KR20060025362A - Copper plating apparatus - Google Patents

Copper plating apparatus Download PDF

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Publication number
KR20060025362A
KR20060025362A KR1020040074129A KR20040074129A KR20060025362A KR 20060025362 A KR20060025362 A KR 20060025362A KR 1020040074129 A KR1020040074129 A KR 1020040074129A KR 20040074129 A KR20040074129 A KR 20040074129A KR 20060025362 A KR20060025362 A KR 20060025362A
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South Korea
Prior art keywords
circuit board
printed circuit
copper
electrolytic cell
electrolyte
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KR1020040074129A
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Korean (ko)
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KR100633043B1 (en
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박용순
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주식회사 티케이씨
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

본 발명은 인쇄회로기판에 구리도금을 수행하는 구리 도금장치에 관한 것으로, 더욱 상세하게는 도금할 인쇄회로기판을 전해액에 침전시킴과 동시에 이 전해액 분사노즐들을 이용하여 전해액의 교반작용을 야기함에 따라 이 전해액의 원활한 유체흐름으로 도금이 이루어져서 도금편차를 저감시키고 도금불량도 방지할 수 있는 구리 도금장치에 관한 것이다.The present invention relates to a copper plating apparatus for performing copper plating on a printed circuit board, and more particularly, to precipitate a printed circuit board to be plated in an electrolyte solution and to cause agitation of the electrolyte solution using the electrolyte injection nozzles. The present invention relates to a copper plating apparatus that can be plated by a smooth fluid flow of this electrolyte to reduce plating deviation and prevent plating defects.

상기와 같은 본 발명은 구리동(1)이 전해조(2)의 전해액(3)에 투입되고 전처리 공정을 마친 인쇄회로기판(4)이 행거(5)에 의해 현수 지지되면서 이 전해액(3)에 침전되어 급전부(6)에 의해 공급되는 전기에 의해 이 인쇄회로기판(4)에 구리도금이 이루어지는 구리 도금장치에 있어서, 상기 행거(5)에 현수 지지되면서 전처리 공정을 끝낸 인쇄회로기판(4)이 다시 한번 재세정되기 위해 산세탱크(7)에 침전되는 산세 처리부(8)와, 상기 산세 처리부(8)를 거친 행거(5)의 인쇄회로기판(4)을 승·하강시키는 리프터(9), 상기 리프터(9)에서 인계된 인쇄회로기판(4)의 원활한 도금을 위해 전해액(3)을 적정온도로 냉각 유지시키는 냉각코일(10)을 갖춘 냉각부(11), 이 냉각부(11)를 거친 행거(5)에 보유 지지된 인쇄회로기판(4)을 전해액(3)에서 침전시키면서 전해액 분사노즐(12) 들을 이용하여 인쇄회로기판(4)을 도금하는 전해조(2) 및, 이 전해조(2)의 분사노즐(12)에서 분사되는 전해액(3)을 전해조(2)에서 펌프(13)로 흡입하여 상기 분사노즐(12) 들로 공급하는 전해액 공급부(14)로 이루어져 있다.In the present invention as described above, the copper copper 1 is introduced into the electrolytic solution 3 of the electrolytic cell 2, and the printed circuit board 4 having finished the pretreatment process is suspended and supported by the hanger 5 to the electrolytic solution 3. In a copper plating apparatus in which copper is plated on the printed circuit board 4 by electricity that is precipitated and supplied by the feeding part 6, the printed circuit board 4 which has been suspended from the hanger 5 and finished the pretreatment process 4. ) Lifter 9 for raising and lowering the pickling processing unit 8 that is settled in the pickling tank 7 and the printed circuit board 4 of the hanger 5 which has passed through the pickling processing unit 8 to be washed again. ), A cooling unit (11) having a cooling coil (10) for cooling and maintaining the electrolyte solution (3) at an appropriate temperature for smooth plating of the printed circuit board (4) taken over by the lifter (9), the cooling unit (11) Electrolyte injection nozzle (12) while precipitating the printed circuit board (4) held in the hanger (5) through the electrolyte solution (3) The electrolytic cell 2 for plating the printed circuit board 4 by using the electrolytic cell 2, and the electrolytic solution 3 injected from the injection nozzle 12 of the electrolytic cell 2 is sucked from the electrolytic cell 2 by the pump 13 to the above-mentioned. It consists of an electrolyte supply unit 14 for supplying to the injection nozzles (12).

Description

구리 도금장치{Copper plating apparatus}Copper plating apparatus

도 1은 본 발명에 따른 구리 도금장치의 전체 평면도,1 is an overall plan view of a copper plating apparatus according to the present invention,

도 2는 도 1의 정면도,2 is a front view of FIG. 1,

도 3은 도 1의 측면도,3 is a side view of FIG. 1;

도 4는 본 발명에 따른 리프터의 확대 정면도,4 is an enlarged front view of a lifter according to the present invention;

도 5는 도 4의 측면도,5 is a side view of FIG. 4;

도 6은 본 발명에 따른 전해액 분사 노즐부의 확대 정면도,6 is an enlarged front view of an electrolyte injection nozzle unit according to the present invention;

도 7은 도 6의 측면도,7 is a side view of FIG. 6;

도 8은 본 발명에 따른 도금조의 부분 정면도,8 is a partial front view of a plating bath according to the present invention,

도 9는 도 8의 측면도이다.9 is a side view of FIG. 8.

-도면의 주요부분에 대한 부호의 설명-Explanation of symbols on the main parts of the drawing

1 : 구리동, 2 : 전해조,1: copper copper, 2: electrolytic cell,

3 : 전해액, 4 : 인쇄회로기판,3: electrolyte, 4: printed circuit board,

5 : 행거, 6 : 급전부,5: hanger, 6: feeder,

7 : 산세 탱크, 8 : 산세 처리부,7: pickling tank, 8: pickling processing unit,

9 : 리프터, 10 : 냉각코일,9: lifter, 10: cooling coil,

11 : 냉각부, 12 : 분사노즐,11: cooling part, 12: injection nozzle,

13 : 펌프, 14 : 전해액 공급부,13: pump, 14: electrolyte supply portion,

15 : 밀대, 16 : 안내레일,15: push rod, 16: guide rail,

17 : 지지대, 18 : 가이드 축,17: support, 18: guide shaft,

19 : 모터, 20 : 벨로우즈,19: motor, 20: bellows,

21 : 랙잭, 22 : 승, 하강 가이드,21: rackjack, 22: win, descent guide,

23 : 흡입 파이프, 24 : 펌프,23: suction pipe, 24: pump,

25 : 여과기, 26 : 토출 파이프,25: filter, 26: discharge pipe,

27 : 분배관, 28 : 마스크 판,27: distribution pipe, 28: mask plate,

30 : 프레임.30: the frame.

본 발명은 인쇄회로기판에 구리도금을 수행하는 구리 도금장치에 관한 것으로, 더욱 상세하게는 도금할 인쇄회로기판을 전해액에 침전시킴과 동시에 이 전해액 분사노즐들을 이용하여 전해액의 교반작용을 야기함에 따라 전해액의 원활한 유체흐름으로 도금이 이루어져서 도금편차를 저감시키고 도금불량도 방지할 수 있는 구리 도금장치에 관한 것이다.The present invention relates to a copper plating apparatus for performing copper plating on a printed circuit board, and more particularly, to precipitate a printed circuit board to be plated in an electrolyte solution and to cause agitation of the electrolyte solution using the electrolyte injection nozzles. The present invention relates to a copper plating apparatus capable of reducing plating deviation and preventing plating defects by plating by a smooth fluid flow of an electrolyte.

주지된 바와 같이 도금은 재료 표면에 다른 종류의 금속 또는 합금의 얇은 막으로 피복하는 것으로, 방식·장식·표면경화 등을 목적으로 하고, 또한 자성박막, 도체박막, 저항체 박막 및 초전도 박막 등의 특수한 기능을 갖는 박막을 제조 하기 위하여 실시한다.As is well known, plating is a coating of a thin film of a different type of metal or alloy on a surface of a material, for the purpose of anticorrosion, decoration, surface hardening, and the like, and special coatings such as magnetic thin films, conductor thin films, resistor thin films and superconducting thin films. In order to manufacture a thin film having a function.

도금 중 구리도금은 주로 전기 도금법을 이용하여 실시되는바, 일반적으로 인쇄회로기판에 구리도금을 전기분해를 이용하여 수행할 때 전해조에 유산동을 투입하여 전해질 용액 내에서 인쇄회로기판이 구리 도금되어 지도록 되어 있다.Copper plating during plating is mainly carried out by electroplating. Generally, when copper plating is performed on electroplated circuit boards, copper lactate is added to the electrolytic cell so that the printed circuit board is copper plated in the electrolyte solution. It is.

그러나 종래 이러한 방식의 구리도금은 전해액이 담겨진 전해조에 인쇄회로기판이 침전되어 지나가면서 구리도금이 이루어지게 되어 있으나, 전해액의 유체흐름이 원활하게 유지되지 못하여 도금 후 도금편차가 발생하여 제품의 불량률을 증가시키는 문제점이 제기 되었다.However, in the conventional copper plating of this type, copper plating is performed as the printed circuit board is deposited and passed through the electrolytic cell containing the electrolyte, but the fluid flow of the electrolyte is not maintained smoothly, and plating deviation occurs after plating, thereby reducing the defective rate of the product. Increasing problems were raised.

또한 전처리 과정과 도금과정을 마친 인쇄회로기판을 후공정으로 이송시킬 때 도금장비의 전체 레이아웃이 원만하지 못하여 전해조의 전해액이 이 인쇄회로기판에 묻어서 도금장비의 주변으로 떨어져 작업환경을 악화시키는 단점도 지니고 있었다.In addition, when transferring the printed circuit board after the pretreatment process and the plating process to the post process, the overall layout of the plating equipment is not smooth, and the electrolyte of the electrolytic cell is buried in the printed circuit board and falls to the periphery of the plating equipment, which also worsens the working environment. I had it.

이에 본 발명은 상기와 같은 목적을 달성하기 위하여 발명된 것으로 인쇄회로기판을 전해조의 전해액에서 도금할 때 전해액의 흐름과 교반이 원활하게 이루어져 도금할 인쇄회로기판의 도금편차 없이 균일성이 향상되면서 도금불량도 방지하는 구리 도금장치를 제공함에 그 목적이 있다.Accordingly, the present invention was invented to achieve the above object, and when plating the printed circuit board in the electrolytic solution of the electrolytic bath, the flow and stirring of the electrolyte is smoothly performed, thereby improving the uniformity without plating deviation of the printed circuit board to be plated. It is an object of the present invention to provide a copper plating apparatus for preventing defects.

상기와 같은 목적을 달성하기 위한 본 발명은 구리동이 전해조의 전해액에 투입되고 전처리 공정을 마친 인쇄회로기판이 행거에 의해 현수 지지되면서 이 전해액에 침전되어 전기분해에 의해 구리도금이 이루어지는 구리 도금장치에 있어서, 상기 행거에 현수 지지되면서 전처리 공정을 끝낸 인쇄회로기판이 다시 한번 재세정되기 위해 침전되는 산세 처리부와, 상기 산세 처리부를 거친 행거의 인쇄회로기판을 승·하강시키는 리프터, 상기 리프터에서 인계된 인쇄회로기판의 원활한 도금을 위해 전해액을 적정온도로 냉각 유지시키는 냉각코일을 갖춘 냉각부, 상기 냉각부를 거친 행거에 보유 지지된 인쇄회로기판을 전해액에서 침전시키면서 전해액 분사노즐을 이용하여 인쇄회로기판을 도금하는 전해조, 상기 전해조의 전해액 분사노즐에서 분사되는 전해액을 전해조에서 펌프로 흡입하여 이 분사노즐로 공급하는 전해액 공급부로 이루어져 있다.In order to achieve the above object, the present invention provides a copper plating apparatus in which copper copper is introduced into an electrolytic solution of an electrolytic cell and the printed circuit board which has completed the pretreatment process is suspended by a hanger and precipitated in the electrolytic solution and copper plated by electrolysis. And a pickling processing unit which is suspended on the hanger and has a pretreatment process, wherein the printed circuit board is settled to be washed again, and a lifter for lifting and lowering the printed circuit board of the hanger which has passed through the pickling processing unit. Cooling unit having a cooling coil for cooling and maintaining the electrolyte at an appropriate temperature for smooth plating of the printed circuit board, and using the electrolyte injection nozzle while depositing the printed circuit board held in the hanger through the cooling unit from the electrolyte Electrolyzer plating, spraying from the electrolytic solution injection nozzle of the electrolytic cell It is made by a suction pump into the electrolytic solution in the electrolytic cell to the electrolytic solution supply part for supplying to the spray nozzle.

이하, 본 발명의 바람직한 실시예를 첨부된 예시도면에 의거 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

본 발명은 구리동(1)이 전해조(2)의 전해액(3)에 투입되고 전처리 공정을 마친 인쇄회로기판(4)이 행거(5)에 의해 현수 지지되면서 이 전해액(3)에 침전되어 급전부(6)에 의해 공급되는 전기에 의해 전해 분해되어 이 인쇄회로기판(4)에 구리도금이 이루어지는 구리 도금장치에 있어서, 상기 행거(5)에 현수 지지되면서 전처리 공정을 끝낸 인쇄회로기판(4)이 다시 한번 재세정되기 위해 산세탱크(7)에 침전되는 산세 처리부(8)와, 상기 산세 처리부(8)를 거친 행거(5)의 인쇄회로기판(4)을 승·하강시키는 리프터(9), 상기 리프터(9)에서 인계된 인쇄회로기판(4)의 원활한 도금을 위해 전해액(3)을 적정온도로 냉각 유지시키는 냉각코일(10)을 갖춘 냉각부(11), 이 냉각부(11)를 거친 행거(5)에 보유 지지된 인쇄회로기판(4)을 전해액(3) 에서 침전시키면서 전해액 분사노즐(12) 들을 이용하여 인쇄회로기판(4)을 도금하는 전해조(2) 및, 이 전해조(2)의 분사노즐(12)에서 분사되는 전해액(3)을 전해조(2)에서 펌프(13)로 흡입하여 상기 분사노즐(12) 들로 공급하는 전해액 공급부(14)로 이루어져 있다.In the present invention, copper copper (1) is introduced into the electrolytic solution (3) of the electrolytic cell (2), and the printed circuit board (4) having finished the pretreatment step is suspended by the hanger (5) while being precipitated in the electrolytic solution (3) In the copper plating apparatus which electrolytically decomposes by electricity supplied by the whole part 6, and copper-plats to this printed circuit board 4, the printed circuit board 4 which carried out the pretreatment process while being suspended by the said hanger 5 was finished. ) Lifter 9 for raising and lowering the pickling processing unit 8 that is settled in the pickling tank 7 and the printed circuit board 4 of the hanger 5 which has passed through the pickling processing unit 8 to be washed again. ), A cooling unit (11) having a cooling coil (10) for cooling and maintaining the electrolyte solution (3) at an appropriate temperature for smooth plating of the printed circuit board (4) taken over by the lifter (9), the cooling unit (11) Electrolyte jet nozzle (1) while precipitating the printed circuit board (4) held in the hanger (5) through the electrolyte solution (3) 2) suction the electrolyzer 2 for plating the printed circuit board 4 and the electrolytic solution 3 injected from the injection nozzle 12 of the electrolyzer 2 from the electrolyzer 2 to the pump 13 It consists of an electrolyte supply unit 14 to supply to the injection nozzles (12).

여기서 도 1 내지 도 3은 본 발명에 따른 구리 도금장치의 평면도와 정면도 및 측면도를 나타낸 것으로, 세정과 린스공정을 마친 행거(5)에 보유 지지된 인쇄회로기판(4)이 공지의 트랜스퍼(도면에 도시하지 않았음)에 의해 리프터(9)의 밀대(15)에 인계되는데, 이 밀대(15)의 푸셔가 행거(5)를 밀어서 화살표 (가)방향으로 투입되면, 상기 산세 처리부(8)의 산세 탱크(7) 내에 담겨진 산세액에 의해 화학 처리가 이루어진다.1 to 3 show a plan view, a front view, and a side view of a copper plating apparatus according to the present invention, in which a printed circuit board 4 held on a hanger 5 having been cleaned and rinsed is a known transfer ( It is taken over by the pusher 15 of the lifter 9, which is not shown in the drawing. When the pusher of the pusher 15 pushes the hanger 5 and is put in the direction of arrow (A), the pickling processing part 8 The chemical treatment is performed by the pickling liquid contained in the pickling tank (7).

즉 산세 처리부(8)에서 인쇄회로기판(4)은 이 기판에 구리도금을 고루고 균일하게 이루어지기 위해 산세 처리되어 진다.In other words, in the pickling processing unit 8, the printed circuit board 4 is pickled in order to evenly and uniformly plate copper on the substrate.

이어 상기 산세 처리부(8)를 거친 행거(5)에 보유 지지된 인쇄회로기판(4)은 리프터(9)에 의해 상승 되어지는데, 이는 상기 리프터(9)의 밀대(15)에 안착된 행거(5)를 들어 올려서 이 행거(5)가 보유 지지한 인쇄회로기판(4)을 산세 처리부(8)에서 끄집어내기 위함이다.Subsequently, the printed circuit board 4 held on the hanger 5 passing through the pickling processing unit 8 is lifted by the lifter 9, which hangs on the pusher 15 of the lifter 9. 5) This is for lifting the printed circuit board 4 held by the hanger 5 from the pickling processing unit 8 by lifting it.

이러한 역할을 수행하는 리프터(9)는 도 4와 도 5에 도시된 바와 같이 행거(5)가 안착되는 안내레일(16)을 갖춘 지지대(17)가 보울트 등을 매개로 양쪽 가이드 축(18)과 연결되고 상기 지지대(17)는 모터(19)에 설치된 벨로우즈(20)를 갖춘 랙잭(21)과 연결되어 있어서 상기 모터(19)의 기동에 의해 프레임(30)과 랙잭(21) 을 지점으로 양쪽 가이드 축(18)과 지지대(17)는 함께 승, 하강되어 진다.As shown in FIGS. 4 and 5, the lifter 9 performing this role is provided with a guide 17 having a guide rail 16 on which the hanger 5 is seated. And the support 17 is connected to the rack jack 21 having the bellows 20 installed on the motor 19 so that the frame 30 and the rack jack 21 are moved to the point by the start of the motor 19. Both guide shafts 18 and the support 17 are raised and lowered together.

즉 상기 구리동(1)이 내장된 전해조(2)는 전해액(3)이 가득 차 있기 때문에 행거(5)가 직접 투입될 수 없어서 승, 하강용 리프터(9)를 이용하여 이 행거(5)를 상승시켜 전해조(2) 투입부에 이동시킨 후 하강시키어 구리도금이 이루어지는데, 여기서 승, 하강시키는 구동장치는 모터를 이용한 랙잭(21) 구동장치이다.In other words, the electrolytic cell 2 in which the copper copper 1 is embedded is not equipped with the hanger 5 because the electrolytic solution 3 is full, so that the hanger 5 can be lifted by using the lifter 9 for lifting and lowering. It is raised to move the electrolytic cell (2) input unit and then lowered to make copper plating, where the drive device for raising and lowering is a rack jack 21 driving device using a motor.

그리고 상기 리프터(9)에서 인계된 행거(5)에 현수된 인쇄회로기판(4)은 안내레일(16)을 타고 냉각부(11)를 갖춘 전해조(2)로 투입되는바, 여기서 냉각부(11)는 냉각코일(10)에 의해 전해조(2)에 담겨진 전해액(3)을 도금에 적정한 온도인 약 25℃를 유지시키기 위함이다.And the printed circuit board (4) suspended on the hanger (5) taken over from the lifter (9) is introduced into the electrolytic cell (2) having a cooling section (11) by the guide rail (16), where the cooling section ( 11) is to maintain about 25 ° C., which is a temperature suitable for plating the electrolyte solution 3 contained in the electrolytic cell 2 by the cooling coil 10.

이렇게 전해조(2)의 냉각부(11)를 거친 인쇄회로기판(4)은 도 2의 화살표 방향으로 이동하면서 전해조(2)의 전해액(3)에 침전되면서 도금이 이루어지게 되는데, 이때 이 행거(5)가 안내레일(16)을 따라 이동할 때 상기 행거(5)에 현수된 인쇄회로기판(4)은 전해조(2)의 전해액(3)에 침전되어 승, 하강 가이드(22) 사이를 지나가게 되고, 이와 더불어 상기 전해조(2)의 양측벽에 설치된 전해액 분사노즐(12)들에 의해 분사되는 전해액(3)들로 인쇄회로기판(4)의 표면은 원활한 도금이 이루어진다.The printed circuit board 4 having passed through the cooling unit 11 of the electrolytic cell 2 is thus plated while being deposited in the electrolytic solution 3 of the electrolytic cell 2 while moving in the direction of the arrow of FIG. 2. When 5) moves along the guide rail 16, the printed circuit board 4 suspended on the hanger 5 is precipitated in the electrolyte solution 3 of the electrolytic cell 2 so as to pass between the lifting and lowering guides 22. In addition, the surface of the printed circuit board 4 is smoothly plated with the electrolyte solutions 3 sprayed by the electrolyte injection nozzles 12 provided on both side walls of the electrolytic cell 2.

즉, 도금기판인 인쇄회로기판의 가공 특성상 이 도금기판에 구멍이 나 있을 경우 이 구멍들 사이로 도금액인 전해액의 원활한 공급과 충격을 가해서 전해액의 유체 흐름과 교반을 야기하여 도금편차와 도금불량을 방지하게 되어 있다.That is, in the processing characteristics of a printed circuit board, which is a plated board, if there are holes in the plated board, smooth supply and impact of the electrolytic solution, which is a plating solution, is applied between the holes to cause fluid flow and agitation of the electrolytic solution, thereby preventing plating deviation and plating failure. It is.

이러한 역할을 수행하는 상기 전해액 공급부(14)는 도 3과 도 6 및 도 7에 도시된 바와 같이 전해조(2)의 전해액(3)을 흡입하는 흡입 파이프(23)와, 이 흡입 파이프(23)에 연결된 펌프(24), 상기 펌프(24)를 거친 전해액(3)을 여과하는 여과기(25), 이 펌프(24)를 통해 여과된 전해액을 방출하는 토출 파이프(26), 이 토출 파이프(26)로 공급된 전해액이 공급되는 분배관(27) 및, 상기 분배관(27)에 등간격으로 설치된 여러 개의 분사노즐(12)로 이루어져 있다.The electrolyte supply unit 14 performing this role includes a suction pipe 23 for sucking the electrolyte solution 3 of the electrolytic cell 2 as shown in FIGS. 3, 6, and 7, and the suction pipe 23. A pump 24 connected to the filter 24, a filter 25 for filtering the electrolyte solution 3 passing through the pump 24, a discharge pipe 26 for discharging the electrolyte solution filtered through the pump 24, and the discharge pipe 26. It consists of a distribution pipe 27 is supplied to the electrolyte supplied to the) and a plurality of injection nozzles 12 provided at equal intervals in the distribution pipe (27).

한편, 도 9에는 전해조(2)의 전해액에서 도금 처리되는 인쇄회로기판(4)의 상, 하부쪽에는 마스크 판(28)이 설치되어 있는데, 이 마스크 판(28) 들에 의해서 도금액 흐름이 인쇄회로기판(4)의 상, 하부쪽으로 집중적으로 흐르는 것을 방지하여 균일한 도금작업이 이루어지도록 되어 있다.Meanwhile, in FIG. 9, mask plates 28 are provided on the upper and lower sides of the printed circuit board 4 to be plated by the electrolytic solution of the electrolytic cell 2, and the plating liquid flow is printed by the mask plates 28. The plating is prevented from flowing intensively to the upper and lower portions of the circuit board 4 so that uniform plating is performed.

이와 같이 전해조(3)의 전해액에 침전되면서 분사노즐(12) 들에 의해 분사된 전해액으로 구리도금이 완료된 인쇄회로기판(4)은 후공정인 후처리 공정으로 이송되어 도금이 완료된다.As described above, the printed circuit board 4 having the copper plating completed with the electrolytic solution injected by the injection nozzles 12 while being precipitated in the electrolytic solution of the electrolytic cell 3 is transferred to a post-treatment process, which is a post-process, to complete plating.

상기와 같은 본 발명에 따른 구리 도금장치는 도금기판인 인쇄회로기판(4)을 도금할 때 전해액의 교반작용과 원활한 유체흐름을 유도하여 도금편차를 없애어 균일한 도금이 이루어질 뿐만 아니라 도금불량도 방지할 수 있는 잇점을 갖게 된다.The copper plating apparatus according to the present invention as described above, even when plating the printed circuit board (4) is a plating substrate to induce a stirring action and a smooth fluid flow of the electrolytic solution to eliminate the plating deviation uniform plating as well as poor plating You have the benefit of preventing it.

또한, 도금장비의 모듈화를 실현하여 현장설치 공사시 공사기간 단축과 작업환경의 개선도 이루어지는 효과도 있다.In addition, the modularization of the plating equipment is realized to reduce the construction period and improve the working environment during on-site installation.

Claims (4)

구리동(1)이 전해조(2)의 전해액(3)에 투입되고 전처리 공정을 마친 인쇄회로기판(4)이 행거(5)에 의해 현수 지지되면서 이 전해액(3)에 침전되어 급전부(6)에 의해 공급되는 전기에 의해 전해 분해되어 이 인쇄회로기판(4)에 구리도금이 이루어지는 구리 도금장치에 있어서, Copper copper (1) is introduced into the electrolytic solution (3) of the electrolytic cell (2), and the printed circuit board (4) after the pretreatment process is suspended by the hanger (5) while being precipitated in the electrolytic solution (3) to feed the feed section (6). In the copper plating apparatus which electrolytically decomposes by the electricity supplied by), and copper-plats to this printed circuit board 4, 상기 행거(5)에 현수 지지되면서 전처리 공정을 끝낸 인쇄회로기판(4)이 다시 한번 재세정되기 위해 산세탱크(7)에 침전되는 산세 처리부(8)와, 상기 산세 처리부(8)를 거친 행거(5)의 인쇄회로기판(4)을 승·하강시키는 리프터(9), 상기 리프터(9)에서 인계된 인쇄회로기판(4)의 원활한 도금을 위해 전해액(3)을 적정온도로 냉각 유지시키는 냉각코일(10)을 갖춘 냉각부(11), 이 냉각부(11)를 거친 행거(5)에 보유 지지된 인쇄회로기판(4)을 전해액(3)에서 침전시키면서 전해액 분사노즐(12) 들을 이용하여 인쇄회로기판(4)을 도금하는 전해조(2) 및, 이 전해조(2)의 분사노즐(12)에서 분사되는 전해액(3)을 전해조(2)에서 펌프(13)로 흡입하여 상기 분사노즐(12) 들로 공급하는 전해액 공급부(14)로 이루어진 것을 특징으로 하는 구리 도금장치.The pickling processing unit 8 which is suspended on the hanger 5 and the printed circuit board 4 having finished the pretreatment process is settled in the pickling tank 7 to be washed again, and the hanger which has passed through the pickling processing unit 8. A lifter 9 for raising and lowering the printed circuit board 4 of (5) and cooling and maintaining the electrolyte solution 3 at an appropriate temperature for smooth plating of the printed circuit board 4 taken over by the lifter 9. Cooling unit 11 with cooling coil 10, printed circuit board 4 held in hanger 5 passing through cooling unit 11, and the electrolyte injection nozzles 12 The electrolytic cell 2 for plating the printed circuit board 4 using the electrolytic cell 2, and the electrolytic solution 3 injected from the injection nozzle 12 of the electrolytic cell 2 is sucked into the pump 13 from the electrolytic cell 2 to perform the injection. Copper plating apparatus, characterized in that consisting of the electrolyte supply unit 14 for supplying to the nozzles (12). 제 1항에 있어서, 행거(5)가 안착되는 안내레일(16)을 갖춘 지지대(17)가 보울트 등을 매개로 양쪽 가이드 축(18)과 연결되고 상기 지지대(17)는 모터(19)에 설치된 벨로우즈(20)를 갖춘 랙잭(21)과 연결되어 있어서 상기 모터(19)의 기동에 의해 프레임(30)와 랙잭(21)을 지점으로 양쪽 가이드 축(18)과 지지대(17)는 함께 승, 하강되어 지는 것을 특징으로 하는 구리 도금장치.The support (17) according to claim 1, wherein a support (17) with a guide rail (16) on which the hanger (5) is seated is connected to both guide shafts (18) by means of bolts, and the support (17) is connected to the motor (19). It is connected to the rack jack 21 having the bellows 20 is installed so that both the guide shaft 18 and the support 17 together with the frame 30 and the rack jack 21 by the start of the motor (19). Copper plating apparatus, characterized in that being lowered. 제 1항에 있어서, 전해조(2)의 전해액(3)을 흡입하는 흡입 파이프(23)와, 이 흡입 파이프(23)에 연결된 펌프(24), 상기 펌프(24)를 거친 전해액(3)을 여과하는 여과기(25), 이 펌프(24)를 통해 여과된 전해액을 방출하는 토출 파이프(26), 이 토출 파이프(26)로 공급된 전해액이 공급되는 분배관(27) 및, 상기 분배관(27)에 등간격으로 설치된 여러 개의 분사노즐(12)로 이루어진 것을 특징으로 하는 구리 도금장치.2. The suction pipe (23) for sucking the electrolyte solution (3) of the electrolytic cell (2), the pump (24) connected to the suction pipe (23), and the electrolyte solution (3) passing through the pump (24). A filter 25 for filtration, a discharge pipe 26 for discharging the electrolyte solution filtered through the pump 24, a distribution pipe 27 to which the electrolyte solution supplied to the discharge pipe 26 is supplied, and the distribution pipe ( 27) copper plating device, characterized in that consisting of a plurality of injection nozzles (12) installed at equal intervals. 제 1항에 있어서, 전해조(2)의 전해액에서 도금 처리되는 인쇄회로기판(4)의 상, 하부쪽에는 마스크 판(28)이 설치되어 있는데, 이 마스크 판(28) 들에 의해서 도금액 흐름이 인쇄회로기판(4)의 상, 하부쪽으로 집중적으로 흐르는 것을 방지하는 역할을 하도록 이루어진 것을 특징으로 하는 구리 도금장치.2. The mask plate 28 is provided on the upper and lower sides of the printed circuit board 4, which is plated by the electrolytic solution of the electrolytic cell 2, and the plating liquid flows by the mask plates 28. Copper plating apparatus, characterized in that made to serve to prevent intensive flow to the upper, lower side of the printed circuit board (4).
KR1020040074129A 2004-09-16 2004-09-16 Copper plating apparatus KR100633043B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110042445A (en) * 2019-05-31 2019-07-23 广东华祐新材料有限公司 One kind covering copper equipment and covers copper method
CN110844601A (en) * 2019-12-10 2020-02-28 东莞市鸿展机电设备有限公司 Circuit board wet flow processing device

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Publication number Priority date Publication date Assignee Title
JPS6277494A (en) 1985-10-01 1987-04-09 Hitachi Plant Eng & Constr Co Ltd Plating device for printed circuit board
JP2000256891A (en) 1999-03-04 2000-09-19 Oki Electric Ind Co Ltd Electroplating method and anode structural body

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110042445A (en) * 2019-05-31 2019-07-23 广东华祐新材料有限公司 One kind covering copper equipment and covers copper method
CN110844601A (en) * 2019-12-10 2020-02-28 东莞市鸿展机电设备有限公司 Circuit board wet flow processing device

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