KR20060008160A - Mechanical power transmission apparatus for semiconductor equipment - Google Patents

Mechanical power transmission apparatus for semiconductor equipment Download PDF

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Publication number
KR20060008160A
KR20060008160A KR1020040057857A KR20040057857A KR20060008160A KR 20060008160 A KR20060008160 A KR 20060008160A KR 1020040057857 A KR1020040057857 A KR 1020040057857A KR 20040057857 A KR20040057857 A KR 20040057857A KR 20060008160 A KR20060008160 A KR 20060008160A
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KR
South Korea
Prior art keywords
power transmission
contact surface
drive
transmission device
belt
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KR1020040057857A
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Korean (ko)
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손성국
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삼성전자주식회사
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Priority to KR1020040057857A priority Critical patent/KR20060008160A/en
Publication of KR20060008160A publication Critical patent/KR20060008160A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2812/00—Indexing codes relating to the kind or type of conveyors
    • B65G2812/02—Belt or chain conveyors
    • B65G2812/02128—Belt conveyors
    • B65G2812/02138—Common features for belt conveyors
    • B65G2812/02168—Belts provided with guiding means, e.g. rollers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

게시된 반도체 설비용 동력전달장치는 돌출된 삼각형 형상의 하면을 갖는 구동밸트와 구동밸트 하면이 끼워져 회전될 수 있도록 삼각형형상으로 파여진 접촉면을 갖되, 회전축을 경계로 대응되게 형성된 접촉면이 형성된 접촉몸체를 갖는 구동롤러를 구비한다.The disclosed power transmission device for semiconductor equipment has a driving belt having a protruding triangular lower surface and a contact surface formed in a triangular shape so that the lower surface of the driving belt can be inserted and rotated, and a contact body having a contact surface formed corresponding to the rotation axis. It has a drive roller having a.

구동롤러, 구동밸트, 틀어짐Drive roller, drive belt, twist

Description

반도체 설비용 동력전달장치{Mechanical Power Transmission Apparatus for Semiconductor Equipment}Mechanical Power Transmission Apparatus for Semiconductor Equipment

도 1은 종래의 반도체 설비용 동력전달장치를 보여주는 단면도,1 is a cross-sectional view showing a power transmission device for a conventional semiconductor equipment;

도 2는 본 발명의 반도체 설비용 동력전달장치를 보여주는 단면도이다.2 is a cross-sectional view showing a power transmission device for semiconductor equipment of the present invention.

< 도면의 주요부분에 대한 부호의 설명 ><Description of Symbols for Major Parts of Drawings>

200 : 구동롤러 210 : 접촉몸체200: driving roller 210: contact body

211 : 접촉면 250 : 구동밸트211: contact surface 250: drive belt

본 발명은 반도체 설비용 동력전달장치에 관한 것으로써, 보다 상세하게는 소정의 동력을 받아 회전하는 구동롤러에 연결되어 회전하는 구동밸트의 틀어짐을 방지하도록 한 반도체 설비용 동력전달장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power transmission device for semiconductor equipment, and more particularly, to a power transmission device for semiconductor equipment that is connected to a rotating driving roller by a predetermined power to prevent twisting of a rotating driving belt.

일반적으로, 반도체 설비중 예컨데, 웨이퍼 정렬장치에서, 웨이퍼 에지부를 정렬하기위해 웨이퍼 원주면에 접촉되어 회전하는 회전롤러를 회전시키기 위하여 롤러 축과 연결되어 동력을 전달하는 동력전달장치가 설치된다.In general, in semiconductor equipment, for example, in a wafer aligning device, a power transmission device is provided which is connected to a roller shaft and transmits power to rotate a rotating roller which contacts and rotates a wafer circumferential surface to align a wafer edge portion.

도 1은 종래의 동력전달장치를 보여주는 도면이다. 1 is a view showing a conventional power transmission device.                         

도 1을 참조하면, 상기 동력전달장치는 회전축(C)에 연결되어 모터등의 동력수단(미도시)으로부터 동력을 전달받아 회전하는 구동롤러(100)와, 상기 구동롤러(100)의 접촉면(111)에 접촉되어 다른 측으로 동력을 전달하는 수단인 구동밸트(150)가 설치된다.Referring to Figure 1, the power transmission device is connected to the rotating shaft (C) drive roller 100 is rotated by receiving power from a power means (not shown), such as a motor, the contact surface of the drive roller 100 ( The driving belt 150, which is a means for contacting 111 and transmitting power to the other side, is installed.

그러나, 상기와 같이 접촉몸체(110)의 접촉면(111)에 구동밸트(150)가 접촉되어 설치된 상태로 장시간 공정을 진행하다 보면, 결국 구동롤러(100)의 접촉면(111)에 접촉되어 설치된 구동밸트(150)가 일측으로 틀어지는 결과를 초래한다.However, if the driving belt 150 is in contact with the contact surface 111 of the contact body 110 and installed for a long time as described above, the drive is installed in contact with the contact surface 111 of the drive roller 100. This results in the belt 150 twisting to one side.

따라서, 구동롤러(100)의 접촉면(111)과 구동밸트(150)의 설치 위치가 불균형해짐에 따라 서로가 변칙적인 운동을 하게되어 구동밸트(150)와 구동롤러(100)의 접촉면(111)이 부분적으로 마모가 발생하게 되고, 그로인해 구동밸트(150)와 구동롤러(100)의 사용수명이 짧아지는 문제점이 있었다.Accordingly, as the contact surface 111 of the drive roller 100 and the installation position of the drive belt 150 become unbalanced, the anomalous movements are performed with each other, so that the contact surface 111 of the drive belt 150 and the drive roller 100 are moved. This partial wear occurs, thereby shortening the service life of the driving belt 150 and the driving roller 100.

따라서, 본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로써, 본 발명의 목적은 구동롤러의 구동밸트 접촉면을 오목한 형상 또는 삼각형 형상으로 파이게 형성하여 구동밸트를 끼움으로써 구동롤러 구동시 구동밸트가 어느 한측으로 틀어지는 것을 방지하고, 구동밸트의 사용 수명을 연장시킬 수 있는 반도체 설비용 동력전달장치를 제공하는데 있다. Therefore, the present invention has been made in order to solve the above problems, the object of the present invention is to drive the drive roller driving by inserting the drive belt by forming the drive belt contact surface of the drive roller in a concave or triangular shape. It is to provide a power transmission device for a semiconductor device that can prevent the belt from twisting to either side and extend the service life of the drive belt.

본 발명의 반도체 설비용 동력전달장치는 구동밸트와; 상기 구동밸트의 일면 의 소정부분을 끼워서 결합시키고, 상기 구동밸트의 양측면이 틀어지지 않도록 지지하는 소정형상의 접촉몸체를 갖는 구동롤러를 포함한다.The power transmission device for semiconductor equipment of the present invention includes a drive belt; It includes a drive roller having a contact body of a predetermined shape to couple the predetermined portion of one side of the drive belt, and to support both sides of the drive belt so as not to be twisted.

여기서, 상기 구동롤러의 상기 접촉몸체는 중심부가 오목하게 형성된 접촉면을 갖고, 회전축을 경계로 대응되게 형성된 것이 바람직하다.Here, the contact body of the drive roller has a contact surface formed in the center concave, it is preferably formed corresponding to the boundary of the rotation axis.

그리고, 상기 구동밸트 일면의 소정부분은 상기 구동롤러의 상기 접촉면에 끼워져 결합되도록 볼록하게 형성된 중심부인 것이 바람직하다.And, the predetermined portion of one side of the drive belt is preferably a central portion formed convex to be fitted to the contact surface of the drive roller.

또한, 상기 구동롤러의 상기 접촉몸체 중심부는 적어도 하나의 꼭지점을 갖도록 파여져 형성된 접촉면을 갖고, 회전축을 경계로 대응되게 형성된 것이 바람직하다.In addition, the center of the contact body of the drive roller has a contact surface formed to be dug to have at least one vertex, preferably formed to correspond to the axis of rotation.

여기서, 상기 접촉면은 중심부가 파여져 형성되되, 삼각형 형상인 것이 바람직하다.Here, the contact surface is formed by digging a central portion, it is preferable that the triangular shape.

이하, 첨부된 도면을 참조로 하여 본 발명에 따르는 바람직한 실시예를 설명하도록 한다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

도 2는 본 발명의 반도체 설비용 동력전달장치를 보여주는 단면도이다.2 is a cross-sectional view showing a power transmission device for semiconductor equipment of the present invention.

도 2를 참조로 하여, 본 발명에 따르는 바람직한 실시예를 설명하도록 한다.2, a preferred embodiment according to the present invention will be described.

본 발명의 동력전달장치는 하면 중심부가 하나의 돌출된 꼭지점을 갖도록 형성된 구동밸트(250)와, 상기 구동밸트(250)의 하면이 끼워져 회전될 수 있도록 접촉몸체(210)를 갖는 구동롤러(200)로 구성된다.The power transmission apparatus of the present invention has a driving roller 250 having a lower center of the center and a driving roller 250 having a contact body 210 so that the lower surface of the driving belt 250 is inserted and rotated. It is composed of

그리고, 구동롤러(200)의 접촉몸체(210)는 상기 구동밸트(250)의 하면과 상응하는 형상으로 중심부에 하나의 꼭지점을 갖는 삼각형 형상으로 파여진 접촉면(211)을 갖고, 또한, 회전축(C)을 경계로 대응되게 형성된다.Then, the contact body 210 of the drive roller 200 has a contact surface 211 is excavated in a triangular shape having one vertex at the center in the shape corresponding to the bottom surface of the drive belt 250, and also, the rotating shaft ( C) is formed to correspond to the boundary.

따라서, 모터등의 동력수단을 통해 동력을 전달받아 구동롤러(200)가 회전하는 경우, 구동밸트(250)의 하면 꼭지점이 구동롤러(200) 접촉면(211) 꼭지점에 끼워져 결합된 상태에서 회전함으로 구동밸트(250) 양측면이 틀어지는 것을 방지할 수 있다.Therefore, when the driving roller 200 is rotated by receiving power through a power means such as a motor, the lower surface of the driving belt 250 rotates in a state in which it is fitted to the vertex of the contact surface 211 of the driving roller 200. Both sides of the driving belt 250 may be prevented from twisting.

또한, 도면에는 도시되지 않았지만, 구동롤러의 접촉면 형상은 중시부가 파여지게 형성되되 둘 또는 새개의 꼭지점을 갖도록 형성되고, 구동밸트 하면도 끼워져 결합될 수 있도록 이에 상응하는 형상으로 형성될 수도 있다.In addition, although not shown in the drawing, the contact surface shape of the driving roller is formed so that the central portion is dug, it may be formed to have two or new vertices, and may be formed in a corresponding shape so that the lower side of the driving belt can also be fitted.

한편, 구동롤러의 접촉면을 상기와 같이 꼭지점을 갖지 않더라도 중심부에서 오목한 형상으로 형성되고, 구동밸트 역시 접촉면에 끼워져 결합될 수 있도록 볼록한 형상으로 형성 될 수도 있다.On the other hand, even if the contact surface of the drive roller does not have a vertex as described above, it is formed in a concave shape in the center, the drive belt may also be formed in a convex shape to be coupled to the contact surface.

상기와 같은 구성을 갖는 본 발명에 의하면, 반도체 제조설비에서 모터등의 동력수단에 의해 동력을 얻어 임의의 속도로 회전하는 구동롤러에 있어서, 구동롤러 상의 접촉면에 삼각형 형상으로 파여진 부분에 끼워져 회전되는 구동뱉트를 설치함으로써, 구동롤러 회전시 구동롤러가 측면으로 틀어짐으로써 서로 변칙적인 운동을 한느 것을 방지할 수 있고, 또한, 그로인해 부분적으로 마모가 발생하는 것을 방지할 수 있는 효과가 있다.According to the present invention having the above-described configuration, in a driving roller that is rotated at an arbitrary speed by being powered by a power means such as a motor in a semiconductor manufacturing facility, the roller is inserted into and rotated in a triangular shape on a contact surface on the driving roller. By providing a drive spit, the drive rollers are twisted laterally during rotation of the drive rollers, thereby preventing anomalous movements from each other, and thereby preventing partial wear from occurring.

따라서, 제품 수명을 연장시킴과 아울러 설비 유지비용을 절감하는데 큰 효과가 있다.Therefore, there is a great effect in extending the life of the product and at the same time reducing the equipment maintenance cost.

Claims (5)

구동밸트;Driving belt; 상기 구동밸트의 일면의 소정부분을 끼워서 결합시키고, 상기 구동밸트의 양측면이 틀어지지 않도록 지지하는 소정형상의 접촉몸체를 갖는 구동롤러를 포함하는 것을 특징으로 하는 반도체 설비용 동력전달장치.And a driving roller having a contact body of a predetermined shape for fitting and coupling a predetermined portion of one surface of the driving belt and supporting both sides of the driving belt so as not to be distorted. 제 1항에 있어서,The method of claim 1, 상기 구동롤러의 상기 접촉몸체는 중심부가 오목하게 형성된 접촉면을 갖고, 회전축을 경계로 대응되게 형성된 것을 특징으로 하는 반도체 설비용 동력전달장치.The contact body of the drive roller has a contact surface formed in the center concave, the power transmission device for a semiconductor equipment, characterized in that formed to correspond to the axis of rotation. 제 2항에 있어서,The method of claim 2, 상기 구동밸트 일면의 소정부분은 상기 구동롤러의 상기 접촉면에 끼워져 결합되도록 볼록하게 형성된 중심부인 것을 특징으로 하는 반도체 설비용 동력전달장치.The predetermined portion of one surface of the drive belt is a power transmission device for a semiconductor device, characterized in that the central portion formed convex to be fitted to the contact surface of the drive roller. 제 1항에 있어서,The method of claim 1, 상기 구동롤러의 상기 접촉몸체 중심부는 적어도 하나의 꼭지점을 갖도록 파여져 형성된 접촉면을 갖고, 회전축을 경계로 대응되게 형성된 것을 특징으로 하는 반도체 설비용 동력전달장치.The center of the contact body of the drive roller has a contact surface formed by digging to have at least one vertex, the power transmission device for a semiconductor device, characterized in that formed corresponding to the axis of rotation. 제 4항에 있어서,The method of claim 4, wherein 상기 접촉면은 중심부가 파여져 형성되되, 삼각형 형상인 것을 특징으로 하는 반도체 설비용 동력전달장치.The contact surface is formed by digging a central portion, power transmission device for semiconductor equipment, characterized in that the triangular shape.
KR1020040057857A 2004-07-23 2004-07-23 Mechanical power transmission apparatus for semiconductor equipment KR20060008160A (en)

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