KR20050045519A - Apparatus for spraying a photoresist on a wafer - Google Patents

Abstract

The photoresist jetting apparatus includes a photoresist jetting nozzle connected to a container in which the photoresist is stored. The photoresist spray nozzle has a nozzle tip for ejecting the photoresist onto the wafer. And an air jet unit to jet air to the nozzle tip to prevent the photoresist from solidifying at the nozzle tip. The air injection unit includes an air supply nozzle and an air injection nozzle connected to the air supply source and installed on an outer circumferential surface of the injection nozzle. The air jet nozzle may be provided with a guide member for guiding the jet direction of air to the nozzle tip. Air is injected from the air jet unit to the nozzle tip, thereby preventing the photoresist from solidifying at the nozzle tip. Thus, the solidified photoresist is partially blocked on the nozzle tip, or provided with the photoresist being ejected onto the wafer to prevent defects.

Description

Photoresist Sprayer {APPARATUS FOR SPRAYING A PHOTORESIST ON A WAFER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photoresist (PR) ejection apparatus, and more particularly, to an apparatus for ejecting PR onto a wafer to form a pattern.

In recent years, rapidly developing semiconductor devices have tended to have high performance while gradually becoming thinner. Such a semiconductor device manufacturing process includes a process for manufacturing a semiconductor chip on a wafer, a packaging process for protecting the manufactured semiconductor chip from an external environment, and a semiconductor process for allowing a semiconductor chip to input and output electrical signals to and from external devices. It includes a process to make.

The process of manufacturing a semiconductor chip includes applying a PR on a wafer to form a predetermined pattern on the substrate, then patterning the PR using a mask and patterning a predetermined film on the substrate using the PR pattern. Include.

In the process of applying PR, a spinner apparatus including a spin coater for rotating the wafer at high speed and a PR supply device for spraying PR on the wafer at high speed by the spin coater are mainly used. The PR supply apparatus has a spray nozzle for ejecting PR onto a wafer.

1 is a front view showing a conventional PR supply device. Referring to Fig. 1, a conventional PR supply apparatus includes a PR container 1 in which a PR is stored. The PR vessel 1 is connected to the PR injection nozzle 3 via a pipe 2. The PR injection nozzle 3 has a nozzle tip 4 for discharging PR. The nozzle tip 4 is placed on the wafer.

On the other hand, PR contains volatile solvent components that volatilize naturally when exposed to the atmosphere such as alcohol or gasoline. PR remains in the nozzle tip 4 of the PR injection nozzle 3 which injected PR. Therefore, when the PR injection nozzle 3 is not used for a long time, the solvent component of the PR remaining on the nozzle tip 4 is exposed to the atmosphere to evaporate. As a result, a phenomenon in which the remaining PR solidifies at the nozzle tip 4 occurs.

The solidified PR partially blocks the nozzle tip 4 so that it is not possible to provide the desired amount of PR from the PR spray nozzle 3 to the correct position on the wafer. If the amount of PR provided on the wafer is less than the set amount and not provided in the correct position on the wafer, it becomes impossible to accurately pattern the PR applied on the wafer to the designed dimensions. As a result, there is a problem that the desired film cannot be formed accurately on the wafer.

In addition, the solidified PR is likely to be provided on the wafer with the subsequent PR sprayed from the PR spray nozzle 3. Solidified PR is a major cause of defects on the wafer.

Moreover, as the critical dimension of the pattern gradually becomes finer, PR is being replaced by ArF PR from KrF PR. Accordingly, the viscosity of PR is also rapidly decreasing from 6 to 8 cp (centi-poise) to 1 to 2 cp band. As a result, when PR with low viscosity is used, the phenomenon in which PR solidifies at the nozzle tip is further increased.

SUMMARY OF THE INVENTION An object of the present invention is to provide a photoresist injection apparatus capable of preventing the nozzle tip from contacting with the atmosphere as much as possible to prevent the PR remaining on the nozzle tip from solidifying.

In order to achieve the object of the present invention, the photoresist jetting apparatus according to the present invention includes a photoresist jetting nozzle connected to a container in which the photoresist is stored. The photoresist spray nozzle has a nozzle tip for ejecting the photoresist onto the wafer. And an air jet unit to jet air to the nozzle tip to prevent the photoresist from solidifying at the nozzle tip.

The air injection unit includes an air supply nozzle and an air injection nozzle connected to the air supply source and installed on an outer circumferential surface of the injection nozzle. The air jet nozzle may be provided with a guide member for guiding the jet direction of air to the nozzle tip.

According to the present invention as described above, by the air is injected from the air injection unit to the nozzle tip, the phenomenon that the photoresist is solidified at the nozzle tip is prevented. Thus, the solidified photoresist is partially blocked on the nozzle tip, or provided with the photoresist being ejected onto the wafer to prevent defects.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Example 1

2 is a partial cross-sectional view showing a photoresist injection apparatus according to a first embodiment of the present invention, Figure 3 is a bottom view of FIG.

2, the photoresist injection apparatus 100 according to the first embodiment includes a PR container 110 in which PR is stored, a PR injection nozzle 140 for injecting PR onto a wafer, and a PR injection nozzle 140. It includes a PR line 120 for connecting the PR container 110 and the air injection unit for injecting air to the PR injection nozzle 140 to form an air curtain.

The PR spray nozzle 140 has a nozzle tip 150 having spray holes 151 for spraying PR onto the wafer. The nozzle tip 150 is installed at the bottom center of the PR injection nozzle 140. The nozzle tip 150 has an outer diameter shorter than the outer diameter of the PR injection nozzle 140. On the other hand, the PR spray nozzle 140 is connected to the PR line 120 by the nut 130.

The air jet unit includes an air jet nozzle 160 for jetting high pressure air to the nozzle tip 150. The air injection nozzle 160 has a ring shape installed on the outer peripheral surface of the lower end of the pipe 120. The air injection nozzle 160 is connected to the air tank 170 in which the high pressure air is stored by the air line 180.

Referring to FIG. 3, the nozzle tip 150 having the injection hole 151 has an outer diameter shorter than that of the PR injection nozzle 150. The PR spray nozzle 150 has an outer diameter shorter than the PR line 120. Since the air injection nozzle 160 is installed on the outer circumferential surface of the PR line 120, the air injection nozzle 160 has a longer diameter than the PR line 120.

PR is sprayed onto the wafer from the nozzle tip 150 of the PR spray nozzle 140. Some of the solvent component of the PR will evaporate upwards while in contact with the atmosphere. Thus, the evaporated PR tries to stick to the outer surface of the nozzle tip 150.

However, since high pressure air is injected from the air jet nozzle 160 to the outer surface of the nozzle tip 150, the evaporated PR is prevented from being buried on the outer surface of the nozzle tip 150. In addition, the air injected from the air jet nozzle 160 serves as an air curtain surrounding the nozzle tip 150. Since the nozzle tip 150 can be isolated from the outside by the air curtain, the rate at which the PR contacts the atmosphere can also be reduced. That is, since the rate at which the solvent component of the PR evaporates can be reduced, the phenomenon in which the evaporated PR adheres to the nozzle tip 150 is suppressed.

Example 2

4 is a cross-sectional view illustrating a photoresist injection apparatus according to Embodiment 1 of the present invention, and FIG. 5 is a bottom view of FIG. 2.

Referring to FIG. 4, the photoresist injection apparatus 200 according to the second embodiment includes a PR container 210, a PR injection nozzle 240 for injecting PR onto a wafer, a PR injection nozzle 240, and a PR container ( And an air injection unit for injecting air into the PR line 220 and the PR injection nozzle 240 connecting the 210 to form an air curtain. A nozzle tip 250 having a spray hole 251 for spraying PR onto the wafer is installed at the center of the bottom surface of the PR spray nozzle 240. Meanwhile, the PR spray nozzle 240 is connected to the PR line 220 by the nut 230.

The air injection unit includes an air injection nozzle 260 for injecting high pressure air to the nozzle tip 250, an air tank 270, and an air line 280 connecting the air tank 270 and the air injection nozzle 260. Include. The air jet nozzle 260 according to the second embodiment is installed on the outer circumferential surface of the PR jet nozzle 240. The air jet nozzle 260 has an outer diameter substantially the same as the outer diameter of the PR line 220.

Referring to FIG. 5, the nozzle tip 250 has a shorter outer diameter than the PR injection nozzle 250. The PR spray nozzle 250 has a shorter outer diameter than the PR line 220. The air injection nozzle 260 has an inner diameter substantially the same as the outer diameter of the PR injection nozzle 250 and also has an outer diameter substantially the same as the outer diameter of the PR line 220.

Example 3

6 is a partial cross-sectional view showing a photoresist injection apparatus according to a third embodiment of the present invention.

Referring to FIG. 6, the photoresist injection apparatus 300 according to the third exemplary embodiment includes a PR container 310, an injection nozzle 340, a PR line 320, and an air injection unit.

The PR spray nozzle 340 has a nozzle tip 350 having spray holes 351 for spraying PR onto the wafer. The nozzle tip 350 is installed at the bottom center of the PR injection nozzle 340. The PR spray nozzle 340 is connected to the PR line 320 by a nut 330.

The air jet unit comprises an air jet nozzle 360 to the nozzle tip 350. The air injection nozzle 360 is a ring shape provided on the outer peripheral surface of the lower end of the pipe 320. The air jet nozzle 360 is connected to the air tank 370 in which the high pressure air is stored by the air line 380.

On the other hand, the air jet unit further includes a guide member 390 for guiding the air injected from the air jet nozzle 360 toward the nozzle tip 350. The guide member 390 has a funnel shape formed of inner and outer cylinders 391 and 392 to form an air passage 393. The inner cylinder 391 has a shape extending downwardly inclined in the direction of the nozzle tip 350 from the inner bottom of the air jet nozzle 360. The outer cylinder 392 extends longer than the inner cylinder 391 inclined downward from the outer lower end of the air jet nozzle 360 toward the nozzle tip 350. The outer cylinder 392 is spaced apart from the inner cylinder 391 at regular equal intervals. Accordingly, an air passage 393 is formed between the inner and outer cylinders 391 and 392 through which the air injected from the air injection nozzle 360 moves. The surface formed between the lower ends of the inner and outer cylinders 391 and 392, that is, the surface from which the air is injected, is directed toward the nozzle tip 350.

Since the air injected from the air jet nozzle 360 is guided to the nozzle tip 350 through the air passage 393 of the guide member 390, most of the air will prevent the PR from sticking to the nozzle tip 350. It becomes the number. Therefore, the photoresist injection apparatus according to the third embodiment is more excellent in the PR sticking prevention effect than the above-described first and second embodiments.

Example 4

7 is a partial cross-sectional view showing a photoresist injection apparatus according to Embodiment 4 of the present invention.

Referring to FIG. 7, the photoresist jetting apparatus 400 according to the fourth exemplary embodiment includes a PR container 410, a jetting nozzle 440, a PR line 420, and an air jetting unit.

The PR spray nozzle 440 has a nozzle tip 450 having spray holes 451 for spraying PR onto the wafer. The nozzle tip 450 is installed at the bottom center of the PR injection nozzle 440. The PR spray nozzle 440 is connected to the PR line 420 by a nut 430.

The air injection unit includes an air injection nozzle 460 for injecting high pressure air to the nozzle tip 450, an air tank 470, and an air line 480 for connecting the air tank 470 and the air injection nozzle 460. Include. The air jet nozzle 460 according to the fourth embodiment is installed on the outer circumferential surface of the PR jet nozzle 440. The air jet nozzle 460 has an outer diameter that is substantially the same as the outer diameter of the PR line 420.

The air jet unit further includes a guide member 490 for directing air jetted from the air jet nozzle 460 toward the nozzle tip 450. The guide member 490 is a funnel shape formed of the inner and outer cylinders 491 and 492 to form the air passage 493. Since the guide member 490 is substantially the same as the shape of the guide member 390 according to the third embodiment, the description is not repeated herein. .

8 is a cross-sectional view showing a spin coater having a photoresist injection device according to the present invention.

Referring to FIG. 8, the spin coater includes a photoresist spraying device 100 according to Embodiment 1 of the present invention and a spin unit 500 for rotating a wafer. Since the photoresist injection apparatus 100 has been described in detail in Embodiment 1, repeated description thereof will be omitted.

The spin unit 500 includes a chamber 510 having an upper opening. The spin chuck 520 on which the wafer is placed is disposed at the inner center of the chamber 510. The spin chuck 520 is connected to the motor 540 by the rotation shaft 530. Accordingly, the spin chuck 520 in which the wafer is placed is rotated at a high speed.

When the wafer is placed in the spin chuck 520, the spin chuck 520 rotates at a high speed by the motor 540. In this state, the PR is injected onto the rotating wafer from the spray nozzle 140 of the photoresist supply apparatus 100. Thus, PR is applied on the wafer with a uniform thickness.

After the PR application process is completed, the phenomenon that the remaining PR is solidified and fixed at the nozzle tip 150 is prevented by the air injection unit according to the present invention.

As described above, according to the present invention, since high pressure air is injected from the air injection unit to the nozzle tip, PR in contact with the atmosphere is prevented from rising and being fixed to the nozzle tip.

In addition, since the air injected from the air injection unit serves as an air curtain surrounding the nozzle tip, the rate at which the PR contacts the external atmosphere is reduced. As a result, evaporation of the PR is suppressed, and the phenomenon that the PR is fixed to the nozzle tip and the solidified or the solidified PR is sprayed onto the wafer together with the injected PR is also prevented.

In addition, since the air injected from the air injection unit is guided to the nozzle tip by the guide member, the effect of preventing the sticking of the PR can be further improved.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified without departing from the spirit and scope of the invention described in the claims below. And can be changed.

1 is a partial cross-sectional view showing a conventional photoresist supply apparatus.

2 is a partial cross-sectional view showing a photoresist supply apparatus according to a first embodiment of the present invention.

3 is a bottom view of a photoresist supply apparatus according to Embodiment 1 of the present invention.

4 is a partial cross-sectional view showing a photoresist injection apparatus according to a second embodiment of the present invention.

5 is a bottom view of a photoresist supplying apparatus according to Embodiment 2 of the present invention.

6 is a partial cross-sectional view showing a photoresist injection apparatus according to a third embodiment of the present invention.

7 is a partial cross-sectional view showing a photoresist injection apparatus according to Embodiment 4 of the present invention.

8 is a cross-sectional view showing a spin coater having a photoresist injection device according to the present invention.

-Explanation of symbols for the main parts of the drawing-

110: PR container 120: PR line

140: PR injection nozzle 150: nozzle tip

160: air injection nozzle 390: guide member

Claims (6)

A photoresist spray nozzle connected to the photoresist reservoir by photoresist lines; A nozzle tip installed at the photoresist spray nozzle and having a spray hole through which the photoresist is sprayed; And And an air ejection unit for spraying air to the nozzle tip to prevent the photoresist from adhering to the nozzle tip. The method of claim 1, wherein the air injection unit An air tank in which high pressure air is stored; And And an air jet nozzle configured to receive air from the air tank and jet air to the nozzle tip. The photoresist injection apparatus of claim 2, wherein the air injection unit further comprises a guide member for guiding air injected from the air injection nozzle toward the nozzle tip. The method of claim 3, wherein the guide member An inner cylinder extending obliquely from the inner end of the air injection nozzle toward the nozzle tip; And And an outer cylinder extending obliquely from the outer end of the air jet nozzle toward the nozzle tip to form an air passage together with the inner cylinder. The photoresist injection apparatus of claim 2, wherein the air jet nozzle is provided on an outer circumferential surface of the photoresist line. 3. The photoresist jetting apparatus according to claim 2, wherein the air jetting nozzle is provided on an outer circumferential surface of the photoresist jetting nozzle.