KR20050026649A - A cooling apparatus of the exothermic parts - Google Patents

Abstract

A device for cooling an exothermic computer part of a semiconductor thermoelectric module type with a reduced size/volume is provided to minimize a cooling system by simplifying a cooling device for cooling the exothermic parts in a system and cool the exothermic parts at a proper temperature by enabling a user to adjust a cooling temperature. The first heat radiating plate(20) absorbs heat by contacting with the CPU(10). The second heat radiating plate(40) emits the heat by receiving the heat absorbed in the first heat radiating plate through a transfer pipe(30). A thermoelectric element(50) contacts with the second heat radiating plate, and cools the second heat radiating plate by emitting the heat absorbed from the second heat radiating plate to air. A temperature sensor(60) measures the temperature of the CPU. A controller(70) controls the thermoelectric element by receiving temperature data from the temperature sensor.

Description

A cooling device for a computer heating part of a semiconductor thermoelectric module type {A COOLING APPARATUS OF THE EXOTHERMIC PARTS}

The present invention relates to a device for cooling a heating element inside a system, in particular a semiconductor thermoelectric module which makes it possible to reduce the size and volume of the system and to cool the heating element at a desired temperature by reducing related equipment for cooling the heating element. It relates to a cooling device of a computer heating component of the method.

In general, the electronic components that make up a system are electrically connected to each other through wires or cables or organically through a circuit board to perform a specific function.

However, due to the development of electronic technology, the electronic components have been strengthened over time, and in particular, the accuracy and the processing speed of the operation have been greatly improved.

However, although the technological developments such as the processing speed of the electronic components have come, as described above, the electronic components generate a lot of thermal energy in order to perform a specific operation. Due to such unnecessary heat, the electronic component may be shortened in life and deteriorated in function.

Therefore, in order to solve the above problems, an electronic component generating unnecessary heat energy is provided with a cooling device or a system to cool them.

However, conventionally, in order to cool the heat generated by the heat generating parts, for example, the CPU, a heat sink 2 is attached to the CPU 1, and a fan (FAN) is mounted on the heat sink. 3)) is attached and cooled. According to such a prior art, as the size of the system (for example, a computer system) increases in size and height, there is a disadvantage that the recent trend toward the miniaturization or slip type electronic system is not revived.

In addition, conventionally, the heat generating parts can be cooled only by the atmospheric temperature through the air in the air, and thus, when it is necessary to cool the temperature below the atmospheric temperature, there is a problem that cannot be coped.

The present invention has been made to solve the problems of the prior art as described above, to minimize the cooling system by simplifying the cooling device for cooling the heating element inside the system, a semiconductor that can adjust the temperature for cooling the heating element It is an object of the present invention to provide a cooling device for a thermoelectric modular computer heating element.

In the device for forming a cooling device for a semiconductor thermoelectric module type computer heating component of the present invention for achieving the above technical problem, in the device for cooling the heating component,

A first heat dissipation plate in contact with the heat generating part to absorb heat;

A second heat dissipation plate receiving heat absorbed by the first heat dissipation plate through a transfer pipe and dissipating heat;

A thermoelectric element in contact with the second heat sink and absorbing heat emitted from the heat sink and radiating it back into the air to cool the second heat sink;

A temperature sensor measuring a temperature of the heat generating component;

And a controller configured to control the thermoelectric element by receiving temperature data from the temperature sensor.

And further comprising a fan (Fan) outside the system in order to absorb the heat generated by the thermoelectric element to dissipate in the air,

The first heat sink and the second heat sink are characterized in that made of a copper or aluminum material.

Hereinafter, with reference to Figure 2 showing the configuration of the present invention the cooling device of the present invention, the operation of the respective components of the cooling device of the semiconductor thermoelectric module type computer heating component having the above configuration means and the preferred embodiment of the present invention It explains in detail.

The central processing unit (CPU 10) is an electronic component that is essential for an electronic system, and is an electronic component that performs most important functions such as data processing and arithmetic even in a personal computer. Since the central processing unit needs to process data at the speed required by the system, a complex and high performance system operates at the corresponding speed, thereby generating corresponding thermal energy. The present invention is to maintain the normal operation by cooling the electronic component that generates such heat.

The heat sink 1 (20) cools the heat generating parts by receiving heat from the heat generating parts such as chipset, which is heated by using the principle of heat conduction. In order to maximize the cooling work in the heat sink, the larger the area exposed to air, good. To achieve this, a large amount of irregularities are formed on the heat sink, because increasing the contact surface with air can dissipate heat as quickly as possible. As described above, the first heat sink absorbs heat generated from the electronic heating component (the central processing unit in FIG. 2).

On the other hand, in order to maximize the effectiveness of the heat sink, if the material such as high thermal conductivity copper or aluminum will be more heat dissipation. In other words, the heat sink is usually a lot of aluminum or copper in terms of cost effectiveness.

The transfer pipe 30 is a moving space of the refrigerant moving between the first heat sink and the second heat sink. That is, when the first heat sink absorbs and cools the heat of the central processing unit, the liquid refrigerant present in the first heat sink is vaporized into a hot gas state. The condensation phenomenon causes the second heat sink to flow to the second heat sink. You will move. Then, the gaseous refrigerant is heat-exchanged by the thermoelectric element so that the gaseous refrigerant is phase-converted to the liquid refrigerant and then moved back to the first heat sink.

The second heat sink 40 includes the contents described in the first heat sink. However, there are some differences from the first heat sink, in which the first heat sink absorbs hot heat generated from the central processing unit, but the second heat sink receives the heat absorbed from the first heat sink through the transfer pipe. Act as cooling (heating) by the device. In the second heat sink, the gaseous refrigerant dissipates heat to phase-convert to a liquid refrigerant.

The thermoelectric device 50 refers to a device using various effects represented by the interaction between heat and electricity. Thermistor, which is a device using a temperature change of electrical resistance, and a device using the Seebeck effect, in which electromotive force is generated by a temperature difference. And a Peltier element, which is an element using the Peltier effect, which is a phenomenon in which heat absorption (or generation) occurs due to a current.

The Seebeck effect is a phenomenon in which electromotive force is generated when two ends of two kinds of metals are connected and the temperature of both ends is different, and it is applied to temperature measurement using a thermoelectric pair. The Peltier effect is a phenomenon in which two types of metal ends are connected and a current is flowed therein so that one terminal absorbs heat and the other terminal generates heat in the current direction.

The thermoelectric device applied to the present invention is a semiconductor device using the Peltier effect described above. Peltier element can be obtained. It is possible to switch the endothermic / exothermic according to the current direction, the endothermic amount / calorific value is adjusted according to the amount of current can adjust the cooling temperature.

That is, the thermoelectric element 50 is in contact with the second heat radiation plate having a hot gas refrigerant inside the endothermic reaction and the heat exchange with the hot gas refrigerant to exchange the refrigerant of the second heat sink in the cold liquid state Is converted into a refrigerant. Then, the refrigerant is moved back to the first heat sink to cool the central processing unit, which is a heat generating component that generates heat.

On the other hand, in order to cool the heat generated in the exothermic reaction of the thermoelectric element may be installed outside the electronic system fan to dissipate heat into the air. For example, a fan can be installed outside the body of the personal composer.

The temperature sensor 60 measures the temperature of heat generated from the central processing unit and serves to transfer the data to the controller. The present invention is an essential component needed to cool to the desired temperature, not the ambient temperature.

The controller 70 is a component for operating the cooling system normally and cooling the heating component at an appropriate temperature. The controller 70 controls the thermoelectric element by receiving temperature data from a temperature sensor. That is, when the temperature data received from the temperature sensor is lower than the proper cooling temperature, the thermoelectric element is controlled to cause the endothermic reaction of the thermoelectric element to be stronger. When the temperature data is higher than the proper cooling temperature, the thermoelectric element is weakened. The thermoelectric element is controlled as much as possible.

Next, a preferred embodiment by the constituent means constituting the present invention having the above function will be described in detail.

First of all, since the present invention configures a cooling system using a thin heat sink without installing a cooling fan in the system as in the related art, the size of the system is miniaturized and the cooling temperature can be controlled.

The first heat sink is attached to the heating element inside the system. This first heat sink will consist of a thin plate with good thermal conductivity, and will contain a refrigerant therein.

When the first heat sink is attached to the central processing unit, which is one of the heat generating parts, the first heat sink absorbs heat generated from the central processing unit. Then, the liquid refrigerant inside the first heat sink is evaporated (collected by heat) to become a gaseous refrigerant.

The gaseous refrigerant is naturally moved to the second heat sink through the A feed pipe by the convection phenomenon. At this time, the movement is made by the convection phenomenon, but in case the convection phenomenon is weak or the movement and circulation of the refrigerant is inappropriate, the pump (not shown) may be connected to the heat sink to help the circulation of the refrigerant.

The refrigerant of the hot gas that has moved to the second heat sink is converted into a liquid refrigerant by dissipating heat inside the second heat sink. That is, the second heat sink is in contact with the endothermic reaction of the thermoelectric element, so that the refrigerant in the hot gas state inside is taken away and converted into a liquid refrigerant.

The refrigerant, which has been deprived of heat by the thermoelectric element and converted into a liquid state, moves back to the first heat sink through the B transfer pipe to absorb heat generated from the central processing unit, cools the heat-generating component, and vaporizes it again to form a gas state. Is converted into a refrigerant and moves to the second heat sink through the A feed pipe.

As the above operation is repeated repeatedly to cool the heat generated from the central processing unit.

On the other hand, when there is too much heat energy generated in the central processing unit to prevent proper cooling at a specific cooling temperature, the user can adjust the proper cooling temperature by the operation of the temperature sensor and the control device.

In other words, the temperature sensor continuously measures the temperature of heat generated by the central processing unit and delivers it to the controller. The controller then receives the temperature data and controls the thermoelectric element to maintain the proper temperature.

If the temperature data measured by the temperature sensor is below the proper temperature, cooling should be added. Therefore, the temperature of the liquid refrigerant should be further controlled. Therefore, in this case, the endothermic reaction occurs more strongly by controlling the current of the thermoelectric element so that the second heat sink is converted into a cooler liquid refrigerant. Then, the coolant can cool the heat of the central processing unit properly by the coolant liquid.

On the other hand, if the temperature data measured by the temperature sensor is higher than the appropriate temperature, the cooling should be weakened, so the control of raising the temperature of the liquid refrigerant should be further controlled. Therefore, in this case, the endothermic reaction is controlled to be weaker by controlling the current of the thermoelectric element so that the central processing unit can be cooled at an appropriate temperature.

As described above, the present invention can effectively cool the central processing unit, which is a heat generating component, by circulation of the refrigerant through the first heat sink, the second heat sink, and the transfer pipe. The thermoelectric element is used for effective cooling, and the current of the thermoelectric element is controlled by a controller to cool it at an appropriate temperature.

Meanwhile, referring to FIG. 3, another embodiment for cooling the heat generating parts to a desired temperature by the user, rather than cooling the heat generating parts to the ambient temperature as follows, is as follows.

On the central processing unit (CPU 81), which is a heat generating component, the side in which the endothermic reaction of the thermoelectric element 82 occurs is attached in contact. Then, heat generated in the central processing unit by the endothermic reaction of the thermoelectric element is released and cooled.

At this time, the temperature sensor 84 continuously measures the temperature of the heat generated by the central processing unit and transmits the temperature data to the controller 85. If it is out of the proper cooling temperature determined by the user can maintain the proper cooling temperature as the controller controls the thermoelectric element.

In other words, if the temperature data received from the temperature sensor is higher than the appropriate cooling temperature, the cooling of the central processing unit needs to be further strengthened. Therefore, the current of the thermoelectric element should be controlled so that the endothermic reaction of the thermoelectric element occurs more strongly. On the contrary, if the temperature data is less than the proper cooling temperature, since the cooling of the central processing unit needs to be lowered, the current of the thermoelectric element is controlled so that the endothermic reaction of the thermoelectric element occurs more weakly.

On the other hand, the heat sink 83 serves to dissipate the energy of the heat generated from the thermoelectric element into the air, and the related structure and contents are the same as the first heat sink or the second heat sink described above.

As described above, the present invention can minimize the configuration of the system and cool the heat generating parts inside the system, such as the central processing unit, by the proper cooling temperature desired by the user rather than the atmospheric temperature. It will be apparent that such a cooling system is applicable not only to a personal computer system but also to an electronic device including a heating component.

According to the cooling device of the semiconductor thermoelectric module-type computer heating element having the above-described configuration means and preferred embodiments, the heat generated from the heating component can be cooled by a bulky thermoelectric element, thereby miniaturizing the cooling system. It is possible to achieve, and the cooling temperature can be adjusted by the user can cool the heating parts by the appropriate temperature has the effect of achieving efficient cooling.

1 is a configuration diagram of a cooling apparatus of a conventional heat generating component.

It is a block diagram of the cooling device of the heat generating component of this invention.

3 is another configuration diagram related to the present invention.

Claims (3)

An apparatus for cooling a heat generating part, A first heat dissipation plate in contact with the heat generating parts to absorb heat; A second heat dissipation plate receiving heat absorbed by the first heat dissipation plate through a transfer pipe and dissipating heat; A thermoelectric element in contact with the second heat sink and absorbing heat emitted from the heat sink and radiating it back into the air to cool the second heat sink; A temperature sensor measuring a temperature of the heat generating component; And a controller for controlling the thermoelectric element by receiving temperature data from the temperature sensor. The method according to claim 1, Cooling device for a semiconductor thermoelectric module type computer heating element further comprises a fan (Fan) outside the system to absorb the heat generated by the thermoelectric element and to dissipate in the air. The method according to claim 1, The first heat dissipation plate and the second heat dissipation plate is a cooling device for a semiconductor thermoelectric module type computer heating element, characterized in that made of a material of copper or aluminum.