KR20060026726A - Printed circuit board having device and method for fabricating the same - Google Patents

Abstract

The present invention improves mechanical and electrical coupling between a device and a printed circuit board by using a capillary phenomenon in which an adhesive rises along a through hole formed in the device when a device such as a passive device or an active device is mounted on a printed circuit board. The present invention relates to a printed circuit board on which the device is mounted and a method of manufacturing the same.

A device-embedded printed circuit board according to the present invention includes a base substrate on which a circuit pattern is formed; An adhesive applied on the base substrate; And an element having at least one through hole formed thereon, attached to the adhesive, the adhesive being raised along the inner wall of the through hole, and the terminal being electrically connected to the circuit pattern. do.

In addition, the method for manufacturing a device-embedded printed circuit board according to the present invention includes the steps of (A) forming at least one through hole in the device; (B) applying an adhesive to the base substrate on which the circuit pattern is formed; (C) attaching the device to the adhesive; And (D) electrically connecting the terminal of the device and the circuit pattern of the base substrate.

Printed Circuit Board, Passive Device, Active Device, Through Hole, Capillary Phenomenon

Description

Printed circuit board having device and method for fabricating the same}

1 is a cross-sectional view of a printed circuit board on which a conventional device is mounted.

2A to 2D are cross-sectional views illustrating a flow of a method of manufacturing a printed circuit board on which a device according to a first embodiment of the present invention is mounted.

3A and 3B are cross-sectional views illustrating electrical connections between a printed circuit board and the device fabricated in FIGS. 2A to 2D.

4A to 4G are cross-sectional views illustrating a flow of a method of manufacturing a printed circuit board on which a device according to a second embodiment of the present invention is mounted.

5A and 5B are cross-sectional views of printed circuit boards in which devices according to third and fourth embodiments of the present invention are mounted.

* Description of the symbols for the main parts of the drawings *

1100, 2100, 3100, 4100: devices such as passive devices or active devices

1110, 2110, 3110, 4110: through hole

1120, 2130, 3120, 4120: oxide layer

1130, 3130, 4130: Terminal

1200, 2200, 3200, 4200: Base Board

1210, 1220, 3210, 4220: Circuit Pattern

1230, 2230: Insertion Groove

Adhesive: 1300, 2300, 3300, 4300

1400, 3400: Wire Bonding

2120: copper plating layer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board having a device mounted thereon and a method of manufacturing the same, and more particularly, an adhesive rises along a through hole formed in the device when a device such as a passive device or an active device is mounted on a printed circuit board. By using a capillary phenomenon, the present invention relates to a printed circuit board on which a device having improved mechanical and electrical coupling properties between the device and the printed circuit board and a manufacturing method thereof are provided.

The development of ICs (Integrated Circuits) is miniaturizing and high-integration, and developing toward multifunction and high performance. Interposers, printed circuit boards (PCBs), etc., which use such ICs for the purpose of electrical connection with other devices, should be directed towards high integration and minimization of parasitic components. Research on mounting chips for realization is required, and in a package for mounting various passive and active devices, the device is mounted on a printed circuit board as part of a method for meeting the above requirements. Research into embedding is being actively conducted in recent years.

A method of manufacturing a printed circuit board on which a device such as a passive device or an active device is mounted, a method of directly mounting a finished component (for example, a semiconductor chip) on an organic substrate or a ceramic substrate, and a specific material in the printed circuit board. The method of manufacturing an element using the etc. is tried.

In these two methods, thermal and mechanical stresses between heterogeneous materials generated by inserting dissimilar materials into a substrate expose a significant problem to be solved in the reliability of a printed circuit board.

1 is a cross-sectional view of a printed circuit board mounted with a conventional device, which is disclosed in US Pat. No. 6,489,685.

As shown in FIG. 1, a printed circuit board on which a conventional device is mounted includes an insulating layer 101, a wiring pattern 102a and 102b, a semiconductor device 103, an internal via hole 104, and a bump; 105). As shown, the printed circuit board disclosed in US Pat. No. 6,489,685 directly mounts the semiconductor device 103, but focuses on electrical connection rather than reliability of mechanical bonding.

As a result, the mechanical bonding force between the semiconductor device 103 and the printed circuit board is inferior in the printed circuit board disclosed in US Patent No. 6,489,685, so that the position matching in the conventional build-up process of the printed circuit board is difficult. There was a difficult problem. In addition, the printed circuit board disclosed in U.S. Patent No. 6,489,685 has a weak mechanical strength between the semiconductor element 103 and the printed circuit board, and thus has a very weak problem in external impact after the manufacturing process or the completion of the product. Since this increases the defective rate of the product, there is a problem of reducing the reliability of the final electronic product.

The technical problem of the present invention for solving the above problems is a printed circuit board mounted with a device that provides the reliability of the mechanical connection with the reliability of the electrical connection between the device such as passive or active devices and the printed circuit board and its manufacture To provide a way.

In order to solve the above technical problem, a printed circuit board mounted with a device according to an embodiment of the present invention includes a base substrate having a circuit pattern; An adhesive applied on the base substrate; And an element having at least one through hole formed thereon, the lower surface being attached to the adhesive, the adhesive being raised along the inner wall of the through hole, and the terminal being electrically connected to the circuit pattern. It is characterized by.

According to another aspect of the present invention, there is provided a printed circuit board including a base substrate on which a circuit pattern is formed; An insertion groove formed in the base substrate; Adhesive applied to the lower end of the insertion groove; And at least one through hole is formed, the bottom surface is attached to the adhesive to be inserted into the insertion groove, the adhesive is raised along the inner wall of the through hole, and the terminal is electrically connected to the circuit pattern. Characterized in that it comprises a.

Preferably, the device of the printed circuit board having the device according to the present invention further includes a low surface energy material layer formed on the inner wall of the through hole.

Preferably, the low surface energy material layer of the printed circuit board mounted with the device according to the present invention is an oxide layer. The device of the printed circuit board mounted with the device according to the present invention is formed on a surface including an inner wall of the through hole. It is preferable to further include a plating layer to be formed, and an oxide layer formed on the plating layer.

In order to solve the above technical problem, a method of manufacturing a printed circuit board mounted with the device according to the invention (A) forming at least one through hole in the device; (B) applying an adhesive to the base substrate on which the circuit pattern is formed; (C) attaching a bottom surface of the device to the adhesive such that the adhesive rises along the inner wall of the through hole; And (D) electrically connecting the terminal of the device and the circuit pattern of the base substrate. The method of manufacturing a printed circuit board on which the device according to the present invention is mounted may be performed after step (A). (E) preferably forming a low surface energy material layer on the inner wall of the through hole.

The low surface energy material layer of the method of manufacturing a printed circuit board having the device according to the present invention is preferably an oxide layer.

According to an aspect of the present invention, there is provided a method of manufacturing a printed circuit board having a device mounted thereon, the method including: (E) forming a plating layer on an inner wall of the through hole; And (F) forming an oxide layer on the plating layer.

The step (A) of the method of manufacturing a printed circuit board having the device mounted thereon may include at least one of at least one of mechanical drilling, laser drilling, wet etching, and dry etching. It is preferable to form a through hole. Hereinafter, a printed circuit board on which an element according to the present invention and a manufacturing method thereof will be described in detail with reference to the accompanying drawings.

2A and 2B are cross-sectional views illustrating a method of manufacturing a printed circuit board on which a device according to a first embodiment of the present invention is mounted, and FIGS. 3A and 3B illustrate a printed circuit board manufactured with FIGS. 2A to 2D. 2A, a through hole 1110 is formed in a device 1100 such as a passive device or an active device.

Here, it is preferable to form the through hole 1110 in a portion where a circuit or the like is not formed in the element 1100, and is typically formed in the outer portion of the element 1100. The number of the through holes 1110 formed is at least one, and the number of through holes 1110 may be provided after the device 1100 is bonded to the base substrate 1200 to provide a predetermined mechanical bonding force. To form. The through hole 1110 may be processed in the device 1100 by using a mechanical drilling method, a laser drilling method, a wet etching method, a dry etching method, or the like.

As illustrated in FIG. 2B, an oxide layer 1120 (eg, an SiO ₂ layer when the device 1100 is a silicon semiconductor chip) is formed on an inner wall of the through hole 1110 of the device 1100. By forming the oxide layer 1120 on the inner wall of the through hole 1110, the surface energy on the inner wall of the through hole 1110 is lowered.

Here, the method of forming the oxide layer 1120 on the inner wall of the through hole 1110 may be a natural oxide layer formed by the exposure of the device 1100 in the air, and an oxide layer formed by a chemical vapor deposition (CVD) method. It may be a thermal oxidation layer formed in a high temperature oxygen atmosphere after inserting the device 1100 in the electric furnace.

In another embodiment, a low surface energy material may be applied to the inner wall of the through hole 1110 without lowering the oxide layer 1120 to the inner wall of the through hole 1110. As shown in FIG. 2C, after the insertion groove 1230 is formed in the base substrate 1200 on which the predetermined pattern is formed, the adhesive 1300 is applied to the lower end of the insertion groove 1230.

Here, the insertion groove 1230 is processed using a router drill or a laser drill, and the like, and then preferably processed according to the product tolerance of the device 1100 to be inserted.

Meanwhile, the adhesive 1300 may use a liquid adhesive, and may use a B-stage prepreg in a semi-cured state.

As shown in FIG. 2D, the device 1100 having the oxide layer 1120 formed on the inner wall of the through hole 1110 is inserted into the insertion groove 1230 of the base substrate 1200.

In the case where the liquid adhesive is used, the liquid adhesive rises along the inner wall of the through hole 1110 of the device 1100 due to capillary action, and thus the mechanical bonding force between the device 1100 and the base substrate 1200 is increased. To improve.

On the other hand, when using a prepreg in the semi-cured state, by heating the prepreg to a temperature higher than the glass transition temperature (Tg) of the prepreg, the resin of the prepreg penetrates the element 1100 by capillary action Ascending along the inner wall of the hole 1110. Thereafter, by lowering the temperature, the device 1100 and the base substrate 1200 are bonded to each other. Herein, the prepreg may be heated by a laser induced heating method that locally heats only the junction portion of the prepreg, a method of heating the entire printed circuit board, or the like.

Subsequently, electrical connection between the base substrate 1200 and the device 1100 may be performed when the terminal of the device 1100 is formed at the top or the terminal of the device 1100 is formed at the bottom. Here, when the terminal of the device 1100 is formed in the lower portion, in the process of bonding the device 1100, the pressure is applied between the base substrate 1200 and the device 1100, or the terminal of the device 1100 is formed There is a disadvantage that a special chemical surface treatment must be performed to remove the adhesive 1300 of the portion. Therefore, the case where the terminal is formed on the upper portion of the device 1100 is preferable to ensure the reliability of the electrical connection.

As shown in FIG. 3A, the printed circuit board on which the device according to the present invention is mounted includes a base substrate 1200 having a circuit pattern, an insertion groove 1230 formed in the base substrate 1200, and an insertion groove 1230. An adhesive 1300 applied to the bottom and a device 1100 having a lower surface attached to the adhesive 1300, and along the oxide layer 1120 of the inner wall of the through hole 1110 formed in the device 1100. A part of the adhesive 1300 is raised. The circuit pattern 1210 formed on the upper surface of the base substrate 1200 and the terminal 1130 formed on the upper surface of the device 1100 may be wire bonded to form a wire bonding 1400 to transmit electrical signals. Alternatively, as illustrated in FIG. 3B, the terminal formed on the upper surface of the device 1100 may be formed by performing an insulation layer stacking process, a via hole processing process, a copper plating process, and a circuit pattern forming process according to a conventional build-up method. 1130 and the circuit pattern 1220 formed on the base substrate 1200 may be electrically connected to each other.

4A to 4G are cross-sectional views showing the flow of a method of manufacturing a printed circuit board on which a device according to a second embodiment of the present invention is mounted. As shown in FIG. 4A, a device 2100 such as a passive device or an active device is shown. At least one through hole 2110 is formed in a portion where a circuit or the like is not formed.

The method of processing the through hole 2110 in the device 2100 may be a mechanical drilling method, a laser drilling method, a wet etching method, a dry etching method, or the like.

As shown in FIG. 4B, a copper plating layer 2120 is formed on the upper and lower surfaces of the device 2100 and the inner wall of the through hole 2110. Here, the upper and lower surfaces and the through hole 2110 of the device 2100 are made of only a conductive material. In this case, electrolytic copper plating with good physical properties is performed. However, when an insulating material is exposed to the upper and lower surfaces of the device 2100 and the through hole 2110, it is preferable to perform electroless copper plating after electroless copper plating and having good physical properties.

In an embodiment of the present invention, the plating layer 2120 formed on the upper and lower surfaces of the device 2100 and the inner wall of the through hole 2110 is not limited to copper, and gold may be used depending on the purpose or purpose of use. The plating layer may be formed of a conductive material such as nickel (Ni), tin (Sn), or the like as a main component. As shown in FIG. 4C, the upper and lower parts of the device 2100 may be formed by performing exposure, development, and etching processes using an etching resist. A predetermined copper plating layer 2120 pattern is formed on the surface. In this case, the copper plating layer 2120 is removed in a portion where the circuit of the device 2100 is formed so that a short circuit does not occur.

In another embodiment, instead of the above-described process of FIGS. 4B and 4C, after forming a predetermined plating resist pattern on the upper and lower surfaces of the device 2100 and the through holes 2110, the copper plating layer 2120 may be locally formed. It may be.

As shown in FIG. 4D, an oxide layer 2130 is formed on the copper plating layer 2120 formed on the upper and lower surfaces of the device 2100 and the inner wall of the through hole 2110.

Here, the method of forming the oxide layer 2130 on the copper plating layer 2120 may be a natural oxide layer formed as the device 2100 is exposed to the atmosphere, and after inserting the device 2100 into an electric furnace, in a high temperature oxygen atmosphere. It may be a thermal oxidation layer formed. Alternatively, the oxide layer may be an oxide layer (eg, an SiO ₂ layer) grown using various CVD processes.

As shown in FIG. 4E, the oxide layer 2130 formed on the upper and lower surfaces of the device 2100 is selectively etched to form a predetermined pattern.

The etching method of the oxide layer 2130 may be a dry etching method using a sputtering equipment or the like, or a wet etching method of spraying etching liquid after forming an etching resist pattern may be used. Likewise, after the insertion grooves 2230 are formed in the base substrate 2200 having a predetermined pattern, the adhesive 2300 is applied to the lower ends of the insertion grooves 2230.

As shown in FIG. 4G, the device 2100 is inserted into the insertion groove 2230 of the base substrate 2200. At this time, the adhesive 2300 rises along the oxide layer 2130 of the inner wall of the through hole 2110 of the device 2100, thereby improving the mechanical bonding force between the device 2100 and the base substrate 2200. The electrical connection between the 2200 and the device 2100 is the same as the first embodiment of FIGS. 3A and 3B.

In the above-described first and second embodiments, in order to insert elements 1100 and 2100, such as passive elements or active elements, and reduce the final thickness of the base substrates 1200 and 2200, the base substrates 1200 and 2200 are provided. Insertion grooves 1230 and 2230 were formed. However, the device may be bonded to a printed circuit board on which the insertion grooves 1230 and 2230 are not formed, depending on the purpose or purpose of use.

5A and 5B are cross-sectional views of printed circuit boards in which devices according to third and fourth embodiments of the present invention are mounted.

As shown in FIG. 5A, a printed circuit board on which a device according to a third exemplary embodiment of the present invention is mounted includes a base substrate 3200 having a circuit pattern, an adhesive 3300 coated on the base substrate 3200, and And a lower portion of the adhesive 3300 attached to the adhesive 3300, and a portion of the adhesive 3300 is raised along the oxide layer 3120 of the inner wall of the through hole 3110 formed in the device 3100. . In this embodiment, the circuit pattern 3210 formed on the upper surface of the base substrate 3200 and the terminal 3130 formed on the upper surface of the device 3100 form an electrical connection with the wire bonding 3400. As shown in FIG. 5B, a printed circuit board on which a device according to a fourth embodiment of the present invention is mounted has a conventional build-up method on a base substrate 4200 in which the device 4100 is bonded by an adhesive 4300. Accordingly, the insulating layer stacking process, the via hole processing process, the copper plating process, and the circuit pattern forming process may be performed to electrically connect the terminal 4130 formed on the upper surface of the device 4100 and the circuit pattern 4220 formed on the base substrate 4200. You can also connect

Although the present invention has been described above, this is only one embodiment, and it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention. . However, it will be confirmed through the claims that such changes and modifications fall within the scope of the present invention.

As described above, the present invention uses a capillary phenomenon in which the adhesive rises along the through-holes formed in the device, thereby providing a printed circuit board and a method for manufacturing the device, which improve the mechanical and electrical coupling between the device and the printed circuit board. To provide.

Therefore, the printed circuit board mounted with the device and the manufacturing method thereof according to the present invention have a strong mechanical bond between the device and the printed circuit board, so that the position of the device does not deviate in a subsequent build-up process of the printed circuit board, And the electrical connection between the circuit pattern of the printed circuit board is easy.

In addition, the printed circuit board mounted with the device according to the present invention and its manufacturing method have a strong mechanical bond between the device and the printed circuit board, there is also a very strong effect against external impact after the manufacturing process or product completion.

Claims (10)

A base substrate on which a circuit pattern is formed; An adhesive applied on the base substrate; And At least one through hole is formed, a bottom surface is attached to the adhesive, the adhesive is raised along the inner wall of the through hole, and a terminal is electrically connected to the circuit pattern. Printed circuit board mounted with the element. A base substrate on which a circuit pattern is formed; An insertion groove formed in the base substrate; Adhesive applied to the lower end of the insertion groove; And At least one through hole is formed, the bottom surface is attached to the adhesive is inserted into the insertion groove, the adhesive is raised along the inner wall of the through hole, the terminal is electrically connected to the circuit pattern Printed circuit board mounted with the device, characterized in that it comprises a device. The method according to claim 1 or 2, The device further comprises a low surface energy material layer (low surface energy material layer) formed on the inner wall of the through hole. The method of claim 3, wherein And the low surface energy material layer is an oxide layer. The method according to claim 1 or 2, And the device further comprises a plating layer formed on a surface including an inner wall of the through hole, and an oxide layer formed on the plating layer. (A) forming at least one through hole in the device; (B) applying an adhesive to the base substrate on which the circuit pattern is formed; (C) attaching a bottom surface of the device to the adhesive such that the adhesive rises along the inner wall of the through hole; And (D) electrically connecting the terminal of the device and the circuit pattern of the base substrate; a method of manufacturing a printed circuit board mounted with the device. The method of claim 6, wherein after step (A), And (E) forming a low surface energy material layer on the inner wall of the through hole. The method of claim 7, wherein The low surface energy material layer is an oxide layer manufacturing method of a printed circuit board mounted device. The method of claim 6, wherein after step (A), (E) forming a plating layer on the inner wall of the through hole; And (F) forming an oxide layer on the plating layer; the manufacturing method of a printed circuit board mounted with the device further comprising. The method of claim 6, In the step (A), at least one through hole is formed in the device using at least one of mechanical drilling, laser drilling, wet etching, and dry etching. Method of manufacturing a substrate.

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