KR20050113872A - Hybrid module - Google Patents

Hybrid module Download PDF

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Publication number
KR20050113872A
KR20050113872A KR1020040039002A KR20040039002A KR20050113872A KR 20050113872 A KR20050113872 A KR 20050113872A KR 1020040039002 A KR1020040039002 A KR 1020040039002A KR 20040039002 A KR20040039002 A KR 20040039002A KR 20050113872 A KR20050113872 A KR 20050113872A
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South Korea
Prior art keywords
terminal
solder ball
hybrid module
conductor
pcb
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KR1020040039002A
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Korean (ko)
Inventor
김관우
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엘지이노텍 주식회사
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Priority to KR1020040039002A priority Critical patent/KR20050113872A/en
Publication of KR20050113872A publication Critical patent/KR20050113872A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

볼 그리드 어레이(Ball Grid Array) 패키지와 인쇄회로기판의 접합구조를 개선한 하이브리드 모듈이 개시된다. 상기 하이브리드 모듈은 하면에 구(球)형의 솔더 볼이 배열된 BGA(Ball Grid Array) 패키지, 상기 솔더 볼(Solder Ball)이 탑재되어 접합되는 단자가 압입되어 설치되고 자신의 상면과 하면을 전기적으로 연결하는 컨덕터가 압입되어 설치된 PCB(Printed Circuit Board)를 구비하는 하이브리드 모듈에 있어서, 상기 단자는 상기 솔더 볼의 일측이 삽입되어 안치되도록 상기 솔더 볼의 직경 보다 작은 내경을 가지는 상하면이 개방된 원통형으로 마련되고, 상기 컨덕터는 상기 단자의 내측에 압입되되, 상기 컨덕터와 상기 솔더 볼은 접촉되지 않는다. 상기 하이브리드 모듈은 솔더 볼이 탑재되어 접합되는 단자가 상하면이 개방된 원통형으로 마련되고, 솔더 볼의 하단부 일측이 단자의 상단부측 내부에 삽입되어 접합되므로 BGA 패키지와 PCB는 상호 정확하면서 안정되게 정렬된다. 그리고, PCB의 상하면을 전기적으로 연결하기 위한 컨덕터를 단자의 내측에 압입하면 되므로 컨덕터를 압입하기 별도의 비아홀을 형성할 필요가 없다. 그러므로, 제조공정이 단축된다.Disclosed is a hybrid module that improves a bonding structure of a ball grid array package and a printed circuit board. The hybrid module has a ball grid array (BGA) package in which a spherical solder ball is arranged on a lower surface thereof, and a terminal to which the solder ball is mounted and bonded is press-fitted, and the upper and lower surfaces of the hybrid module are electrically mounted. In a hybrid module having a printed circuit board (PCB) installed by pressing a conductor connected to the connector, the terminal has a cylindrical upper and lower surface having an inner diameter smaller than the diameter of the solder ball so that one side of the solder ball is inserted The conductor is pressed into the inside of the terminal, but the conductor and the solder ball do not contact. The hybrid module has a terminal in which solder balls are mounted and bonded to each other, and the upper and lower sides of the terminal are provided in an open cylindrical shape, and a lower end of the solder ball is inserted into and bonded to the upper end of the terminal so that the BGA package and the PCB are aligned precisely and stably. . In addition, since the conductor for electrically connecting the upper and lower surfaces of the PCB may be press-fitted into the inside of the terminal, there is no need to form a separate via hole to press-in the conductor. Therefore, the manufacturing process is shortened.

Description

하이브리드 모듈 {HYBRID MODULE}Hybrid module {HYBRID MODULE}

본 발명은 볼 그리드 어레이(Ball Grid Array : 이하 "BGA"라 함) 패키지와 인쇄회로기판(Printed Circuit Board : 이하 "PCB"라 함)의 접합구조를 개선한 하이브리드 모듈(Hybrid Module)에 관한 것이다.The present invention relates to a hybrid module having an improved junction structure between a ball grid array package (hereinafter referred to as "BGA") package and a printed circuit board (hereinafter referred to as "PCB"). .

오늘날, 전자기기의 소형화, 박형화 및 다기능화에 따라 많은 양의 정보를 빠른 시간에 처리할 수 있는 고집적화된 반도체칩이 요구되고 있다. 이에 부응하여 많은 수의 입출력을 갖는 소형의 반도체패키지를 제조하기 위한 기술에 많은 노력을 쏟고 있고, 이러한 노력의 결과로 솔더 볼(Solder Ball)을 이용하여 BGA 패키지와 PCB를 접합하여 하이브리드 모듈을 제조하는 기술이 개발되었다.Today, with the miniaturization, thinning, and multifunction of electronic devices, there is a demand for highly integrated semiconductor chips capable of processing a large amount of information in a short time. In response to this, much effort has been put into the technology for manufacturing a small semiconductor package having a large number of input and output, and as a result of this effort, a hybrid module is manufactured by bonding a BGA package and a PCB using a solder ball. Technology has been developed.

도 1은 종래의 하이브리드 모듈의 개략적 구성을 보인 도로써, 이를 설명한다.1 is a view showing a schematic configuration of a conventional hybrid module, it will be described.

도시된 바와 같이, 하이브리드 모듈(10)은 상호 접합된 BGA 패키지(20)와 PCB(30)로 구성된다. BGA 패키지(20)는 기판(21), 기판(21)의 상면에 접착된 반도체칩(23), 기판(21)에 형성된 도전성 패턴과 반도체칩(23)을 접속시키는 와이어(25), 반도체칩(23)과 와이어(25)를 덮는 형태로 코팅된 수지(27) 및 기판(21)의 하면에 매트릭스형태로 배열된 구(球)형의 솔더 볼(29)을 가진다. 그리고, PCB(30)에는 단자(31)와 컨덕터(Conductor)(33)가 압입되어 설치된다. 단자(31)는 솔더 볼(29)과 대응되게 마련되어 솔더 볼(29)이 탑재된 후 납땜되어 접합되고, 컨덕터(33)는 단자(31)와 접속되어 PCB(30)의 상면과 하면을 전기적으로 연결한다.As shown, the hybrid module 10 is composed of a BGA package 20 and a PCB 30 bonded to each other. The BGA package 20 includes a substrate 21, a semiconductor chip 23 bonded to an upper surface of the substrate 21, a wire 25 connecting the conductive pattern formed on the substrate 21 and the semiconductor chip 23, and a semiconductor chip. The resin 27 coated in the form of covering the 23 and the wire 25 and the spherical solder balls 29 arranged in a matrix form on the lower surface of the substrate 21. In addition, a terminal 31 and a conductor 33 are press-fitted to the PCB 30. The terminal 31 is provided so as to correspond to the solder ball 29, and the solder ball 29 is mounted and soldered thereon, and the conductor 33 is connected to the terminal 31 to electrically connect the upper and lower surfaces of the PCB 30. Connect with

상기와 같은 종래의 하이브리드 모듈(10)은 단자(31)의 상하면이 편평한 평면으로 형성되므로 BGA 패키지(20)의 솔더 볼(29)을 단자(31)의 상면에 탑재한 후 열을 가하여 솔더 볼(29)을 단자(31)에 납땜하여 접합할 때, 조그마한 충격 등에 의하여 BGA 패키지(20)와 PCB(30)의 정렬이 어긋나게 된다. 이로인해, 전기적으로 연결되지 않아야 할 단자(31)들이 상호 연결되는 단점이 있다.In the conventional hybrid module 10 as described above, since the upper and lower surfaces of the terminal 31 are formed in a flat plane, the solder ball 29 of the BGA package 20 is mounted on the upper surface of the terminal 31 and then heated to apply the solder ball. When soldering (29) to the terminal 31 for joining, the alignment of the BGA package 20 and the PCB 30 are misaligned due to a small impact or the like. This has the disadvantage that the terminals 31 which are not to be electrically connected are interconnected.

또한, PCB(30)의 상면과 하면을 전기적으로 연결하기 위해서는 컨덕터(33)가 압입되는 비아홀(33a)을 PCB(30)에 별도로 형성하여야 하므로 제조공정이 복잡한 단점이 있다.In addition, in order to electrically connect the upper surface and the lower surface of the PCB 30, the via hole 33a into which the conductor 33 is press-fitted must be separately formed in the PCB 30, which is a complicated manufacturing process.

본 발명은 상기와 같은 종래 기술의 문제점을 해소하기 위하여 안출된 것으로, 본 발명의 목적은 PCB에 설치된 단자를 상하면이 개방된 원통형으로 형성하여 BGA 패키지와 PCB를 정확하고 안정되게 정렬할 수 있을 뿐만 아니라 PCB의 상면과 하면을 간편하게 전기적으로 연결할 수 있는 하이브리드 모듈을 제공함에 있다.The present invention has been made in order to solve the problems of the prior art as described above, the object of the present invention is to form a terminal with a top and bottom open cylindrical to the PCB can be accurately and stably aligned with the BGA package. Rather, it provides a hybrid module that allows easy electrical connection between the top and bottom of the PCB.

상기 목적을 달성하기 위한 본 발명에 따른 하이브리드 모듈은, 하면에 구(球)형의 솔더 볼이 배열된 BGA(Ball Grid Array) 패키지, 상기 솔더 볼(Solder Ball)이 탑재되어 접합되는 단자가 압입되어 설치되고 자신의 상면과 하면을 전기적으로 연결하는 컨덕터가 압입되어 설치된 PCB(Printed Circuit Board)를 구비하는 하이브리드 모듈에 있어서,Hybrid module according to the present invention for achieving the above object, a ball grid array (BGA) package in which a sphere-shaped solder ball is arranged on the lower surface, the terminal to which the solder ball (Solder Ball) is mounted and bonded In the hybrid module having a PCB (Printed Circuit Board) is installed by pressing the conductor is electrically connected to the upper and lower surfaces of the installation,

상기 단자는 상기 솔더 볼의 일측이 삽입되어 안치되도록 상기 솔더 볼의 직경 보다 작은 내경을 가지는 상하면이 개방된 원통형으로 마련되고, 상기 컨덕터는 상기 단자의 내측에 압입되되, 상기 컨덕터와 상기 솔더 볼은 접촉되지 않는다.The terminal has a cylindrical shape having an upper and lower surfaces having an inner diameter smaller than the diameter of the solder ball so that one side of the solder ball is inserted and placed therein, and the conductor is pressed into the inside of the terminal, but the conductor and the solder ball are No contact

이하, 첨부한 도면을 참조하여 본 발명의 일 실시예에 따른 하이브리드 모듈을 상세히 설명한다.Hereinafter, a hybrid module according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 일 실시예에 따른 하이브리드 모듈의 개략적 구성을 보인 도이고, 도 3은 도 2에 도시된 단자의 사시도이다.2 is a view showing a schematic configuration of a hybrid module according to an embodiment of the present invention, Figure 3 is a perspective view of the terminal shown in FIG.

도시된 바와 같이, PDP의 CPU 등에 사용되는 하이브리드 모듈(100)은 상호 접합된 BGA(Ball Grid Array) 패키지(110)와 PCB(Printed Circuit Board)(120)로 구성된다.As shown, the hybrid module 100 used in the CPU of the PDP is composed of a ball grid array (BGA) package 110 and a printed circuit board (PCB) 120 bonded to each other.

BGA 패키지(110)는 기판(111), 기판(111)의 상면에 접착된 반도체칩(113), 기판(111)에 형성된 도전성 패턴과 반도체칩(113)을 접속시키는 와이어(115), 반도체칩(113)과 와이어(115)를 덮는 형태로 코팅되어 반도체칩(113)과 상기 도전성 패턴을 보호하는 수지(117) 및 기판(111)의 하면에 매트릭스형태로 배열되어 PCB(120)에 접합되는 구(球)형의 솔더 볼(119)을 가진다.The BGA package 110 includes a substrate 111, a semiconductor chip 113 bonded to an upper surface of the substrate 111, a wire 115 connecting the conductive pattern formed on the substrate 111 and the semiconductor chip 113, and a semiconductor chip. (113) and the wire 115 is coated to cover the semiconductor chip 113 and the resin 117 and the lower surface of the substrate 111 to protect the conductive pattern is arranged in a matrix form bonded to the PCB 120 It has a spherical solder ball 119.

그리고, 회로가 형성된 PCB(120)에는 솔더 볼(119)과 대응되게 결합공(121)이 형성되고, 결합공(121)에는 솔더 볼(119)이 탑재된 후 열이 가해지면 납땜되어 접합되는 단자(123)가 압입되어 설치된다. 본 실시예에 따른 단자(123)는 상하면이 개방된 원통형으로 마련되는데, 이때 단자(123)의 내경(D1)은 솔더 볼(119)의 직경(D2)보다 작게 마련된다. 그러면, 솔더 볼(119)의 하단부 일측이 단자(123)의 상단부 내측에 삽입되어 지지되므로 BGA 패키지(110)와 PCB(120)는 상호 정확하면서도 안정되게 정렬된다. 그리고, PCB(120)의 상하면을 전기적으로 연결하고자 할 경우에는, 단자(123)의 내측에 컨덕터(Conductor)(125)를 압입하고, 컨덕터(125)와 PCB(120)의 회로를 적절하게 연결하여 PCB(120)의 상면 및 하면을 전기적으로 연결한다. 이때, 컨덕터(125)는 단자(123) 보다 낮게 형성되어 솔더 볼(119)이 접촉되지 않도록 구성된다.In addition, a coupling hole 121 is formed in the PCB 120 where the circuit is formed to correspond to the solder ball 119, and the solder hole 119 is soldered and joined when heat is applied after the solder ball 119 is mounted on the coupling hole 121. The terminal 123 is pressed in and installed. The terminal 123 according to the present exemplary embodiment is provided in a cylindrical shape having an upper and lower surface open. In this case, the inner diameter D1 of the terminal 123 is smaller than the diameter D2 of the solder ball 119. Then, since one side of the lower end of the solder ball 119 is inserted and supported inside the upper end of the terminal 123, the BGA package 110 and the PCB 120 are aligned with each other accurately and stably. In addition, when the upper and lower surfaces of the PCB 120 are to be electrically connected, a conductor 125 is pressed into the inside of the terminal 123, and the circuit of the conductor 125 and the PCB 120 is properly connected. To electrically connect the upper and lower surfaces of the PCB 120. At this time, the conductor 125 is formed lower than the terminal 123 is configured so that the solder ball 119 is not in contact.

이상에서 설명한 바와 같이, 본 발명에 따른 하이브리드 모듈은 솔더 볼이 탑재되어 접합되는 단자가 상하면이 개방된 원통형으로 마련되고, 솔더 볼의 하단부 일측이 단자의 상단부측 내부에 삽입되어 접합되므로 BGA 패키지와 PCB는 상호 정확하면서 안정되게 정렬된다.As described above, the hybrid module according to the present invention has a cylindrical shape in which the upper and lower sides of the terminal to which the solder balls are mounted and joined are provided in a cylindrical shape, and the lower end of the solder ball is inserted into the upper end of the terminal and bonded to the BGA package. PCBs are aligned precisely and stably with each other.

그리고, PCB의 상하면을 전기적으로 연결하기 위한 컨덕터를 단자의 내측에 압입하면 되므로 컨덕터를 압입하기 별도의 비아홀을 형성할 필요가 없다. 그러므로, 제조공정이 단축된다.In addition, since the conductor for electrically connecting the upper and lower surfaces of the PCB may be press-fitted into the inside of the terminal, there is no need to form a separate via hole to press-in the conductor. Therefore, the manufacturing process is shortened.

이상에서는, 본 발명의 일 실시예에 따라 본 발명을 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 변경 및 변형한 것도 본 발명에 속함은 당연하다.In the above, the present invention has been described in accordance with one embodiment of the present invention, but those skilled in the art to which the present invention pertains have been changed and modified without departing from the spirit of the present invention. Of course.

도 1은 종래의 하이브리드 모듈의 개략적 구성을 보인 도.1 is a view showing a schematic configuration of a conventional hybrid module.

도 2는 본 발명의 일 실시예에 따른 하이브리드 모듈의 개략적 구성을 보인 도.Figure 2 shows a schematic configuration of a hybrid module according to an embodiment of the present invention.

도 3은 도 2에 도시된 단자의 사시도.3 is a perspective view of the terminal shown in FIG.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on main parts of drawing

110 : BGA 패키지 119 : 솔더 볼110: BGA Package 119: Solder Ball

120 : PCB 123 : 단자120: PCB 123: terminal

Claims (1)

하면에 구(球)형의 솔더 볼이 배열된 BGA(Ball Grid Array) 패키지, 상기 솔더 볼(Solder Ball)이 탑재되어 접합되는 단자가 압입되어 설치되고 자신의 상면과 하면을 전기적으로 연결하는 컨덕터가 압입되어 설치된 PCB(Printed Circuit Board)를 구비하는 하이브리드 모듈에 있어서,BGA (Ball Grid Array) package in which spherical solder balls are arranged on the lower surface, and terminals to which the solder ball is mounted and joined are press-fitted and electrically connected to their upper and lower surfaces. In the hybrid module having a printed circuit board (PCB) is pressed and installed, 상기 단자는 상기 솔더 볼의 일측이 삽입되어 안치되도록 상기 솔더 볼의 직경 보다 작은 내경을 가지는 상하면이 개방된 원통형으로 마련되고,The terminal is provided in a cylindrical shape of the upper and lower surfaces having an inner diameter smaller than the diameter of the solder ball so that one side of the solder ball is inserted and placed, 상기 컨덕터는 상기 단자의 내측에 압입되되, 상기 컨덕터와 상기 솔더 볼은 접촉되지 않는 것을 특징으로 하는 하이브리드 모듈.The conductor is pressed into the inside of the terminal, the conductor and the solder ball, characterized in that the solder ball does not contact.
KR1020040039002A 2004-05-31 2004-05-31 Hybrid module KR20050113872A (en)

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KR1020040039002A KR20050113872A (en) 2004-05-31 2004-05-31 Hybrid module

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Application Number Priority Date Filing Date Title
KR1020040039002A KR20050113872A (en) 2004-05-31 2004-05-31 Hybrid module

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