KR20050057020A - Substrate carrier having door latching and substrate clamping mechanisms - Google Patents

Abstract

In a first aspect, an automatic door opener is provided that includes (1) a platform adapted to support a substrate carrier; (2) a door opening mechanism adapted to open a door of the substrate carrier while the substrate carrier is supported by the platform; and (3) a tunnel. The tunnel is adapted to extend from an opening in a clean room wall toward the platform and at least partially surround the platform. The tunnel is further adapted to direct a flow of air from the clean room wall toward the platform and out of the tunnel. Numerous other aspects are provided.

Description

Substrate carrier with door latching and substrate clamping mechanisms {SUBSTRATE CARRIER HAVING DOOR LATCHING AND SUBSTRATE CLAMPING MECHANISMS}

This application claims priority to US provisional application 60 / 407,340, filed August 31, 2002, which is hereby incorporated by reference in its entirety.

FIELD OF THE INVENTION The present invention generally relates to substrate processing, and more particularly to apparatuses and methods for interfacing the substrate processing to substrate carriers and processing tools.

This application is related to the following commonly assigned and pending US patent applications, each of which is hereby incorporated by reference in its entirety:

US Provisional Patent Application (Application No. 60 / 407,451, Delegation Docket No. 6900 / L), filed Aug. 31, 2002, entitled "System For Transporting Wafer Carriers";

 U.S.A. entitled "Method and Apparatus for Using Wafer Carrier Movement to Actuate Wafer Carrier Door Opening / Closing" filed Aug. 31, 2002 Patent application (Application No. 60 / 407,339, Delegation Docket No. 6976 / L);

 United States patent application entitled "Method and Apparatus for Unloading Wafer Carrier from Wafer Carrier Transport Systems", filed Aug. 31, 2002 60 / 407,474, delegated docket number 7024 / L);

 United States Provisional Patent Application (Application No. 60 / 407,336, Delegated Docket Number, filed August 31, 2002, entitled "Method and Apparatus for Supplying Wafers to a Processing Tool") 7096 / L);

 United States Provision entitled “End Effector Having Mechanism For Reorienting A Wafer Carrier Between Vertical And Horizontal Orientations,” filed August 31, 2002. Patent application (application no. 60 / 407,452, delegated docket number 7097 / L);

 United States Provisional Patent Application entitled "Wafer Loading Station with Docking Grippers at Docking Stations," filed August 31, 2002 (Application No. 60 / 407,337, Delegation Docker No. 7099) / L);

 US Provisional Patent Application (Application No. 60 / 443,087, Authorized Docket No. 7163 / L) entitled “Method and Apparatus for Transporting Wafer Carriers” filed January 27, 2003;

 United States patent application filed on August 31, 2002 entitled "Wafer Carrier Handler That Unloads Wafer Carriers Directly From a Moving Conveyor" (Application No. 60 / 407,463). , Delegated docket number 7676 / L1);

  US patent application entitled "Wafer Carrier Handler That Unloads Wafer Carriers Directly From a Moving Conveyor", filed Jan. 27, 2003 (Application No. 60 / 443,004) , Delegated docket number 7676 / L2);

 US Provisional Patent Application (Application No. 60 / 443,153, entitled "Overhead Transfer Flange and Support for Suspending Wafer Carrier," filed January 27, 2003) Docket number 8092 / L);

 US Provisional Patent Application (Application No. 60 / 443,001, Delegation Docket) entitled "Systems and Methods for Transferring Wafer Carriers Between Processing Tools," filed January 27, 2003 Number 8201 / L);

 United States Provisional Patent Application (Application No. 60 / 443,115, Authorized Docket No. 8202) entitled "Apparatus and Method for Storing and Loading Wafer Carriers", filed Jan. 27, 2003 / L);

Semiconductor devices are formed for use in computers and monitors, etc. on substrates such as silicon substrates, glass plates or the like, usually referred to as wafers. Such devices are formed by sequential fabrication steps such as thin film deposition, oxidation, etching, polishing and thermal and lithographic processing. Although multiple fabrication steps can often be performed by a single processing tool, substrates typically must be transferred between different processing tools during at least some of the fabrication steps needed for device fabrication.

Substrates are generally stored in a carrier for transfer between processing tools and other locations. In many cases, the substrate carriers completely enclose the substrate or substrates contained within the carriers with a fixed amount of air or other gas to reduce dust contamination of the substrates. Existing substrate carriers generally have doors that must be opened and / or removed to allow the substrate to be extracted from the substrate carrier when the substrate carrier is interfaced to the processing tool.

It may be desirable to provide a latching mechanism for the substrate carrier to sometimes ensure that the door of the carrier remains closed when the door is to be closed (eg during delivery). It may also be desirable to provide a clamping mechanism in the substrate carrier to ensure that each substrate is held in the carrier housing while the carrier is being received at or in the processing tool. Such latching and clamping mechanisms typically require the use of a number of actuators and specially designed keys that increase the cost and complexity of the substrate carriers. More simple and economical substrate carriers are desirable.

1 is a schematic side top view showing a substrate transfer position provided in accordance with the present invention.

2A and 2B are equivalent views of a substrate carrier provided in accordance with the present invention, showing the substrate carrier of the present invention in the closed and open states, respectively.

2C is a side view of the substrate carrier of FIG. 2B.

3 is an enlarged partial side view showing some of the components of the inventive substrate carrier of FIGS. 2A and 2B when the inventive substrate carrier is in a closed and latched state.

4A is an equivalent view of a carrier opening mechanism provided in accordance with the present invention as part of the substrate transfer position of FIG.

4B is an enlarged equivalent view showing a portion of FIG. 4A.

4C is a front view of the carrier opening mechanism of FIG. 4A with the substrate carriers of FIGS. 2A-2C disposed.

5A is a schematic equivalent view illustrating the clamping mechanism included in the substrate carrier of FIGS. 2A and 2B and provided in accordance with the present invention.

5B is an enlarged schematic equivalent view of a portion of FIG. 5A.

5C is an equivalent view of the embodiment of the substrate carrier of FIGS. 2A and 2B with the lid of the substrate carrier removed and a clamping member or the like clamping the substrate.

FIG. 5D is an enlarged equivalent view detailing a portion of FIG. 5C. FIG.

6A is a partial side view illustrating the clamping member of the clamping mechanism of FIGS. 5A and 5B in clamping contact with a substrate.

6B is a cross-sectional view of the substrate carrier of FIG. 5C when an alternative clamping member configuration is used.

FIG. 6C is an enlarged equivalent view showing a portion of FIG. 6B in detail. FIG.

7A and 7B are similar to FIGS. 5A and 5B, respectively, and illustrate the substrate clamping mechanism of the present invention in the released state.

FIG. 7C is a cross sectional view similar to FIG. 6B with the clamping members retracted. FIG.

FIG. 7D is an enlarged equivalent view showing a portion of FIG. 7C in detail. FIG.

FIG. 7E is an equivalent view of an embodiment of a substrate carrier in which the lid of the substrate carrier is removed and the clamping members are discarded from the substrate.

8 is an equivalent view of an alternative embodiment of a substrate loading station including a substrate carrier adjuster that may be used in the present invention.

In one embodiment of the invention, (1) a platform provided to support a substrate carrier; (2) a door opening mechanism provided to open the door of the substrate carrier while the substrate carrier is supported by the platform; And (3) an automatic door opener comprising a tunnel. The tunnel is provided to extend toward the platform and at least partially surround the platform at the opening of the washroom wall. The tunnel is further provided to direct air flow from the washroom wall towards the platform and out of the tunnel.

In a second embodiment of the present invention, a method of loading a substrate into a processing tool is provided. The method includes the steps of (1) loading a substrate carrier on a platform disposed adjacent to a clean room wall separating the platform from the processing tool; (2) at least partially surrounding the substrate carrier with a tunnel extending from the opening of the clean room wall towards the platform; (3) opening the door of the substrate carrier while the substrate carrier is supported by the platform; And (4) directing an air stream from the wash chamber wall toward the platform and out of the tunnel.

In a third embodiment of the invention, an apparatus for unlatching a substrate carrier is provided. The apparatus includes (1) a substrate transfer position comprising a support structure provided to support a substrate carrier; And (2) an actuator device disposed relative to the support structure. The actuator device is provided to interact with the latching mechanism of the substrate carrier supported by the support structure, to exploit the movement of the substrate carrier to activate the unlatching of the substrate carrier.

In a fourth embodiment of the invention, an apparatus for releasing a substrate clamping mechanism of a substrate carrier is provided. The apparatus includes (1) a substrate delivery position comprising a support structure provided to support a substrate carrier, and (2) an actuator device disposed in relation to the support structure. The actuator device is provided to interact with the substrate clamping mechanism of the substrate carrier held by the support structure.

In a fifth embodiment of the present invention, there is provided an apparatus for unlatching a substrate carrier and releasing the substrate clamping mechanism of the substrate carrier by utilizing both characteristics of the first and second embodiments of the present invention. Many other embodiments are provided, and systems and methods are provided for performing this.

It will be understood that the term "latching mechanism" as used in the present specification and claims means an apparatus that applies a force to the door of the substrate carrier to hold the door in the closed position. "Latching" is understood to hold the door of the substrate carrier in a closed position. "Unlatching" is understood to allow the door of the substrate carrier to open (regardless of whether the door is actually open).

By the apparatus and method of the present invention, the door of the substrate carrier is stably closed despite gravity or other attempts to open the door. In accordance with the present invention, the substrate clamping mechanism included in the substrate carrier can also ensure that the substrate is held in a stable position within the substrate carrier during delivery of the substrate carrier. This condition can prevent unintentional contact between the substrate and the interior of the substrate carrier, thereby reducing the possibility of dust contamination or damage of the substrate. In one or more embodiments of the present invention, these features include the use of fewer actuators or specially designed keys used in many existing substrate carriers.

Other features and advantages of the present invention will become more fully apparent from the following detailed description, claims and accompanying drawings.

According to the invention, the door latching mechanism of the substrate carrier is automatically unlatched by interaction with the actuator device of the latching mechanism at the substrate transfer position (eg of the processing tool that can be used during semiconductor device fabrication). The same actuator mechanism may also release the substrate clamping mechanism, which may be part of the substrate carrier (eg, to protect the substrate stored by the substrate carrier during delivery).

1 is a schematic side top view showing a processing tool and associated factory interface including a substrate transfer location provided in accordance with the present invention. In Fig. 1, reference numeral 100 denotes a schematic representation of a processing tool.

As will be familiar to those skilled in the art, the processing tool 100 may include one or more loading locks, one or more transfer chambers, and / or one or more processing chambers associated with the one or more transfer chambers. These properties are not shown separately. One or more semiconductor device manufacturing processes in the processing chambers may be applied to a substrate loaded into the processing tool 100.

Factory interface (FI) 102 is coupled to the processing tool 100 to provide an interface between the processing tool 100 and one or more carriers containing substrates to be loaded into the processing tool 100. The factory interface 102 includes a washroom wall 103 that separates the interior of the factory interface from the washroom perimeter 105. The factory interface 102 includes a port 104 through which one or more substrates can be delivered to the factory interface 102. More than one cat number of ports 104 may be used. The optional door 106 can selectively close the port 104 of the factory interface 102. In one embodiment of the present invention, the door 106 shown in FIG. 1 may be omitted, and the factory interface 102 may have a positive internal pressure such that a constant gas flow is directed through the port 104. This is to exit the factory interface 102. The positive internal pressure of the factory interface 102 thereby serves to prevent dust / contaminants from entering the factory interface 102. Positive pressure uses the HEPA, ULPA or similar washroom grade filters known in the art and uses the factory interface via filtered air flow through the factory interface (eg, from top to bottom of the factory interface). And may be maintained at 102. In one embodiment of the invention, a hydraulic pressure differential of 0.005 inches to 0.2 inches between the inside and outside of the factory interface 102 may be used (eg, using ambient air that is recycled and filtered).

The substrate transfer location 108 is provided outside of the factory interface 102 in accordance with the present invention (eg, on the outside of the door 106 and the port 104). The substrate transfer location 108 includes a substrate carrier support structure, such as a support platform 110, on which the substrate carrier 112 of the present invention (described further below) may be supported.

A carrier movement device 114, such as a motor stage or pneumatic cylinder, is associated with the support platform 110, the device being separated from the factory interface toward the factory interface 102 by the substrate carrier 112. Is provided for moving. Alternatively, the substrate carrier may be supported by a gripper (not shown) that grips the substrate carrier through, for example, an overhead hydrogen flange (not shown) of the substrate carrier to suspend the substrate carrier. The gripper or support 110 can include one or more kinetic properties (eg, kinetic pins, mounts, etc.) for substrate carrier placement.

In FIG. 1, reference numeral 116 denotes an openable portion of a door or substrate carrier 112. An actuator device (described below) included in the substrate transfer position 108, and a latching mechanism (described below) provided on the substrate carrier 112 are not shown separately in FIG. 1. In accordance with at least one embodiment of the present invention, the movement of the substrate carrier 112 causes the actuator device of the substrate transfer position 108 to unlatch the openable portion 116 of the substrate carrier 112. It interacts with the latching mechanism of the substrate carrier 112. The interaction of the actuator device of the substrate transfer position 108 and the latching mechanism of the substrate carrier 112 may serve to release the substrate clamping mechanism (not shown in FIG. 1) of the substrate carrier 112. . The actuator device of the substrate transfer position 108, and the substrate clamping mechanism of the substrate carrier 112 will be further described below with reference to FIGS. 2A-7E.

The factory interface 102 may also include a substrate manipulation robot, which is not shown and is provided to transfer substrates between the substrate carrier 112 and the process output 100.

In the embodiment of FIG. 1, the controller 118 is coupled with them for operation control of the door 106 of the factory interface 102 and the carrier movement device 114.

Reference numeral 120 denotes one or more substrate carrier storage shelves (for storing one or more substrate carriers) that can be mounted in association with the substrate delivery location 108. For example, the one or more substrate carrier storage shelves 120 may be positioned above the substrate transfer location 108 as shown.

FIG. 2A is an equivalent view of the substrate carrier 112 of the present invention in the closed state, and FIG. 2B is a view similar to FIG. 2A, showing the substrate carrier 112 of the present invention in the open state. The substrate carrier 112 of the present invention includes a carrier housing 200 in which a substrate 202 (FIG. 2B) can be included. The carrier housing 200 includes an openable portion 204 that includes a door 206 that is pivotally mounted to the carrier housing 200. The door 206 is pivoted between the closed arrangement shown in FIG. 2A and the open arrangement shown in FIG. 2B.

In accordance with the present invention, the substrate carrier 112 of the present invention includes a latching mechanism 208. In at least one embodiment, the latching mechanism 208 of the present invention follows the side wall 214 of the carrier housing 200, preferably with the lower edge 212 of the housing (although other positions may be used). It may include an elongated, tubular-shaped enclosure 210 arranged along. The enclosure 210 has a rectangular or rectangular cross section, for example. Other forms may be used. The enclosure 210 may be integrally formed with or separately from the carrier housing 200, for example.

As shown in the side view of FIG. 2C, the openable portion 204 of the carrier housing 200 may have an angled face 216 (eg, some other possible angle of 45 °), and the door The 206 may have an angled face 218 such that no scrubbing action is performed on the openable portion 204 of the carrier housing when the door 206 is closed. As a result, dust generation, etc., when closing the door 206 can be reduced. One or both of the angled faces 216 and 218 may be covered with an elastic material such as silicon for sealing therebetween.

3 is a partial side elevation view of the substrate carrier 112 of the present invention, detailing an exemplary embodiment of the latching mechanism 208 of the present invention. The latching action of the latching mechanism 208 is performed between the tab 300 extending outward from the right side 301 (FIG. 2B) of the door 206 and the latch member 302 slidable inside the enclosure 210. Provided by the interaction. In the example shown, the tab 300 is disposed above the lower edge 304 (FIG. 3) of the door 206. Latch member 302 has an outer end 306 extending outward from mouth 308 of enclosure 210. The latch member 302 includes a finger 310 extending outward from the outer end 306 of the latch member 302. The finger 310 is further described below and when the latching member 208 is in the latching state as shown in FIG. 3, the door 206 is closed (FIGS. 2A and 3) and the latch member ( The finger of 302 is configured to lie under the tab 300. In such an arrangement, the finger 310 may allow the tab 300 (and thus the door 206) to pivot to the pivot point P relative to the carrier housing 200 (eg, the door 206). ) By applying an upward force on the tab 300 to keep it in a closed configuration. Specifically, the portion 310a of the finger 310 contacts the portion 300a of the tab 300 as shown in FIG.

In at least one embodiment of the invention, the portion 300a of the tab 300 and the portion 310a of the finger 310 are inclined with respect to the vertical plane (although no other angle is used or no angle is used). Even inclined at, for example, about 10 to 15 °). The inclination of the portion 310a of the finger 310 provides a vertical force component that can assist in the closure of the substrate carrier 112. Inclination of the portion 300a of the tab 300 causes the tab 300 and / or the finger 310 to be more evenly distributed by frictional contact with the surfaces of the tab 300 and the finger 310. Can reduce dust generation and / or wear. A low friction coating or contact surface (not shown) may also be added to the tab 300 and / or the finger 310, which may be used during the opening and / or closing of the substrate carrier 112. And to reduce frictional interaction between the fingers 310. Examples of such low friction coatings / contact surfaces include polytetrafluoroethylene (PTFE) or Teflon, materials such as PTFE, other low friction and / or low particle generating materials, and the like.

The latching mechanism 208 also includes a biasing device such as a spring 312. The spring 312 is maintained at an inner end 313 of the enclosure 210 (eg, an end facing the mount 308 of the enclosure 210). The spring 312 is biased toward the tab 300 of the door 206 (eg, toward the latching arrangement shown in FIG. 3) to bias the latch member 302 outward. Push against the inner end 314 of. Other suitable biasing devices may similarly be used.

Step 318 is formed on the outer end 306 of the latch member 302 at the point where the finger 310 appears at the outer end 306. When the latching mechanism 208 is in the latching arrangement shown in FIG. 3, the step 318 of the latch member 302 is configured to limit the outward movement of the latch member 302. Contact 320).

2A and 2B, although only one latching mechanism 208 associated with the side wall 214 of the carrier housing 200 is shown in the figure, it is still possible to latch the left side 322 of the door 206. Two latching mechanisms may be provided in association with the opposite wall of the carrier housing 200.

4A is an equivalent view of one exemplary embodiment of a carrier opening mechanism 400 configured in accordance with the present invention. In an exemplary embodiment, the carrier opening mechanism 400 may be disposed near or within the port 104 of the factory interface 102. In general, the carrier opening mechanism 400 may be used at any location where a substrate carrier 112 is desired to access the substrate 202.

Referring to FIG. 4A, the carrier opening mechanism 400 is shown as viewed outward from the interior of the factory interface 102 (FIG. 1) toward the substrate transfer location 108 via the port 104. 4B is an enlarged equivalent view illustrating in detail the portion 401 (FIG. 4A) of the carrier opening mechanism 400. As shown in FIGS. 4A and 4B, the carrier opening mechanism 400 is generally matched to the profile of the substrate carrier 112 and is substrated by, for example, a rectangular tunnel 402 as described further below. It is shaped to provide a small gap for clean air flow around the carrier 112. Other configurations can be used. For example, the carrier opening mechanism 400 may include two side portions having an actuating device (described in more detail below) adjacently coupled with the port 104.

4B, cam slots 404 are formed in the sidewalls 406 of the tunnel 402. U.S. Patent Application (Application No. 60 / 407,339, Delegated Docket No., filed August 31, 2002, entitled "Method and Apparatus for Using Wafer Carrier to Operate Wafer Carrier Door Opening and Closing", previously incorporated herein) As described more fully in 6976 / L), the door 206 of the substrate carrier 112 has a carrier opening mechanism (i) to guide the door 206 in the open arrangement shown in FIGS. 2B and 2C. And a cam follower 408 that cooperates with the cam slot 404 of 400.

As described in the pending patent application of the above-mentioned number, the opening of the door 206 may occur by the docking movement of the substrate carrier 112 relative to the port 104. As used herein, the term "docking" or docking motion refers to the movement toward the inside of the substrate carrier toward the port where the substrates are exchanged, such as the port of the cleaning chamber wall. Similarly, “undocking” or undocking movement refers to the movement toward the outside of the substrate carrier away from the port where the substrates are exchanged, such as the port of the cleaning chamber wall. Arrow 410 in FIG. 4B schematically illustrates such a docking movement.

As shown in FIG. 4B, the stop 412 is connected to the cam slot 404 of the tunnel 402 at the sidewall 406 and the carved-out region 413 of the sidewall 406. Are placed adjacent to each other. The cut 413 is configured to receive the latching mechanism 208 (the latching mechanism appears from the sidewalls of the carrier housing 200 as shown in FIGS. 2A-2C). 4A and 4B, the carrier mover 114 (eg, sled) and the substrate carrier 112 positioned in parallel with the carrier opening mechanism 400 are placed in the correct arrangement on the carrier mover 114. Also shown is a movable pin 414 provided on the carrier ear canal 114 to interact with an alignment feature (not shown) on the bottom surface of the substrate carrier 112 (FIG. 1) for guiding. Typically a number of features (eg, three or more) may be used to assist in the placement of the substrate carrier 112 relative to the carrier movement device 114. Step 416 is provided adjacent the stop 412 of the carrier opening mechanism 400, which provides a structure to the stop 412 and provides the substrate carrier 112 and / or carrier moving device 114. ) To control the flow of air around it (described further below). A latching mechanism is provided wherein an opposite sidewall (eg, sidewall 418) of the carrier opening mechanism 400 is provided on the cam slot, the substrate carrier 112 side facing the side 214 in FIGS. 2A-2C. It is similarly configured with cuts, stops and / or steps configured to receive.

The stop 412 functions as an actuation mechanism for interacting with the latching mechanism 208 of the substrate carrier 112 (FIG. 3). (Not shown in the figures, the additional port stop provided on the sidewall 418 (FIG. 4A) of the tunnel 402 can work with the second latching mechanism (not shown) of the substrate carrier 112. In particular, the substrate carrier 112 As a result of the docking movement of), the finger 310 (FIG. 3) of the latching member 302 comes into contact with the stop 412. The substrate carrier 112 may or may not be in contact with the step 416 during docking. When the substrate carrier 112 begins to move in the direction indicated by the arrow 410 (FIG. 4B), the movement of the latch member 302 in that direction is stopped by the stop 412, such that the latch member 302 is moved. Is pushed into the seal 210 against the biasing force of the spring 312. As a result, the tab 300 is released from the finger 310 of the latch member 302 so that the door 206 pivots (about point P (FIG. 3)) and the cam slot 404 (FIG. 4B) and Opened by the interaction of the cam follower (FIG. 3).

4C is a front plan view of the carrier opening mechanism 400 of FIG. 4A with the substrate carrier 112 disposed therein. As shown in FIG. 4C, step 416 provides a factory interface 102 (by providing a controlled air gap G between carrier opening mechanism 400 and substrate carrier 112 and carrier movement mechanism 114. 1 may help to reduce excess air flow through port 104 and carrier opening opening mechanism 400 (eg, forming laminar air flow). The lamella flow can be generated, for example, by providing an air gap G between about 0.05 and 0.150 inches. Other air gap spacings can be used.

As noted above, positive static pressure can be maintained in the factory interface 102 through the flow of filtered air through the factory interface (eg, from the top of the factory interface to the bottom of the factory interface) and in HEPA. The use of ULPA or similar washroom grade filters is known in the art. In one embodiment of the invention, a differential pressure of 0.005-0.2 inches between the inside and outside of the factory interface 102 can be used (eg, using recycled, filtered circulating air).

In one or more other aspects of the present invention, door 106 (FIG. 1), referred to as “port door”, is incorporated herein by reference in its entirety, and is disclosed in US Pat. No. 6,082,951, entitled “Wafer Cassette Load Station”. Keys (not shown) or other unlocking and / or door opening mechanisms for unlocking, receiving and supporting the door 116 of the substrate carrier 112 as described may be included. The door 106 moves farther back from the platform 110 and then lowers and bears the door 116 of the substrate carrier 112 as is generally known; Optionally, the door 106 may lack any x-axis movement and the platform 106 may move the substrate carrier 112 away from the port 104 (or other similar opening of the cleaning room wall 103) to allow the door 106 to move. Can lower the substrate carrier 112 without contact as described in US Pat. No. 6,082,951 (supporting the door 116 of the substrate carrier 112). The platform 110 may then cause the substrate carrier 112 to move back to the port 104 (eg, causing the substrate to be removed from the door). In either case, in accordance with the present invention, the substrate carrier 112 is maintained in the tunnel 402 and receives the flow of air from the factory interface 102, for example flake flow, as described above.

The laminar flow of air tends to prevent particles from reaching the trajectory withdrawn from the substrate carrier 112 where the substrate will be delivered to the processing tool. The laminar air flow and / or positive pressure factory interface device may be adapted to any substrate carrier (eg, single substrate carrier, multiple substrate carrier, whether substrate carrier movement is used to open and / or close the substrate carrier door). , Front opening substrate carrier, front opening single pod, etc.), and any substrate substrate carrier door device. For example, the present invention may be used to enclose an opening that is transferred between an open substrate carrier and a processing tool in order to create a laminar air flow from the processing tool side past the open substrate carrier (eg, out of tunnel 402). Can be.

Substrate clamping mechanisms that may be included in the substrate carrier 112 of the present invention will be described with reference to FIGS. 5A-7E.

5A is a schematic identical view of an exemplary substrate clamping mechanism 500 provided in accordance with the present invention. FIG. 5B is an enlarged, identical view detailing part 502 of FIG. 5A.

The substrate clamping mechanism 500 of the present invention operates by the interaction of the clamping members 504 with the latch members 302 of the kind described above with respect to the latching mechanism 208 (FIG. 3). In one embodiment of the invention, as shown in FIG. 5A, four clamping members 504 comprising two pairs of clamping members 504 are provided, and each pair of clamping members 504 is provided. Associated with each latch member 302. Other members of the clamping members can be used.

5B, in one embodiment of the invention each clamping member 504 is generally L-shaped with a horizontal leg 506 and a relatively short vertical leg 508. As shown in FIG. Other shapes / configurations can be used. In FIG. 5B, the side walls of the carrier housing 200 (FIGS. 2A-2C) are schematically represented by dashed lines 214. Each clamping member 504 may be slidably mounted in each hole 511 (FIGS. 2C and 5C described below) of the sidewall 214 of the carrier housing 200.

5A, 5B, when the substrate clamping mechanism 500 is in the clamping condition, the inner side 512 of the latch member 302 contacts the vertical leg 508 of the clamping member 504 and clamps the clamping member. 504 holds clamping member 505 such that end 514 of horizontal leg 506 contacts edge 516 of substrate 202. Simultaneous contact of all four clamping members 504 with the substrate 202 is used to clamp the substrate 202 (eg, to hold the substrate 202 stationarily during the delivery of the substrate carrier 112). .

5C is an equivalent view of an embodiment of the substrate carrier 112, with the leads (not shown) of the substrate carrier 112 removed. 5D is an enlarged equivalent view showing the details of FIG. 5C portion 517. In the embodiment of FIGS. 5C and 5D, the substrate carrier 112 includes a hollow region 520 with an angled side wall portion 522 and an unangled side wall portion 524 (FIG. 5D). The non-angular side wall portion 524 has a diameter substantially the same as the substrate 202 (eg, about 0.004 to 0.005 inches larger than the substrate 202 in one embodiment, although other sizes may be used). The side wall portion 522 is angled to ensure correct placement of the substrate 202 when the substrate 202 is lowered to an angular side wall portion 524 of the substrate carrier 112. In at least one embodiment, the angled side wall portion 522 has an angle of about 45 ° from the plane of the substrate 202, although other angles may be used.

5C and 5D, clamping members 504 are shown in the clamping portion; The latch member 302 extends under the tab 300 of the door 206 to hold the door 206 in the closed position as described above (as shown in FIG. 5C). As further shown in FIG. 5C, in the clamping position, the latch member 302 has a respective clamping member (504) to compress each clamping member 504 into contact with the substrate 202 through the holes 511. Against the vertical leg 508 of 504.

6A is a partial side view illustrating contact between one of the clamping members 504 and the substrate 202. As shown in FIG. 6A, contact with the substrate 202 may be through a V-shaped groove 526 formed at the end 514 of the horizontal leg 506 of the clamping member 504. V-shaped grooves and other configurations can be used to contact the substrate 202. For example, FIG. 6B is a cross-sectional view of the substrate carrier 112 of FIG. 5C, and FIG. 6C is an enlarged equivalent view detailing the portion 525 of FIG. 6B, wherein the clamping members 504 are horizontal legs 506. FIG. Has a flat groove 528 at the end 514. As noted above, other configurations can be used to provide effective clamping of the substrate 202. As further shown in FIGS. 6B and 6C, the vertical legs 508 of each clamping member 504 are biased toward the latch member 302 (eg, via a spring 530 or other suitable biasing mechanism). ).

In order to protect the substrate 202 from contamination created by the latching mechanism 208 and / or damage due to contact between the substrate 202 and the clamping members 504, (1) a thin film (eg, in FIG. 6C A flexible thin film 532, such as a diaphragm, may be used to isolate the latching mechanism 208 from the cleaning substrate region 533 of the substrate carrier 112 on which the substrate 202 is disposed (as shown in FIGS. 6B and 6C). There is; And / or (2) the end 514 of each clamping member 504 may be provided with a “soft side” 534 to contact the substrate 202 (as shown in FIG. 6A). For example, the flexible thin film 532 removes the substrate 202 from all of the moving parts of the latching mechanism 208 (eg, latch member 302, clamping members 504, springs 530, etc.) capable of producing particles. Isolate. Flexible thin film 532 and / or soft side 534 may include, for example, urethane, silicone, or the like.

Referring again to FIG. 5B, the notch 536 is formed on the side 512 of the latch member 302. When the substrate clamping mechanism 500 is in the clamping position as shown in FIG. 5B, the notch 536 is disposed in the forward direction with respect to the clamping member 504 (as further described below). Similar notches not shown are similarly disposed with respect to the other clamping member 504 connected with the latch member 302 of FIG. 5B. In addition, similar notches (not shown) are provided in the other latch member 302 (FIGS. 5A and 6B) and similarly disposed with respect to the clamping members 504 associated with the similarly different latch member 302. do.

7A and 7B are views similar to FIGS. 5A and 5B, respectively, but showing the substrate clamping mechanism 500 in a release (unclamping) condition. FIG. 7B is an enlarged view detailing a portion of FIG. 7A.

5A and 5B and 7A and 7B, the release of the clamping mechanism 500 occurs as follows. Docking movement of the substrate carrier 112 is performed in relation to the port 104 (FIG. 1). That is, the carrier housing 200 (represented by the sidewall 214 in FIGS. 5B and 7B), the latch members 302, the clamping members 504 and the substrate 202 are shown in FIG. 5B (arrow 410 in FIG. 4B). Are moved together in the direction indicated by arrow 702. Referring to FIG. 5B, during the docking movement, the pinker 310 of the latch member 302 comes into contact with the obstruction 412 of the carrier opening mechanism 400 (FIG. 4B). Thus, the movement of the latch member 302 in the direction represented by the arrow 702 is stopped. The clamping member 504 advances along the latch member 302 until it reaches the notch 536. A biasing device, such as the spring 530 of FIGS. 6B and 6C, is used to cause the clamping member 504 to enter the notch 536 so that the clamping member 504 releases contact away from the substrate 202. All four clamping members 504 (FIG. 5A) may move to release contact at the same time as the substrate 202 in a substantially similar manner, thereby releasing the substrate 202 from clamping. (As an alternative to the biasing device described above, the clamping member 504, and in particular the vertical leg 508 of the clamping member, is coupled to the latch member 302 by the tongue of the groove device or another similar camming device such that the clamping member 504 is notched 536. Pulled away from the substrate 202).

FIG. 7C is a cross sectional view similar to FIG. 6B, but the clamping members 504 are retracted toward the notches 536 of each notch member 302; FIG. 7D is an enlarged equivalent view showing details of portion 704 of FIG. 7C; 7E is an equivalent view of an embodiment of the substrate carrier 112, with the lid 706 of the substrate carrier 112 removed. As shown in FIGS. 7C-7E, when the substrate carrier 112 moves forward with respect to each latch member 302, the spring 530 biases each clamping member 504 toward the latch 302. Each clamping member 504 enters its respective notch 536 by retreating away from the substrate 202 through the aperture 511. Substrate 202 is then extracted from substrate carrier 112 as described below.

Referring to FIGS. 1-7E, in operation, a substrate carrier 112 that includes a substrate 202 to be processed in a processing tool 100 is, for example, a carrier regulator robot (not shown) connected to the factory interface 102. Is disposed on the support platform 110 at the substrate transfer location 108. The controller 118 causes the door 106 (if provided) to open and causes the carrier movement mechanism 114 to dock the substrate carrier 112 with the port 104. The docking movement of the substrate carrier 112 causes the fingers 310 of the latch members 302 (FIG. 3) to contact the stops 412 (only one shown in FIG. 4B) of the tunnel 402. . As the substrate carrier 112 continues to advance, the latch members 302 are disengaged from the tabs 300 (only one of which is shown in FIG. 3) and are pushed towards the enclosure 210. On the other hand, the cam members 408 (only one shown in FIG. 3) enter the cam slots 404 (only one shown in FIG. 4B) of the tunnel 402 and the door of the substrate carrier 112. 206 is directed downward to pivot downwards (as shown in FIGS. 2B, 2C and 7E). At the same time, the clamping members 504 move towards the notches 536 (FIGS. 5B, 7B and 7D) of the latch members 302. Clamping members 504 enter notches 536 to move away from substrate 202 and to dislodge substrate 202 from clamping. In at least one embodiment, the notches 536 of each latch member 302 are clamping members when the cam member 408 is at the bottom of the cam slot 404 and / or the door 206 is fully open. 504 is disposed to be disposed within the notches 536.

Since the door 206 (if provided) is unlatched and opened, and the substrate 202 is unclamped, the substrate 202 can be used for extraction from the substrate carrier 112. A substrate conditioning robot (not shown) of the factory interface 102 extracts the substrate 202 from the substrate carrier 112 and loads the substrate 202 into the processing tool 100. For example, a blade of a substrate adjuster (not shown) extends below the substrate 202 (eg, in region 533 of substrate carrier 112 (FIG. 7C)) past the out-hollow region 520 and the substrate carrier ( The substrate 202 is lifted to the area of 112 (FIG. 7B). Substrate 202 may then be loaded into processing tool 100. The substrate 202 is processed in the processing tool 100. After the processing of the substrate 202 is completed, the substrate adjusting robot returns the substrate 202 toward the substrate carrier 112.

The carrier movement mechanism 114 then undocks the substrate carrier 112 from the port 104. Undocking movement of the substrate carrier 112 causes the cam followers 408 to be guided upwards of the cam slots 404 closely to the door 206. When the carrier housing 200 is moved away from the stops 412 of the carrier opening mechanism 400, the biasing force of the springs 312 causes the latch members 302 to be moved out of the enclosure 210. The tabs 300 and the fingers 310 on the door 206 are engaged. The door 206 is thus latched back in the closed position.

By the same movement of the latch members 302, the notches 536 (FIGS. 5B, 7B) of the latch members 302 are moved away from the clamping members 504. In response, the sides 512 of the latch members 302 cause the clamping members 504 to contact the substrate 202, thereby clamping the substrate 202. The latched substrate carrier 112 where the substrate 202 is clamped is ready to be moved away from the substrate transfer location 108 and can be moved to another processing tool for further processing or to another location in the manufacturing facility.

The present invention provides for the secure latching of the substrate carrier door and the secure clamping of the substrate in the substrate carrier. As a result, coarse adjustment or damage to the substrate and / or particle contamination of the substrate can be avoided.

The above description discloses only exemplary embodiments of the invention; Modifications of the above described apparatus which fall within the scope of the invention will be apparent to those skilled in the art. For example, although the present invention is shown in connection with single substrate carriers, it is also contemplated that the present invention may apply to substrate carriers holding one or more substrates. A "single substrate carrier" will be understood to mean a substrate carrier that is shaped and sized to contain only one substrate at a time.

As shown here, the substrate carrier of the present invention includes both the latching mechanism of the present invention and the substrate clamping mechanism of the present invention. However, it is also contemplated in accordance with the present invention to provide a substrate carrier comprising a latching mechanism without a substrate clamping mechanism or to provide a substrate carrier with a substrate clamping mechanism without a latching mechanism. Alternatively or additionally, the clamping members 504 can be configured to rotate away from the substrate 202.

The present invention can be used in connection with any processing tool that performs one or more of the following: deposition, oxidation, etching, heat treatment, photolithography, and the like. Instead of using the substrate transfer position of the present invention for the factory interface, the substrate transfer position of the present invention may be used directly at the load lock of the processing tool or any other suitable position.

The present invention has been shown in connection with interfacing a substrate carrier to a processing tool. However, the present invention is equally applicable to interfacing a substrate carrier to a measurement location, chemical / mechanical polishing (CMP) device, or any other location or device where the substrate can be delivered to the substrate carrier.

Instead of the support platform 110 and carrier movement mechanism 114 shown here, the substrate transfer location 108 functions as a substrate carrier support structure, grips the substrate carrier 112 (eg, on top of the substrate carrier). By the flanges) and the US application filed prior to Aug. 31, 2002, entitled “Wafer Loading Station with Docking Grippers at Docking Stations” (Delegation Docket No. 7099). It may have a gripper (not shown) provided to move the substrate carrier 112 towards and away from the port 104 as disclosed in patent application 60 / 407,337. For example, FIG. 8 is an equivalent view of another embodiment of a substrate loading station that may include a substrate carrier adjuster that may be used in the present invention. In FIG. 8, reference numeral 801 indicates another substrate loading station. Reference numeral 803 denotes another substrate carrier adjuster. Substrate loading station 801 of FIG. 8 is generally a US patent entitled “Wafer Loading Station with Docking Grippers at Docking Stations” (commission Docker No. 7099) and co-pending with the above filed on Aug. 31, 2002. It may be generally similar to the embodiment of the loading station disclosed in Application No. 60 / 407,337.

The substrate carrier adjuster 803 of FIG. 8 includes a pair of vertical guides 805, 807 and a horizontal guide 809 mounted for vertical movement on the vertical guides 805, 807. The support 811 is mounted on the horizontal guide 809 for horizontal movement along the horizontal guide 809. End effector 813 is mounted on support 811. End effector 813 is entitled " End Effector Having Mechanism For Reorienting A Wafer Carrier Between Vertical And Horizontal Orientations " (Delegation Docket 7097), and previously incorporated US patent application Ser. No. 60 / filed Aug. 31, 2002. It may include an end effector capable of varying the orientation of the substrate carrier from vertical to horizontal and vice versa, as described at 407,452. Any other suitable end effector may also be used as an end effector that grips the substrate carrier through an overhead transfer flange of the substrate carrier.

It will be observed that substrate loading station 801 has two columns of docking stations 815, although fewer columns of docking stations may be used. Each docking station 815 includes a number of docking grippers 817. Each docking gripper 817 is provided for supporting the substrate carrier through its overhead transfer flange and for docking and undocking the substrate carrier (as previously described). Optionally, the docking grippers move towards the cleaning chamber wall (or the front wall of the chamber, such as the factory interface chamber), which supports the substrate carrier (eg, through the bottom surface of the substrate carrier) and to which the docking platform is mounted. It can be replaced with docking platforms that move away.

Preferably, the substrate loading station 801 comprises a frame F to which the vertical and horizontal guides 805, 807 and 809 are coupled. In this manner, the preferred substrate loading station 801 is modular and can be quickly installed and calibrated. If the substrate loading station 801 includes one or more storage shelves S (shown on the platform), the storage shelf S may also be mounted on the frame F. By mounting both the substrate carrier adjuster and the storage shelf or shelves to this frame, the substrate carrier adjuster and the storage shelves have a predetermined position with respect to each other. This further facilitates installation and calibration and is another advantage of using a modular substrate loading station. Similarly, other mechanisms such as dedicated mechanisms for loading and / or unloading substrate carriers from an overhead factory delivery system, for example, may be named "Systemp For Transporting Wafer Carriers" (Delegation Docket No. 6900). It may preferably be mounted to frame F as described in previously incorporated US patent application 60 / 407,451, filed August 31.

In one aspect, the frame F may be mounted in the cleaning chamber wall, or in certain mounting locations (eg, predrilled bolt holes, etc.) on the front wall of the chamber (eg, factory interface chamber). Preferably, the wall also has certain mounting positions on which docking grippers or docking platforms are mounted. Additionally, the wall may have certain mounting positions on which the substrate carrier opening mechanism 400 may be mounted. When the frame F, the docking mechanisms and the substrate carrier opening mechanism are each mounted at predetermined positions on the same surface, the respective relative positions are predetermined, and installation and calibration of the substrate loading station 801 is facilitated.

Although the present invention has been disclosed in connection with the illustrative embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claims.

Claims (26)

As an automatic door opener, A platform provided for supporting a substrate carrier; A door opening mechanism provided for opening the door of the substrate carrier while the substrate carrier is supported by the platform; And Including a tunnel, the tunnel, Extending from the opening of the washroom wall towards the platform and at least partially surrounding the platform, An automatic door opener provided to direct air flow from the washroom wall towards the platform and out of the tunnel. 2. The automatic door opener of claim 1 wherein the substrate carrier comprises a front opening substrate carrier. 2. The automatic door opener of claim 1 wherein the substrate carrier comprises a single substrate carrier. 2. The automatic door opener of claim 1 wherein the substrate carrier comprises multiple substrate carriers. 2. The automatic door opener of claim 1 wherein the substrate carrier comprises a front opening integral pod. 2. The automatic door opener of claim 1 wherein the door opening mechanism is disposed in a tunnel. 2. The automatic door opener of claim 1 wherein the door opening mechanism is provided for using a docking movement to open the door of the substrate carrier. The method of claim 1, wherein the tunnel provides for directing air flow from the chamber wall to the platform by allowing air to flow from the chamber wall opening to the platform in response to a pressure difference maintained between the platform and the opening of the chamber wall. Automatic door opener, characterized in that. 2. The automatic door opener of claim 1 wherein the air stream includes a laminar air stream that at least partially surrounds the substrate carrier. 2. The automatic door opener of claim 1 wherein the washroom wall comprises a factory interface wall of a processing tool. 2. The automatic door opener of claim 1 wherein the door opening mechanism comprises a port door provided for unlocking, receiving and supporting the door of the substrate carrier and for removing the substrate from the substrate carrier. 12. The automatic door opener of claim 11 wherein the port door is provided to move the substrate carrier away and then to lower it. The method of claim 11, wherein the platform, Move the substrate carrier away from the port door so that the port door is lowered, And then move the substrate carrier back towards the opening of the cleaning chamber wall. A method of loading a substrate into a processing tool, Separating the platform from the processing tool and loading the substrate carrier on a platform disposed adjacent the washroom wall; At least partially surrounding the substrate carrier with a tunnel extending from the opening in the chamber wall to the platform; Opening the door of the substrate carrier while the substrate carrier is supported by the platform; And Directing air flow from the scrubbing wall towards the platform and out of the tunnel. 15. The method of claim 14, wherein the substrate carrier comprises a front open substrate carrier. 15. The method of claim 14, wherein the substrate carrier comprises a single substrate carrier. 15. The method of claim 14, wherein the substrate carrier comprises multiple substrate carriers. 15. The method of claim 14 wherein the substrate carrier comprises a front opening integral pod. 15. The method of claim 14, wherein opening the door of the substrate carrier comprises using a door opening mechanism disposed in the tunnel to open the door of the substrate carrier. 15. The method of claim 14, wherein opening the door of the substrate carrier comprises using a door opening mechanism provided for using a docking movement to open the door of the substrate carrier. 15. The method of claim 14, wherein directing the air flow from the washroom wall towards the platform includes flowing air from the opening of the washroom wall to the platform in response to a pressure difference maintained between the opening of the washroom wall and the platform. Loading method characterized in that. 22. The method of claim 21, further comprising creating a pressure difference between the opening of the wash chamber wall and the platform. 23. The method of claim 22, wherein creating a pressure differential between the openings of the wash chamber and the platform comprises flowing filtered air to the factory interface associated with the processing tool. 23. The method of claim 22, wherein creating a pressure difference between the opening of the wash chamber and the platform comprises maintaining a pressure difference between about 0.0005 and 0.2 inches of water between the opening of the wash chamber and the platform. Loading method. 15. The method of claim 14, wherein the washroom wall comprises a factory interface wall of a processing tool. 15. The method of claim 14, wherein directing the air flow from the washroom wall to the platform and out of the tunnel comprises directing laminar air flow from the washroom wall to the platform and out of the tunnel. Loading method.