to impart conductivity. However, in the case of imparting conductivity by adding carbon, there is a problem in that carbon is transferred to the surface according to the composition of the polymer resin, and in the case of coating the conductive polymer, there is a problem due to the deterioration of mechanical properties and high price. In addition, in the latter case, when the carrier tape is packaged, there is a problem in adhesiveness with the cover tape and it is not commercialized. Therefore, in order to solve this problem, development of a polymer material which prevents carbon from leaving the surface of the polymer material and has excellent adhesion to the cover tape has been required.

The present invention is to provide a conductive polyolefin resin having good surface conductivity and excellent conductivity, and a container for packaging electronic components and sheets using the same, in order to solve the conventional problems described above.

The present invention overcomes the above disadvantages, in the group consisting of high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene vinyl acetate copolymer, ethylene acrylate copolymer, polypropylene, chlorinated polyethylene, ethylene propylene copolymer or ethylene octene copolymer A polyolefin resin composition having excellent electrical conductivity in which carbon black is contained in one or more selected thermoplastic resins, wherein the polymethyl styrene resin and / or a mixture of hydrogenated styrene / butadiene copolymers and styrene / butadiene / styrene copolymers By incorporation into this conductive resin, it is significantly reduced that the carbon black is released from wear, especially in contact with the IC or the like.

The present invention relates to a conductive polyolefin resin composition having excellent electrical conductivity by adding carbon black, and a container and a sheet for packaging an electronic component employing the same. The following compositions and inventions thereby are proposed.

(1) at least one thermoplastic resin selected from the group consisting of high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene vinyl acetate copolymer, ethylene acrylate copolymer, polypropylene, chlorinated polyethylene, ethylene propylene copolymer or ethylene octene copolymer 10 to 30 parts by weight of polymethylstyrene resin (C) based on (A) 50 to 110 parts by weight and 5 to 50 parts by weight of carbon black (B) and 100 parts by weight of the total amount of (A) and (B). , An electrically conductive resin composition having a surface resistance of 10 ² to 10 ¹⁰ Ω.

(2) at least one thermoplastic resin selected from the group consisting of high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene vinyl acetate copolymer, ethylene acrylate copolymer, polypropylene, chlorinated polyethylene, ethylene propylene copolymer or ethylene octene copolymer 10 to 30 parts by weight of polymethylstyrene resin (C) based on 50 to 110 parts by weight of (A) and 5 to 50 parts by weight of carbon black (B) and 100 parts by weight of the total amount of (A) and (B), hydrogenated An electrically conductive resin composition containing 1 to 10 parts by weight of styrene / butadiene copolymer (D) and 1 to 10 parts by weight of styrene / butadiene / styrene block copolymer (E) and having a surface resistance of 10 ² to 10 ¹⁰ Ω.

(3) An electronic component packaging container employing an electroconductive resin composition as defined in any one of (1) to (2) above.

(4) A sheet employing an electrically conductive resin composition as defined in any one of (1) to (2) above.

(5) A sheet as defined in (4) above having a substrate layer and an electrically conductive resin composition layer.

(6) An electronic component packaging container employing a sheet as defined in (5) above.

Hereinafter, the present invention will be described in more detail.

In the present invention, the polyolefin resin (A) alone or high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene vinyl acetate copolymer, ethylene acrylate copolymer, polypropylene, chlorinated polyethylene, ethylene propylene copolymer or ethylene octene copolymer It can be used as a mixture, and in the case of polypropylene resin, it is incorporated in an amount of 50 to 110 parts by weight, particularly preferably 60 to 80 parts by weight. When the polypropylene resin is less than 50 parts by weight, the effect of preventing the release of carbon is insufficient, and when more than 110 parts by weight, sufficient mechanical properties cannot be obtained.

In the present invention, the carbon black (B) is, for example, furnace black, channel black or acetylene black, preferably incorporated in a small amount in the resin by having a large specific surface area and thus high level. The electrical conductivity of can be obtained. For example, mention may be made of Super Conductive Furnace (SCF), Electric Conductive Furnace (ECF), Ketjenblack or acetylene black. It is added in an amount such that the surface resistance can be 10 ² to 10 ¹⁰ Ω, preferably 10 ⁴ to 10 ⁸ Ω. If the surface resistance exceeds 10 ¹⁰ Ω, a sufficient antistatic effect may not be obtained, and if the surface resistance is less than 10 ² Ω, for example, static electricity may promote the inflow of electricity from the outside, thereby causing electronic components to fail. have.

To obtain the surface resistance. The amount of carbon black to be added is particularly preferably 5 to 50 parts by weight, particularly preferably 20 to 40 parts by weight of the thermoplastic resin carbon black (B). If the amount is less than 5 parts by weight, sufficient electrical conductivity cannot be obtained, and if the amount is more than 50 parts by weight, the uniform dispersibility with the resin is lowered, and the extrudability is significantly reduced. Mechanical strength and the like decrease.

In the present invention, the amount of polymethylstyrene (C) is preferably 10 to 30 parts by weight, more preferably 15 to 25 parts by weight, per 100 parts by weight of the total amount of the thermoplastic resin (A) and the carbon black (B). . When the amount is less than 10 parts by weight, the mechanical strength is insufficient, and when the amount exceeds 30 parts by weight, the workability is lowered.

Meanwhile, in addition to polymethylstyrene (C), 1 to 10 parts by weight of hydrogenated styrene / butadiene copolymer (D) and 1 to 10 parts by weight of styrene / butadiene / styrene block copolymer (E) may be further mixed, and these upper and lower limits If it is less than or exceeding, similar technical disadvantages appear when the upper and lower limits of the polymethylstyrene (C) are less than or exceeded.

When carbon black is incorporated so that the surface resistance is at a level of 10 ² to 10 ¹⁰ Ω so that the electrically conductive resin composition of the present invention maintains sufficient moldability, the melt flow index (measured according to ASTM D1238) is polypropylene-based. The resin is preferably at least 0.1 g / 10 minutes, particularly preferably at least 0.5 g / 10 minutes under a load of 2.16 kg at 230 ° C.

In order to improve the fluidity of the composition or the mechanical properties of the molded article, various additives such as lubricants, plasticizers, processing reinforcing agents and reinforcing agents, or other resin components may be incorporated into the electrically conductive resin composition, if necessary.

In the present invention, in order to obtain the electroconductive resin composition by kneading and pelletizing the raw material, known means such as a Banbury mixer, an extruder, and the like can be employed. When kneading, the raw materials can be kneaded stepwise by kneading all of the raw materials at once or separately kneading a mixture of polyolefin resin and carbon block and finally kneading the kneaded mixture and the remaining resin at once. have.

The electrically conductive resin composition can be used as a container for packaging an electronic component by being molded. The electronic component packaging container is extruded in a sheet form and then formed into a container for packaging electronic components such as a tray, a magazine tube, or an emboss carrier tape by a conventional method such as vacuum molding, press molding, or hot plate molding. Can be. In particular, in recent years, it is a trend to be employed as a carrier tape or tray form suitable for automated packaging. By inserting the electronic component into the packaging container, the electronic component packaging is completed. In such cases, the container should be fitted with a cover tape, if necessary. For example, in the case of the carrier tape, after inserting the electronic component, the cover tape is attached to the carrier tape to complete the packaging. The electronic component package includes having such a structure.

The sheet of the electroconductive resin composition of the present invention may be a single layer sheet or a multilayer sheet. A multilayer sheet has the said electrically conductive resin composition layer on at least one surface of a thermoplastic resin base material layer. The thermoplastic resin is not particularly limited. For example, polyolefin-based, polystyrene-based resin, ABS resin or polycarbonate resin can be used.

The total thickness of the sheet is usually 0.3 to 0.5 mm, and in the multilayer sheet, the thickness of the electroconductive resin composition layer is preferably 5 to 50% of the total thickness. If the thickness of the electrically conductive resin is less than 5%, the electrical conductivity may drop partially after molding, and if it is 50% or more, the mechanical strength is reduced.

The electronic component is not particularly limited and includes, for example, ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light emitting diodes), liquid crystals, piezoelectric element resistors, filters, Crystal oscillators, quartz resonators, connectors, switches, volumes or relays may be mentioned. The type of IC is not particularly limited and may be, for example, SOP, HEMT, SQFP, BGA, CSP, SOJ, QFP or PLCC.

Hereinafter, the present invention will be described in more detail with reference to Examples.

Composition (parts by weight) PP (A) Carbon black (B) (A) + (B) Styrene Resin SEBS (D) SBS (E) PMS (C) HIPS Example 1 Example 2 Example 3 100 100 100 30 30 30 100 100 100 25 20 15  5 5   5 Comparative Example 1 Comparative Example 2 Comparative Example 3 100 100 100 30 30 30 100 100 100 25 20 15  5 5   5

Examples 1 to 3

The raw materials were uniformly mixed in a ratio as shown in Table 1 by a high speed mixer, and then kneaded by a φ 45 mm twin screw extruder, cooled and pelletized. The pelletized resin composition was then molded into a sheet having a 300 μm thickness by a φ 90 mm extruder (L / D = 28) and a T-die.

Comparative Examples 1 to 3

The process was carried out in the same manner as in Example 1 except that the raw material was in the proportion as shown in Table 1.

Evaluation was performed by the following method.

(1) elongation, tensile strength and tensile modulus

It was measured at a tensile rate of 5 mm / min by the ASTM D638 evaluation method.

(2) surface resistance

The resistance was measured at arbitrary 10 points with the sheet | seat gap 50 mm using surface ohmmeter ST-3 (made by SIMCO Japan).

(3) Desorption of Carbon

 After inserting the IC QFP14 mm x 20 mm x 64 pins into the sheet molded article, the cover tape was attached and then placed in a shaker, and repeated for 48 hours. Next, the presence or absence of carbon black on the lead part of the said IC was observed with the microscope. Evaluation was made by dividing the IC lead into four stages according to the criteria of the following five grades, and the results were evaluated in total.

1: Leavings are observed both on the molded part and on the lid.

2: Leaving is observed in the entire lead.

3: Leaving is observed in 21 or more leads and 63 or less leads.

4: Leaving is observed at 20 leads or less.

5: No departure is observed.

Surface resistance (Ω)  Elongation (%) Fracture Tensile Strength (kg / ㎠) Tensile Modulus (kg / ㎠) Departure of Carbon (out of 20 points) obverse The back MD TD MD TD MD TD Example 1 Example 2 Example 3 10 ⁴ 10 ⁴ 10 ⁴ 10 ⁴ 10 ⁴ 10 ⁴ 30 35 39 32 36 41 350 341 320 355 342 325 17830 16510 15500 17690 16680 15430 19 18 18 Comparative Example 1 Comparative Example 2 Comparative Example 3 10 ⁴ 10 ⁴ 10 ⁴ 10 ⁴ 10 ⁴ 10 ⁵ 52 63 73 47 64 80 272 255 233 275 258 237 15280 14210 13550 15220 14320 13680 13 14 14

As shown in Table 2, each of Examples 1 to 3 is superior in elongation, tensile strength, tensile modulus and release of carbon as compared to Comparative Examples 1 to 3.

When using an electroconductive resin composition as a surface layer and using a polypropylene resin as a base material layer, the sheet | seat which has the layer of the said electroconductive resin composition coextruded to 30 micrometer thickness in each surface of the base material layer of 300 micrometers in total thickness, The sheet was manufactured by a coextrusion method by a φ90 mm extruder and a φ65 mm extruder, and molded into a carrier tape by a thermoforming method in a conventional emboss carrier molding machine, and then evaluated by the same method as the above evaluation method. Results The same results were obtained with surface resistance and withdrawal of carbon, the carrier tape being suitable for IC packaging.

Resin used in the Example and the comparative example is as follows.

PP (Polypropylene Resin): Samsung General Chemical CoPP BB110,

Carbon Black: Raven 520 Ultra from Columbian Chemicals Korea,

PMS (polymethyl styrene): TI-300 of Dainippon Ink and Chemicals, Inc.,

HIPS (impact-resistant polystyrene resin): Dongbu Hannong Chemical, H724EP,

SEBS (hydrogenated styrene / butadiene copolymer resin): Tuftec H-1062 from PS Japan Corporation, and

SBS (styrene / butadiene / styrene block copolymer resin): K-Resin KR03 of KRCC.

The electrically conductive resin composition of the present invention, in the group consisting of high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene vinyl acetate copolymer, ethylene acrylate copolymer, polypropylene, chlorinated polyethylene, ethylene propylene copolymer or ethylene octene copolymer Polymethylstyrene resin (C) 10 based on 50 to 110 parts by weight of at least one thermoplastic resin (A) and 5 to 50 parts by weight of carbon black (B) and 100 parts by weight of the total amount of (A) and (B) To 30 parts by weight and / or additionally 1 to 10 parts by weight of hydrogenated styrene / butadiene copolymer (D) and 1 to 10 parts by weight of styrene / butadiene / styrene block copolymer (E), and has a surface of 10 ² to 10 ¹⁰ Ω Resistant electroconductive resin composition that prevents contamination due to wear and tear of carbon black when contacted with electronic devices such as ICs. It can be reduced thoroughly, and is excellent in mechanical properties.

Claims (6)

At least one thermoplastic resin (A) selected from the group consisting of high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene vinyl acetate copolymer, ethylene acrylate copolymer, polypropylene, chlorinated polyethylene, ethylene propylene copolymer or ethylene octene copolymer 10 to 30 parts by weight of polymethylstyrene resin (C), based on 50 to 110 parts by weight and 5 to 50 parts by weight of carbon black (B) and 100 parts by weight of the total amount of (A) and (B), 10 ² Electroconductive resin composition having a surface resistance of ¹⁰ to 10 ¹⁰ Ω. The method according to claim 1, further comprising 1 to 10 parts by weight of hydrogenated styrene / butadiene copolymer (D) and 1 to 10 parts by weight of styrene / butadiene / styrene block copolymer (E), and has a surface resistance of 10 ² to 10 ¹⁰ Ω. Electroconductive resin composition having a. An electronic component packaging container employing the electrically conductive resin composition of claim 1. A sheet employing the electroconductive resin composition of claim 1. Base material layer; And a sheet having a surface layer of the electrically conductive resin composition of claim 1. An electronic component packaging container employing the sheet of claim 5.