KR20060067753A - Cooling water control system of semiconductor product device and method for refrigeration by use same - Google Patents

Cooling water control system of semiconductor product device and method for refrigeration by use same Download PDF

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Publication number
KR20060067753A
KR20060067753A KR1020040106654A KR20040106654A KR20060067753A KR 20060067753 A KR20060067753 A KR 20060067753A KR 1020040106654 A KR1020040106654 A KR 1020040106654A KR 20040106654 A KR20040106654 A KR 20040106654A KR 20060067753 A KR20060067753 A KR 20060067753A
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South Korea
Prior art keywords
cooling water
flow rate
semiconductor manufacturing
cooling
manufacturing equipment
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KR1020040106654A
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Korean (ko)
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함규환
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삼성전자주식회사
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Publication of KR20060067753A publication Critical patent/KR20060067753A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28B—STEAM OR VAPOUR CONDENSERS
    • F28B9/00—Auxiliary systems, arrangements, or devices
    • F28B9/04—Auxiliary systems, arrangements, or devices for feeding, collecting, and storing cooling water or other cooling liquid
    • F28B9/06—Auxiliary systems, arrangements, or devices for feeding, collecting, and storing cooling water or other cooling liquid with provision for re-cooling the cooling water or other cooling liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Abstract

본 발명은 반도체 제조설비에 관한 것으로, 반도체 제조공정이 진행되는 챔버가 마련되는 반도체 제조설비와, 챔버를 냉각시키기 위한 냉각수를 공급하고, 공급되는 냉각수의 유량을 조절하기 위한 유량조절밸브가 마련되는 냉각수 급수라인과, 챔버를 냉각시킨 냉각수가 환수되고, 환수되는 냉각수의 유량을 감지하는 유량감지센서가 마련되는 냉각수 환수라인과, 유량감지센서에서 감지되는 측정치와 설정치를 비교하여 냉각수 급수라인의 유량조절밸브를 제어하는 제어부가 마련되는 것을 특징으로 하며, 이에 따라, 반도체 제조설비를 냉각시키고 환수되는 냉각수의 유량을 항시 감지하여 공급되는 냉각수의 유량을 조절할 수 있어 작업자의 미조작 또는 착오로 인한 반도체 제조설비의 온도 상승을 예방하여 반도체 제조설비의 안정적인 동작을 유지할 수 있는 효과가 있다.The present invention relates to a semiconductor manufacturing apparatus, which is provided with a semiconductor manufacturing apparatus in which a chamber in which a semiconductor manufacturing process is performed, and a coolant for cooling the chamber, and a flow regulating valve for adjusting a flow rate of the supplied cooling water. Cooling water supply line, the cooling water return line is provided with a flow rate sensor for detecting the flow rate of the cooling water is returned to the cooling water, and the flow rate of the cooling water supply line by comparing the measured value and the set value detected by the flow rate sensor It is characterized in that the control unit for controlling the control valve is provided, thereby cooling the semiconductor manufacturing equipment and the flow rate of the cooling water supplied by sensing the flow rate of the cooling water to be returned at all times to adjust the semiconductor due to unmanipulation or error of the operator It prevents the temperature rise of the manufacturing equipment and ensures stable operation of the semiconductor manufacturing equipment. It has a sustainable effect.

Description

반도체 제조설비의 냉각수 조절시스템 및 이를 이용한 냉각방법{Cooling water control system of semiconductor product device and method for refrigeration by use same} Cooling water control system of semiconductor manufacturing equipment and cooling method using the same {Cooling water control system of semiconductor product device and method for refrigeration by use same}             

도 1은 종래 기술에 따른 반도체 제조설비의 냉각시스템을 나타낸 간략도이다. 1 is a simplified diagram showing a cooling system of a semiconductor manufacturing apparatus according to the prior art.

도 2는 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템을 나타낸 구성도이다. Figure 2 is a block diagram showing a cooling water control system of a semiconductor manufacturing equipment according to the present invention.

도 3은 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템을 나타낸 블록도이다.3 is a block diagram showing a cooling water control system of a semiconductor manufacturing apparatus according to the present invention.

도 4는 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템의 작동을 나타낸 순서도이다.Figure 4 is a flow chart showing the operation of the cooling water control system of the semiconductor manufacturing equipment according to the present invention.

**도면의 주요 부분에 대한 부호의 설명**** Description of the symbols for the main parts of the drawings **

1 : 반도체 제조설비1: semiconductor manufacturing equipment

2 : 챔버2: chamber

100 : 냉각장치100: cooling device

120 : 냉각수 급수라인 120: cooling water supply line                 

122 : 유량조절밸브122: flow control valve

130 : 제어부130: control unit

140 : 냉각수 환수라인140: cooling water return line

142 : 유량감지센서
142: flow rate sensor

본 발명은 반도체 제조설비에 관한 것으로, 보다 상세하게는 반도체 제조설비의 냉각을 위하여 냉각수를 사용하는 반도체 제조설비의 냉각장치에서 냉각장치에 사용되는 냉각수의 흐름을 감지하여 냉각수 유량을 조절하도록 한 반도체 제조설비의 냉각수 조절시스템 및 이를 이용한 냉각방법에 관한 것이다.The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to detect a flow of cooling water used in a cooling apparatus in a cooling apparatus of a semiconductor manufacturing apparatus using cooling water for cooling a semiconductor manufacturing apparatus, and to adjust a cooling water flow rate. The present invention relates to a cooling water control system of a manufacturing facility and a cooling method using the same.

일반적으로, 확산로를 사용하는 반도체설비에는 웨이퍼(Wafer)를 소정 공정챔버(Chamber) 내에 투입하고 수소가스와 실란가스 등의 반응가스를 이용하여 고온으로 진행하는 바, 공정챔버의 내부는 각 제조공정별 특성에 맞춰 소정의 높은 온도를 유지하게 된다.In general, in a semiconductor facility using a diffusion path, a wafer is introduced into a predetermined process chamber and proceeds to a high temperature using a reaction gas such as hydrogen gas and silane gas. The predetermined high temperature is maintained according to the process-specific characteristics.

이러한, 공정챔버들의 온도는 반도체의 특성상 요구되는 온도로 정확하게 유지되어야 하는데, 이는 챔버를 가열하는 히터(Heater)와 챔버를 냉각시키는 PCW(Process Cooling Water;이하 '냉각수'라 함)를 이용하여 상호 동기하도록 구성함으로써 챔버 내부를 일정한 온도로 지속적으로 유지시킨다. The temperature of the process chambers must be maintained exactly at the temperature required for the characteristics of the semiconductor. This is achieved by using a heater to heat the chamber and a PCW (Process Cooling Water) to cool the chamber. By synchronizing, the inside of the chamber is kept at a constant temperature.                         

특히, 반도체 TEL(Batch식) 설비에서는 복수의 웨이퍼(Wafer)를 투입시킨 웨이퍼 보트(Boat)를 상기 확산로에 이송시켜 소정 공정을 진행하는 튜브 외벽에 설치되는 히터와, 상기 튜브와 결합되며 상기 튜브 내로 가스를 공급하는 가스공급 인젝터(Injector)와 배기라인이 연결 및 지지되는 매니폴드(Manifold)와, 상기 확산로에 웨이퍼가 적재되는 보트를 이동시키는 보트캡과, 상기 보트캡(Boatcap)이 공정을 마치고 아래로 내려올 때 상기 확산로의 하부 빈공간을 차단하는 자리를 차단하는 오토셔터(Auto shutter) 등 전술한 네 부분에 냉각수를 플로우시켜 공정에 필요한 소정 온도를 유지시키고 있다.In particular, a semiconductor TEL (Batch type) facility is coupled to the tube and the heater is installed on the outer wall of the tube to transfer a wafer boat (Wafer) into the diffusion path for a predetermined process The manifold to which the gas supply injector for supplying gas into the tube and the exhaust line are connected and supported, the boat cap for moving the boat on which the wafer is loaded in the diffusion path, and the boat cap Cooling water is flowed into the four parts described above, such as an auto shutter, which blocks a space that blocks the lower empty space of the diffusion path when the process is finished and descends to maintain a predetermined temperature required for the process.

한편, 확산로 내부를 균일한 온도로 유지시키기 위해서는 냉각수가 각 장치에 공급될 때, 장치의 각 부분별로 적절한 유량이 설정되어 공급될 수 있어야 하므로 공급되는 냉각수량을 제어할 수 있도록 냉각수를 공급하는 냉각수라인과 각 장치의 사이에 유량조절밸브를 설치하여 사용되고 있다.On the other hand, in order to maintain the inside of the diffusion furnace at a uniform temperature, when the cooling water is supplied to each device, an appropriate flow rate must be set and supplied for each part of the device, so that the cooling water is supplied to control the amount of cooling water supplied. It is used by installing flow control valve between cooling water line and each device.

이하, 종래 기술에 따른 냉각시스템을 간단히 설명한다. Hereinafter, the cooling system according to the prior art will be briefly described.

도 1은 종래 기술에 따른 반도체 제조설비의 냉각시스템을 나타낸 간략도 및 통상적으로 반도체 제조설비의 냉각시스템에 사용되는 유량조절밸브를 나타낸 것이다. 1 is a schematic view showing a cooling system of a semiconductor manufacturing facility according to the prior art and a flow control valve typically used in the cooling system of a semiconductor manufacturing facility.

도시한 바와 같이 종래기술에 따른 반도체 제조설비의 냉각시스템은, 반도체 제조설비(1)와 반도체 제조설비(1)에서 웨이퍼의 제조공정이 진행되는 챔버(2)가 마련되며, 웨이퍼 제조공정을 진행하는 챔버(2)로 냉각수를 공급하는 냉각수급수라인(12)과, 챔버(2)를 냉각시킨 냉각수가 환수되는 냉각수 환수라인(18)이 마련되 며, 냉각수 급수라인(12)의 소정부에는 냉각수 급수라인(12)으로 공급되는 냉각수의 유량을 조절하기 위한 유량조절밸브(14)가 마련된다. As shown, the cooling system of the semiconductor manufacturing equipment according to the prior art is provided with a chamber (2) through which a wafer manufacturing process is performed in the semiconductor manufacturing equipment (1) and the semiconductor manufacturing equipment (1), and the wafer manufacturing process is performed. Cooling water supply line 12 for supplying the cooling water to the chamber (2) is provided, and a cooling water return line 18 for returning the cooling water cooling the chamber 2 is provided, the predetermined portion of the cooling water supply line 12 A flow rate control valve 14 for adjusting the flow rate of the cooling water supplied to the cooling water supply line 12 is provided.

여기서, 유량조절밸브(14)는 도 1에 확대 도시한 바와 같이 냉각수 급수라인(12)으로 공급되는 냉각수의 유량에 따라 승강 이동되는 액츄레이터(17)가 마련되며, 작업자가 액츄레이터(17)의 위치를 파악하여 유량을 조절하기 위한 조절노브(16)가 마련된다. Here, the flow rate control valve 14 is provided with an actuator 17 which is moved up and down in accordance with the flow rate of the cooling water supplied to the cooling water supply line 12, as shown in Figure 1 enlarged, the operator 17 Adjusting knob 16 for adjusting the flow rate by detecting the position of is provided.

이러한, 종래기술에 따른 냉각시스템은, 작업자가 냉각수 급수라인(12)에 마련된 유량조절밸브(14)의 액츄레이터(17)의 위치를 파악하여 조절노브(16)를 회전시켜 유량을 조절함으로써, 냉각수 급수라인(12)으로 공급되는 냉각수의 유량을 제어할 수 있다. In the cooling system according to the related art, the operator grasps the position of the actuator 17 of the flow regulating valve 14 provided in the cooling water feed line 12, and rotates the adjusting knob 16 to adjust the flow rate. The flow rate of the cooling water supplied to the cooling water supply line 12 may be controlled.

그러나, 종래 기술에 따른 냉각시스템은 작업자가 수시로 유량조절밸브(14)의 액츄레이터(17)를 감시해야만 유량의 이상에 따른 반도체 제조설비(1)의 온도 상승을 예방할 수 있으며, 작업자의 착오로 인하여 유량조절밸브(14)를 조절하지 못했을 경우 반도체 제조설비(1)의 오작동을 유발하는 문제점이 있었다.
However, the cooling system according to the prior art can prevent the temperature rise of the semiconductor manufacturing equipment 1 due to the abnormal flow rate only when the operator monitors the actuator 17 of the flow control valve 14 at any time. Due to the failure to adjust the flow control valve 14 there was a problem causing a malfunction of the semiconductor manufacturing equipment (1).

본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로, 반도체 제조설비를 냉각시키고 환수되는 냉각수의 유량을 감지하여 반도체제조설비를 냉각시키기 위하여 공급되는 냉각수의 유량을 조절할 수 있는 반도체 제조설비의 냉각수 조절시스템 및 이를 이용한 냉각방법을 제공함에 그 목적이 있다.
The present invention has been made to solve the above problems, the cooling water of the semiconductor manufacturing equipment that can adjust the flow rate of the cooling water supplied to cool the semiconductor manufacturing equipment by sensing the flow rate of the cooling water and cooling the semiconductor manufacturing equipment The purpose is to provide a control system and a cooling method using the same.

상기의 목적을 달성하기 위한 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템 및 이를 이용한 냉각방법은, 반도체 제조공정이 진행되는 챔버가 마련되는 반도체 제조설비와; 상기 챔버를 냉각시키기 위한 냉각수를 공급하고, 공급되는 냉각수의 유량을 조절하기 위한 유량조절밸브가 마련되는 냉각수 급수라인과; 상기 챔버를 냉각시킨 냉각수가 환수되고, 환수되는 냉각수의 유량을 감지하는 유량감지센서가 마련되는 냉각수 환수라인과; 상기 유량감지센서에서 감지되는 측정치와 설정치를 비교하여 상기 냉각수 급수라인의 유량조절밸브를 제어하는 제어부가 마련되는 것을 특징으로 한다. Cooling water control system and a cooling method using the same of the semiconductor manufacturing equipment according to the present invention for achieving the above object comprises a semiconductor manufacturing equipment is provided with a chamber in which the semiconductor manufacturing process is performed; A cooling water supply line for supplying cooling water for cooling the chamber and provided with a flow control valve for controlling a flow rate of the supplied cooling water; A cooling water return line provided with a flow rate sensor for detecting a flow rate of the cooling water returned by the cooling water cooling the chamber; A control unit for controlling the flow rate control valve of the cooling water supply line by comparing the measured value and the set value detected by the flow rate sensor is characterized in that it is provided.

여기서, 상기 유량조절밸브는, 상기 제어부의 전기적 신호에 따라 상기 냉각수가 공급되는 유로를 개폐하는 솔레노이드 컨트롤 밸브로 마련되는 것이 바람직하다.Here, the flow rate control valve is preferably provided as a solenoid control valve for opening and closing the flow path to which the cooling water is supplied in accordance with the electrical signal of the control unit.

또한, 상기 제어부는, 상기 유량제어밸브의 개폐량 및 유량감지센서의 감지량을 디스플레이 하는 표시부가 더 마련되는 것이 바람직하다. The control unit may further include a display unit displaying the opening / closing amount of the flow control valve and the detection amount of the flow detection sensor.

또한, 상기 제어부는 상기 유량감지센서에서 감지되는 감지량이 상기 제어부의 설정치를 초과 또는 미달되었을 경우 경고음을 발생하는 발신부가 더 마련되는 것이 바람직하다. The control unit may further include a transmitter configured to generate an alarm sound when the amount detected by the flow rate sensor exceeds or falls below the set value of the controller.

그리고, 냉각수 급수라인을 통하여 반도체 제조설비의 챔버를 냉각시키기 위한 냉각수가 공급되는 냉각수공급단계; 상기 냉각수 급수라인을 통해 공급되는 냉 각수가 상기 챔버를 냉각시키는 냉각단계; 상기 챔버를 냉각시킨 냉각수가 냉각수 환수라인을 통해 환수되는 환수단계; 상기 냉각수 환수라인을 통해 환수되는 냉각수의 유량을 측정하는 유량측정단계; 상기 냉각수 환수라인의 유량측정값과, 설정된 값을 비교하여 상기 냉각수 급수라인에 마련된 유량조절밸브를 조절하여 급수량을 조절하는 유량조절단계를 포함하는 것을 특징으로 한다. And, the cooling water supply step is supplied with cooling water for cooling the chamber of the semiconductor manufacturing equipment through the cooling water supply line; A cooling step of cooling the chamber by cooling water supplied through the cooling water supply line; A return step in which the coolant that cools the chamber is returned through a coolant return line; A flow rate measuring step of measuring a flow rate of the cooling water returned through the cooling water return line; And a flow rate adjusting step of adjusting a water supply amount by adjusting a flow rate control valve provided in the cooling water supply line by comparing the flow rate measurement value of the cooling water return line with a set value.

여기서, 상기 유량측정단계 이후, 상기 냉각수 환수라인에서 측정되는 측정값 및 상기 유량조절밸브의 개폐량을 표시하는 표시단계가 더 포함되는 것이 바람직하다. Here, after the flow rate measuring step, it is preferable to further include a display step of displaying the measured value measured in the cooling water return line and the opening and closing amount of the flow control valve.

또한, 상기 유량측정단계 이후, 상기 냉각수 환수라인에서 측정되는 측정값이 설정된 비교값에 대하여 상이할 경우 경고음을 발신하는 발신단계가 더 포함되는 것이 바람직하다.In addition, after the flow rate measuring step, it is preferable to further include a transmitting step for transmitting a warning sound when the measured value measured in the cooling water return line is different with respect to the set comparison value.

이하, 첨부된 도면을 참조하여 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템 및 이를 이용한 냉각방법을 상세히 설명한다. Hereinafter, with reference to the accompanying drawings will be described in detail the cooling water control system and the cooling method using the same in the semiconductor manufacturing equipment according to the present invention.

본 발명을 설명함에 있어서, 정의되는 용어들은 본 발명에서의 기능을 고려하여 정의 내려진 것으로, 이는 당 분야에 종사하는 기술자의 의도 또는 관례 등에 따라 달라질 수 있으므로, 본 발명의 기술적 구성요소를 한정하는 의미로 이해되어서는 아니 될 것이다.In the description of the present invention, terms defined are defined in consideration of functions in the present invention, which may vary according to the intention or custom of a person skilled in the art, and thus, limit the technical components of the present invention. It should not be understood as.

도 2는 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템을 나타낸 구성도이이고, 도 3은 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템을 나타낸 블록도이다. 2 is a block diagram showing a cooling water control system of the semiconductor manufacturing equipment according to the present invention, Figure 3 is a block diagram showing a cooling water control system of the semiconductor manufacturing equipment according to the present invention.                     

도시한 바와 같이 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템은, 반도체 제조설비(1)와 반도체 제조설비(1)에서 웨이퍼의 제조공정이 진행되는 챔버(2)가 마련되며, 웨이퍼 제조공정을 진행하는 챔버(2)로 냉각수를 공급하는 냉각수급수라인(120)과, 챔버(2)를 냉각시킨 냉각수가 환수되는 냉각수 환수라인(140)이 마련된다. As shown, the cooling water control system of the semiconductor manufacturing equipment according to the present invention is provided with a chamber (2) through which the wafer manufacturing process is performed in the semiconductor manufacturing equipment (1) and the semiconductor manufacturing equipment (1). The cooling water supply line 120 for supplying the cooling water to the chamber 2 that proceeds, and the cooling water return line 140 for returning the cooling water for cooling the chamber 2 are provided.

여기서, 냉각수 급수라인(120)의 소정부에는 냉각수 급수라인(120)으로 공급되는 냉각수의 유량을 조절하기 위한 유량조절밸브(122)가 마련되며, 유량조절밸브(122)는 외부의 전기적 신호에 따라 통과되는 유량을 조절할 수 있는 솔레노이드 컨트롤 밸브(solenoid control valve)로 마련되는 것이 바람직하며, 그리고, 냉각수 환수라인(140)의 소정부에는 냉각수 환수라인(140)으로 환수되는 냉각수의 유량을 감지하는 유량감지센서(142)가 마련된다.Here, a predetermined portion of the cooling water supply line 120 is provided with a flow control valve 122 for adjusting the flow rate of the cooling water supplied to the cooling water supply line 120, the flow control valve 122 is applied to the external electrical signal It is preferable to be provided with a solenoid control valve (solenoid control valve) that can be adjusted according to the flow rate, and, in a predetermined portion of the coolant return line 140 to detect the flow rate of the coolant returned to the coolant return line (140) The flow rate sensor 142 is provided.

또한, 냉각수 환수라인(140)으로 환수되는 냉각수의 유량을 감지하는 유량감지센서(142)의 감지값에 따라 유량제어밸브(122)의 개폐량을 조절하는 제어부(130)가 마련되며, 제어부(130)에는 유량제어밸브(122)의 개폐량 및 유량감지센서(142)의 감지량을 디스플레이 하는 표시부(미도시)와, 유량감지센서(142)에서 감지되는 감지량이 설정치를 초과하거나, 미달되었을 경우 경고음을 발생하여 작업자가 인지하도록 하는 발신부(132)가 더 마련될 수 있다. In addition, the controller 130 is provided to adjust the opening and closing amount of the flow control valve 122 according to the detection value of the flow rate sensor 142 for detecting the flow rate of the coolant returned to the coolant return line 140, the control unit ( 130 is a display unit (not shown) for displaying the opening and closing amount of the flow control valve 122 and the detection amount of the flow rate sensor 142, and the amount of detection detected by the flow rate sensor 142 exceeds or falls below the set value. In this case, the transmitter 132 may be further provided to generate a warning sound so as to recognize the worker.

이에 따라, 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템의 작동을 첨부한 도면을 참조하여 상세히 설명한다. Accordingly, the operation of the cooling water control system of the semiconductor manufacturing equipment according to the present invention will be described in detail with reference to the accompanying drawings.

도 4는 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템의 작동을 나타 낸 순서도이다.Figure 4 is a flow chart showing the operation of the cooling water control system of the semiconductor manufacturing equipment according to the present invention.

먼저, 반도체제조설비(1)의 챔버(2)를 냉각시키기 위하여 냉각수 급수라인(120)으로 냉각수가 공급되며(단계 S100), 냉각수 급수라인(120)으로 공급되는 냉각수는 반도체 제조설비(1)의 챔버(2)를 통과하면 챔버(2)를 냉각시킨다(단계 S110).First, the cooling water is supplied to the cooling water supply line 120 to cool the chamber 2 of the semiconductor manufacturing equipment 1 (step S100), and the cooling water supplied to the cooling water supply line 120 is the semiconductor manufacturing equipment 1. After passing through the chamber 2, the chamber 2 is cooled (step S110).

이후, 반도체 제조설비(1)의 챔버(2)를 냉각시킨 냉각수는 냉각수 환수라인(140)을 통하여 환수되며(단계 S120), 냉각수 환수라인(140)으로 환수되는 냉각수는 냉각수 환수라인(140)에 마련된 유량감지센서(142)에 의해 그 유량이 측정된다(단계 S130). Thereafter, the cooling water that cools the chamber 2 of the semiconductor manufacturing equipment 1 is returned through the cooling water return line 140 (step S120), and the cooling water returned to the cooling water return line 140 is the cooling water return line 140. The flow rate is measured by the flow rate sensor 142 provided at (step S130).

이때, 제어부(130)는 유량감지센서(142)에 감지되는 감지량을 수신하여 감지되는 유량에 따라 냉각수 급수라인(120)의 유량조절밸브(122)를 조절하여 냉각수 급수라인(120)을 통하여 반도체 제조설비(1)의 챔버(2)로 공급되는 냉각수의 유량을 제어한다(단계 S140). At this time, the control unit 130 receives the detection amount detected by the flow rate sensor 142 and adjusts the flow rate control valve 122 of the coolant water supply line 120 according to the detected flow rate through the coolant water supply line 120 The flow rate of the cooling water supplied to the chamber 2 of the semiconductor manufacturing equipment 1 is controlled (step S140).

즉, 반도체 제조설비(1)의 챔버(2)를 냉각하고 냉각수 환수라인(140)으로 환수되는 냉각수의 유량이 제어부(130)에 설정된 양보다 크거나 작은 경우 냉각수 급수라인(120)에 마련된 유량조절밸브(122)를 조절하여 냉각수 급수라인(120)을 통하여 반도체 제조설비(1)의 챔버(2)로 공급되는 냉각수의 유량을 조절한다. That is, the flow rate provided in the cooling water supply line 120 when the flow rate of the cooling water that cools the chamber 2 of the semiconductor manufacturing equipment 1 and returns to the cooling water return line 140 is greater than or less than the amount set in the controller 130. The control valve 122 is adjusted to control the flow rate of the cooling water supplied to the chamber 2 of the semiconductor manufacturing equipment 1 through the cooling water supply line 120.

여기서, 제어부(130)는 유량제어밸브(122)의 개폐량 및 유량감지센서(142)의 감지량을 표시부에 디스플레이하며, 또한, 유량감지센서(142)에서 감지되는 감지량이 설정치를 초과하거나, 미달되었을 경우 작업자가 이를 인지하도록 하는 발신부 (132)를 통하여 경고음을 발생시킨다. Here, the control unit 130 displays the opening and closing amount of the flow control valve 122 and the detection amount of the flow rate sensor 142 on the display unit, the detection amount detected by the flow rate sensor 142 exceeds the set value, If not, a warning sound is generated through the transmitter 132 to allow the operator to recognize it.

이상에서 살펴본 바와 같이 본 발명의 바람직한 실시예에 대해 상세히 기술되었지만, 본 발명이 속하는 기술분야에 있어서 통상의 지식을 가진 사람이라면, 첨부된 청구 범위에 정의된 본 발명의 정신 및 범위를 벗어나지 않으면서 본 발명을 여러 가지로 변형하여 실시할 수 있을 것이다. 따라서 본 발명의 앞으로의 실시예들의 변경은 본 발명의 기술을 벗어날 수 없을 것이다.
Although described in detail with respect to preferred embodiments of the present invention as described above, those of ordinary skill in the art, without departing from the spirit and scope of the invention as defined in the appended claims Various modifications may be made to the invention. Therefore, changes in the future embodiments of the present invention will not be able to escape the technology of the present invention.

이상에서 살펴본 바와 같이, 본 발명에 따른 반도체 제조설비의 냉각수 조절시스템 및 이를 이용한 냉각방법에 따르면, 반도체 제조설비를 냉각시키고 환수되는 냉각수의 유량을 항시 감지하여 공급되는 냉각수의 유량을 조절할 수 있어 작업자의 미조작 또는 착오로 인한 반도체 제조설비의 온도 상승을 예방하여 반도체 제조설비의 안정적인 동작을 유지할 수 있는 효과가 있다.As described above, according to the cooling water control system and the cooling method using the same of the semiconductor manufacturing equipment according to the present invention, by cooling the semiconductor manufacturing equipment and can always adjust the flow rate of the cooling water supplied by sensing the flow rate of the cooling water returned It is possible to prevent the temperature rise of the semiconductor manufacturing equipment due to misoperation or aberration, thereby maintaining stable operation of the semiconductor manufacturing equipment.

Claims (7)

반도체 제조공정이 진행되는 챔버가 마련되는 반도체 제조설비와;A semiconductor manufacturing facility having a chamber in which a semiconductor manufacturing process is performed; 상기 챔버를 냉각시키기 위한 냉각수를 공급하고, 공급되는 냉각수의 유량을 조절하기 위한 유량조절밸브가 마련되는 냉각수 급수라인과;A cooling water supply line for supplying cooling water for cooling the chamber and provided with a flow control valve for controlling a flow rate of the supplied cooling water; 상기 챔버를 냉각시킨 냉각수가 환수되고, 환수되는 냉각수의 유량을 감지하는 유량감지센서가 마련되는 냉각수 환수라인과;A cooling water return line provided with a flow rate sensor for detecting a flow rate of the cooling water returned by the cooling water cooling the chamber; 상기 유량감지센서에서 감지되는 측정치와 설정치를 비교하여 상기 냉각수 급수라인의 상기 유량조절밸브를 제어하는 제어부가 마련되는 것을 특징으로 하는 반도체 제조설비의 냉각수 조절시스템.Cooling water control system of the semiconductor manufacturing equipment, characterized in that the control unit for controlling the flow control valve of the cooling water supply line by comparing the measured value and the set value detected by the flow rate sensor. 제 1항에 있어서, 상기 유량조절밸브는,According to claim 1, wherein the flow control valve, 상기 제어부의 전기적 신호에 따라 상기 냉각수가 공급되는 유로를 개폐하는 솔레노이드 컨트롤 밸브로 마련되는 것을 특징으로 하는 반도체 제조설비의 냉각수 조절시스템.Cooling water control system of the semiconductor manufacturing equipment, characterized in that provided with a solenoid control valve for opening and closing the flow path supplied with the cooling water in accordance with the electrical signal of the controller. 제 1항에 있어서, 상기 제어부는,The method of claim 1, wherein the control unit, 상기 유량제어밸브의 개폐량 및 유량감지센서의 감지량을 디스플레이 하는 표시부가 더 마련되는 것을 특징으로 하는 반도체 제조설비의 냉각수 조절시스템.Cooling water control system of the semiconductor manufacturing equipment, characterized in that the display unit for displaying the opening and closing amount of the flow control valve and the detection amount of the flow rate sensor is further provided. 제 1항에 있어서, 상기 제어부는 The method of claim 1, wherein the control unit 상기 유량감지센서에서 감지되는 감지량이 상기 제어부의 설정치를 초과 또는 미달되었을 경우 경고음을 발생하는 발신부가 더 마련되는 것을 특징으로 하는 반도체 제조설비의 냉각수 조절시스템.Cooling water control system of the semiconductor manufacturing equipment, characterized in that the transmitter is further provided for generating a warning sound when the detected amount detected by the flow rate sensor exceeds or falls below the set value of the controller. 냉각수 급수라인을 통하여 반도체 제조설비의 챔버를 냉각시키기 위한 냉각수가 공급되는 냉각수공급단계;A cooling water supply step of supplying cooling water for cooling the chamber of the semiconductor manufacturing equipment through the cooling water supply line; 상기 냉각수 급수라인을 통해 공급되는 냉각수가 상기 챔버를 냉각시키는 냉각단계;A cooling step of cooling the chamber by the cooling water supplied through the cooling water supply line; 상기 챔버를 냉각시킨 냉각수가 냉각수 환수라인을 통해 환수되는 환수단계;A return step in which the coolant that cools the chamber is returned through a coolant return line; 상기 냉각수 환수라인을 통해 환수되는 냉각수의 유량을 측정하는 유량측정단계;A flow rate measuring step of measuring a flow rate of the cooling water returned through the cooling water return line; 상기 냉각수 환수라인의 유량측정값과, 설정된 값을 비교하여 상기 냉각수 급수라인에 마련된 유량조절밸브를 조절하여 급수량을 조절하는 유량조절단계를 포함하는 것을 특징으로 하는 반도체 제조설비의 냉각수 조절시스템을 이용한 냉각방법.Using the cooling water control system of the semiconductor manufacturing equipment, comprising a flow rate adjusting step of adjusting the flow rate by adjusting the flow rate control valve provided in the cooling water supply line by comparing the flow rate measurement value and the set value of the cooling water return line Cooling method. 제 5항에 있어서, The method of claim 5, 상기 유량측정단계 이후, 상기 냉각수 환수라인에서 측정되는 측정값 및 상기 유량조절밸브의 개폐량을 표시하는 표시단계가 더 포함되는 것을 특징으로 하는 반도체 제조설비의 냉각수 조절시스템을 이용한 냉각방법.After the flow rate measuring step, the display method for displaying the measured value measured in the cooling water return line and the opening and closing amount of the flow control valve further comprises a cooling water control system of the semiconductor manufacturing equipment. 제 5항에 있어서, The method of claim 5, 상기 유량측정단계 이후, 상기 냉각수 환수라인에서 측정되는 측정값이 설정된 비교값에 대하여 상이할 경우 경고음을 발신하는 발신단계가 더 포함되는 것을 특징으로 하는 반도체 제조설비의 냉각수 조절시스템을 이용한 냉각방법.After the flow rate measuring step, the cooling method using a cooling water control system of the semiconductor manufacturing equipment, characterized in that further comprising the step of transmitting a warning sound if the measured value measured in the cooling water return line is different from the set comparison value.
KR1020040106654A 2004-12-15 2004-12-15 Cooling water control system of semiconductor product device and method for refrigeration by use same KR20060067753A (en)

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