KR20050109294A - Led lamp structure having light diffusion pin - Google Patents

Led lamp structure having light diffusion pin Download PDF

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Publication number
KR20050109294A
KR20050109294A KR1020040033894A KR20040033894A KR20050109294A KR 20050109294 A KR20050109294 A KR 20050109294A KR 1020040033894 A KR1020040033894 A KR 1020040033894A KR 20040033894 A KR20040033894 A KR 20040033894A KR 20050109294 A KR20050109294 A KR 20050109294A
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South Korea
Prior art keywords
chip
led lamp
epoxy
wire
light
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KR1020040033894A
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Korean (ko)
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김종복
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현대자동차주식회사
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Priority to KR1020040033894A priority Critical patent/KR20050109294A/en
Publication of KR20050109294A publication Critical patent/KR20050109294A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/40—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the combination of reflectors and refractors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2103/00—Exterior vehicle lighting devices for signalling purposes
    • F21W2103/20—Direction indicator lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

본 발명은 엘이디 램프에서 빛이 발산되는 몰드의 외측 둘레면에 복수개의 확산핀을 내장하여 상기 엘이디 램프에서 발생된 빛의 조사각을 확장시킬 수 있는 빛 확산핀이 구비된 엘이디 램프에 관한 것으로서, 그 특징적인 구성은 에노드(1a)와 케소드(1b)로 이루어진 리드 프레임(1)과, 상기 에노드(1a)의 상면에 다이 본딩 공정을 통하여 부착된 칩(2)과, 상기 칩(2)과 케소드(1b)의 사이에 와이어 본딩 공정을 통하여 부착된 와이어(3)와, 상기 칩(2)과 와이어(3)를 보호하기 위하여 칩(2)이 본딩된 리드 프레임(1)의 상부에 몰드 공정을 통하여 감싸여진 에폭시(4)로 구성된 엘이디 램프에 있어서, 상기 칩(2)에서 발생되는 빛의 조사각이 확장되도록 에폭시(4)의 외측 둘레면에 글라스 화이버로 이루어진 복수개의 확산핀(5)이 내장된 것이다.The present invention relates to an LED lamp having a light diffusion pin that can extend the irradiation angle of the light generated by the LED lamp by embedding a plurality of diffusion pins on the outer circumferential surface of the mold to emit light from the LED lamp, The characteristic configuration includes a lead frame 1 composed of an anode 1a and a cathode 1b, a chip 2 attached to an upper surface of the anode 1a through a die bonding process, and the chip ( 2) and the wire 3 attached through the wire bonding process between the cathode 1b and the lead frame 1 in which the chip 2 is bonded to protect the chip 2 and the wire 3. In the LED lamp composed of an epoxy (4) wrapped through a mold process on the top of, a plurality of glass fibers made of glass fibers on the outer circumferential surface of the epoxy (4) so that the irradiation angle of light generated from the chip (2) is extended The diffusion pin 5 is built.

Description

빛 확산핀이 구비된 엘이디 램프{LED lamp structure having light diffusion pin} LED lamp with light diffusion pin {LED lamp structure having light diffusion pin}

본 발명은 빛 확산핀이 구비된 엘이디 램프에 관한 것으로서, 더욱 상세하게는 엘이디 램프에서 빛이 발산되는 몰드의 외측 둘레면에 복수개의 확산핀을 내장하여 상기 엘이디 램프에서 발생된 빛의 조사각을 확장시킬 수 있는 빛 확산핀이 구비된 엘이디 램프에 관한 것이다.The present invention relates to an LED lamp having a light diffusion pin, and more particularly, a plurality of diffusion pins are built into the outer circumferential surface of the mold from which the light is emitted from the LED lamp, thereby reducing the irradiation angle of the light generated from the LED lamp. The present invention relates to an LED lamp having an expandable light diffusion pin.

일반적으로 자동차의 전/후방에는 주변을 주행하는 차량 및 보행자가 차량의 위치 및 이동 방향을 확인할 수 있도록 복수개의 램프가 설치되어 있다.In general, a plurality of lamps are installed at the front and rear of the vehicle so that vehicles and pedestrians traveling around can check the position and the moving direction of the vehicle.

이러한 램프는 내부에 필라멘트가 내장된 램프가 널리 사용되고 있으나 이러한 필라멘트 내장 램프는 사용수명이 짧고 내구성이 약하였다.Such lamps are widely used lamps with built-in filaments, but these lamps with built-in filaments have a short service life and low durability.

따라서 이러한 문제점을 해결하기 위하여 최근에는 칩에 전원을 공급하면 빛이 발생되는 엘이디(LED) 램프를 널리 사용하고 있다.Therefore, in order to solve such a problem, LED (LED) lamps, which generate light when power is supplied to a chip, are widely used in recent years.

상기 엘이디 램프는 도 1에 나타낸 바와 같이 에노드(1a)와 케소드(1b)로 이루어진 리드 프레임(1)중 에노드(1a)의 상면에 다이 본딩 공정을 통하여 칩(2)을 부착하되, 상기 다이 본딩 고정은 에노드(1a)의 상면에 실버 에폭시를 도포하고 그 상면에 칩(2)이 부착되도록 일정한 압력으로 가압하는 것이다.As shown in FIG. 1, the LED lamp attaches the chip 2 to the upper surface of the anode 1a of the lead frame 1 including the anode 1a and the cathode 1b through a die bonding process. The die bonding fixing is to apply a silver epoxy to the upper surface of the anode (1a) and pressurized at a constant pressure so that the chip 2 is attached to the upper surface.

이와 같이 칩(2)이 부착된 후 상기 칩(2)과 케소드(1b)가 연결되도록 와이어 본딩 공정을 통하여 와이어(3)로 연결하게 되며, 상기 와이어 본딩 공정은 와이어(3)의 양 단부를 칩(2)의 상면에 형성된 전극과 케소드(1b)의 상면에 일정한 압력으로 각각 접착 연결하는 것이다.After the chip 2 is attached as described above, the chip 2 and the cathode 1b are connected to each other by a wire 3 through a wire bonding process, and the wire bonding process is performed at both ends of the wire 3. Is adhesively connected to the electrode formed on the upper surface of the chip 2 and the upper surface of the cathode 1b at a constant pressure, respectively.

그리고 상기 칩(2)과 와이어(3)를 보호하기 위하여 칩(2)이 본딩된 리드 프레임(1)의 상부를 에폭시(4)로 감싸는 몰드 공정을 수행한다.In order to protect the chip 2 and the wire 3, a mold process of wrapping the upper part of the lead frame 1 to which the chip 2 is bonded with epoxy 4 is performed.

상기 몰드 공정은 이형제가 뿌려지고 에폭시(4)가 담겨진 몰드 컵(도면 미도시)에 리드 프레임(1)의 상부를 담근 후 전기 오븐에 넣고 경화시키면 엘이디 램프가 완성되는 것이다.In the mold process, the LED lamp is completed when the upper part of the lead frame 1 is immersed in a mold cup (not shown) in which a release agent is sprayed and epoxy 4 is contained, and then placed in an electric oven.

상술한 바와 같이 제조된 엘이디 램프를 자동차의 리어콤비 램프에 설치된 상태를 설명하면 다음과 같다.Referring to the LED lamp manufactured as described above installed in the rear combi lamp of the vehicle as follows.

도 2에 나타낸 바와 같이 리어콤비 램프(10)의 내부에 복수개의 엘이디 램프를 등간격으로 설치하되, 각 엘이디 램프의 사이에는 리플렉터(11)가 설치되어 있고, 리어콤비 램프(10)의 전면에는 투명한 재질의 확산판(12)이 설치되어 있다.As shown in FIG. 2, a plurality of LED lamps are installed at equal intervals inside the rear combination lamp 10, and reflectors 11 are installed between the LED lamps, and a front surface of the rear combination lamp 10 is provided. A diffuser plate 12 of transparent material is provided.

따라서, 엘이디 램프에 전원을 공급하면 칩(2)에서 빛이 발생되고 그 빛은 전면으로 조사되며, 이때 조사되는 빛의 각도는 약 70°로서, 엘이디 램프가 설치된 전방에는 빛이 조사되지만 엘이디 램프의 둘레면 즉, 리플렉터(11)와 근접되는 70°보다 넓은 곳에는 암영대(20)가 발생하게 된다.Therefore, when power is supplied to the LED lamp, light is generated from the chip 2 and the light is irradiated to the front, and the angle of the irradiated light is about 70 °, and the light is irradiated to the front where the LED lamp is installed, but the LED lamp is A dark zone 20 is generated at a circumferential surface of, i.e., a wider area than 70 ° close to the reflector 11.

따라서, 빛이 조사되지 못하는 암영대(20)의 발생으로 인하여 시인성이 저하되는 문제점이 있었다.Therefore, there is a problem in that visibility is reduced due to the generation of the dark zone 20 that is not irradiated with light.

본 발명은 상기 문제점을 해결하기 위하여 발명한 것으로서, 그 목적은 칩이 부착된 리드 프레임의 상부에 구비되는 에폭시의 외측 둘레면에 복수개의 확산핀을 내장하여 칩에서 발생되는 빛이 조사되는 방향을 확장시킬 수 있는 빛 확산핀이 구비된 엘이디 램프를 제공함에 있다.The present invention has been invented to solve the above problems, the purpose of which is to embed a plurality of diffusion pins on the outer peripheral surface of the epoxy provided on the top of the lead frame to which the chip is attached to the direction in which light generated from the chip is irradiated An LED lamp is provided with an expandable light diffusion pin.

상기 목적을 달성하기 위한 본 발명의 특징적인 구성을 설명하면 다음과 같다.Referring to the characteristic configuration of the present invention for achieving the above object is as follows.

본 발명의 빛 확산핀이 구비된 엘이디 램프는 에노드와 케소드로 이루어진 리드 프레임과, 상기 에노드의 상면에 다이 본딩 공정을 통하여 부착된 칩과, 상기 칩과 케소드의 사이에 와이어 본딩 공정을 통하여 부착된 와이어와, 상기 칩과 와이어를 보호하기 위하여 칩이 본딩된 리드 프레임의 상부에 몰드 공정을 통하여 감싸여진 에폭시로 구성된 엘이디 램프에 있어서, 상기 칩에서 발생되는 빛의 조사각이 확장되도록 에폭시의 외측 둘레면에 글라스 화이버로 이루어진 복수개의 확산핀이 내장된 것이다.The LED lamp having the light diffusion pin of the present invention includes a lead frame consisting of an anode and a cathode, a chip attached to the upper surface of the anode through a die bonding process, and a wire bonding process between the chip and the cathode. In the LED lamp composed of a wire attached through the, and the epoxy wrapped around the chip and the lead frame bonded to protect the chip and the wire through a mold process, so that the irradiation angle of the light generated from the chip is extended A plurality of diffusion pins made of glass fibers are embedded on the outer circumferential surface of the epoxy.

이와 같은 특징을 갖는 본 발명을 상세하게 설명하면 다음과 같다.Referring to the present invention having such characteristics in detail as follows.

도 3은 본 발명에 따른 엘이디 램프를 나타낸 단면도 및 평면도이고, 도 4는 본 발명에 따른 엘이디 램프가 자동차의 리어 콤비램프에 설치된 상태를 나타낸 단면도이다.3 is a cross-sectional view and a plan view of the LED lamp according to the present invention, Figure 4 is a cross-sectional view showing a state in which the LED lamp according to the present invention is installed on the rear combination lamp of the vehicle.

여기에서 참조되는 바와 같이 본 발명은 에노드(1a)와 케소드(1b)로 이루어진 리드 프레임(1)과, 상기 에노드(1a)의 상면에 다이 본딩 공정을 통하여 부착된 칩(2)과, 상기 칩(2)과 케소드(1b)의 사이에 와이어 본딩 공정을 통하여 부착된 와이어(3)와, 상기 칩(2)과 와이어(3)를 보호하기 위하여 칩(2)이 본딩된 리드 프레임(1)의 상부에 몰드 공정을 통하여 감싸여진 에폭시(4)로 구성된 엘이디 램프를 구비하되, 상기 칩(2)에서 발생되는 빛의 조사각이 확장되도록 에폭시(4)의 외측 둘레면에 글라스 화이버로 이루어진 복수개의 확산핀(5)이 내장되어 있다.As referred to herein, the present invention provides a lead frame 1 including an anode 1a and a cathode 1b, a chip 2 attached to an upper surface of the anode 1a through a die bonding process, and A wire 3 attached between the chip 2 and the cathode 1b through a wire bonding process, and a lead in which the chip 2 is bonded to protect the chip 2 and the wire 3. An LED lamp composed of an epoxy (4) wrapped through a mold process is provided on the upper part of the frame (1), and the glass is formed on the outer circumferential surface of the epoxy (4) so that the irradiation angle of light generated from the chip (2) is extended. A plurality of diffusion pins 5 made of fibers are built in.

한편, 상기 확산핀(5)의 선단부는 에폭시(4)의 외부로 돌출되게 형성되어 있다.On the other hand, the tip end of the diffusion pin 5 is formed to protrude to the outside of the epoxy (4).

이와 같이 구성된 본 발명의 엘이디 램프를 자동차의 리어콤비 램프(10)에 설치된 상태를 설명하면 다음과 같다.Referring to the LED lamp of the present invention configured as described above installed in the rear combi lamp 10 of the vehicle as follows.

도 4에 나타낸 바와 같이 리어콤비 램프(10)의 내부에 엘이디 램프를 설치하되, 엘이디 램프의 사이에는 리플렉터(11)가 설치되어 있고, 리어콤비 램프(10)의 전면에는 투명한 재질의 확산판(12)이 설치되어 있다.As illustrated in FIG. 4, an LED lamp is installed inside the rear combination lamp 10, and a reflector 11 is installed between the LED lamps, and a diffuser plate made of a transparent material is disposed on the front surface of the rear combination lamp 10. 12) is installed.

상기 엘이디 램프에 전원을 공급하면 칩(2)에서 빛이 발생되고 그 빛은 전면으로 조사됨과 동시에 에폭시(4)에 내장된 확산핀(5)에 의해서 확산된다.When power is supplied to the LED lamp, light is generated from the chip 2 and the light is radiated to the front surface and diffused by the diffusion pin 5 embedded in the epoxy 4.

이와 같이 확산된 빛은 리플렉터(11)에 반사된 후 전방으로 조사되게 되므로 엘이디 램프의 둘레면에 암영대가 발생되지 않게된다.Since the light diffused as described above is reflected by the reflector 11 and irradiated forward, dark zones are not generated on the circumferential surface of the LED lamp.

이와 같이 본 발명은 엘이디 램프의 에폭시에 둘레면에 내장된 복수개의 확산핀에 의해서 칩에서 발생되는 빛이 에폭시의 둘레면으로 확산되므로 빛이 조사되지 못하는 암영대의 형성을 방지하게 되는 특유의 효과가 있다.As described above, the present invention has a unique effect of preventing the formation of a dark zone where light cannot be irradiated because light generated from the chip is diffused to the peripheral surface of the epoxy by a plurality of diffusion pins embedded in the epoxy of the LED lamp. There is.

도 1은 일반적인 엘이디 램프를 나타낸 단면도.1 is a cross-sectional view showing a typical LED lamp.

도 2는 일반적인 엘이디 램프가 자동차의 리어 콤비램프에 설치된 상태를 나타낸 단면도.2 is a cross-sectional view showing a state in which a general LED lamp is installed on the rear combination lamp of the vehicle.

도 3은 본 발명에 따른 엘이디 램프를 나타낸 단면도 및 평면도.3 is a cross-sectional view and a plan view of the LED lamp according to the present invention.

도 4는 본 발명에 따른 엘이디 램프가 자동차의 리어 콤비램프에 설치된 상태를 나타낸 단면도.4 is a cross-sectional view showing a state in which the LED lamp according to the present invention is installed on the rear combination lamp of the vehicle.

※도면의 주요부분에 대한 부호의 설명※※ Explanation of symbols about main part of drawing ※

1 : 리드 프레임 1a : 에노드1: lead frame 1a: anode

1b : 케소드 2 : 칩1b: Cathode 2: Chip

3 : 와이어 4 : 에폭시3: wire 4: epoxy

5 ; 확산핀 10 : 리어콤비 램프5; Diffusion Pin 10: Rear Combi Lamp

11 : 리플렉터 12 : 확산판11: reflector 12: diffuser plate

Claims (2)

에노드(1a)와 케소드(1b)로 이루어진 리드 프레임(1)과, 상기 에노드(1a)의 상면에 다이 본딩 공정을 통하여 부착된 칩(2)과, 상기 칩(2)과 케소드(1b)의 사이에 와이어 본딩 공정을 통하여 부착된 와이어(3)와, 상기 칩(2)과 와이어(3)를 보호하기 위하여 칩(2)이 본딩된 리드 프레임(1)의 상부에 몰드 공정을 통하여 감싸여진 에폭시(4)로 구성된 엘이디 램프에 있어서,A lead frame (1) consisting of an anode (1a) and a cathode (1b), a chip (2) attached to an upper surface of the anode (1a) through a die bonding process, and the chip (2) and a cathode In the upper part of the lead frame 1 to which the chip 2 is bonded in order to protect the chip 2 and the wire 3 and the wire 3 attached through the wire bonding process between (1b). In the LED lamp composed of an epoxy (4) wrapped through, 상기 칩(2)에서 발생되는 빛의 조사각이 확장되도록 에폭시(4)의 외측 둘레면에 글라스 화이버로 이루어진 복수개의 확산핀(5)이 내장됨을 특징으로 하는 빛 확산핀이 구비된 엘이디 램프. LED lamp having a light diffusion pin, characterized in that a plurality of diffusion pins (5) made of glass fibers are built in the outer peripheral surface of the epoxy (4) so that the irradiation angle of the light generated from the chip (2). 제 1 항에 있어서, 상기 확산핀(5)의 선단부는 에폭시(4)의 외부로 돌출되게 형성됨을 특징으로 하는 빛 확산핀이 구비된 엘이디 램프. 2. The LED lamp of claim 1, wherein the tip of the diffusion pin (5) is formed to protrude out of the epoxy (4).
KR1020040033894A 2004-05-13 2004-05-13 Led lamp structure having light diffusion pin KR20050109294A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7407312B2 (en) * 2005-12-29 2008-08-05 Lg Display Co., Ltd. Luminescent diode, fabrication method thereof, and backlight assembly having the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7407312B2 (en) * 2005-12-29 2008-08-05 Lg Display Co., Ltd. Luminescent diode, fabrication method thereof, and backlight assembly having the same

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