AU2003273251A1 - Substrate carrier having door latching and substrate clamping mechanisms - Google Patents

Substrate carrier having door latching and substrate clamping mechanisms

Info

Publication number
AU2003273251A1
AU2003273251A1 AU2003273251A AU2003273251A AU2003273251A1 AU 2003273251 A1 AU2003273251 A1 AU 2003273251A1 AU 2003273251 A AU2003273251 A AU 2003273251A AU 2003273251 A AU2003273251 A AU 2003273251A AU 2003273251 A1 AU2003273251 A1 AU 2003273251A1
Authority
AU
Australia
Prior art keywords
substrate
clamping mechanisms
door latching
carrier
substrate carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003273251A
Inventor
Martin R. Elliott
Eric A. Englhardt
Jeffrey C. Hudgens
Robert B. Lowrance
Michael Rice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of AU2003273251A1 publication Critical patent/AU2003273251A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
AU2003273251A 2002-08-31 2003-08-28 Substrate carrier having door latching and substrate clamping mechanisms Abandoned AU2003273251A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40734002P 2002-08-31 2002-08-31
US60/407,340 2002-08-31
PCT/US2003/026985 WO2004021413A1 (en) 2002-08-31 2003-08-28 Substrate carrier having door latching and substrate clamping mechanisms

Publications (1)

Publication Number Publication Date
AU2003273251A1 true AU2003273251A1 (en) 2004-03-19

Family

ID=31978463

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003273251A Abandoned AU2003273251A1 (en) 2002-08-31 2003-08-28 Substrate carrier having door latching and substrate clamping mechanisms

Country Status (5)

Country Link
KR (1) KR101050632B1 (en)
CN (1) CN1689141B (en)
AU (1) AU2003273251A1 (en)
TW (1) TWI310229B (en)
WO (1) WO2004021413A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393231B (en) * 2008-05-21 2013-04-11 Unimicron Technology Corp Substrate having semiconductor chip embedded therein and fabrication method thereof
KR200473415Y1 (en) * 2012-05-10 2014-07-04 신형철 Double door system for a polisher
US10738381B2 (en) 2015-08-13 2020-08-11 Asm Ip Holding B.V. Thin film deposition apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5261935A (en) * 1990-09-26 1993-11-16 Tokyo Electron Sagami Limited Clean air apparatus
TW224182B (en) * 1992-08-04 1994-05-21 Ibm
ES2078718T3 (en) * 1992-08-04 1995-12-16 Ibm MANUFACTURING CHAIN STRUCTURES BASED ON FULLY AUTOMATED AND COMPUTERIZED CONVEYORS ADAPTED TO PRESSURE SEALABLE TRANSPORTABLE CONTAINERS.
KR100221983B1 (en) * 1993-04-13 1999-09-15 히가시 데쓰로 A treating apparatus for semiconductor process
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
US5827118A (en) * 1996-08-28 1998-10-27 Seh America, Inc. Clean storage unit air flow system
US6244812B1 (en) * 1998-07-10 2001-06-12 H-Square Corporation Low profile automated pod door removal system

Also Published As

Publication number Publication date
KR20050057020A (en) 2005-06-16
WO2004021413A1 (en) 2004-03-11
CN1689141A (en) 2005-10-26
KR101050632B1 (en) 2011-07-19
TWI310229B (en) 2009-05-21
TW200409273A (en) 2004-06-01
CN1689141B (en) 2012-07-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase