KR100589413B1 - Plasma Display Panel and Device for manufacturing rib of PDP and Method thereof - Google Patents

Abstract

According to the present invention, an etching liquid spray pipe is horizontally disposed on the partition formation surface of the rear substrate of the plasma display panel so that the etching solution is evenly sprayed on the partition formation surface to improve the uniformity of the etching process. An injection nozzle for injecting etchant to a substrate, a rotating part connected to the injection pipe to reciprocally rotate the injection pipe in the longitudinal direction of the injection pipe, and a linear connection of the injection pipe along the rotation direction connected to the injection pipe A partition processing apparatus for a plasma display panel including a moving unit for reciprocating movement is provided.

Spray pipe, spray nozzle, rotating, moving, bulkhead

Description

Plasma display panel and device for manufacturing plasma display panel, and plasma display panel according thereto

1 is an exploded perspective view illustrating a discharge cell of a typical plasma display panel;

2 is a schematic perspective view illustrating an operating state of a partition processing apparatus of a plasma display panel according to an embodiment of the present invention;

3 is a schematic cross-sectional view showing a partition processing state of a plasma display panel according to the related art.

The present invention relates to a plasma display panel (hereinafter, also referred to as a 'PDP'), and more particularly, a barrier rib processing apparatus and a processing method for forming a partition on a substrate of one side of the PDP through an etching process; The present invention relates to a plasma display panel manufactured accordingly.

As is known, a plasma display panel (PDP) applies a predetermined voltage to two electrodes provided in a discharge space so that plasma discharge occurs between them, and a predetermined pattern is generated by ultraviolet rays generated during the plasma discharge. The phosphor layer thus formed is excited to form an image.

Such plasma displays are largely divided into AC type, DC type, and hybrid type. As shown in FIG. 1, the conventional plasma display panel 100 includes a rear substrate 111, a plurality of address electrodes 115 formed on the rear substrate 111, and a rear substrate 111 on which the address electrodes 115 are formed. A dielectric layer 119 formed on the dielectric layer 119 to limit the discharge current and to facilitate generation of wall charges, and a plurality of partition walls formed on the dielectric layer 119 to maintain the discharge distance and prevent cross talk between cells. 123 and the phosphor layer 125 coated on the partition wall 123.

The plurality of discharge sustaining electrodes 117 are formed below the front substrate 113 to be orthogonal to the plurality of address electrodes 115 formed on the rear substrate 111 at regular intervals. The dielectric layer 121 and a protective film 127 for protecting the dielectric layer from sputtering during discharge sequentially cover the discharge sustain electrode 117.

In the PDP configured as described above, ultraviolet rays are generated by applying a voltage between two electrodes formed in the discharge space to generate a discharge on the surface of the dielectric layer and the protective layer on the electrode, and the ultraviolet rays are coated on the rear substrate by the ultraviolet rays. Is excited to emit light, and color display is performed by the R, G and B phosphors coated separately.

In order to form a partition on the rear substrate, a sand blasting method or a screen printing method is used, and recently, a method of forming a partition through an etching solution has been studied.

In the method of forming a partition wall through the etching solution, an address electrode and a dielectric layer are formed on the glass substrate, and the screen paste of the partition glass paste or the green tape for the partition wall is attached thereon, followed by heat treatment to attach a stripe-type mask pattern. The barrier rib is formed by etching the drilled portion of the mask pattern by spraying.

However, in the related art, the etching solution is not evenly sprayed on the partition formation surface in the etching solution spraying process, so that the partition is unevenly processed.

That is, as illustrated in FIG. 3, a spray pipe 200 having a plurality of etching spray nozzles 210 formed on the barrier rib forming surface of the rear substrate 111 is disposed in the longitudinal direction of the barrier rib 123 for the conventional etching process. As a result, the etching solution is sprayed at a predetermined angle. At this time, the spray pipe 200 is rotated at a predetermined angle in both directions with its center as the rotation axis, so that the etching solution can be sprayed widely.

However, in the conventional structure described above, the shape of the partition wall becomes very weak due to the spray angle of the etchant, and a phenomenon in which the middle portion of the partition wall is recessed inward like a jar occurs based on the cross section, thereby forming a phosphor layer in the partition wall. Phosphor paste does not remain on the sidewalls of the city, resulting in a problem that the luminance of the panel is lowered and the discharge characteristics are deteriorated.

In addition, the injection pipe is rotated by itself to widen the injection angle, but when looking at the distribution of the etching liquid injected from one injection nozzle, the amount of etching liquid injection in the central portion and the peripheral portion of the injection pipe is reciprocated.

That is, the etchant is continuously supplied regardless of the rotation of the injection pipe and the etchant is supplied only when the injection pipe is rotated to the periphery, so that the etchant is not evenly supplied to the partition formation surface, and the partition is unevenly formed. As described above, the display quality of the PDP is deteriorated.

The present invention has been invented to solve the problems of the prior art described above, and an object of the present invention is to spray the etching solution evenly on the partition wall forming surface to improve the uniformity of the etching process of the plasma display panel partition wall processing apparatus and processing It is an object of the present invention to provide a method and a plasma display panel.

In order to achieve the above object, the present invention is intended to rotate the injection pipe for injecting the etching liquid and to reciprocate the injection pipe in the rotational direction in forming the partition wall through the etching method.

To this end, the PDP partition wall processing method of the present invention comprises forming a partition layer, applying a photoresist on the partition layer, placing a photomask on which a pattern of a desired shape is formed, and exposing with a UV light, developing the photoresist with a developer. Forming a photoresist pattern having a desired shape, by reciprocating the spray pipe provided with the spray nozzles to scatter the etching liquid on the photoresist pattern, and simultaneously forming the partition walls by the etching liquid sprayed by reciprocating the spray pipe in a rotational direction. Forming and thinning the photoresist pattern with an alkaline solution.

Wherein the step of spraying the etchant is to spray the etchant along the longitudinal direction of the partition to be formed.

In addition, the present invention is a processing apparatus for processing a PDP partition wall according to the above process, the etching liquid injection pipe is arranged horizontally on the upper portion of the partition wall forming surface of the rear substrate, and formed along the injection pipe to spray the etching liquid on the rear substrate An injection nozzle, a rotating part connected to the injection pipe to reciprocate the injection pipe in the longitudinal direction of the injection pipe, and a moving part connected to the injection pipe to linearly reciprocate the injection pipe along the rotation direction Include.

Accordingly, the injection pipe is capable of spraying the etching solution on the partition wall surface evenly and widely through the injection nozzle by performing a parallel reciprocating motion together with the rotational motion by itself.

Here, preferably, the injection pipe is disposed at right angles to the longitudinal direction of the partition wall and reciprocally moves the injection pipe along the longitudinal direction of the partition wall.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view illustrating a discharge cell of a general plasma display panel, and FIG. 2 is a schematic perspective view illustrating an operating state of a partition wall processing apparatus of a plasma display panel according to an exemplary embodiment of the present invention.

First, the PDP will be briefly described with reference to FIG. 1. The PDP has a plurality of address electrodes 115 and a dielectric layer 119 that limits discharge current and facilitates generation of wall charges. A rear substrate 111 including a plurality of barrier ribs 123 and phosphor layers 125 formed on surfaces of the barrier ribs 123 to maintain a distance and prevent cross talk between cells; and the rear substrate 111. A plurality of discharge sustaining electrodes 117, a dielectric layer 121, and a protective film 127 are formed to be orthogonal to the plurality of address electrodes 115 formed at a predetermined interval and orthogonal to each other.

Looking at the device for forming the partition wall 123 on the back substrate 111 of the PDP of the above structure, the partition wall to be formed to be formed at a predetermined interval on the partition wall forming surface of the back substrate 111 ( A plurality of etching liquid injection pipes 10 placed at right angles to the 123, a spray nozzle 11 for spraying etching liquid onto the rear substrate 111 formed along the lower surface of the injection pipe 10, and the injection A rotating part 20 connected to the pipe 10 to reciprocally rotate the injection pipe 10 along the longitudinal direction of the injection pipe 10, and connected to the injection pipe 10 to connect the injection pipe 10 to the injection pipe 10. The moving part 21 for linear reciprocating movement along the longitudinal direction of the partition 123 is included.

The rotation unit 20 is connected to a shaft, for example, between a power source such as a driving motor for rotating the shaft and the driving motor and the injection pipe 10 to reciprocate the rotational movement of the driving motor. A power conversion mechanism such as a cam for converting to motion may be included, but is not limited thereto.

In addition, the moving part 21 may also include a power source such as a drive motor or a cylinder and a power conversion mechanism such as a rack and a pinion for converting the rotational force of the drive motor into a linear motion of the injection pipe 10. It is not limited to.

Accordingly, as shown in FIG. 2, the injection pipe 10 rotates the etching liquid to the partition forming surface of the rear substrate 111 through the injection nozzle 11 installed at the bottom and rotates in the longitudinal direction of the partition 123. And reciprocating.

Therefore, the etching liquid injected from the injection nozzle 11 is primarily extended in the longitudinal direction of the partition wall 123 according to the rotation of the injection pipe 10, and at this time, the injection range of the etching liquid in accordance with the rotation of the injection pipe 10 The etching liquid injection amount deviation generated therein is solved as the injection pipe 10 moves to the periphery within the etching liquid injection range along the longitudinal direction of the partition wall 123, so that the etching liquid can be evenly sprayed on the partition formation surface as a whole.

That is, when the injection pipe 10 is rotated while the etching liquid injected through the injection nozzle 11 of the injection pipe 10 is defined in the injection range on the partition formation surface of the rear substrate 111 according to the injection angle. In the rotational direction, the injection position is moved, and at this time, a portion (center portion) and a portion (peripheral portion) where the injection regions of the etching liquid overlap each other appear.

In addition, when the injection pipe 10 moves in the rotational direction as described above with the rotation of the injection pipe 10, the injection pipe 10 moves to the peripheral portion where the etching liquid injection regions do not overlap, thereby moving the injection position of the etching liquid. In addition, the etching liquid can be sprayed in duplicate, thereby obtaining an even spraying effect of the etching liquid which cannot be obtained in the state where the injection pipe 10 is only rotated.

Here, the rotation angle of the injection pipe 10 and the moving distance of the injection pipe 10 are not particularly limited, and the injection pipe 10 may be moved according to the rotation angle, and the injection pipe separately from the rotation angle ( 10) can be reciprocated.

On the other hand, look at the formation process of the partition wall by the etching as follows.

First, the entire surface is printed with a barrier paste on the dielectric formed on the entire surface of the substrate to form a barrier layer.

When the barrier layer is formed, applying a photoresist on the barrier layer, and placing a photomask having a pattern of a desired shape on it, exposing with ultraviolet light, developing the photoresist with a developer to form a photoresist pattern of the desired shape Will go through.

In the next process, the barrier layer is etched using an etchant to form the barrier rib 123 having a desired pattern.

In this case, the forming of the partition wall by the etching solution may include reciprocating the injection pipe 10 through which the etching liquid is sprayed in the axial direction to disperse the etching liquid sprayed through the injection nozzle 11 in the longitudinal direction of the partition wall 123 and the And reciprocating the injection pipe 10 in the longitudinal direction of the partition wall 123.

Therefore, the etching solution is sprayed on the partition forming surface on the substrate while being rotated in the longitudinal direction of the partition wall, and the spraying position is shifted in the longitudinal direction of the partition wall so as to expand the spraying area of the etching solution and overlap each other so that the etching solution is completely evenly deposited on the substrate. do.

When the partition wall formation process by the etching solution as described above is finished, the partition wall 123 is formed on the rear substrate by thinning the photoresist pattern with the alkaline solution in the following process.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the present invention, it is possible to uniformly form the partition wall by spraying the etching liquid evenly, thereby processing the plasma display panel with high precision and high brightness.

In addition, there is an effect that can realize mass production through the etching process.

Claims (7)

Forming a barrier rib layer by performing front surface printing with a barrier paste on a dielectric formed on the entire surface of the substrate; Applying a photoresist on the barrier layer, and placing a photomask on which a pattern having a desired shape is formed and performing exposure to ultraviolet rays; Developing the photoresist with a developer to form a photoresist pattern having a desired shape;  Dispersing the etching liquid along the longitudinal direction of the barrier rib to be formed on the photoresist pattern by reciprocating the spray pipe having the spray nozzle installed in the longitudinal direction of the spray pipe; Forming a partition wall by etching liquid sprayed by reciprocating linear movement along the longitudinal direction of the partition wall to which the etching liquid is sprayed together to form the injection pipe; Thin film photoresist pattern with alkaline solution Bulkhead processing method of the plasma display panel comprising a. delete An upper substrate and a lower substrate disposed to face each other; Address electrodes formed on the lower substrate and a dielectric layer covering the address electrodes; A partition wall disposed in a space between the upper substrate and the lower substrate to partition a plurality of discharge cells and to be processed by the method of claim 1; A phosphor layer formed on the partition wall surface; A discharge sustaining electrode corresponding to the discharge cell while extending in a direction crossing the address electrode on the upper substrate; Plasma display panel comprising a. An etching liquid injection pipe which is horizontally placed on an upper surface of the partition wall forming surface of the rear substrate of the plasma display panel and disposed at right angles to the longitudinal direction of the partition wall; An injection nozzle formed along the injection pipe for injecting etching liquid onto a rear substrate; A rotating part connected to the injection pipe for reciprocating the injection pipe in the longitudinal direction of the injection pipe; A moving part connected to the injection pipe to linearly reciprocate the injection pipe along the longitudinal direction of the partition wall Bulkhead processing apparatus of the plasma display panel comprising a. delete delete An upper substrate and a lower substrate disposed to face each other; Address electrodes formed on the lower substrate and a dielectric layer covering the address electrodes; A partition wall disposed in a space between the upper substrate and the lower substrate to partition a plurality of discharge cells and to be processed by the apparatus of claim 4; A phosphor layer formed on the partition wall surface; A discharge sustaining electrode corresponding to the discharge cell while extending in a direction crossing the address electrode on the upper substrate; Plasma display panel comprising a.

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