KR20050104558A - Phosphor paste coating apparatus for plasma display panel and plasma display panel manufacturing method - Google Patents

Abstract

The present invention provides a phosphor coating device for a plasma display panel that more effectively responds to the pitch minimization of partition walls and the demand of a large substrate.

A phosphor coating device for a plasma display panel of the present invention includes: a tank in which phosphor paste is embedded and supplied; A nozzle head having a plurality of spray nozzles which receive phosphor paste from the tank and apply sprays correspondingly to the recesses between the partition walls of the substrate; And a cylinder for elevating the nozzle head, wherein a pitch between spray nozzles adjacent to each other in the nozzle head is greater than a pitch between pixels formed by partitions on the substrate.

Description

Phosphor Coating System for Plasma Display Panel and Plasma Display Panel Manufacturing Method {PHOSPHOR PASTE COATING APPARATUS FOR PLASMA DISPLAY PANEL AND PLASMA DISPLAY PANEL MANUFACTURING METHOD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel phosphor coating device and a plasma display panel manufacturing method, and more particularly, to a plasma display panel phosphor coating device and a plasma display, which form a phosphor layer in recesses between partition walls by a nozzle spray method. It relates to a panel manufacturing method.

In general, a plasma display panel (hereinafter referred to as PDP) generates gas discharge between electrodes by a direct current or alternating voltage applied to the electrode, and excites the phosphor with ultraviolet rays emitted at this time. A flat panel display device that emits light, that is, displays images using gas discharge, and has excellent display capability such as display capacity, brightness, contrast, afterimage, and viewing angle, and has been spotlighted as a device that can replace CRT. have.

AC type PDP, which is distinguished from DC type PDP according to the driving method, forms discharge sustaining electrodes of X and Y electrodes on the inner surface of the front substrate, and covers the discharge sustaining electrodes with a transparent dielectric layer to generate wall charges. When the current is applied to the sustain electrode, MgO protective layer is laminated on the transparent dielectric layer to protect the transparent dielectric layer by preventing the ion of ionized atoms from colliding with the transparent dielectric layer and to increase the emission coefficient of secondary electrons generated when the ions are hit. Forming address electrodes on an inner surface of the rear substrate which is sealed against the front substrate, covering the address electrodes with a white dielectric layer to reflect visible light while protecting the address electrodes, and forming partitions in the white dielectric layer. And forms a phosphor layer inside the partition walls so as to be excited by ultraviolet rays to emit visible light. In the discharge cell layer is formed consists of a structure filled with an inert gas such as neon (Ne) and xenon (Xe).

When the operation of the PDP is schematically explained, first, an address voltage and a scan voltage are applied to the address electrode and the Y electrode, respectively, and an address discharge occurs between them to form wall charges in the discharge cell. Next, when a discharge sustain voltage is applied between the Y electrode and the X electrode, a sustain discharge occurs in the discharge cell while exceeding a discharge start voltage in addition to the wall voltage formed by the wall charge. In this sustain discharge state, light in the ultraviolet region of the discharge light impinges on the phosphor layer to emit visible light. As a result, an image is realized by each pixel formed for each discharge cell.

In the method of manufacturing the PDP, the discharge sustaining electrode, the transparent dielectric layer, and the MgO protective film are formed on the inner surface of the front substrate, and the address electrode, the white dielectric layer, the partition wall, and the phosphor layer are formed on the inner surface of the rear substrate. The substrates are sealed to each other, the air in the space formed between the two substrates is discharged, and then an inert gas is injected into the space to complete the PDP.

The manufacturing method of the PDP includes a process of forming a phosphor layer by applying a phosphor paste between partitions of a rear substrate. The screen printing method is applied to this process, but this screen printing method is difficult to apply to the high-definition and closed partition structures in which the pitch of the discharge cells is minutely formed due to the lack of discharge property. In this case, there is a problem that the manufacture of the mask is insufficient.

A nozzle spray method is used as a method to replace this screen printing method, and a phosphor coating apparatus is used for this nozzle spray method. The phosphor coating device includes a plurality of spray nozzles sequentially arranged at the nozzle head, and sequentially sprays and applies R, G, and B phosphor pastes to the recesses between partition walls arranged at a fine pitch through the spray nozzles. To form a phosphor layer.

This phosphor coating device is required to be finer as the pitch of the spray nozzles formed in the nozzle head becomes smaller as the pitch of the partition walls becomes smaller. In contrast, the spray nozzle should have an opening of a necessary size for spraying the phosphor paste with a uniform discharge amount.

Therefore, the phosphor coating device has a limitation in optimizing the conflicting requirements as described above, and in addition, since the plurality of spray nozzles are arranged in a straight line with the nozzle head, it is possible to meet the demand for finer pitch of partition walls. There are hard limits.

Despite these demands, when the pitch of the spray nozzles formed in the spray head is made too fine in accordance with the pitches of the refined partition walls, the phosphor coating device causes mutual interference between the phosphor pastes sprayed from neighboring spray nozzles and discharges them. The quality of the PDP is degraded to cause defects and discharge irregularities.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a phosphor coating device for a plasma display panel which more effectively responds to the pitch of partition walls and the needs of a large substrate.

In addition, another object of the present invention is to provide a plasma display panel manufacturing method for improving the quality of the PDP by uniformly discharging the phosphor paste in response to the pitch minimization of the partition walls.

In order to achieve the above object, a plasma display panel phosphor coating apparatus according to the present invention,

A tank incorporating and supplying phosphor paste;

A nozzle head having a plurality of spray nozzles which receive phosphor paste from the tank and apply sprays correspondingly to the recesses between the partition walls of the substrate; And

A cylinder for elevating the nozzle head;

The pitch between the spray nozzles adjacent to each other in the nozzle head is greater than the pitch between pixels formed by the partition walls on the substrate.

In addition, the phosphor coating device for plasma display panel according to the present invention,

A tank incorporating and supplying phosphor paste;

A nozzle head having a plurality of spray nozzles which receive phosphor paste from the tank and apply sprays correspondingly to the recesses between the partition walls of the substrate; And

A cylinder for elevating the nozzle head;

The spray nozzles adjacent to each other in the nozzle head are arranged in a zigzag form along a direction perpendicular to the nozzle head traveling direction when the phosphor face is applied.

The spray nozzles may include first row spray nozzles disposed forward in the forward direction of the phosphor paste of the nozzle head;

And second row spray nozzles disposed behind a point between each of the first row spray nozzles.

The first row spray nozzles are disposed immediately before a point corresponding to one half of the interval between the second row spray nozzles.

The injection nozzles are arranged in three neighboring triangles, and this triangular arrangement is formed repeatedly along the nozzle head.

The four spray nozzles are arranged in a parallelogram with four neighbors, and the parallelogram arrangement is repeatedly formed along the nozzle head.

The spray nozzles are all formed with openings of the same size.

Among the spray nozzles, the spray nozzles respectively provided at both ends of the nozzle head are formed to have a size 1/2 of the spray nozzle openings provided therebetween.

In addition, the plasma display panel manufacturing method according to the present invention,

A first substrate manufacturing step of forming a discharge sustaining electrode and a dielectric layer on the substrate;

A second substrate manufacturing step of forming an address electrode, a dielectric layer, a partition wall, and a phosphor layer on a substrate separate from the first substrate; And

Sealing the first and second substrates, and injecting discharge gas after exhaust;

In the manufacturing of the second substrate, the forming of the phosphor layer may include

And applying a phosphor paste to the recesses between the partitions with a phosphor coating device having a pitch between adjacent injection nozzles provided in the nozzle head greater than the pitch between pixels formed by the partitions.

The spray nozzles provided in the nozzle head of the phosphor coating device are arranged in a zigzag form along a direction perpendicular to the nozzle head traveling direction when the phosphor paste is applied.

The step of applying the phosphor paste starts in a dummy region disposed outside the effective region of the second substrate and ends in another dummy region.

Application of the phosphor paste sprays the phosphor paste from the front and the rear alternately based on the traveling direction of the nozzle head.

In the applying of the phosphor paste, the nozzle head is advanced in one outermost region of the second substrate by spraying the phosphor paste into the recesses between the partition walls of the region,

Returning the nozzle head to a next region disposed subsequent to the outermost region,

The returned nozzle head is further advanced, and a phosphor paste is sprayed and applied to the concave portions between the partitions of the next region arranged after the outermost region,

The nozzle head is returned to the next area which is disposed following the previous area until the area of the second substrate is terminated, and the returned nozzle head is further advanced to form recesses between the partitions of the partitions of the next area following the previous area. The process of spraying and applying the paste is repeated sequentially.

In the applying step of the phosphor paste, the phosphor paste is sprayed twice in the recess between the partition walls positioned at the portion where the previous region and the next region are continuous, when the previous region is applied and the next region is applied.

In the coating step of applying the phosphor paste, when the previous region is coated with the phosphor paste corresponding to 1/2 of the amount of application of the recess between the other partitions, the recesses between the partitions located in the portion where the previous region and the next region are continued. And spray each when applying the next area.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a phosphor coating apparatus for a plasma display panel according to the present invention. The phosphor coating device applies a nozzle spraying method to a concave portion (a space formed by a line) formed between these partition walls (the line portion forming the lattice in the drawing) corresponding to the fine pattern of the partition walls and the large substrate. It is comprised so that a phosphor layer may be formed by spraying fluorescent paste effectively.

The phosphor coating device is a PDP manufacturing method of manufacturing a first substrate (not shown) and a second substrate 1 separately and sealing them to complete the PDP, the step of forming the second substrate 1 between the partition walls It is used to form a phosphor layer in the recess 2. This phosphor coating device can be applied to both a stripe-type barrier rib structure or a closed barrier rib structure. FIG. 1 illustrates that the phosphor coating device of the present invention is used for a second substrate 1 having a closed partition structure.

Referring to this drawing, the phosphor coating device will be described. The phosphor coating device for plasma display panel includes a tank 3 for supplying the phosphor paste, and a plurality of spray nozzles for injecting the phosphor paste thus supplied onto the second substrate 1. The nozzle head 7 provided with (5) and the cylinder 9 which raises and lowers this nozzle head 7 to the fluorescent substance paste injection position of the 2nd board | substrate 1 are comprised as a main part.

First, the tank 3 is connected to the nozzle head 7 by a supply pipe 11. Therefore, the phosphor paste embedded in the tank 3 is supplied to the nozzle head 7 through the supply pipe 11. The tank 3 is provided with R, G, and B so that the phosphor pastes can be separately embedded and supplied so that R, G, and B phosphor pastes can be sequentially applied to the areas between the partitions of the second substrate 1. It is preferred to be provided with three corresponding ones. In FIG. 1 only one tank 3 is shown for convenience.

The nozzle head 7 supplied with the phosphor paste from the tank 3 has a plurality of spray nozzles 5 so as to spray the phosphor paste corresponding to the area between the partition walls formed in the fine pattern on the second substrate 1. And a chamber structure so as to spray a uniform amount of phosphor paste through the spray nozzle (5).

This nozzle head 7 is connected by the cylinder 9 so that raising / lowering operation is possible. That is, the cylinder 9 is provided at one side of the nozzle head 7. The cylinder 9 moves the spray nozzles 5 vertically above the second substrate 1 to the position where the phosphor paste can be sprayed corresponding to the area between the partition walls by the stretching operation.

The tank 3, the nozzle head 7, and the cylinder 7 as described above are provided in a frame (not shown) of the applicator so as to reciprocate and elevate on the second substrate 1. Since the frame may be configured in various ways, a detailed description thereof will be omitted.

Fig. 2 is a plan sectional view of the nozzle head used in the phosphor coating device of the present invention.

Referring to the nozzle head 7 with reference to the drawings, the nozzle head 7 is provided with a plurality of spray nozzles 5, the spray nozzles 5 are formed in the fine partition structure of the second substrate 1 Correspondingly, it is arranged in a structure capable of spraying the phosphor paste. That is, the pitch Pn of the spray nozzle 5 is made larger than the pitch Pb between pixels formed on the second substrate 1. Here, the pitch Pn of the spray nozzle 5 is defined as the distance between the two nearest spray nozzles 5, and the inter-pixel pitch Pb is the distance between the centers of the closest subpixels (discharge cells) of the same color. Is defined as In spite of this pitch relationship, the spray nozzles 5 must respectively correspond to the regions of the discharge cells surrounded by the partition wall formed in the second substrate 1.

To this end, the spray nozzles 5 are composed of first row spray nozzles 5a and second row spray nozzles 5b. The first row jetting nozzles 5a are disposed forward with respect to the jetting direction S of the nozzle head 7, and the second row jetting nozzles 5b are each of the first row jetting nozzles 5a. It is arrange | positioned in the back between. This arrangement of the spray nozzles 5 makes each spray while making the pitch Pn of the spray nozzle 5 formed by the neighboring spray nozzles 5 larger than the inter-pixel pitch Pb formed by the partition walls. The nozzles 5 can correspond to the discharge cell regions between the partitions of the second substrate 1. Specifically, the first row jetting nozzles 5a are disposed between the second row jetting nozzles 5b so that the first row and the second row jetting nozzles 5a and 5b accurately correspond to the regions of the partition walls. 1/2 distance of the interval (L) It is arrange | positioned in the immediate front of the point corresponding to L), respectively. By this arrangement, the pitch Pn of the jet nozzle 5 is substantially increased while corresponding to the inter-pixel pitch Pb.

In other words, these spray nozzles 5 are arranged in a set of three neighboring triangles, the triangle arrangement is repeatedly formed along the nozzle head 7, and four neighboring four are arranged in a set of parallelograms. It can be seen that the parallelogram arrangement is formed repeatedly along the nozzle head 7.

3 is a partial step cross-sectional view of the nozzle head of the first embodiment along the line A-A of FIG.

In this way, since the injection nozzles 5 are formed with the openings Ao of the same size over the entire area of the nozzle head 7, the injection amount of the phosphor paste can be equally applied over the entire area of the nozzle head 7. have.

4 is a partial step cross-sectional view of the nozzle head of the second embodiment along the line A-A in FIG.

Unlike the first embodiment, this second embodiment forms the spray nozzles 5e provided at both ends of the nozzle head 7 in a different size than the other spray nozzles 5n. That is, the openings Ae of the injection nozzles 5e provided at both ends of the nozzle head 7 are formed to be 1/2 the size of the openings Ao of the other injection nozzles 5n. Therefore, the amount of phosphor paste sprayed from the spray nozzles 5e at both ends corresponds to 1/2 of the amount of phosphor paste sprayed from the other spray nozzles 5n.

This is carried out by the nozzle head 7 (S) to spray and apply the phosphor paste to the areas between the partitions of the second substrate 1, the injection nozzle (5) provided at both ends of the nozzle head (7) The areas corresponding to are sprayed twice in an amount corresponding to 1/2 of the amount of the phosphor paste sprayed from the other spray nozzles 5 to be applied. Thus, by forming the injection nozzle 5e provided in the both ends of the nozzle head 7 to 1/2 size of the opening Ao of the other injection nozzle 5n, when the nozzle head 7 advances continuously, the nozzle head ( 7) The spray nozzles 5e at both ends positioned at the outer side can effectively prevent staining by the phosphor face which may be generated at the far end of the nozzle head 7 due to the difference in the spray conditions with the other spray nozzles 5n. Can be.

5 is a cross-sectional view of a state in which the phosphor paste is injected from the spray nozzles of FIGS. 3 and 4.

Referring to the drawing of the phosphor paste with reference to this figure, when the phosphor paste is injected through the spray nozzle 5, the phosphor paste P grows while remaining at the tip of the spray nozzle 5. As shown in FIGS. 2 to 4, when the pitch Pn of the spray nozzle 5 is increased, the phosphor paste P remaining in the neighboring spray nozzles 5 is due to this pitch Pn. They do not overlap each other. In addition, the nozzle head 7 effectively sprays the phosphor paste in correspondence to the partition walls and the minute inter-pixel pitch Pb of the region between the partition walls, thereby preventing the spots and unevenness of the lines.

Hereinafter, a method of manufacturing a plasma display panel using the phosphor coating apparatus configured as described above will be described.

6 is a flowchart of a method of manufacturing a plasma display panel according to the present invention.

Referring to this drawing, a manufacturing method is described. The panel manufacturing method includes a first substrate manufacturing step (ST100) for forming a discharge sustaining electrode, a dielectric layer, and a protective film on the first substrate (1), and the first substrate manufacturing step. A second substrate fabrication step (ST200) for separately forming an address electrode, a dielectric layer, a partition, and a phosphor layer on a second substrate, and the first and second substrates are sealed (ST300), and the first and second seals are exhausted. Discharging air between the two substrates and injecting an inert gas (ST400) to complete the PDP (ST500).

The address electrode ST210, the dielectric layer ST220, and the barrier rib forming step ST230 of the first substrate fabrication step ST100, the second substrate fabrication step ST200 may use a known method. 2, only the step ST240 of forming the phosphor layer in the regions between the partition walls will be described.

In the step ST240 of forming the phosphor layer in the regions between the partition walls, the spray nozzles disposed in the nozzle head 7 at a pitch Pn larger than the inter-pixel pitch Pb formed by the partition walls And applying the phosphor paste by spraying the phosphor paste onto the discharge cell regions between the partitions of the second substrate 1 through 5) (ST241).

7 is a schematic plan view of a substrate on which a phosphor paste is applied in the manufacturing method of the present invention.

Referring to the drawing, the coating step ST241 of the phosphor paste is described. The coating step ST241 of the phosphor paste is disposed on the outside of the effective area 1v that actually implements the image on the second substrate 1. Application of the phosphor paste is started in the dummy region 1d, and ends in the other side dummy region 1d. That is, the application of the phosphor paste in the dummy region 1d of the second substrate 1 starts and ends, so that the amount of the phosphor paste is uniformly sprayed in the effective region 1v of the second substrate 1, thereby The phosphor paste is uniformly applied to the regions.

FIG. 8 is a partial plan view of a first embodiment connecting one application region of the phosphor paste in the manufacturing method of the present invention. FIG.

Referring to this drawing, the phosphor face application step ST241 will be described. FIG. 8 shows the nozzle head 7 in the application step ST241 of the phosphor paste starting in one dummy region 1d of the second substrate 1. The correlation between the injection nozzle 5 and the dummy area 1d is shown. Since the start and end of the phosphor coating step ST241 appear in the same shape, only the start state is shown and the end state is omitted.

That is, in the application step ST241 of the phosphor paste, the injection nozzle 5 alternately moves along the longitudinal direction of the nozzle head 7 with respect to discharge cell regions between neighboring partitions. It is provided in front and back, and fluorescent paste is sprayed alternately in the front and back in this dummy area | region 1d. For this reason, the phosphor paste is slightly unevenly sprayed and applied in the dummy region 1d, but is uniformly sprayed and applied in the effective basin 1v. In other words, coating unevenness does not occur in the effective region 1v of the second substrate 1.

Again, with reference to FIG. 7, the application step ST241 of the phosphor paste will be described over the entire area of the second substrate 1.

In the coating step ST241 of the phosphor paste, the nozzle head 7 is advanced in one outermost region C1 of the second substrate 1 to spray the phosphor paste into the regions between the partition walls of the region C1. The nozzle head 7 is returned to the next area C2 disposed after the outermost area C1, and the returned nozzle head 7 is further moved to the outermost area C1. Phosphor paste is sprayed and applied to the areas between the partitions of the next area C2 arranged next to (ST241b), and the nozzle head (until the end area Cn of the second substrate 1 is finished). 7) is returned to the next area following the previous area, and the returned nozzle head 7 is further advanced to spray and apply the phosphor paste to the areas between the partitions of the next area following the previous area (ST241n). The process is repeated sequentially.

In applying the phosphor paste in this manner, the one-time application region C1 of the phosphor paste is continuously connected to the next application region C2. That is, when the nozzle head 7 proceeds from the previous process, the recess 13 corresponding to the injection nozzle 5 provided at the outermost part of the nozzle head 7 is the phosphor paste sprayed by the injection nozzle 5. Is applied. During the progress of the nozzle head 7 in the subsequent process, the concave portion 15 corresponding to the injection nozzle 5 provided at the outermost part of the nozzle head 7 is coated with phosphor paste sprayed by the injection nozzle 5. do. The recesses 13 and 15 to which the phosphor paste has been applied by the front and rear processes are continuously arranged.

Fig. 9 is a partial plan view of a second embodiment connecting the one-time application regions of the phosphor paste in the manufacturing method of the present invention.

This second embodiment has the same overall method as the first embodiment, and the first embodiment uses the nozzle head 7 shown in FIG. 4 as compared to using the nozzle head 7 of FIG. There is. Therefore, only parts different from the first embodiment will be described here.

Referring to FIG. 9, the phosphor face application step ST241 will be described. In the phosphor paste application step ST241, the recess 17 between the partition walls positioned at the portion where the previous area C1 and the next area C2 are connected to each other is described. ) Is applied by spraying the phosphor paste twice when applying the previous region C1 and when applying the next region C2.

When the phosphor paste is applied to this recess 17 once, the application amount corresponds to 1/2 of the amount of the phosphor paste applied to the other area. In FIG. 9, two half arrows are shown in this recess 17, and one normal arrow is shown in the other area. The directions of these arrows indicate the advancing direction of the nozzle head 7 and the widths indicate the phosphor paste amount. In other words, the two half arrows mean that the phosphor paste is sprayed twice in one recess 17. For this reason, one normal arrow and two half arrows mean that the phosphor paste amount is the same.

As a result, the concave portion 17 to which the outermost portion of the nozzle head 7 is connected is applied with the same amount of phosphor paste as the other concave portions 17, thereby preventing uneven coating, that is, line unevenness.

The second substrate 1 having the good phosphor layer as described above is sealed together with the separately produced first substrate (ST300), and after exhaust, gas is injected (ST400), and completed with PDP (ST500).

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the present invention, the phosphor paste is sprayed by the nozzle spraying method to form the phosphor layer in the recesses between the partition walls so as to effectively correspond to the large substrate, and the opening of the spray nozzle provided in the nozzle head to the required size. By keeping the pitch of the spray nozzles larger than the pitch of the partition walls while maintaining it, the ejection of the phosphor paste is made uniform, preventing the interference of the phosphor face remaining at the tip of the neighboring spray nozzles, and preventing coating stains, thereby minimizing the pitch of the partition walls. It is more effective to respond to this and thereby improve the quality of PDP.

1 is a perspective view of a phosphor coating apparatus for a plasma display panel according to the present invention.

Fig. 2 is a plan sectional view of the nozzle head used in the phosphor coating device of the present invention.

3 is a partial step cross-sectional view of the nozzle head of the first embodiment along the line A-A of FIG.

4 is a partial step cross-sectional view of the nozzle head of the second embodiment along the line A-A in FIG.

5 is a cross-sectional view of a state in which the phosphor paste is injected from the spray nozzles of FIGS. 3 and 4.

6 is a flowchart of a method of manufacturing a plasma display panel according to the present invention.

7 is a schematic plan view of a substrate on which a phosphor paste is applied in the manufacturing method of the present invention.

FIG. 8 is a partial plan view of a first embodiment connecting one application region of the phosphor paste in the manufacturing method of the present invention. FIG.

Fig. 9 is a partial plan view of a second embodiment connecting the one-time application regions of the phosphor paste in the manufacturing method of the present invention.

Claims (19)

A tank incorporating and supplying phosphor paste; A nozzle head having a plurality of spray nozzles which receive phosphor paste from the tank and apply sprays correspondingly to the recesses between the partition walls of the substrate; And A cylinder for elevating the nozzle head; And a pitch between jet nozzles adjacent to each other in the nozzle head is greater than a pitch between pixels formed by barrier ribs on the substrate. The method of claim 1, The spray nozzles may include first row spray nozzles disposed forward in the forward direction of the phosphor paste of the nozzle head; And a second row jetting nozzle disposed behind the point between each of the first row jetting nozzles. The method of claim 2, And the first row spray nozzles are disposed in front of a point corresponding to one half of the interval between the second row spray nozzles. The method of claim 1, And the spray nozzles are arranged in three neighboring triangles, and the triangle arrangement is repeatedly formed along the nozzle head. The method of claim 1, And four spray nozzles are arranged in parallelograms, and the parallelogram arrangements are repeatedly formed along the nozzle head. The method of claim 1, And the spray nozzles are all formed of openings having the same size. The method of claim 1, And spray nozzles provided at both ends of the nozzle head of the spray nozzles each having a size of 1/2 of the spray nozzle opening provided therebetween. A tank incorporating and supplying phosphor paste; A nozzle head having a plurality of spray nozzles which receive phosphor paste from the tank and apply sprays correspondingly to the recesses between the partition walls of the substrate; And A cylinder for elevating the nozzle head; And spray nozzles adjacent to each other in the nozzle head are arranged in a zigzag form along a direction perpendicular to a nozzle head advancing direction when the phosphor face is applied. The method of claim 8, The spray nozzles may include first row spray nozzles disposed forward in the forward direction of the phosphor paste of the nozzle head; And a second row jetting nozzle disposed behind the point between each of the first row jetting nozzles. The method of claim 8, And the first row spray nozzles are disposed in front of a point corresponding to one half of the interval between the second row spray nozzles. The method of claim 8, And the spray nozzles are all formed of openings having the same size. The method of claim 8, And spray nozzles provided at both ends of the nozzle head of the spray nozzles each having a size of 1/2 of the spray nozzle opening provided therebetween. A first substrate manufacturing step of forming a discharge sustaining electrode and a dielectric layer on the substrate; A second substrate manufacturing step of forming an address electrode, a dielectric layer, a partition wall, and a phosphor layer on a substrate separate from the first substrate; And Sealing the first and second substrates, and injecting discharge gas after exhaust; In the manufacturing of the second substrate, the forming of the phosphor layer may include And a coating step of applying a phosphor paste to the recesses between the partition walls with a phosphor coating device having a pitch between adjacent injection nozzles provided in the nozzle head greater than a pitch between pixels formed by the partition walls. Manufacturing method. The method of claim 13, Spray nozzles provided in the nozzle head of the phosphor coating device are arranged in a zigzag form along a direction perpendicular to the nozzle head traveling direction when the phosphor paste is applied. The method of claim 13, And wherein the applying of the phosphor paste starts in a dummy region disposed outside the effective region of the second substrate and ends in another dummy region. The method of claim 13, The coating of the phosphor paste is a plasma display panel manufacturing method of spraying the phosphor paste from the front and rear alternately based on the traveling direction of the nozzle head. The method of claim 13, In the applying of the phosphor paste, the nozzle head is advanced in one outermost region of the second substrate by spraying the phosphor paste into the recesses between the partition walls of the region, Returning the nozzle head to a next region disposed subsequent to the outermost region, The returned nozzle head is further advanced, and a phosphor paste is sprayed and applied to the concave portions between the partitions of the next region arranged after the outermost region, The nozzle head is returned to the next area which is disposed following the previous area until the area of the second substrate is terminated, and the returned nozzle head is further advanced so that the phosphors in the recesses between the partitions of the next area following the previous zero are returned. Plasma display panel manufacturing method for sequentially repeating the application process by spraying the paste. The method of claim 13, In the applying step of the phosphor paste, a plasma display in which the phosphor paste is sprayed twice in the recess between the partition walls located at the portion where the previous region and the next region are connected, when the previous region is applied and the next region is applied. Panel manufacturing method. The method of claim 13, In the coating step of applying the phosphor paste, when the previous region is coated with the phosphor paste corresponding to 1/2 of the amount of application of the recess between the other partitions, the recesses between the partitions located in the portion where the previous region and the next region are continued. And a plasma display panel which is sprayed when the next area is applied.