JP3721340B2 - Conductive resin composition - Google Patents
Conductive resin composition Download PDFInfo
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- JP3721340B2 JP3721340B2 JP2002101010A JP2002101010A JP3721340B2 JP 3721340 B2 JP3721340 B2 JP 3721340B2 JP 2002101010 A JP2002101010 A JP 2002101010A JP 2002101010 A JP2002101010 A JP 2002101010A JP 3721340 B2 JP3721340 B2 JP 3721340B2
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Description
【0001】
【産業上の利用分野】
本発明は、ポリフェニレンエーテル系樹脂の熱可塑性樹脂及びカーボンブラックからなるIC包装用導電性樹脂組成物において、この導電性樹脂組成物にエチレン−α−オレフィン共重合体樹脂を含有させることにより、IC等との接触時の
摩耗によるカーボンブラック等の脱離が原因となるIC等の汚染を著しく減少させたIC包装用導電性樹脂組成物に関する。
【0002】
【従来の技術】
従来からICやICを用いた電子部品の包装形態としてインジェクショントレー、真空成形トレー、マガジン、エンボスキャリアテープなどが使用されており、これらの包装容器には静電気によるIC等の破壊を防止するために(1)包装容器の表面に帯電防止剤を塗布する方法、(2)導電性塗料を塗布する方法、(3)帯電防止剤若しくは導電性フィラーを分散させる方法等が実施されている。
【0003】
しかしながら、(1)の方法は、塗布直後は十分な帯電防止効果を示すが、長時間の使用により、水分による流出、摩耗による帯電防止剤の脱離が生じ易く安定した性能が得られない。また表面固有抵抗値も109〜1012Ω程度であり厳しい帯電防止効果を要求されるICの包装には不適当である。
(2)の方法は、製造において塗布が不均一となり易くまた摩耗による剥がれ落ちのため帯電防止効果を失いICを破壊すると共にICのリード部を汚染するという欠点がある。
(3)の方法においては帯電防止剤では、添加量が多量に必要のため樹脂の物性を低下させ、また表面固有抵抗値が湿度により大きく影響され安定した性能が得られない。
【0004】
又、導電性フィラーとしては金属微粉末、カーボンファイバー、カーボンブラックなどが挙げられる。この内金属微粉末及びカーボンファイバーは、少量の添加で十分な導電性が得られるが成形性が著しく低下し、また均一に分散させることが難しく、かつ成形品の表面に樹脂成分のみのスキン層が出来易く安定した表面固有抵抗値が得られにくい。これらに対しカーボンブラックは混練条件等の検討により均一に分散させることが可能であり、安定した表面固有抵抗値が得られ易いことから一般的に使用されていが、カーボンブラックを多量に添加する必要が有るため流動性や成形性が低下する現象がある。
【0005】
従来、カーボンブラックを分散させる樹脂としては、一般用としてポリ塩化ビニル系樹脂、ポリプロピレン系樹脂、ポリエチレンテレフタレート系樹脂、ポリスチレン系樹脂及びABS系樹脂が、また100℃以上での耐熱用としてポリフェニレンエーテル系樹脂、ポリカーボネート樹脂などが用いられている。これらの樹脂のなかで、耐熱用としてはポリフェニレンエーテル系樹脂が、カーボンブラックを多量に添加しても流動性や成形性の著しい低下がなく、さらにコストの面でも優れている。しかしながら、カーボンブラックを多量に添加した組成物の成形品は、摩耗により成形品の表面から、カーボンブラックが脱離し易いという欠点があった。
【0006】
【発明が解決しようとする課題】
本発明は、かかる欠点を解決するものであり、ポリフェニレンエーテル系樹脂の熱可塑性樹脂及びカーボンブラックからなるIC包装用導電性樹脂組成物において、この導電性樹脂組成物に、さらに、エチレン−α−オレフィン共重合体樹脂を含有させることにより、該導電性樹脂組成物から成るIC包装用の成形品において、成形品とIC等との接触・摩耗が原因となるカーボンブラック等の脱離によるIC等の汚染を著しく減少させたIC包装用導電性樹脂組成物を提供しようとするものである。
【0007】
【課題を解決するための手段】
すなわち、本発明の第1の発明は、(A)ポリフェニレンエーテル系樹脂の熱可塑性樹脂、(B)カーボンブラック及び(C)エチレン−α−オレフィン共重合体樹脂からなるIC包装用導電性樹脂組成物において、(a)前記(A)熱可塑性樹脂100重量部に対し(B)カーボンブラック5〜50重量部を含有し、かつ、前記(A)熱可塑性樹脂と(B)カーボンブラックの合計量100重量部に対し、JIS−K−7215によるデユロメータA型表面硬度が90以下の(C)エチレン−α−オレフィン共重合体樹脂1〜30重量部を含有してなり、かつ、(b)導電性樹脂組成物の表面固有抵抗値が102〜1010Ωであることを特徴とするIC包装用導電性樹脂組成物である。
【0008】
以下、本発明を更に詳細に説明する。本発明においては、(A)ポリフェニレンエーテル系樹脂の熱可塑性樹脂が使用され、ポリフェニレンエーテル系樹脂とはポリフェニレンエーテル樹脂とポリスチレン系樹脂を主成分とする樹脂をいい、ポリフェニレンエーテル樹脂とポリスチレン系樹脂の合計量100重量部におけるポリフェニレンエーテル樹脂の含有量は28〜86重量部が好ましく、28重量部未満ではポリフェニレンエーテル系樹脂としての十分な力学特性が得られず、86重量部を越えると流動性の低下により成形加工が困難となる。該ポリフェニレンエーテル樹脂とは米国特許3383435号に記載されているホモポリマー或いは共重合体が示される。
【0009】
本発明で使用するポリスチレン系樹脂とは一般のポリスチレン樹脂又は耐衝撃性ポリスチレン樹脂及びこれらの混合物を主成分とするものをいう。
【0010】
本発明で使用する(C)カーボンブラックは、ファーネスブラック、チャンネルブラック、アセチレンブラック等であり、好ましくは比表面積が大きく、樹脂への添加量が少量で高度の導電性が得られるものである。例えば,S.C.F.(Super Conductive Furnace)、E.C.F.(Electric Conductive Furnace)、ケッチェンブラック(ライオン−AKZO社製商品名)及びアセチレンブラックである。カーボンブラックの添加量は、表面固有抵抗値が102〜1010Ωとすることのできる添加量であり、かつ(A)熱可塑性樹脂100重量部に対し(B)カーボンブラック5〜50重量部が好ましい。添加量が5重量部未満では十分な導電性が得られず表面固有抵抗値が上昇してしまい、また50重量部を越えると樹脂との均一分散性が悪化し、成形加工が困難となり、かつ、機械的強度等の特性値が低下してしまう。また、表面固有抵抗値が1010Ωを越えると十分な帯電防止効果が得られず、102Ω未満では、導電性が良すぎて電磁誘導や静電誘導などにより起電力が生じICを破壊する恐れがある。
【0011】
本発明で使用する(C)エチレン−α−オレフィン共重合体樹脂は、エチレンとα−オレフィンを共重合した樹脂をいい、エチレンと共重合するα−オレフィンとしては、ポロピレン、ブテンー1、ペンテンー1、ヘキセンー1等があり、例えば、三井石油化学社、「タフマーP」及び「タフマーA」等である。エチレン−α−オレフィン共重合体樹脂はJIS−K−7215で言うデユロメータA型表面硬度が90以下のものが好ましく、メルトフローインデックス(JISK−7210に準じ測定)は、190℃、荷重2.16kgの条件で0.1g/10分以上であり、この数値未満ではポリフェニレンエーテル系樹脂との混練が困難となり、良好な組成物が得られない。エチレン−α−オレフィン共重合体樹脂の添加量は、熱可塑性樹脂とカーボンブラックの合計量100重量部に対して、1〜30重量部が好ましく、特に好ましくは3〜25重量部である。添加量が1重量部未満ではその効果が不十分であり、30重量部を越えるとポリフェニレンエーテル系樹脂中に均一に分散させることが困難となる。
【0012】
本発明の導電性樹脂組成物は、十分な成形加工性を維持するために、表面固有抵抗値が102〜1010Ωとなるようにカーボンブラックを充填した場合、メルトフローインデックス(JIS−K−7210に準じ測定)が、ポリフェニレンエーテル系樹脂に充填した場合、230℃、荷重10kgの条件で、0.1g/10分以上である。
【0013】
更に、本発明の導電性樹脂組成物には、必要に応じて流動特性を改善するための滑剤、可塑剤、加工助剤、成形品の力学特性を改善するための補強剤などの各種添加剤や他の樹脂成分を添加することが可能である。本発明において、樹脂等各種原材料を混練、ペレット化するにはバンバリーミキサー、押出機等の公知の方法を用いることが可能である。
【0014】
【実施例】
以下本発明を実施例によりさらに詳細に説明する。
実施例1
表1に示す原料組成割合にて原料を各々計量し、高速混合機より均一に混合した後、φ45mmベント式二軸押出機を用いて混練し、ストランドカット法によりペレット化した。次にペレット化した樹脂組成物をサンプルMはφ65mm押出機(L/D=28)を用い500mm幅のTダイにより厚さ500μmのシート状に成形したもの、サンプルNは、インジェクション成形機(100t)により厚さ1mm×120mm角のプレート状及び
引張測定用試験片形状に成形したものを評価用のサンプルとした。評価結果を表3及び表4に示す。実施例1においては、カーボンブラックの脱落は無かった。
【0015】
比較例1
実施例1と同様にして、表2に示す原料組成割合にて原料を各々計量し、高速混合機より均一に混合した後、φ45mmベント式二軸押出機を用いて混練し、ストランドカット法によりペレット化した。次にペレット化した樹脂組成物にてサンプルM及びサンプルNを作成し評価した。評価結果を表3及び表4に示す。比較例1においては、カーボンブラックの脱落が確認された。
【0016】
【表1】
【0017】
【表2】
【0018】
【表3】
【0019】
【表4】
【0020】
尚、各評価は次に示す方法によって行った。
(1)表面固有抵抗
サンプルM及びNともにロレスター表面抵抗計(三菱油化社製)により電極間を10mmとしサンプル中任意の10点を測定し、その対数平均値を表面固有抵抗値とした。
(2)破断点強度、引張弾性率
JIS−K−7113に準拠しサンプルMについては2号形試験片、サンプルNについては1号形試験片を引張速度10mm/minで測定した。
【0021】
(3)カーボン脱落の有無
各シート及びプレートサンプルの表面にQFP14mm×20mm/64pinのICを100gの荷重で押し付け、ストローク15mmで100往復させ、その後ICのリード部をマイクロスコープで観察した。リード部におけるカーボンブラック等黒色の付着物の有無で評価した。(4)MFI各実施例及び比較例のペレットについてJIS−7210に準拠し測定を行った。
【0022】
【発明の効果】
以上説明したとおり、(A)ポリフェニレンエーテル系樹脂の熱可塑性樹脂及びカーボンブラックからなるIC包装用導電性樹脂組成物において、この導電性樹脂組成物に、さらに、エチレン−α−オレフィン共重合体樹脂を含有させることにより、IC等と接触時の摩耗によるカーボンブラックの脱離が原因となるIC等の汚染を著しく減少させた導電性樹脂組成物を得ることが可能となる。[0001]
[Industrial application fields]
The present invention relates to a conductive resin composition for IC packaging comprising a thermoplastic resin of a polyphenylene ether resin and carbon black, and by adding an ethylene-α-olefin copolymer resin to the conductive resin composition, The present invention relates to a conductive resin composition for IC packaging in which contamination of IC and the like caused by detachment of carbon black and the like due to wear at the time of contact with the resin is remarkably reduced.
[0002]
[Prior art]
Conventionally, injection trays, vacuum forming trays, magazines, embossed carrier tapes, etc. have been used as packaging forms for ICs and electronic parts using ICs. To prevent destruction of ICs due to static electricity in these packaging containers (1) A method of applying an antistatic agent to the surface of a packaging container, (2) a method of applying a conductive paint, (3) a method of dispersing an antistatic agent or a conductive filler, and the like are being carried out.
[0003]
However, the method (1) shows a sufficient antistatic effect immediately after coating, but due to long-term use, the antistatic agent is likely to flow out due to moisture and desorb due to wear, and stable performance cannot be obtained. Further, the surface resistivity is about 10 9 to 10 12 Ω, which is unsuitable for IC packaging that requires a strict antistatic effect.
The method (2) has the disadvantages that the coating is likely to be non-uniform in production, and the antistatic effect is lost due to peeling off due to abrasion, destroying the IC and contaminating the lead portion of the IC.
In the method (3), since the antistatic agent is required to be added in a large amount, the physical properties of the resin are lowered, and the surface specific resistance value is greatly influenced by humidity, so that stable performance cannot be obtained.
[0004]
Examples of the conductive filler include fine metal powder, carbon fiber, and carbon black. The inner metal fine powder and carbon fiber can provide sufficient conductivity with a small amount of addition, but the moldability is remarkably lowered, it is difficult to disperse uniformly, and the skin layer of the resin component only on the surface of the molded product It is difficult to obtain a stable surface resistivity value. In contrast, carbon black can be uniformly dispersed by examining kneading conditions, etc., and is generally used because it is easy to obtain a stable surface resistivity. However, it is necessary to add a large amount of carbon black. Therefore, there is a phenomenon that fluidity and moldability are lowered.
[0005]
Conventionally, as a resin for dispersing carbon black, polyvinyl chloride resin, polypropylene resin, polyethylene terephthalate resin, polystyrene resin, and ABS resin are generally used, and polyphenylene ether resin is used for heat resistance at 100 ° C. or higher. Resin, polycarbonate resin, etc. are used. Among these resins, as the heat resistant polyphenylene ether-based resin, mosquitoes over carbon black in a large amount without significant decrease in the flowability and moldability be added, and further superior in terms of cost. However, a molded product of a composition in which a large amount of carbon black is added has a drawback that carbon black is easily detached from the surface of the molded product due to wear.
[0006]
[Problems to be solved by the invention]
The present invention solves this drawback, and in a conductive resin composition for IC packaging comprising a thermoplastic resin of a polyphenylene ether resin and carbon black, the conductive resin composition further includes ethylene-α-. By including an olefin copolymer resin, in a molded product for IC packaging made of the conductive resin composition, IC or the like due to desorption of carbon black or the like caused by contact or wear between the molded product and the IC or the like An object of the present invention is to provide a conductive resin composition for IC packaging in which the contamination of the IC is significantly reduced.
[0007]
[Means for Solving the Problems]
That is, the first invention of the present invention is a conductive resin composition for IC packaging comprising (A) a thermoplastic resin of a polyphenylene ether resin , (B) carbon black and (C) an ethylene-α-olefin copolymer resin. In the product, (a) 5 to 50 parts by weight of (B) carbon black is contained per 100 parts by weight of (A) thermoplastic resin, and the total amount of (A) thermoplastic resin and (B) carbon black It contains 1 to 30 parts by weight of (C) ethylene-α-olefin copolymer resin having a durometer A type surface hardness of 90 or less according to JIS-K-7215, and (b) conductive. The conductive resin composition for IC packaging is characterized in that the surface specific resistance value of the conductive resin composition is 10 2 to 10 10 Ω.
[0008]
Hereinafter, the present invention will be described in more detail. In the present invention, (A) a thermoplastic resin of a polyphenylene ether resin is used, and the polyphenylene ether resin refers to a resin mainly composed of a polyphenylene ether resin and a polystyrene resin, and is composed of a polyphenylene ether resin and a polystyrene resin. The content of the polyphenylene ether resin in the total amount of 100 parts by weight is preferably 28 to 86 parts by weight, and if it is less than 28 parts by weight, sufficient mechanical properties as a polyphenylene ether-based resin cannot be obtained. The molding process becomes difficult due to the decrease. Examples of the polyphenylene ether resin include homopolymers and copolymers described in US Pat. No. 3,383,435.
[0009]
The general polystyrene resin or high impact polystyrene resin and a mixture thereof are polystyrene resin used in the present invention will have a as a main component.
[0010]
The carbon black (C) used in the present invention is furnace black, channel black, acetylene black or the like, and preferably has a large specific surface area and a high conductivity can be obtained with a small amount added to the resin. For example, S.M. C. F. (Super Conductive Furnace), E.I. C. F. (Electric Conductive Furnace), Ketjen Black (product name of Lion-AKZO) and acetylene black. The amount of carbon black added is such that the surface resistivity can be 10 2 to 10 10 Ω, and (A) 100 parts by weight of thermoplastic resin (B) 5 to 50 parts by weight of carbon black Is preferred. If the amount added is less than 5 parts by weight, sufficient electrical conductivity cannot be obtained and the surface resistivity increases, and if it exceeds 50 parts by weight, the uniform dispersibility with the resin deteriorates, making molding difficult, and The characteristic values such as mechanical strength are lowered. Also, if the surface resistivity exceeds 10 10 Ω, sufficient antistatic effect cannot be obtained. If the surface resistivity is less than 10 2 Ω, the electroconductivity is too good and electromotive force is generated due to electromagnetic induction or electrostatic induction, causing destruction of the IC. There is a fear.
[0011]
The (C) ethylene-α-olefin copolymer resin used in the present invention refers to a resin obtained by copolymerizing ethylene and α-olefin. Examples of the α-olefin copolymerized with ethylene include propylene, butene-1 and pentene-1. Hexene 1 and the like, for example, Mitsui Petrochemical Co., Ltd., “Toughmer P” and “Toughmer A”. The ethylene-α-olefin copolymer resin preferably has a durometer A-type surface hardness of 90 or less according to JIS-K-7215, and has a melt flow index (measured according to JISK-7210) of 190 ° C. and a load of 2.16 kg. In this condition, it is 0.1 g / 10 min or more, and if it is less than this value, kneading with a polyphenylene ether resin becomes difficult, and a good composition cannot be obtained. The addition amount of the ethylene-α-olefin copolymer resin is preferably 1 to 30 parts by weight, particularly preferably 3 to 25 parts by weight with respect to 100 parts by weight of the total amount of the thermoplastic resin and carbon black. The addition amount is less than 1 part by weight the effect is insufficient, it becomes difficult to uniformly disperse in the polyphenylene ether-based resin in fat exceeds 30 parts by weight.
[0012]
When the conductive resin composition of the present invention is filled with carbon black so that the surface resistivity becomes 10 2 to 10 10 Ω in order to maintain sufficient moldability, the melt flow index (JIS-K Measured according to 72100), when filled in a polyphenylene ether resin , 0 . 1 g / 10 min or more.
[0013]
Furthermore, the conductive resin composition of the present invention includes various additives such as a lubricant, a plasticizer, a processing aid, and a reinforcing agent for improving the mechanical properties of a molded product, as necessary. It is possible to add other resin components. In the present invention, known methods such as a Banbury mixer and an extruder can be used to knead and pelletize various raw materials such as resins.
[0014]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples.
Example 1
The raw materials were weighed at the raw material composition ratios shown in Table 1, mixed uniformly from a high speed mixer, kneaded using a φ45 mm vented twin screw extruder, and pelletized by a strand cut method. Next, the pelletized resin composition was formed into a sheet having a thickness of 500 μm by using a T-die having a width of 500 mm by using a φ65 mm extruder (L / D = 28). Sample N was an injection molding machine (100 t). ) Was formed into a 1 mm × 120 mm square plate shape and a tensile test specimen shape as an evaluation sample. The evaluation results are shown in Tables 3 and 4. In Example 1 , the carbon black did not fall off.
[0015]
Comparative Example 1
In the same manner as in Example 1, the raw materials were weighed at the raw material composition ratios shown in Table 2, mixed uniformly from a high-speed mixer, kneaded using a φ45 mm vented twin screw extruder, and subjected to a strand cut method. Pelletized. Next, Sample M and Sample N were prepared and evaluated with the pelletized resin composition. The evaluation results are shown in Tables 3 and 4. In Comparative Example 1 , it was confirmed that the carbon black was dropped.
[0016]
[Table 1]
[0017]
[Table 2]
[0018]
[Table 3]
[0019]
[Table 4]
[0020]
Each evaluation was performed by the following method.
(1) Both surface specific resistance samples M and N were measured with a Lorester surface resistance meter (manufactured by Mitsubishi Yuka Co., Ltd.) with the distance between the electrodes set to 10 mm, and any 10 points in the sample were measured.
(2) Strength at break and tensile modulus In accordance with JIS-K-7113, a No. 2 type test piece was measured for sample M and a No. 1 type test piece was measured for sample N at a tensile speed of 10 mm / min.
[0021]
(3) Presence or absence of carbon drop The IC of QFP 14 mm × 20 mm / 64 pin was pressed against the surface of each sheet and plate sample with a load of 100 g, reciprocated 100 times with a stroke of 15 mm, and then the lead portion of the IC was observed with a microscope. Evaluation was made based on the presence or absence of black deposits such as carbon black in the lead portion. (4) MFI Each Example and Comparative Example pellets were measured according to JIS-7210.
[0022]
【The invention's effect】
As described above, in (A) a conductive resin composition for IC packaging comprising a thermoplastic resin of polyphenylene ether resin and carbon black, an ethylene-α-olefin copolymer resin is further added to this conductive resin composition. By containing the conductive resin composition, it is possible to obtain a conductive resin composition in which contamination of IC and the like caused by carbon black detachment due to wear during contact with the IC and the like is remarkably reduced.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2002101010A JP3721340B2 (en) | 2002-04-03 | 2002-04-03 | Conductive resin composition |
Applications Claiming Priority (1)
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