KR20050029656A - Method to build thin metal film without adhesive by using ion sputtering and ultrasonic welding - Google Patents

Method to build thin metal film without adhesive by using ion sputtering and ultrasonic welding Download PDF

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Publication number
KR20050029656A
KR20050029656A KR1020030066716A KR20030066716A KR20050029656A KR 20050029656 A KR20050029656 A KR 20050029656A KR 1020030066716 A KR1020030066716 A KR 1020030066716A KR 20030066716 A KR20030066716 A KR 20030066716A KR 20050029656 A KR20050029656 A KR 20050029656A
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KR
South Korea
Prior art keywords
substrate
metal film
thin metal
metal
ion
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KR1020030066716A
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Korean (ko)
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유정원
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유정원
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Priority to KR1020030066716A priority Critical patent/KR20050029656A/en
Publication of KR20050029656A publication Critical patent/KR20050029656A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0005—Separation of the coating from the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment

Abstract

To provide a method for manufacturing non-adhesive type thin metal film by substrate metal ion deposition and ultrasonic welding, wherein the method is capable of manufacturing a thin metal film and reducing manufacturing cost and process by strong metal ion bonding force and ultrasonic welding without use of an adhesive. The method for manufacturing non-adhesive type thin metal film by substrate metal ion deposition is characterized in that a metal ion bond layer is formed on the substrate by forming plasma under the vacuum state using magnetron or other methods, thereby scanning electron beams onto the surface of a moving substrate, wherein thickness of the metal ion bond layer is about 1 to 2 mum, and molecules of the substrate are bonded with molecules of metal by strong ion bonding so that ion bonded metal ions function as an adhesive for adhering the thin metal film. The method for manufacturing non-adhesive type metal foil film by ultrasonic welding is characterized in that a thin metal film is adhered to the surface of a substrate by ultrasonic welding, wherein metal ions are bonded to the substrate, friction heat is generated between the thin metal film and a metal ion layer of the substrate by vibration of vibrator to produce oxide so that the thin metal film and molecules of the ion layer are diffused to be bonded, wherein welding between the metal ion layer and the thin metal film is performed at a metal fusion point or less without thermal damage on the substrate, bonding effect of a thin metal film and a metal ion layer having equal properties is excellent, wherein ultrasonic frequency used is 20 to 40 KHz, and the higher ultrasonic frequency is, the lower welding energy is.

Description

표면 금속 이온 증착과 초음파 용접을 이용한 무접착제 금속박 필름 제조 방법{Method to build thin metal film without adhesive by using ion sputtering and ultrasonic welding}Method for manufacturing non-stick metal foil film by surface metal ion deposition and ultrasonic welding {Method to build thin metal film without adhesive by using ion sputtering and ultrasonic welding}

본기술은 표면 금속 이온 증착과 초음파 용접을 이용한 무접착제 금속박 필름 제조 방법을 나타낸 것이다. 기존의 이온 분사를 이용한 필름 제조는 두께를 높일 수는 있으나 상대적으로 비용과 시간이 많이 소용되는 단점이 있었다.The present technology shows a method of manufacturing a non-adhesive metal foil film using surface metal ion deposition and ultrasonic welding. Conventional film production using ion injection can increase the thickness, but it has a disadvantage in that it is relatively expensive and time-consuming.

본 제조 공정을 이용하면 강한 이온 결합력의 특성과 초음파 용접을 이용하므로 별도의 접착제를 사용하지 않는 얇은 금속박 필름을 제조 할 수 있으며 제조원가 및 공정을 줄일 수 있다.Using this manufacturing process, it is possible to manufacture a thin metal foil film without the use of a separate adhesive because of the characteristics of strong ion bonding force and ultrasonic welding, and can reduce the manufacturing cost and process.

본 고안은 도1 과 도2 와 같은 제조 공정으로 제작이 되어진다. The present invention is manufactured by the manufacturing process as shown in FIG.

제조 공정으로는In the manufacturing process

1. 필름 제조를 원하는 기판 표면에 증착을 원하는 금속을 마그네트론이나 기타 다른 방법을 이용하여 진공상태에서 프라즈마를 형성하여 전자빔을 이동하는 기판 표면에 주사하여 금속이온 결합층을 형성한다. 이온층의 두께는 약 1-2 미크론 정도로 형성된다. 기판분자와 금곡분자간에 강한 이온결합을 하여, 이온 결합된 금속이온이 금속박을 접착하는 접착제 역할을 한다. (도1)1. A metal ion bonding layer is formed by scanning a metal to be deposited on the surface of the substrate to be manufactured by using a magnetron or other method in a vacuum to scan the surface of the substrate to move the electron beam. The thickness of the ion layer is formed at about 1-2 microns. Strong ionic bonding is performed between the substrate molecule and the gold grain molecule, and the ion-bonded metal ions serve as an adhesive for bonding the metal foil. (Figure 1)

2. 금속 이온 결합을 한 기판 표면에 금속박을 초음파 용접으로 접착한다. 금속박과 수평진동을 하는 진동자에 의해 전달된 진동에 의해 금속박과 기판의 금속 이온층간에 마찰열이 발생하고 이때 산화물이 발생하여 금속박과 이온층의 분자가 확산되어 결합하게 되며, 이때 금속의 융점온도 이하에서 용접이된다. 따라서 기판에 열로 인한 손상을 주지 않고 금속 이온층과 금속박 간에 용접이 된다. 특히 동일 물성을 가진 금속박과 이온일 경우 결합 효과는 탁월하다. 이때 사용되는 초음파 주파수는 20-40 KHz 이며, 고주파수 일수록 낮은 에너지 용접이 된다. (도2)2. Metal foil is bonded by ultrasonic welding to the surface of the substrate to which the metal ions are bonded. Friction heat is generated between the metal foil and the metal ion layer of the substrate by the vibration transmitted by the vibrator, which vibrates with the metal foil horizontally. At this time, oxides are generated, and the molecules of the metal foil and the ion layer diffuse and bond. This becomes. Therefore, welding is performed between the metal ion layer and the metal foil without damaging the substrate by heat. Especially in the case of metal foil and ions having the same physical properties, the bonding effect is excellent. The ultrasonic frequency used is 20-40 KHz, and the higher the frequency, the lower the energy welding. (Figure 2)

이온 분사를 이용한 필름제조는 두께를 높일 수는 있으나 상대적으로 비용이 많이 들고 속도가 상당히 느리다. 특히 구리의 경우 정지된 기판에 25 미크론 이온 증착시 30분이 소요되며, 넓은 면적은 엄청난 시간과 비용이 쇼요된다.Film production using ion injection can increase thickness, but it is relatively expensive and considerably slow. Copper, in particular, takes 30 minutes to deposit 25 microns of ions onto a stationary substrate, and the large area is enormous.

그러나, 본 제조 공정을 이용하면 강한 이온 결합력의 특성과 초음파 용접을 이용하여 접착제를 사용하지 않은 얇은 금속박 필름을 제조 할 수 있으며 제조 원가 및 공정을 줄일 수 있다.However, by using the present manufacturing process it is possible to produce a thin metal foil film without the adhesive by using the characteristics of strong ion bonding force and ultrasonic welding, it is possible to reduce the manufacturing cost and process.

도 1 : 기판 이온 증착Figure 1: Substrate Ion Deposition

도 2 : 초음파 융착Figure 2: Ultrasonic Fusion

Claims (1)

표면 금속 이온 증착과 초음파 용접을 이용한 무접착제 금속박 필름 제조 방법.Method for producing a non-adhesive metal foil film using surface metal ion deposition and ultrasonic welding.
KR1020030066716A 2003-09-23 2003-09-23 Method to build thin metal film without adhesive by using ion sputtering and ultrasonic welding KR20050029656A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109207945A (en) * 2018-09-12 2019-01-15 杭州联芳科技有限公司 A kind of combined type magnetic control sputtering sedimentation platform

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109207945A (en) * 2018-09-12 2019-01-15 杭州联芳科技有限公司 A kind of combined type magnetic control sputtering sedimentation platform

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