KR20060017053A - Printed circuit board formed optical fiber's buffer and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a printed circuit board (1) in which an optical fiber path (7) in which an optical signal transmission optical fiber (2) is embedded is formed. More specifically, the diameter of the optical fiber (2) is formed at one side of the optical fiber path (7). Forming a buffer portion 8, which is a wider space, buffers the optical fiber 2 so that the optical signal is transmitted without deforming by inducing the bending direction of the optical fiber 2 even when mechanical and thermal external influences act on the optical fiber 2 Provided are a printed circuit board 1 having a section 8 and a method of manufacturing the same.

Printed circuit board, optical fiber

Description

Printed circuit board formed optical fiber's buffer and manufacturing method             

1 is a schematic illustration of the path of light in the optical coupling portion of the printed circuit board 100 according to the prior art.

2 is a cross-sectional view of a printed circuit board 1 in which an optical fiber 2 according to the present invention is embedded.

3 is a cross-sectional view of an embodiment of the straight portion A shown in FIG. 1 in the printed circuit board 1 in which the optical fiber 2 according to the present invention is embedded.

FIG. 4 is a cross-sectional view of an embodiment of the rectangular portion B shown in FIG. 1 in the printed circuit board 1 in which the optical fiber 2 according to the present invention is embedded.

5 is a cross-sectional view of an exemplary embodiment of the curved portion C shown in FIG. 1 in the printed circuit board 1 having the optical fiber 2 according to the present invention.

6 is a flowchart illustrating a method of manufacturing the printed circuit board 1 having the optical fiber 2 buffer part 8 according to the present invention.

<Brief description of symbols for the main parts of the drawings>

1 printed circuit board 2 optical fiber

3: light generator 4: light receiving part

5: upper plate 6: lower plate

7: optical fiber 8: buffer part

A: straight part B: right angle part

C: curve

The present invention relates to a printed circuit board having an optical fiber buffer portion and a method of manufacturing the same, and more particularly, a buffer portion having a wider space than an optical fiber diameter is formed in the inner layer of the printed circuit board, so that an optical signal is deformed even when an external influence is applied to the optical fiber. The present invention relates to a printed circuit board and a method of manufacturing the same.

A printed circuit board (PCB) that is generally used is provided to insert various components by coating a substrate on which a copper thin film circuit is implemented. In recent years, the performance of components mounted on a printed circuit board is improved, and thus, a conventional printed circuit board has a problem in signal transmission because the transfer capability of the substrate does not match the processing capability of the component. In particular, electrical signals that transmit signals to these copper thin film circuits are sensitive to the external environment and generate noise, which is a major obstacle for electronic products requiring high precision. Instead of metallic circuits such as copper, such as printed circuit boards, printed circuit boards using optical fibers have been developed to enable the production of high-precision high-tech equipment that is more stable, such as radio interference and noise.

That is, the optical fiber is installed on one side of the multilayer printed circuit board, and then stacked together with other layers, and both ends of the optical fiber are coupled to the light generator and the light receiving unit for converting electrical signals of the printed circuit board into optical signals. It is. At this time, since the light having a linearity as a signal transmission medium, the coupling structure and alignment should be maintained stably in the light generator, the light receiving unit, and the optical fiber.

However, as shown in FIG. 1, the process of plating and printing is performed in the state in which the optical fiber 101 is embedded inside the optical fiber path 102 of the printed circuit board 100, thereby manufacturing the printed circuit board 100. In addition, the mechanical and thermal external force affects the printed circuit board 100, the optical fiber 101, and the like when used in the equipment. Due to such external force, the optical fiber 101 is mechanically and thermally deformed, and in particular, due to the deformation that is contracted and stretched in the longitudinal direction, problems such as the position, alignment and coupling angle of both ends of the optical fiber 101 are deformed. Is generated. That is, in the optical coupling portion of the printed circuit board 100 which is coupled to the optical generator 103 or the light receiving portion and the optical fiber 101, the light irradiated from the optical generator 103 should enter the optical fiber 101 (r1). ), The alignment between the optical fiber 101 and the light generator 103 is disturbed, so that a part of the light is emitted to the outside (r2), and thus the optical signal is not transmitted, causing malfunction of the high-precision high-tech equipment. Is generated.

The present invention for solving the above problems relates to a printed circuit board formed an optical fiber path in which the optical signal transmission optical fiber is embedded, and more specifically, by forming a buffer portion having a wide space at one side with the optical fiber in which the optical fiber is embedded The present invention relates to a printed circuit board having an optical fiber buffer unit configured to stably transmit an optical signal, and a method of manufacturing the same. The optical signal is transmitted without being deformed.

The present invention for achieving the above object includes a light generator for transmitting the optical signal converted from the electrical signal to the optical fiber, and a light receiving unit for converting the optical signal transmitted from the optical fiber to the electrical signal, the optical fiber is embedded A printed circuit board having an optical fiber path formed therein, wherein a buffer part having a space wider than the optical fiber diameter is provided at one side of the optical fiber path, so that an optical signal generated from the optical generator is not deformed to the light receiving part. Provided is a printed circuit board having an optical fiber buffer.

According to another embodiment of the present invention, in the method of manufacturing a printed circuit board having an optical fiber transmitting an optical signal therein, the optical fiber path is formed on each of the substrate and the substrate, and the substrate and A buffer part forming step of respectively forming a buffer part on one side with the optical fiber of the lower plate, and coupling the plate to the upper side of the lower plate so that the optical fiber is positioned in the optical fiber path between the plate and the lower plate; And setting a light generator on one side of the plate such that one end of the optical fiber between the base plate and the plate is coupled to a light generator, and setting the light generator on the one side of the plate, and the other side of the fiber between the base plate and the plate. A printed circuit board having an optical fiber buffer unit formed by a light receiving unit setting step of placing a light receiving unit on one side of the plate such that an end thereof is coupled to the light receiving unit. It provides a method of manufacturing.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

2 is a cross-sectional view of a printed circuit board 1 having an optical fiber 2 according to the present invention, FIG. 3 is a straight portion A of FIG. 1, FIG. 4 is a right angle portion B, and FIG. 5 is a curved portion. Fig. 6 shows a cross-sectional view of each embodiment, and Fig. 6 shows a flowchart of a method of manufacturing a printed circuit board 1 in which an optical fiber 2, a buffer part 8, according to the present invention is formed.

That is, the printed circuit board 1 having the optical fiber 2, the buffer part 8 according to the present invention, and a manufacturing method thereof, as shown in FIGS. 2 to 5, include a light generator 3, a light receiving part 4, Optical fiber 2;

In general, a printed circuit board 1 formed of a multilayer includes a light generator 3 for converting an electrical signal into an optical signal on one side, and a light receiving unit 4 for converting an optical signal back to an electrical signal on the other side. The photogenerator 3 used generally includes a photodiode such as VCSEL and the like, and the photoreceptor 4 includes a photodiode and the like. The optical fiber 2 is coupled between the light generator 3 and the light receiving portion 4, and the "printed circuit board 1 (electrical signal)-the light generator 3 (electrical-optical signal)-the optical fiber 2 ( Optical signal)-light-receiving portion 4 (photo-electrical signal)-printed circuit board 1 (electrical signal) to form a signal transmission flow.

In addition, an optical fiber path 7 is provided between the upper substrate 5 and the lower substrate 6 of the multilayer printed circuit board 1 to position the optical fiber 2, and then, the optical fiber 2 is laminated during the lamination process. 2) is laminated in the inserted state. At this time, one side of the optical fiber path 7 was formed with a buffer portion 8 which is a wider space than the outer diameter of the optical fiber (2).

At this time, the method of forming the optical fiber paths 7 on the substrate 5 and the substrate 6 of the printed circuit board 1 is formed by etching, and the method using a photoresist pattern is preferable. In addition, the forming of the buffer part 8 in the optical fiber path 7 of the plate 5 and the base plate 6 is to be formed by etching, and also by the photoresist pattern.

In particular, in the optical fiber path 7 thus formed, buffer portions 8 are respectively formed in the straight portion A, the right angle portion B, and the curved portion C, and the cross section of the optical fiber passage 7 is an arc, and The longitudinal section was shaped to suit the respective case. That is, as shown in Figure 3, when formed in the straight portion (A) was provided so that the longitudinal section is a semi-circular or trapezoidal pocket (S1). Thus, when the contracting force is applied from both sides of the optical fiber 2 to the inside, the length of the optical fiber 2 is increased, and thus, the optical fiber 2 has one side of the optical fiber 2 in a pocket type S1 which is a free space of the buffer part 8 below the optical fiber 2. This bending prevented the optical fiber 2 from being pushed in the other direction by the pushing force from one side.

And as shown in Figure 4, in the portion where the optical fiber path (7) longitudinal section is bent at right angles in the right angle portion (B) along the bent optical fiber 2, the inner surface (S2) is more curved, and the outer surface S3 was dug out a lot to form a bag-shaped cross section. Therefore, when contracting force is applied from both sides of the optical fiber 2 to one side, the one side of the optical fiber 2 is stretched, and the one side of the optical fiber 2 is spaced into the space of the buffer part 8 outer surface S3 outside the optical fiber 2. On the contrary, when the tension applied to both sides of the optical fiber 2 acts, the optical fiber 2 is pulled, and one side of the optical fiber 2 is pulled into the inner surface S2 of the buffer part 8 inside the optical fiber 2. .

As shown in FIG. 5, in the curved portion C, the inner surface S4 is inward and the outer surface S5 is plied outward along the curved shape of the bent optical fiber 2. As a result, when the contracting force is applied from both sides of the optical fiber 2 to the inside, the optical fiber 2 is stretched, and one side of the optical fiber 2 is pushed into the space of the buffer part 8 outside the optical fiber 2 outside (S5). When the tension applied to both sides of the optical fiber 2 acts, the optical fiber 2 is pulled, and one side of the optical fiber 2 is pulled into the space S4 of the buffer part 8 inside the optical fiber 2.

Thus, due to mechanical and thermal external influences generated during the manufacture or use of the printed circuit board 1, even if a force in the longitudinal direction acts on the optical fiber 2, the buffer 8 is buffered in the buffer portion 8. That is, even when mechanical and thermal external forces are applied to the printed circuit board 1, the optical fiber 2, and the like, the bending direction of the optical fiber 2 is induced in the buffer part 8, so that the optical generator 3-the optical fiber 2 -The optical signal is transmitted without being deformed because the coupling alignment is maintained at the coupling portion such as the light receiving portion 4 to prevent breakage of the optical fiber 2.

Looking at the manufacturing method of the printed circuit board 1 according to the present invention provided as described above is as shown in FIG. That is, in the method of manufacturing a printed circuit board 1 having an optical fiber 2 for transmitting an optical signal therein, an optical fiber path for forming an optical fiber path 7 on the substrate 5 and the lower substrate 6, respectively. (7) forming step (S1), and buffer part (8) forming step (S2) respectively forming buffer part (8) on one side of the optical fiber path (7) of the plate (5) and the lower plate (6) And coupling the plate 5 to the upper side of the base plate 6 so that the optical fiber 2 is positioned in the optical fiber path 7 between the plate 5 and the base plate 6. A light generator 3 on one side of the plate 5 such that the coupling step S3 and one end of the optical fiber 2 between the base plate 6 and the plate 5 are coupled to the light generator 3. In the step (S4) of setting the light generator (3) for positioning and the other end of the optical fiber (2) between the base plate (6) and the plate (5) is coupled to the light receiving portion (4). 5) A light receiving unit for positioning the light receiving unit 4 on one side ( 4) By the setting step S5, the printed circuit board 1 on which the optical fiber 2 buffer part 8 is formed is manufactured.

In this case, the buffer part 8 is formed on the plate 5 and the lower plate 6 by etching, and in particular, the photoresist pattern is preferably used. The shock absorbing portion 8 is formed by forming a straight portion A, a right angle portion B, a curved portion C, and the like of the optical fiber path 7.

Embodiments as described above are merely for illustrating the present invention, it is apparent to those skilled in the art that various modifications are possible without departing from the scope of the present invention, the protection of the present invention The range is not limited by these examples.

According to the present invention provided as described above, the optical fiber 2 having the optical fiber 2 for printing is formed with the optical fiber 2 having the buffer portion 8 formed with the buffer portion 8 which is a wide space on one side of the optical fiber path 7 embedded therein. The present invention relates to a circuit board (1) and a method of manufacturing the same, wherein the bending direction of the optical fiber (2) is induced even when the mechanical and thermal external influences generated during the manufacture or use of the printed circuit board (1) act on the optical fiber (2). This allows the call to be transmitted without being deformed.

Claims (10)

An optical fiber 2 for transmitting an optical signal, An optical generator 3 for transmitting the optical signal converted from the electrical signal to the optical fiber 2; In the printed circuit board 1 including a light receiving unit 4 for converting an optical signal transmitted from the optical fiber 2 into an electrical signal, the optical fiber path 7 in which the optical fiber 2 is embedded is formed inside, A printed circuit board (1) having an optical fiber (2) buffer portion (8), characterized in that the buffer portion (8) having a space wider than the diameter of the optical fiber (2) on one side of the optical fiber path (7). The method of claim 1, The buffer part (8) is a printed circuit board (1) having an optical fiber (2) buffer part (8), characterized in that formed by etching. The method according to claim 1 or 2, The buffer part (8) is a printed circuit board (1) formed with the optical fiber (2) buffer part (8), characterized in that formed in the straight portion (A) of the optical fiber path (7). The method according to claim 1 or 2, The printed circuit board (1) having the optical fiber (2) buffer unit (8), characterized in that the buffer portion (8) is formed in a right angle portion (B) of the optical fiber path (7). The method according to claim 1 or 2, The buffer part (8) is a printed circuit board (1) having an optical fiber (2) buffer part (8), characterized in that formed in the curved portion (C) of the optical fiber path (7). In the manufacturing method of a printed circuit board (1) provided with an optical fiber (2) for transmitting an optical signal therein, An optical fiber path (7) forming step (S1) of forming an optical fiber path (7) on the upper plate (5) and the lower plate (6), Forming a buffer unit 8 for forming a buffer unit 8 on one side of the optical fiber path 7 of the plate 5 and the lower plate 6, and S2; The optical fiber (2) is located in the optical fiber path (7), the coupling step (S3) for coupling the plate 5 to the upper side of the base plate 6, An optical generator for positioning the light generator 3 on one side of the plate 5 such that one end of the optical fiber 2 between the base plate 6 and the plate 5 is coupled to the light generator 3 ( 3) a setting step (S4), Setting the light receiving unit 4 to position the light receiving unit 4 on one side of the plate 5 so that the other end of the optical fiber 2 between the base plate 6 and the plate 5 is coupled to the light receiving unit 4. A method of manufacturing a printed circuit board (1) having an optical fiber (2) buffer part (8), characterized in that it comprises a step (S5). The method of claim 6, In the step S2 of forming the buffer part 8, the printed circuit board having the optical fiber 2 buffer part 8 formed by etching the buffer part 8 on one side of the optical fiber path 7. The manufacturing method of (1). The method according to claim 6 or 7, And the buffer part (8) is formed in a straight portion (A) of the optical fiber path (7). The method according to claim 6 or 7, The buffer section (8) is a manufacturing method of a printed circuit board (1) is formed in the optical fiber (2) buffer section (8), characterized in that formed in the right angle (B) of the optical fiber path (7). The method according to claim 6 or 7, And the buffer part (8) is formed in the curved part (C) of the optical fiber path (7).

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