KR20050106219A - Pick-up nozzle deposited with diamond film and method thereof - Google Patents

Abstract

The present invention includes a body connected to a vacuum device and a transfer device, a front end extending from the body, and a vacuum hole penetrating the inside of the body and the front end, and the electronic component is sucked to the front end using the vacuum pressure. A pickup nozzle for moving to a work position and a method of manufacturing the same, the manufacturing method comprising: a processing step of processing a vacuum hole passing through the body and the front end portion of the pickup nozzle; And a deposition coating step of injecting hydrogen gas containing methane into the process gas in a vacuum and a high temperature atmosphere, and depositing a diamond film to a predetermined thickness, on the tip end where the electronic component is adsorbed. The tip of has the effect of improving the wear resistance by the deposition coated diamond film.

Description

Pick-up nozzle deposited with diamond film and its manufacturing method

The present invention relates to a pick-up nozzle and a method for manufacturing the same, which absorb a small component using a vacuum pressure when assembling the electronic component and move it to a predetermined position. More specifically, the present invention relates to a pickup nozzle in which a diamond film having excellent abrasion resistance is deposited on the surface of the tip of the pickup nozzle by chemical vapor deposition (CVD) in order to improve wear resistance, and a method of manufacturing the same.

The pickup nozzle refers to a nozzle for positioning the electronic component at a predetermined position in order to assemble the electronic component such as a chip. As shown in FIG. 1, the pickup nozzle 1 includes a body 10 connected to a vacuum device (not shown), a front end portion 11 extending from the body 10, and the body 10 and the front end portion 11. It is provided with a vacuum hole 12 penetrating the inside of. The vacuum hole 12 is connected to a vacuum device (not shown) that sucks air, and the vacuum device makes the vacuum hole 12 in a vacuum state, so that the tip end 11a of the tip portion 11 is attracted by vacuum. The chip is sucked to the vacuum, and when the vacuum is removed, the chip is separated from the tip 11a of the tip portion 11 and placed in a position to be assembled.

On the other hand, in recent years, as miniaturization of electronic components has progressed, very small chips have emerged in assembling electronic components. When the small chips are mounted, the performance of pick-up nozzles for adsorbing and moving small chips is also important. have. That is, since the pickup nozzle 1 repeatedly picks up and moves the small chip, the wear resistance of the tip 11a of the tip portion 11 to which the chip is in direct contact should be improved. Improvement is an important factor in improving the accuracy of the pick-up nozzle 1 and improving the productivity by the continuous process.

2 (a) and 2 (b) are views showing the action of the pickup nozzle. In order to move the small chip 20 to the mounting position, the pick-up nozzle 1 is moved to the position of the small chip 20 by a transfer device (not shown) (see FIG. As shown in (b), when a vacuum pressure is applied to the vacuum hole 12 of the pickup nozzle 1, the small chip 20 is attracted to the tip 11a of the tip 11 of the pickup nozzle 1. do. Then, by moving the small chip 20 to a desired position by the transfer device to remove the vacuum pressure applied to the vacuum hole 12, the small chip 20 is separated from the tip (11a) and then the small chip 20 is It is mounted to a substrate or the like. That is, the role of the pick-up nozzle 1 is to continuously perform a very simple task of adsorbing, moving and separating the small chip 20. The function of the pick-up nozzle 1 is to accurately suck the parts. . If the pick-up nozzle 1 is worn or dropped on the surface of the tip 11a in contact with the small chip 20, a problem occurs that the vacuum pressure cannot be properly maintained in the vacuum hole 12. .

In addition, the pick-up nozzle 1 receives an impact from the electronic component when the electronic component such as the small chip 20 is absorbed, and such continuous and repeated impact is caused by the tip 11a of the tip portion 11 of the pick-up nozzle 1. The surface of the contact surface is partially worn out, so that the overall vacuum pressure cannot be maintained, thereby losing the fixing ability of the electronic component, which results in shortening the life of the pick-up nozzle. In other words, the wear resistance of the tip 11a of the tip 11 of the pick-up nozzle 1 is a direct factor in determining the life of the pick-up nozzle.

On the other hand, the vacuum performance of the pickup nozzle 1 depends on how the cross-sectional shape of the vacuum hole 12 penetrating the inside of the pickup nozzle is performed. That is, in order for the cross-sectional shape of the vacuum hole 12 of the pickup nozzle 1 to have the same vacuum pressure as a whole, it must have a complicated cross section as shown in Fig. 1B. Pick-up nozzle (1) vacuum hole 12 is manufactured through a number of processes, such as drilling work and wire cutting work. For this reason, high costs are put into the machining process. Therefore, if the wear resistance of the pick-up nozzle 1 can be improved, the replacement timing of the pick-up nozzle 1 can be extended, thereby reducing the processing cost required for processing the pick-up nozzle.

Many materials are used to improve the performance of the wear resistance of the pickup nozzle (1). As an example, the tip portion 11 that makes the body 10 of the pickup nozzle made of steel and adsorbs the small chip 20 by vacuum pressure is made of cemented carbide or ceramic having wear resistance. However, in the case of cemented carbide material, there is an easy advantage in processing into various shapes, but there is a problem in that the life is short. Recently, a sintered diamond (PCD) material obtained by mixing artificially synthesized diamond powder with a metal binder and sintered was applied to the front end 11a of the front end portion 11 of the pickup nozzle 1, but the processing of the sintered diamond material itself It is very difficult and the cost of the material itself is very high, and the cost burden is large, and the cumbersome processes of welding the diamond material to meet the complicated cross-sectional shape of the tip 11a of the pick-up nozzle has a complicated manufacturing process. In addition, the pickup nozzle (1) is required to suppress the reflection of light due to the process characteristics of mounting a small chip, in the case of the pickup nozzle (1) using the new material for this purpose a separate coating of the black surface There is a disadvantage that the coating process is required.

The present invention is to solve the problems of the prior art, by using a chemical vapor deposition (CVD) method by coating a diamond film on the tip of the pick-up nozzle tip to a predetermined thickness, it is possible to improve wear resistance An object of the present invention is to provide a pickup nozzle and a manufacturing method thereof.

In addition, the present invention can deposit coating a diamond film having high abrasion resistance without being affected by the cross-sectional shape of the vacuum hole formed inside the pickup nozzle, because the deposited coating diamond film itself has a black color to suppress reflection of light. As such, the necessity of performing an unnecessary coating operation for suppressing light reflection can be eliminated. Accordingly, an object of the present invention is to provide a pickup nozzle and a method of manufacturing the same, which simplify the manufacturing process of the pickup nozzle and enable mass production, thereby enhancing the competitiveness of the electronic component assembly business.

In order to achieve the above object, the present invention includes a body connected to a vacuum device and a transfer device, a front end extending from the body, and a vacuum hole penetrating the inside of the body and the front end, and using the vacuum pressure to the electronic component to the front end A pick-up nozzle manufacturing method for moving to a work position after absorbing the tip of the pick-up method, the pick-up nozzle comprising: a processing step of processing a vacuum hole penetrating the inside of the body and the tip of the pick-up nozzle; And a deposition coating step of injecting hydrogen gas containing methane into the process gas in a vacuum and a high temperature atmosphere and depositing a diamond film to a predetermined thickness with respect to the front end portion to which the electronic component is adsorbed, thereby improving wear resistance of the front end portion of the pickup nozzle. Let's do it.

In addition, the present invention, when the tip portion is a cemented carbide material (WC-Co-based), etching to immerse in a solution containing H ₂ SO ₄ to remove the Co phase present on the surface of the tip portion before depositing the diamond film A step is further included to facilitate the deposition of the diamond film at the tip.

In addition, the present invention is carried out between the etching step and the deposition coating step, in order to promote the diamond nucleation in the deposition coating step to ultrasonically put the pick-up nozzle passed through the etching step in a solution containing acetone and diamond particles An ultrasonication step is further included to shorten the time for which the diamond film is deposited at the tip.

In addition, the present invention, the cemented carbide material which is the material of the tip portion of the average particle size of the WC is 0.5㎛ ~ 20㎛, Co content is more than 0 to less than 9%, the diamond film in the deposition coating step 1㎛ ~ 50㎛ It provides a pickup nozzle manufacturing method characterized in that the deposition of a thickness of, and when the diamond film to be deposited coated has a thickness of 1㎛ ~ 5㎛ so that the WC particles in the cemented carbide material of the tip portion has a size of 0.5㎛ ~ 2㎛ When the diamond film to be deposited coated has a thickness of 5 μm to 50 μm, the WC particles in the cemented carbide material have a size of 2 μm to 20 μm so that the particles of the WC constituting the tip end according to the thickness of the diamond film to be deposited. By varying the size of the wear resistance improvement can be obtained more effectively.

In addition, the present invention is manufactured by the pick-up nozzle manufacturing method, a diamond film is coated on the tip of the body by the deposition coating provides a pick-up nozzle with improved wear resistance.

Hereinafter, a pickup nozzle in which a diamond film is deposited on a tip end according to the present invention and a manufacturing method thereof will be described in more detail. Figure 3 is a process flow chart showing a pick-up nozzle manufacturing method according to the invention, Figure 4 is a cross-sectional view of the front end of the pick-up nozzle manufactured by the pick-up nozzle manufacturing method according to the invention, and Figure 5 is a pick-up nozzle according to the present invention Figure 1 shows an embodiment of a chemical vapor deposition apparatus used in the manufacturing method.

As in the prior art, the pickup nozzle 1 includes a body 10 connected to a vacuum device (not shown) and a transfer device (not shown), and a tip end portion 11 extending from the body 10. The vacuum hole 12 penetrating the inside is formed in 10 and the tip part 11 (refer FIG. 1A). The body 10 of the pickup nozzle according to the present invention is generally made of steel, and the tip portion 11 is made of cemented carbide material (WC-Co).

In the pickup nozzle according to the present invention, as shown in FIG. 4, the diamond film 13 is deposited and coated on the tip 11 of the pickup nozzle 1 by a chemical vapor deposition method which will be described later. The thickness of the diamond film 13 deposited on the tip end portion 11 of the pick-up nozzle 1 according to the present invention is 1 μm to 50 μm, and the size of the WC particles of the cemented carbide material constituting the tip part 11 according to the thickness. May have a different size, and preferably has a size of approximately 0.5 μm to 20 μm. Applicants have shown that when the deposited diamond film 13 has a thickness of 1 µm to 5 µm, a WC particle size of 0.5 µm to 2 µm in the cemented carbide material has a desirable effect on wear resistance, and the deposited diamond film When the thickness of (13) was 5 µm to 50 µm, it was found that wear resistance was excellent when the WC particles inside the cemented carbide material had an average size of 2 µm to 20 µm. Therefore, in the case of the present invention, the cemented carbide material on which the diamond film 13 is deposited is changed according to the needs of the consumer, that is, the thickness of the WC particles, which is its microstructure, according to the thickness of the deposited diamond film 13, thereby providing optimum wear resistance. There is another feature to this implementation.

In the pickup nozzle 1 according to the present invention, the diamond film 13 is deposited to a predetermined thickness on the tip portion 11 made of the cemented carbide material through the steps shown in FIG. First, the processing step (S10) for processing the pick-up nozzle body 10 and the tip portion 11, the body 10 and the tip portion 11 of the pick-up nozzle 1 is coupled to the body 10 and the tip portion 11 The process of processing the vacuum hole 13 penetrating the inner side of the. The shape of the vacuum hole 13 may have a variety of shapes according to the design, it is preferable to have a shape in which the vacuum pressure at the tip (11a) of the tip portion 11 can work evenly over the entire cross section.

Etching step (S20) refers to the step of corroding the Co phase present on the surface of the front end portion 11 of the pickup nozzle (1). The etching step (S20) is to graphitize the diamond film 13 when the diamond film 13 is deposited in the deposition coating step (S40), which is one of the components of the tip 11 made of cemented carbide material. This is to prevent the action. In general, the Co phase acts as a catalyst for making the diamond into graphite, and when the diamond deposited due to the Co phase changes to graphite, between the deposited diamond film 13 and the tip 11 on which the diamond film 13 is deposited. The adhesion strength is weakened so that the diamond film 13 is not integrated with the tip portion 11. Therefore, the etching step S20 of removing the Co phase of the cemented carbide material must be preceded in order for the diamond film 13 to be deposited and coated to realize proper wear resistance.

There are two types of etching methods performed in the etching step (S20), one of which is to remove the Co phase through a high temperature heat treatment. This method can make the adhesion between the diamond film 13 and the tip portion 11 excellent, but causes a problem that heat deformation is involved in the tip portion 11 made of cemented carbide material during heat treatment. As another method, a method of removing the Co phase through chemical etching includes a method in which the tip 11 of the pickup nozzle 1 is immersed in a solution containing H ₂ SO ₄ . In the case of using the chemical etching, the pick-up nozzle 1 can deposit a diamond film without deformation, and when depositing a diamond film within several micrometers, it is preferable to use it because it has excellent adhesive strength. In order to effectively remove the Co phase, the amount of Co in the cemented carbide material of the tip portion 11 is preferably less than 9%.

Next, the deposition coating step S40 is a step of depositing and coating the diamond film 13 on the surface of the front end portion 11 of the pickup nozzle 1. In order to deposit the diamond film 13, a chemical vapor deposition apparatus is used. . In general, chemical vapor deposition equipment for depositing a diamond film is a method using a hot filament and a method using a microwave, an arc jet and the like. The chemical vapor deposition apparatus illustrated in FIG. 5 illustrates an apparatus using a hot filament, which corresponds to one exemplary apparatus for describing a chemical vapor deposition method, and the technical concept of the present invention is not limited thereto. Anyone skilled in the art will know.

Referring to FIG. 5, in the deposition apparatus using the hot filament, the electrodes 30a and 30b are placed on both sides, and the heat filament 31 is disposed on the electrodes 30a and 30b. The pickup nozzle 1 on which the diamond film 13 is to be deposited is placed in the space B between the electrodes 30a and 30b. The chamber (not shown) in which the deposition equipment is installed is made into a vacuum state, and electric heat is applied to the heat filament 31 through the electrodes 30a and 30b to maintain the heat filament 31 at a temperature of 2000 to 2300 ° C. After the injection of a certain amount of hydrogen gas containing 95 to 99.5% of methane (0.5 to 5%) as a process gas at a high temperature, the tip of the pickup nozzle is maintained at 800 to 1000 ° C. The diamond film is deposited coated on.

In addition, referring back to FIG. 3, the present invention may provide acetone of 0.5 μm or less in acetone in order to promote diamond nucleation in the deposition coating step S40 before performing the deposition coating step S40 after the etching step S20. The ultrasonic step S30 may be performed by dipping the pick-up nozzle 1 through the etching step S20 in a solution containing diamond particles having a size and performing an ultrasonic treatment.

Hereinafter, an embodiment of a pickup nozzle manufacturing method according to the present invention will be described.

Example 1

The tip 11 of the pickup nozzle 1 was made of a cemented carbide material having an average particle diameter of WC of 0.7 μm (Co content of 6%), and a vacuum hole 12 was processed therein (S10). Before the end portion 11 of the pick-up nozzle made of cemented carbide material was coated with diamond, the etching step (S20) was carried out for chemical etching for the purpose of removing the Co phase in the end portion 11. A solution containing H ₂ SO ₄ was used as the etching solution, and the pick-up nozzle 1 was immersed in the solution for 3 minutes to corrode.

 In order to promote nucleation when the diamond film 13 is deposited on the pick-up nozzle 1 after the etching step S20, ultrasonic waves are put into a solution containing diamond particles having a size of 0.5 μm or less in ultrasonic waves for 3 minutes. Treatment was carried out (S30).

Then, the cemented carbide nozzle 1 was charged into a chemical vapor deposition apparatus using thermal filament, and the filament temperature was maintained at 2100 ° C., the tip 11 was maintained at 900 ° C., and the hydrogen gas containing 3% of methane was passed through for 5 hours. Diamond deposition coating was carried out. It was confirmed that the diamond film obtained had a thickness of 5 µm, and the pick-up nozzle 1 coated with the diamond film 13 had a black color to sufficiently exhibit the light reflection suppressing effect. In addition, when the pick-up nozzle 1 coated with the diamond film 13 was subjected to a life-time evaluation with a pick-up nozzle made of cemented carbide material, it was possible to obtain a 3 to 10 times life extension effect.

Example 2

The tip 11 of the pick-up nozzle 1 was manufactured using a cemented carbide material having an average particle diameter of 6 μm (Co content 6%), and a vacuum hole 12 was machined inside (S10). Thereafter, before the diamond film 13 is deposited and coated on the tip end portion 11 of the pickup nozzle 1, chemical etching is performed to remove the Co phase in the cemented carbide material (S20). As an etching solution, a solution containing H ₂ SO ₄ was used, and the pick-up nozzle 1 was immersed in the solution for 3 minutes to corrode.

In order to promote nucleation when the diamond film 13 is deposited on the pick-up nozzle 1 that has undergone the etching step S20, ultrasonic waves are put into a solution containing diamond particles having a size of 0.5 μm or less in ultrasonic waves for 3 minutes. Treatment was carried out (S30).

Subsequently, the pick-up nozzle 1 was charged into a chemical vapor deposition apparatus using thermal filament, and the filament temperature was maintained at 2100 ° C. and the tip 11 was maintained at 900 ° C. and hydrogen gas containing 3% of methane was passed. The diamond film was deposited coated over time. The obtained diamond film 13 had a thickness of 15 μm, and the pick-up nozzle 1 coated with the diamond film 13 had a black color, so that the light reflection suppressing effect could be sufficiently exhibited. The diamond film 13 The life span of the pick-up nozzle (1) coated with cemented carbide and the pick-up nozzle made of cemented carbide material was 15 to 20 times longer.

As described above, the present invention, by coating the film having a diamond characteristic on the tip of the pickup nozzle by chemical vapor deposition method, the wear resistance of the pickup nozzle is improved to improve the life, thereby increasing the productivity and cost reduction effect Can be maximized.

In addition, since the diamond film is deposited on the tip, the diamond film can be formed on the pickup nozzle by a simple operation irrespective of the cross-sectional shape of the vacuum hole passing through the tip of the cemented carbide material. In addition, the deposition-coated diamond film has a black characteristic, which simplifies the work by eliminating the need for a separate coating process for reflecting light, which was part of all existing pickup nozzle manufacturing processes.

1A shows a pickup nozzle;

FIG. 1B is a cross-sectional view of FIG. 1A taken along the line A-A.

2 (a) and 2 (b) show the action of the pickup nozzle;

3 is a process flowchart showing a pickup nozzle manufacturing method according to the present invention;

Figure 4 is a cross-sectional view of the front end of the pickup nozzle manufactured by the pickup nozzle manufacturing method according to the present invention; And

5 is a view showing an embodiment of a chemical vapor deposition apparatus used in the pickup nozzle manufacturing method according to the present invention.

<Explanation of symbols for the main parts of the drawings>

1: Pickup Nozzle 10: Body

11: tip 12: vacuum hole

13: diamond film

Claims (7)

A body connected to a vacuum device and a transfer device, a front end extending from the body, and a vacuum hole penetrating the inside of the body and the front end, and the electronic component is absorbed to the front end of the front end by using vacuum pressure and then moved to a working position. In the pickup nozzle manufacturing method for Processing a vacuum hole penetrating the inside of the body and the front end of the pickup nozzle; And a deposition coating step of depositing a diamond film to a predetermined thickness by injecting hydrogen gas containing methane into the process gas in a vacuum and a high temperature atmosphere with respect to the tip part to which the electronic component is adsorbed. The method of claim 1, If the tip is a cemented carbide material (WC-Co-based), further comprising an etching step of immersing in a solution containing H ₂ SO ₄ to remove Co phase present on the surface of the tip before depositing a diamond film Pick-up nozzle manufacturing method characterized in that. The method of claim 2, It is carried out between the etching step and the deposition coating step, in order to promote the diamond nucleation in the deposition coating step further includes an ultrasonic treatment step of sonicating the pick-up nozzle subjected to the etching step in a solution containing acetone and diamond particles Pick-up nozzle manufacturing method characterized in that. The method of claim 3, The cemented carbide material, which is the material of the tip portion, has an average particle size of 0.5 µm to 20 µm, a Co content of 0 to less than 9%, and a diamond film deposited at a thickness of 1 µm to 50 µm in the deposition coating step. Pick-up nozzle manufacturing method characterized in that. The method of claim 4, wherein If the diamond film to be deposited coated has a thickness of 1㎛ ~ 5㎛ WC particles in the cemented carbide material of the tip portion characterized in that the size of 0.5㎛ ~ 2㎛. The method of claim 4, wherein When the diamond film to be deposited coated has a thickness of 5㎛ ~ 50㎛ WC particles in the cemented carbide material of the tip portion characterized in that the size of 2㎛ ~ 20㎛. A pickup nozzle manufactured by the method of manufacturing a pickup nozzle according to any one of claims 1 to 6, wherein a diamond film is deposited on the tip of the body.