KR20060027101A - Optical tranceiver module and a method for manufacturing the same - Google Patents

Abstract

The present invention relates to a three-wavelength optical transmission and reception module and a manufacturing method thereof, and more particularly, a PLC optical device in which a predetermined optical waveguide part is formed and a light emitting device is mounted, and a predetermined optical fiber is coupled to and fixed to an upper portion of the PLC optical device. By hybrid integration of an optical fiber block, a thin film filter unit for separating an optical wavelength attached and input to one side of the PLC optical element, and a sub-mount unit on which the plurality of PD carriers to which the PLC optical element and the photodiode are mounted are mounted, It is effective to mass-produce optical transceiver module at low price.

Optical transceiver module, PLC optical element, thin film filter unit, branched optical waveguide, directional coupler, sub-mount unit, light emitting element, photodiode

Description

Optical wavelength module and a method for manufacturing the same

1 is a perspective view of a portion separated to illustrate a three-wavelength optical transmission and reception module according to an embodiment of the present invention.

2 is an enlarged perspective view for explaining a portion in which a PD carrier is mounted in a submount part applied to an embodiment of the present invention;

3 is an exploded perspective view for explaining a portion in which a light emitting device is mounted on a PLC optical device applied to an embodiment of the present invention.

4A and 4B are cross-sectional views illustrating a state in which an optical fiber block and a PLC optical device are coupled to each other according to an embodiment of the present invention, and FIG. 4A is a cross-sectional view illustrating a coupling state of the optical fiber block having a trapezoidal column-shaped protrusion and a PLC optical device. 4B is a cross-sectional view illustrating a coupling state of an optical fiber block having a rectangular pillar-shaped protrusion and a PLC optical device.

*** Explanation of symbols on main parts of drawing ***

100: PLC optical element, 110: silicon substrate,

120: cladding unit, 120a, 120b: upper and lower cladding layer,

121: mounting groove, 122: guide groove,

123: Cr / Ni / Au electrode, 124,425: solder,

130: light emitting element, 140: branched optical waveguide,

150: directional coupler, 160: first multimode optical waveguide,

170: second multimode optical waveguide, 200: optical fiber block,

210: body portion, 220: optical fiber,

230: coupling groove, 240,240 ': protrusion,

300: thin film filter portion, 400: sub-mount portion,

410: quartz substrate, 420a ~ 420c: light receiving unit,

421: digital photodiode, 422a to 422c: PD carrier,

423a ~ 423c: mounting trench, 424a ~ 424c, 426: electrode,

427: wire bonding, 500: preamplifier

The present invention relates to a three-wavelength optical transmission and reception module and a method of manufacturing the same, and more particularly, a plurality of PDs having photodiodes in a PLC optical device in which a light emitting device, an optical waveguide part, an optical fiber block having a predetermined optical fiber, and a thin film filter part are mounted. The present invention relates to an optical transmission / reception module capable of mass-producing an optical transmission / reception module at a low price by hybrid integration in a sub-mount portion in which a carrier is mounted, and a manufacturing method thereof.

In general, as the optical communication system mainly used in the backbone network is expanded to the subscriber network, the demand for various optical modules required for the subscriber network is increasing rapidly.

In particular, in the case of optical transceiver modules installed in subscribers such as a bi-directional optical transceiver module or an optical triplexer transceiver module, low price and mass production are the most important factors in determining competitiveness. to be.

Therefore, an optical integrated module technology is developed to simultaneously hybridize active devices such as an optical waveguide device, a thin film filter, a laser diode (LD), and a photo diode (PD) to manufacture a high-performance, low-cost optical module. have.

In the conventional hybrid optical integrated module technology, as a method for fabricating a three-wavelength optical transmission / reception module, a thin film is formed by forming two grooves having a thickness of about 30 μm in an optical device of a planar lightwave circuit (PLC). By inserting the filter, we realize wavelength multiplexing device to separate 1310/1490 / 1550nm wavelength, and active flip chip bonding of active devices such as laser diode (LD) and photodiode (PD) to silica platform It shows how to install it.

However, there is a problem that the loss of reflected light in the above-described prior art varies greatly depending on the degree of insertion of the thin film filter. That is, it is difficult to form the groove into which the thin film filter is inserted, evenly in the depth direction while having a narrow width at the correct position. When the thin film filter is inserted into the groove and fixed with the refractive index matching epoxy, a tilt phenomenon occurs. This is because light is not incident correctly on the side of the reflected optical waveguide.

Therefore, it is difficult to reduce the light loss reflected by the thin film filter to about 1dB, which is disadvantageous to low cost as a factor that lowers the yield in mass production.

In addition, in the conventional technology, an expensive flip chip bonding device should be used to secure alignment accuracy within ~ µm when mounting active devices such as the laser diode (LD) or photodiode (PD), and directly to the PLC optical device. Pigtailing a given optical fiber by forming a V-shaped groove is a very difficult process and is not suitable for mass production.

Therefore, the method of fixing the thin film filter to the PLC optical device more easily, mounting active devices using low-cost alignment equipment, and manually sorting and pigtailing optical fibers in a manner that does not lower the overall product yield is proposed. It can only lead to mass production and commercialization.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a light emitting device, an optical waveguide part, a optical fiber block having a predetermined optical fiber, and a PLC optical device in which a thin film filter is mounted. The present invention provides a three-wavelength optical transmission / reception module and a manufacturing method thereof capable of mass-producing an optical transmission / reception module at low cost by hybrid integration in a sub-mount portion in which a carrier is mounted.

One aspect of the present invention to achieve the above object is a PLC optical element is formed a predetermined optical waveguide portion, the light emitting element is mounted; An optical fiber block coupled to an upper portion of the PLC optical element and having a predetermined optical fiber fixed thereto; A thin film filter unit attached to one side of the PLC optical device and configured to separate an input wavelength of the optical device; And a sub-mount part in which the plurality of PD carriers to which the PLC optical element and the photodiode are attached are mounted.

Another aspect of the invention, (a) forming a branched optical waveguide and a directional coupler on the upper portion of the substrate, forming a PLC optical element mounted with a light emitting element on one side of the substrate; (b) manually aligning and mounting an optical fiber block having a predetermined optical fiber fixed on the PLC optical device; (c) providing a thin film filter to separate the optical wavelength input to one side of the PLC optical device; And (d) mounting the PLC optical device on an upper surface thereof, and forming a sub-mount part for mounting a plurality of light receiving parts to receive light output through the branched optical waveguide and the directional coupler. It is to provide a method of manufacturing a transceiver module.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention illustrated below may be modified in many different forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

1 is a perspective view of a part separated to explain the optical transmission and reception module according to an embodiment of the present invention, Figure 2 is a view for explaining a portion in which the PD carrier is mounted to the sub-mount applied to an embodiment of the present invention 3 is an enlarged perspective view, and FIG. 3 is a separation attempt for explaining a portion in which a light emitting device is mounted on a PLC optical device applied to an embodiment of the present invention.

1 to 3, an optical transceiver module according to an embodiment of the present invention includes a PLC optical device 100, an optical fiber block 200, a thin film filter unit 300, and a sub-mount unit 400. It is done by

In the above-described configuration, the PLC optical device 100 is made of a predetermined silicon substrate 110 and a cladding portion 120 formed on the upper surface of the silicon substrate 110, the cladding portion 120 is a predetermined thickness Upper and lower cladding layers 120a and 120b (see FIGS. 4A and 4B).

In addition, a predetermined mounting groove 121 is formed on one side of the clad unit 120 so that a predetermined light emitting device 130 is mounted, and a predetermined guide groove 122 to enable the optical fiber block 200 to be coupled thereto. ) Is formed, and a predetermined optical waveguide part, that is, a branched optical waveguide 140 and a directional coupler 150, which is a single mode optical waveguide, are formed on the clad part 120.

In addition, a first multi-mode optical waveguide 160 is formed at an upper side of the cladding unit 120 to effectively receive the light output from the other side (back side) of the light emitting device 130. The second multi-mode light may be reduced so that the light reflected from the 300 may be reduced and the light reflected from the thin film filter 300 may be received by the light receiver 410c mounted in the sub-mount 400. The waveguide 170 is formed.

Here, the light emitting device 130 is preferably implemented with a laser diode, for example, SC-SSLD, which outputs light having a wavelength of about 1310 nm.

In addition, the branched optical waveguide 140 is composed of a Y-shaped single-mode optical waveguide, from one side (front) of the light emitting device 130 and from the optical fiber 220 fixed to the optical fiber block 200. It performs a function of branching and transmitting the transmitted light in a plurality of directions. In this case, each end of the Y-shape is connected to one side of the light emitting device 130, the thin film filter unit 300 and the optical fiber 220, and the directional coupler 150 at the intersection of the Y-shape Is preferably connected.

In addition, the directional coupler 150 is connected to the branched optical waveguide 140, that is, the intersection of the Y-shaped, and the function of separating according to the wavelength of the light transmitted through the branched optical waveguide 140. Perform.

That is, the directional coupler 150 is a light transmitted from one side of the light emitting device 130, for example, light of 1310nm wavelength is transmitted through the branched optical waveguide 140 to cross-couple (cross), the optical fiber Light transmitted from 220, for example, light having a wavelength of 1490/1550 nm is transmitted through the branched optical waveguide 140 to perform through coupling.

Meanwhile, the directional coupler 150 preferably uses a single mode optical waveguide core having a difference in refractive index of 1.5% ?? and a width and height of 4.5 μm in order to reduce the radius of curvature and the size of the device.

The optical fiber block 200 is formed of a plate-shaped body portion 210, the V-shaped coupling groove 230 is formed on one side of the body portion 210 so that the optical fiber 220 is inserted and fixed A pair of protrusions 240 are formed in the longitudinal direction to be inserted into the guide grooves 122 formed in the PLC optical device 100 at both sides of the coupling groove 230.

The protrusion 240 is preferably made of a trapezoidal or rectangular columnar shape, but is not limited thereto, and may be formed in a semicircular or polygonal columnar shape.

The thin film filter unit 300 is attached to one side of the PLC optical device 100 and performs a function of separating according to the input light, for example, a wavelength of 1310/1490 / 1550nm. That is, the thin film filter unit 300 is a dielectric thin film filter of 1490 nm, transmits light of 1490 nm wavelength and reflects light of 1550 nm wavelength. In addition, the thin film filter unit 300 may reflect light having a wavelength of 1310 nm.

The submount unit 400 is formed of a quartz substrate having a predetermined thickness, and is used to fix the PLC optical device 100 and the plurality of light receiving units 420a to 420c. The PLC optical device 100 is mounted, and a predetermined mounting trench 423a to 423c for mounting the plurality of light receiving units 420a to 420c is formed on one side thereof.

In this case, the light receivers 420a to 420c output light through the branched optical waveguide 140 and the directional coupler 150 from the other side of the light emitting device 130 and the optical fiber 220. For receiving light, a PD with a monitoring photo diode (not shown), a digital photo diode 421 and an analog photo diode (not shown), respectively, is attached. It consists of carriers 422a-422c.

The monitor photodiode is mounted to receive the light transmitted from the other side of the light emitting device 130 through the first multi-mode optical waveguide 160 formed on the PLC optical device 100, the digital photodiode The 421 is mounted to receive the light transmitted from the thin film filter unit 300, and the analog photodiode is formed by the light reflected from the thin film filter unit 300 formed on the PLC optical device 100. 2 is mounted to receive and receive through the multi-mode optical waveguide 170.

Here, the monitor photodiode and the analog photodiode are not shown in the figure, but are mounted under the same conditions as the digital photodiode 421.

On the other hand, the pre-amplifier 500 is further included in the upper portion of the sub-mount unit 400 so as to be positioned near the light receiving units 420a to 420c to increase the reception sensitivity of the light receiving units 420a to 420c. Do.

Hereinafter, the operation principle and manufacturing method of the three-wavelength optical transceiver module according to an embodiment of the present invention having the above-described configuration will be described in detail.

Referring to the operation principle of the three-wavelength optical transmission and reception module according to an embodiment of the present invention with reference to Figure 1, the light of the 1310nm wavelength output from the light emitting device 130 is transmitted through the branched optical waveguide 140 The cross coupling is output from the directional coupler 150, and the light having a wavelength of 1490/1550 nm input from the optical fiber 220 passes through the directional coupler 150.

The transmitted light having a wavelength of 1550 nm is reflected by the thin film filter unit 300 and received through the second multimode optical waveguide 170 to the PD carrier 422c to which the analog photodiode is attached, and has a wavelength of 1490 nm. The light is transmitted through the thin film filter unit 300 and received by the PD carrier 422b to which the digital photodiode 421 is attached.

Referring to FIGS. 1 to 3, a method of manufacturing an optical transmission / reception module according to an embodiment of the present invention is as follows. First, upper and lower clad layers 120a and 120b (see FIGS. 4A and 4B) having a predetermined thickness, on which the branched optical waveguide 140 and the directional coupler 150 are formed, are formed on an upper surface of the silicon substrate 110. Afterwards, a predetermined mounting groove 121 is formed on, for example, dry etching on the upper and lower clad layers 120a and 120b.

After depositing a predetermined Cr / Ni / Au electrode 123 and a solder 124 on the bottom surface of the mounting groove 121 by e-beam evaporation, for example, a photolithography method The optical device 100 is manufactured by patterning through photolithography.

In this case, various materials such as Au-Sn, Pb-Sn, and Pb-In may be used as the material of the solder 124. In particular, in the case of using a conventional Pb-Sn solder jetting method, the electron beam may be used. Since a large amount of Au (gold) does not have to be consumed by the evaporation method, it is advantageous to manufacture a low-cost optical module.

Next, after dicing the manufactured PLC optical device 100 to a desired size, the light emitting device 130 having a chip size precisely adjusted to ± 1 μm, for example, a mode size conversion laser diode SC-SSLD Inserted and die-bonded to the mounting groove 121 is mounted so as to minimize the coupling loss with the branched optical waveguide 140 formed on the PLC optical device (100).

In this case, the mounting groove 121 is preferably processed with a margin of about ± 1㎛ the width and length so that the light emitting device 130 can be inserted.

In addition, for example, refractive index matching may be performed on one side of the PLC optical device 100, that is, the edge portion where the branched optical waveguide 140 and the second multimode optical waveguide 170 cross each other. Attach using epoxy.

In addition, a predetermined guide groove 122 is formed through, for example, a dry etching method so that the protrusion 240 of the optical fiber block 200 is coupled to the upper and lower clad layers 120a and 120b. After that, the optical fiber block 200 to which the optical fiber 220 is fixed is mounted on the PLC optical device 100 by manual alignment. In addition, since the guide groove 122 may be formed at the same time when the mounting groove 121 is formed, an additional process is not required.

At this time, the optical fiber block 200 is formed after the plate-shaped body portion 210, the V-shaped coupling groove for fixing a portion of the optical fiber 220 on one side of the body portion 210 ( 230 is formed in the guide groove 122 formed in the PLC optical device 100 on one side of the body portion 210 to both sides of the coupling groove 230 to manually align the optical fiber 220 A pair of protrusions 240 are formed to be coupled.

In addition, when the protrusion 240 is coupled to the guide groove 122, the cross section of the optical fiber 220 is completely in close contact with the cross section of the split optical waveguide 140 formed in the PLC optical device 100 (Butt-Coupling). Pig-Tailing is preferred, for example using a refractive index matching epoxy.

In addition, the optical fiber block 200, in particular, the protrusion 240 is formed by selectively using any one of silicon anisotropic etching, dry etching or hot-embossing technique, precisely controlled dimensions The optical fiber block 200 can be mass-produced at a low price.

Next, a submount unit 400 for mounting the PLC optical device 100 and the plurality of light receiving units 420a to 420c is manufactured. That is, the sub-mount unit 400 attaches the PLC optical device 100 using, for example, conductive epoxy on the quartz substrate 410, and then, the quartz substrate ( For example, a plurality of mounting trenches 423a to 423c on which the light receiving units 420a to 420c are to be mounted are formed on one side of the upper portion of the upper portion 410.

In addition, after depositing predetermined electrodes 424a to 424c and solder 425 on the mounting trenches 423a to 423c, for example, by electron beam deposition or Pb-Sn solder jetting, for example, by photolithography. Pattern and cut precisely. At this time, the solder 425 is preferably formed to be melted at a low temperature of about 150 ℃.

On the other hand, although not shown on the reference drawings of the present invention, a predetermined solder is deposited on the mounting trenches 423a and 423c under the same conditions as the solder 425 deposited on the mounting trench 423b. .

In addition, when the sub-mount unit 400 is manufactured, a plurality of light receiving units 420a to 420c mounted on the mounting trenches 423a to 423c are manufactured in the same manner. That is, the light receivers 420a to 420c form PD carriers 422a to 422c made of a predetermined quartz substrate. One side of the PD carriers 422a to 422c is formed by, for example, electron beam deposition. After forming the electrode 426 to form a predetermined pattern, it is processed to be inserted into the mounting trench (423a ~ 423c).

On the other hand, although not shown in the reference drawings of the present invention, predetermined electrodes are formed on the PD carriers 422a and 422c under the same conditions as the predetermined electrodes 426 deposited on the PD carrier 422b.

Next, a monitor photodiode (not shown), a digital photodiode 421, and an analog photodiode (not shown) having a light receiving portion diameter of about 80 μm are formed on the manufactured PD carriers 422a to 422c. Positioned so as to be perpendicular to the center of the core of the branched optical waveguide 140 in the corner portion of the device 100, die-bonded using, for example, a conductive epoxy, the anode of each photodiode The electrode and the electrodes 426 formed on the PD carriers 422a to 422c are connected to each other by wire bonding 427.

Subsequently, the PD carriers 422a to 422c to which each photodiode is attached are positioned in the submount unit 400 as shown in FIG. 2, and then die-bonded in a state where a predetermined heat is applied to the submount unit 400. And electrodes 426 formed on the PD carriers 422a to 422c are vertically connected to each other.

In addition, by inserting and curing a refractive index matching epoxy between the PD carriers 422a to 422c and the branched optical waveguide 140, the response sensitivity of the light receiving units 420a to 420c is increased. The adhesion strength of the PD carriers 422a to 422c may be reinforced.

Meanwhile, the material of the sub-mount unit 400 and the PD carriers 422a to 422c may be a quartz substrate, an alumina, a silicon substrate deposited with silica or a polymer material, a thermosetting plastic, or a high frequency loss and dielectric constant, and have low processability. It is preferably made of any one of the substrates formed of this material.

In addition, a pre-amp for increasing reception sensitivity of the light receivers 420a to 420c on the sub-mount unit 400 to be positioned near the light receivers 420a to 420c. ) 500 may be further installed.

Meanwhile, the mounting trenches 423a to 423c formed in the submount unit 400 may not be processed as necessary. That is, the PD carriers 422a to 422c are precisely cut to maintain a constant width, and marks are formed when the electrodes are formed to recognize the center and the width in the PD carriers 422a to 422c in the horizontal direction. The PD carriers 422a to 422a are formed by forming an alignment mark on the edge surface of the PLC optical device 100 to display the width and the center of the PD carrier in the horizontal direction using electrodes based on the branched optical waveguide 140. When the die bonding of 422c is performed, the alignment marks 423a to 423c may not be formed in the submount unit 400, and the alignment marks may be matched with each other to be accurately mounted in the horizontal direction.

4A and 4B are cross-sectional views illustrating a state in which an optical fiber block and a PLC optical device are coupled to each other according to an embodiment of the present invention, and FIG. 4A is a cross-sectional view illustrating a coupling state of an optical fiber block and a PLC optical device having a trapezoidal columnar protrusion. 4B is a cross-sectional view illustrating a coupling state of an optical fiber block having a rectangular columnar protrusion and a PLC optical device.

Referring to FIG. 4A, a structure in which a trapezoidal pillar-shaped protrusion 240 having a predetermined inclination angle is formed on one side of the optical fiber block 200 and inserted into a guide groove 122 formed in the PLC optical device 100. As an example, a V-shaped coupling groove 230 for inserting and fixing the optical fiber 220 and a trapezoidal columnar protrusion 240 for vertical / horizontal alignment are formed using silicon anisotropic etching.

If the height of the trapezoidal columnar protrusion 240 is formed lower than the depth of the guide groove 122 formed in the PLC optical device 100 is aligned in the horizontal direction, the upper cladding layer of the PLC optical device 100 The vertical direction accuracy of the core of the optical fiber 220 and the core of the single mode optical waveguide, that is, the core of the branched optical waveguide 140 is determined by the thickness of 120a. Therefore, it is preferable to adjust the thickness of the upper clad layer 120a to about ~ 1㎛.

Referring to FIG. 4B, a rectangular column-shaped protrusion 240 ′ is formed on one side of the optical fiber block 200 and inserted into the guide groove 122 formed in the PLC optical device 100. For example, after processing a vertical rectangular columnar protrusion 240 'by using an inductive coupled plasma (ICP) dry etching method, a V-shaped to insert and fix the optical fiber 220 using the silicon anisotropic etching method is used. Form a coupling groove 230 of the shape.

The core of the optical fiber 220 is formed by the height of the rectangular pillar-shaped protrusion 240 ′ and the thickness of the lower clad layer 120b remaining on the bottom of the guide groove 122 formed in the PLC optical device 100. The vertical alignment of the core and the single mode optical waveguide, that is, the core of the branched optical waveguide 140 is determined.

Further, the width of the guide groove 122 is processed to be ± 1 μm larger than the width of the square pillar-shaped protrusion 240 ′ so that the square pillar-shaped protrusion 240 ′ may be inserted into the guide groove 122. Since it should be, the accuracy in the horizontal direction is determined by the width of the guide groove 122.

Although a preferred embodiment of the above-described tri-wavelength optical transmission / reception module and a method of manufacturing the same according to the present invention has been described, the present invention is not limited thereto, but the scope of the claims and the detailed description of the invention and the accompanying drawings are various. It is possible to carry out modifications and this also belongs to the present invention.

According to the three-wavelength optical transmitting and receiving module of the present invention as described above and a method for manufacturing the same, a predetermined optical waveguide portion is formed, a PLC optical element on which a light emitting element is mounted, and a predetermined optical fiber coupled to an upper portion of the PLC optical element By hybridizing the optical fiber block to be fixed, a thin film filter unit attached to one side of the PLC optical element, for separating according to the wavelength of the input light, and a sub-mount unit on which the PLC optical element and the plurality of light receiving units are mounted, There is an advantage that mass production of the transmission and reception module at a low price.

In addition, according to the present invention, by precisely adjusting the size of the optical active device, that is, the light emitting device, and then aligned and die-bonded by inserting into the mounting groove formed in the PLC optical device, expensive alignment equipment is not required. The technology has the advantage of reducing the costly process, such as the flip chip process for aligning the optical device with precision within ~ ㎛.

In addition, according to the present invention, when forming the solder in the mounting groove formed in the PLC optical device by using a conventional Pb-Sn solder jetting method when mounting the electronic device, a large amount of Au (gold) is not consumed by electron beam deposition Therefore, there is an advantage in manufacturing a low-cost optical module.

In addition, according to the present invention, unlike the prior art that forms a groove for inserting the thin film filter portion in the PLC optical device and inserts the dielectric thin film filter when manufacturing the optical transceiver module, by forming a directional coupler to form the thin film filter portion of the PLC optical device By providing a structure that can be easily attached to the corner portion, there is an advantage that can enable mass production and low cost.

In addition, according to the present invention, by attaching a plurality of photodiodes to the PD carrier, and mounting the PD carrier to the sub-mounting unit by manual alignment and die bonding method with the PLC optical element, it is possible to implement a low-cost optical transceiver module have.

In addition, according to the present invention, after forming a trapezoidal or square pillar-shaped protrusion and V-shaped coupling groove on one side of the optical fiber block, and processing the alignment guide groove in the PLC optical device, the optical fiber block in the guide groove By using the fixing method, there is an advantage that enables pigtailing by manual alignment.

In addition, according to the present invention, by processing the trapezoidal or square pillar-shaped protrusion formed on one side of the optical fiber block and the V-shaped coupling groove using a hot-embossing technique, precisely dimensionally controlled There is an advantage that mass production of the optical fiber block at a low price.

In addition, according to the present invention, by optically aligning the optical fiber block to the guide groove formed in the PLC optical element by pigtail, it is expected to improve the yield compared to the conventional process of forming a V groove directly on the PLC optical element to attach the optical fiber. There is a very advantageous advantage in low cost optical transceiver module.

Claims (26)

A PLC optical element in which a predetermined optical waveguide portion is formed and in which a light emitting element is mounted; An optical fiber block coupled to an upper portion of the PLC optical element and having a predetermined optical fiber fixed thereto; A thin film filter unit attached to one side of the PLC optical device and configured to separate an input wavelength of the optical device; And And a sub-mount part in which the PLC optical element and a plurality of optical receivers are mounted. The optical waveguide unit of claim 1, A branched optical waveguide for branching and transmitting light transmitted from one side of the light emitting device and the optical fiber in a plurality of directions; And And a directional coupler connected to the branched optical waveguide, the directional coupler separating the wavelength of light transmitted through the branched optical waveguide. The light emitting device of claim 2, wherein the directional coupler is cross-coupled by the light transmitted from one side of the light emitting device through the branched optical waveguide, and the light transmitted from the optical fiber is transmitted through the branched optical waveguide. Three-wavelength optical transmission and reception module, characterized in that the transmission coupling. The optical waveguide according to claim 2, wherein the branched optical waveguide comprises a Y-shaped single mode optical waveguide, and each of the Y-shaped ends is connected to the light emitting element, the thin film filter unit, and the optical fiber, and the Y-shaped The three-wavelength optical transmission and reception module, characterized in that the directional coupler is connected to the intersection of the shape. The method of claim 1, wherein the PLC optical device, Consists of a cladding portion formed on the substrate and the upper surface of the substrate, Three-wavelength light, characterized in that the predetermined guide grooves are formed to be coupled to the mounting portion and the optical fiber block so that the light emitting device is mounted on one side of the clad portion, and the optical waveguide portion is formed on the clad portion. Transceiver module. The method of claim 5, wherein the one side of the optical fiber block is formed with a V-shaped coupling groove to insert and fix the optical fiber, a three-wavelength characterized in that a pair of protrusions are formed in the longitudinal direction to be inserted into the guide groove. Optical transceiver module. The three-wavelength optical transmission / reception module according to claim 6, wherein the protruding portion has a trapezoidal or square pillar shape. The tri-wavelength optical transmitting / receiving module according to claim 1, wherein the light receiving unit is mounted on the sub-mount unit so that light input from the other side of the light emitting device and the optical fiber is transmitted and received through the optical waveguide unit. The tri-wavelength optical transmission / reception module according to claim 1, wherein the light emitting element is a laser diode that outputs light having a wavelength of 1310 nm. The three-wavelength optical transmission / reception module according to claim 1, wherein the wavelength of the light transmitted from the optical fiber is 1490/1550 nm. The three-wavelength optical transmission / reception module according to claim 1, wherein the thin film filter unit is formed of a transmissive thin film filter which reflects light having a wavelength of 1550 nm or 1310 nm and transmits light having a wavelength of 1490 nm. The method of claim 1, wherein the light receiving unit comprises a photodiode for monitoring, a digital photodiode and an analog photodiode, The monitor photodiode is mounted to receive light transmitted from the other side of the light emitting device through a first multi-mode optical waveguide formed on the PLC optical device, and the analog photodiode includes light reflected from the thin film filter unit. And mounted on the PLC optical device so as to be received and received through a second multi-mode optical waveguide, wherein the digital photodiode is mounted to receive the light transmitted from the thin film filter unit. The tri-wavelength optical transmitting / receiving module of claim 1, further comprising a preamplifier installed on an upper portion of the submount unit to be positioned near the optical receiving unit, and configured to increase a reception sensitivity of the optical receiving unit. (a) forming a branched optical waveguide and a directional coupler on an upper portion of the substrate, and forming a PLC optical element on which a light emitting element is mounted on an upper side of the substrate; (b) manually aligning and mounting an optical fiber block having a predetermined optical fiber fixed on the PLC optical device; (c) providing a thin film filter to separate the optical wavelength input to one side of the PLC optical device; And (d) mounting the PLC optical device on an upper surface thereof, and forming a sub-mount part for mounting a plurality of optical receivers to receive the light output through the branched optical waveguide and the directional coupler; Module manufacturing method. The method of claim 14, wherein in the step (a) the PLC optical device, (a1) forming a cladding layer having a predetermined thickness in which the branched optical waveguide and the directional coupler are formed on an upper surface of the substrate; (a2) forming a predetermined mounting groove on the clad layer by dry etching, depositing a predetermined electrode and solder through electron beam deposition or solder jetting, and then patterning the same by photolithography; (a3) inserting and die-bonding the light emitting device into the mounting groove so as to minimize coupling loss with the branched optical waveguide; And (a4) a method of manufacturing a three-wavelength optical transceiver module comprising the step of forming a predetermined guide groove through the dry etching method so that the optical fiber block is coupled on the clad layer. 15. The method of claim 14, wherein in step (b) the optical fiber block, (b1) forming a plate-shaped body portion; (b2) forming a V-shaped coupling groove for fixing a portion of the optical fiber to one surface of the body portion; And (b3) forming a pair of protrusions on both sides of the coupling groove so as to be coupled to a guide groove formed in the PLC optical device on one surface of the body portion. 17. The method of claim 16, wherein when the protrusion is coupled to the guide groove, the three wavelengths are pigtailed using a refractive index matching epoxy so that the cross section of the optical fiber is completely in contact with the cross section of the split optical waveguide formed in the PLC optical device. Method of manufacturing an optical transceiver module. 15. The method of claim 14, wherein the mounting groove and the guide groove are simultaneously formed. 15. The method of claim 14, wherein the optical fiber block is formed by selectively using any one of silicon anisotropic etching, dry etching, or hot embossing. 15. The method of claim 14, wherein a preamplifier is further installed on the sub-mount to increase the reception sensitivity of the optical receiver so as to be located near the optical receiver. 15. The method of claim 14, wherein in the step (c), the thin film filter unit is attached to one side of the PLC optical device by using a refractive index matching epoxy. The method of claim 14, wherein in the step (d) the sub-mount unit, (d1) forming a plurality of mounting trenches to be mounted on the light receiving unit by dry etching on an upper side of the substrate, and depositing predetermined electrodes and solder on the mounting trenches by electron beam deposition or solder jetting, respectively; Patterning through photolithography; (d2) attaching the PLC optical device to the upper portion of the substrate using a conductive epoxy; And (d3) manufacturing the three-wavelength optical transmission / reception module comprising mounting the optical receiver to receive the light output through the light emitting element, the branched optical waveguide, and the directional coupler in each mounting trench. Way. 23. The method of claim 22, wherein the material of the sub-mount portion is made of any one of a quartz substrate, a silicon substrate deposited with alumina, silica, or a polymer material, a thermosetting plastic, or a substrate formed of a material having a low frequency and low dielectric constant and processability. Method for manufacturing a three-wavelength optical transceiver module. The method of claim 22, wherein in the step (d3), the light receiving unit, (d3-1) forming an electrode on a predetermined substrate to form a predetermined pattern by forming an electrode through an electron beam deposition method, and then forming a PD carrier by inserting the electrode into the mounting trench; (d3-2) die bonding a predetermined photodiode to one side of the PD carrier through a conductive epoxy; (d3-3) wire-bonding the anode electrode of the photodiode and the electrode formed on the PD carrier to each other by wire bonding; And (d3-4) after the electrodes formed on the PD carrier and the electrodes formed on the mounting trench are positioned so as to be connected in a vertical direction to each other, die-bonding and mounting through a predetermined column, the three-wavelength light Method of manufacturing a transceiver module. 25. The method of claim 24, wherein a refractive index matching epoxy is inserted between the PD carrier and the branched optical waveguide formed in the PLC optical device to increase the sensitivity of the photodiode and to reinforce the adhesion strength of the PD carrier. Method for manufacturing a three-wavelength optical transmission module, characterized in that. 25. The method of claim 24, wherein the PD carrier is made of quartz, alumina, silica, or a silicon substrate deposited with a polymer material, thermosetting plastic, or a substrate formed of a material having a low frequency and low dielectric constant and processability. Method for manufacturing a three-wavelength optical transceiver module.

Images