KR20050024527A - Ic card and fabricating method therefor - Google Patents
Ic card and fabricating method therefor Download PDFInfo
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- KR20050024527A KR20050024527A KR1020030061314A KR20030061314A KR20050024527A KR 20050024527 A KR20050024527 A KR 20050024527A KR 1020030061314 A KR1020030061314 A KR 1020030061314A KR 20030061314 A KR20030061314 A KR 20030061314A KR 20050024527 A KR20050024527 A KR 20050024527A
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- card
- soft
- coil
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
본 발명은 집적회로칩을 탑재하는 아이씨카드의 제조방법 및 그 방법에 의해 제조된 아이씨카드에 관한 것으로, 특히 집적회로와 코일간의 접촉부분의 파손을 방지하면서도 제조공정이 단순화되고 대칭적인 구조를 이루어 신뢰성이 확보된 아이씨카드 제조방법 및 그 방법에 의해 제조된 아이씨카드에 관한 것이다.The present invention relates to a method of manufacturing an IC card on which an integrated circuit chip is mounted, and to an IC card manufactured by the method. In particular, the manufacturing process is simplified and a symmetrical structure is prevented while preventing contact between the integrated circuit and the coil. It relates to an IC card manufacturing method ensured reliability and an IC card manufactured by the method.
일반적으로 집적회로를 내장한 카드인 집적회로칩카드(IC Card)는 자기테이프를 도포한 카드에 비해 기억 용량과 보안성이 한층 향상되어 금융, 유통, 의료 등에 널리 사용되며, 그 응용분야가 넓고 다기능적인 역할을 가진 것이다.In general, integrated circuit chip card (IC Card), which is a card with integrated circuits, is more widely used in finance, distribution, and medical care as its memory capacity and security are further improved compared to a card coated with magnetic tape. It has a multifunctional role.
종래의 아이씨카드로서 집적회로와 코일간의 접촉부분의 파손을 방지하기 위한 것으로 대한민국 특허 제363657호와 같은 것이 있다.As a conventional IC card to prevent damage of the contact portion between the integrated circuit and the coil, there is such a thing as Korean Patent No. 363657.
상기 종래 기술에 의한 카드 제조방법을 도 1 및 도 2를 참조하여 설명한다. 도 1은 종래의 집적회로칩 카드의 분해사시도이고, 도 2는 종래의 집적회로칩 카드의 단면도이다.The card manufacturing method according to the related art will be described with reference to FIGS. 1 and 2. 1 is an exploded perspective view of a conventional integrated circuit chip card, Figure 2 is a cross-sectional view of a conventional integrated circuit chip card.
도 1 및 도 2에서 보는 바와 같이, 상기 종래의 방법은, 기판(2a)과, 그 기판 상에 설치되는 회로소자(2b)와 그 회로소자에 연결되어 상기 기판 상에 부착 설치되는 배선(2c)으로 구성된 집적회로(2) 및 그 집적회로의 배선에 접속되는 데이터송수신 및 전력공급용 코일(3)이 하측외부판(4)과 상측외부판(5) 사이에 구비하는 집적회로칩카드의 제조방법에 있어서: 집적회로의 기판(2a)의 두께와 집적회로의 배선(2c)의 두께를 합친 두께와 거의 동일한 두께와 상기 상측외부판 내지 하측외부판의 윤곽을 지니는 기판보호판(6)에 집적회로의 기판(2a)의 위치에서 그 기판의 크기와 동일한 크기의 기판설치구멍(6a)을 형성하는 단계; 상기 집적회로(2)의 돌출한 회로소자(2b)와 거의 동일한 두께와 상기 상측외부판(5) 내지 하측외부판(4)의 윤곽을 지니는 회로소자보호판(7)에 그 집적회로의 회로소자의 위치에서 그 회로소자의 크기와 동일한 크기의 회로소자설치구멍(7a)을 형성하는 단계; 상기 하측외부판 상에 상기 기판보호판을 배치한 뒤, 상기 기판보호판(6)에 형성된 기판설치구멍(6a)에 집적회로의 기판(2a)을 삽입하여 집적회로를 배치하는 단계; 다수회 감기거나 절곡된 코일(3)의 각 단부가 상기 집적회로의 배선(2c)에 부착하도록 코일을 상기 기판보호판 상에 배치하는 단계; 상기 회로소자보호판(7)에 형성된 회로소자설치구멍(7a)에 집적회로의 회로소자가 삽입되도록 상기 기판보호판 상에 회로소자보호판을 배치하는 단계; 그리고 상기 회로소자보호판 상에 상측외부판을 배치하여 하측외부판과 상측외부판의 외측으로부터 압착하여 부착하는 단계를 포함하여 구성되는 것을 특징으로 한다.As shown in Figs. 1 and 2, the conventional method includes a substrate 2a, a circuit element 2b provided on the substrate, and a wiring 2c connected to and attached to the circuit element. Of an integrated circuit chip card having an integrated circuit (2) consisting of a circuit and a coil (3) for data transmission / reception and power supply connected to a wiring of the integrated circuit between the lower outer plate (4) and the upper outer plate (5). A manufacturing method comprising: a substrate protective plate 6 having a thickness substantially equal to the sum of the thickness of the substrate 2a of the integrated circuit and the thickness of the wiring 2c of the integrated circuit, and the upper outer plate to the lower outer plate. Forming a substrate mounting hole 6a of the same size as that of the substrate at the position of the substrate 2a of the integrated circuit; The circuit elements of the integrated circuit on the circuit element protection plate 7 having the same thickness as the protruding circuit elements 2b of the integrated circuit 2 and the contours of the upper outer plate 5 to the lower outer plate 4. Forming a circuit element mounting hole 7a having a size equal to that of the circuit element at the position of; Arranging the integrated circuit by disposing the substrate protection plate on the lower outer plate and inserting the substrate (2a) of the integrated circuit into the substrate installation hole (6a) formed in the substrate protection plate (6); Disposing a coil on the substrate protection plate such that each end of the coil (3) wound or bent several times is attached to the wiring (2c) of the integrated circuit; Disposing a circuit element protection plate on the substrate protection plate such that a circuit element of an integrated circuit is inserted into a circuit element installation hole (7a) formed in the circuit element protection plate (7); And arranging an upper outer plate on the circuit element protection plate and compressing and attaching the outer outer plate to the outer outer plate and the outer outer plate.
따라서, 외부로 집적회로의 돌출을 방지함과 동시에 코일의 단부에 발생하는 단턱을 제거함으로써 집적회로와 코일 사이의 접촉부분의 파손 및 코일의 왜곡을 방지하고, 카드사용의 기간을 증대하는 것이 가능하다.Therefore, it is possible to prevent the breakage of the contact portion between the integrated circuit and the coil and the distortion of the coil by preventing the protrusion of the integrated circuit to the outside and at the same time to remove the step that occurs at the end of the coil, and to increase the period of card use. Do.
그러나, 상기 종래의 방법은 기판보호판(6)과 회로소자보호판(7)이 더 필요하고 더구나 각각의 판에 기판설치구멍(6a)과 회로소자설치구멍(7a)이 각각 천공되어야 하므로 제조공정이 복잡하여 지는가 하면, 기판설치구멍(6a)과 회로소자설치구멍(7a)의 크기나 위치가 상대적으로 정확하지 않으면 각 판들(4, 5, 6, 7)을 압착하는 단계에서 IC칩이 파손되는 경우가 종종 발생하며, 상.하측 외부판(4, 5)의 두께는 대칭이나 기판보호판(6)과 회로소자보호판(7)의 두께가 상이하여 (대체로 각각 0.1mm 및 0.35mm) 전체적으로 비대칭인 관계로, 작업시나 카드 사용시 휨 현상이 발생하는 문제점이 있었다.However, the conventional method requires the board protection plate 6 and the circuit element protection plate 7 further, and furthermore, the board mounting hole 6a and the circuit element mounting hole 7a must be drilled in each plate, so that the manufacturing process is performed. In addition, if the size and position of the board mounting hole 6a and the circuit element mounting hole 7a are not relatively accurate, the IC chip may be damaged in the step of pressing the plates 4, 5, 6 and 7. Occasionally, the upper and lower outer plates 4 and 5 have symmetrical thicknesses, but the thicknesses of the substrate protection plate 6 and the circuit protection plate 7 are different (typically 0.1 mm and 0.35 mm, respectively). As a result, there was a problem that warpage occurs during operation or card use.
본 발명은 이상의 문제점을 해결하고자 하는 것으로, IC칩과 코일간의 접촉부분의 파손을 방지하면서도 제조공정이 단순화되고 전체적으로 대칭적인 구조를 이루어 신뢰성이 확보된 아이씨카드의 제조방법을 제공하는 것이다.The present invention is to solve the above problems, to provide a manufacturing method of IC card to ensure the reliability by preventing the breakage of the contact portion between the IC chip and the coil is simplified and the overall symmetric structure.
이상의 본 발명의 목적을 달성하기 위한 본 발명의 일 측면에 따른 아이씨카드의 제조방법은, 상판(30) 및 하판(20)과, 상기 상판 및 하판보다 상대적 두껍고 소프트한 재질의 소프트판(10)으로 구성되는 아이씨카드의 제조방법으로서, (a) 상기 소프트판(10)에 IC칩(40)을 부착하는 단계; 및 (b) 상기 IC칩이 탑재된 소프트판(10)의 상하에 각각 상판(30) 및 하판(20)을 위치시킨 후 가열압착하여 상기 세 개의 판을 합지시키는 단계로 이루어지며, 상기 소프트판에 IC칩을 부착하는 (a) 단계는, (a1) 상기 소프트판(10)의 일측에 IC삽입홀(11)을 천공하는 단계와, (a2) 상기 삽입홀 주위에서 시작하여 카드의 가장자리 윤곽을 따라 코일(12)을 형성하는 단계와, (a3) 상기 코일(13)의 상기 IC칩의 단자(41, 42)와의 접촉점 예상 부위를 스크래치하여 전기적 접속이 용이하도록 한 후, 도전성 페이스트(13)를 페이스팅하는 단계와, (a4) 상기 IC칩(40)을 상기 소프트판(10)에 탑재한 후 가접합하는 단계로 이루어지는 것을 특징으로 한다. The manufacturing method of the IC card according to an aspect of the present invention for achieving the object of the present invention, the upper plate 30 and the lower plate 20, and the soft plate 10 of a relatively thick and soft material than the upper plate and the lower plate A method of manufacturing an IC card comprising: (a) attaching an IC chip 40 to the soft plate 10; And (b) placing the upper plate 30 and the lower plate 20 on the upper and lower sides of the soft plate 10 on which the IC chip is mounted, and laminating the three plates by heating and pressing the soft plate. The step (a) of attaching the IC chip to the (a1) step of drilling the IC insertion hole 11 on one side of the soft plate 10, and (a2) the edge contour of the card starting around the insertion hole Forming a coil 12 along the surface of the coil 13, and (a3) scratching a predicted contact point with the terminals 41 and 42 of the IC chip of the coil 13 to facilitate electrical connection, and then the conductive paste 13 ), And (a4) temporarily mounting the IC chip 40 on the soft plate 10.
한편, 이상의 본 발명의 목적을 달성하기 위한 본 발명의 제1 측면에 따른 아이씨카드는, IC칩(40)을 내장하는 아이씨카드의 외부층인 상판(30)과 하판(20); 및 상기 상판 및 하판보다 상대적 두껍고 소프트한 재질로 이루어지며, 상기 IC칩(40)이 탑재되도록 IC삽입홀(11)을 갖는, 상기 상판과 하판 사이에 위치하는 소프트판(10)의 3개층으로만 이루어지되, 상기 소프트판의 일측면상에 형성되는 코일(13)은, 적어도 상기 IC칩의 단자(41, 41')와 접촉하는 부위의 일부가 상기 소프트판에 묻히는 구조로 형성되며, 상기 접촉부위가 상기 소프트판에 묻힌 상태에서 상기 IC칩의 단자와 전기접속되는 것을 특징으로 한다.On the other hand, the IC card according to the first aspect of the present invention for achieving the above object of the present invention, the upper plate 30 and the lower plate 20 which is an outer layer of the IC card containing the IC chip 40; And three layers of the soft plate 10 positioned between the top plate and the bottom plate, each having a thicker and softer material than the top plate and the bottom plate, and having an IC insertion hole 11 to mount the IC chip 40 thereon. Only the coil 13 formed on one side of the soft plate has a structure in which at least a part of a portion in contact with the terminals 41 and 41 'of the IC chip is buried in the soft plate. The part is electrically connected to the terminal of the IC chip in the state buried in the soft plate.
바람직하게는, 상기 상판 및 하판의 두께는 각각 0.05-0.06mm이며, 상기 소프트판의 두께는 0.32-0.40mm 이다.Preferably, the thickness of the upper plate and the lower plate is 0.05-0.06mm, respectively, and the thickness of the soft plate is 0.32-0.40mm.
이하, 상기 본 발명의 아이씨카드의 제조방법에 대하여 도 3 및 도 4를 참조하여 상세히 설명한다.Hereinafter, a method of manufacturing the IC card of the present invention will be described in detail with reference to FIGS. 3 and 4.
도 3은 본 발명에 따르는 아이씨카드의 단면도이고, 도 4는 본 발명에 따르는 아이씨카드의 제조단계를 설명하기 위한 소프트판의 사진이다.Figure 3 is a cross-sectional view of the IC card according to the present invention, Figure 4 is a photograph of a soft plate for explaining the manufacturing step of the IC card according to the present invention.
도 3에서 보는 바와 같이, 본 발명에 따른 종래기술의 상.하측 외부판(5, 4)에 대응하는 상판(30) 및 하판(20)과, 상기 상.하판보다 상대적 두껍고 소프트한 재질의 소프트판(10)으로 구성된다. 일례로, 상기 소프트판은 이태리의 "Lucchesi SpA" 사의 "WMI-AE" 제품이 사용될 수 있으며, 상기 상.하판의 두께가 0.05-0.06mm인 데 비하여, 소프트판의 두께는 0.32-0.40mm 이나, 이에 한정되는 것은 아니다.As shown in Figure 3, the upper plate 30 and the lower plate 20 corresponding to the upper and lower outer plates (5, 4) of the prior art according to the present invention, and the soft and soft material of relatively thicker than the upper and lower plates It consists of a plate 10. For example, the soft plate may be a product of "WMI-AE" manufactured by "Lucchesi SpA" of Italy, and the thickness of the soft plate is 0.32-0.40 mm, whereas the thickness of the upper and lower plates is 0.05-0.06 mm. It is not limited to this.
상기 소프트판에 칩을 부착하는 공정을 도 3 및 도 4를 참조하여 설명하면, 먼저, 도 4의 (a)에서 보는 바와 같이 소프트판(10)의 일측에 IC삽입홀(11)을 천공한 후, 도 4의 (b)에서 보는 바와 같이 상기 삽입홀 주위에서 시작하여 카드의 가장자리 윤곽을 따라 코일(12)을 와인딩하는 등의 방식으로 형성한다. 이때 상기 코일 와인딩의 시작점 및 종료점은 상기 IC가 삽입될 경우 양 단자(41, 41')가 위치될 지점이 되어야 한다. 그리고 이 경우, 상기 코일은 상기 소프트판(10)의 표면 아래로 함몰되도록 한다. 특히, 상기 소프트판(10)은 종래기술의 기판보호판(6: 도3 참조)과는 달리 표면이 상대적으로 연하기 때문에, 코일이 소프트판의 표면 아래로 묻히는 것이 가능하게 된다.The process of attaching the chip to the soft plate will be described with reference to FIGS. 3 and 4. First, as shown in FIG. 4A, the IC insertion hole 11 is drilled in one side of the soft plate 10. Thereafter, as shown in FIG. 4 (b), the coil 12 is formed along the edge contour of the card starting around the insertion hole and the like. At this time, the start point and the end point of the coil winding should be the point where both terminals 41 and 41 'are positioned when the IC is inserted. In this case, the coil is recessed below the surface of the soft plate 10. In particular, since the soft plate 10 is relatively soft in surface, unlike the conventional substrate protection plate 6 (see FIG. 3), the coil can be buried below the surface of the soft plate.
그후, 도 4의 (c)에서 보는 바와 같이 상기 코일(13)의 상기 +단자(41) 및 -단자(42)와의 접촉점 예상 부위를 스크래칭하여 전기적 접속이 용이하도록 한 후, 무연납과 같은 도전성 페이스트(13)를 페이스팅한다. Then, as shown in (c) of FIG. 4, the contact point predicted portions of the coil 13 with the + terminal 41 and the-terminal 42 are scratched to facilitate electrical connection thereafter, and then conduct conductivity such as lead-free. Paste the paste 13.
마지막으로, 도 4의 (d)에서 보는 바와 같이 기판(42) 상에 회로소자(42)가 결합되고 단자가 돌출되어 있는 IC칩(40)을 상기 소프트판(10)에 탑재한 후, 인두로 가접합한다. 이는 상기 IC칩이 탑재된 소프트판을 이송시 IC칩의 움직임을 방지하는 목적을 갖는다. Finally, as shown in FIG. 4 (d), the IC chip 40 having the circuit elements 42 coupled and the terminals protruding onto the substrate 42 is mounted on the soft plate 10. Temporarily join with. This has the purpose of preventing the movement of the IC chip when transferring the soft plate on which the IC chip is mounted.
이후, 상기 IC칩이 탑재된 소프트판(10)의 상하에 각각 상판(30) 및 하판(20)을 위치시킨 후 가열압착하여 상기 세 개의 판을 합지시킴으로써 아이씨카드를 완성하게 된다.Subsequently, the upper plate 30 and the lower plate 20 are positioned above and below the soft plate 10 on which the IC chip is mounted, and then heat-compressed to laminate the three plates to complete the IC card.
이상 본 발명을 첨부도면에 도시된 일 실시예를 참조하여 설명하였으나, 본 발명은 이에 한정되는 것은 아니며, 당업자가 용이하게 생각해 낼 수 있는 범위 내에서 여러 가지 변형이 가능함은 물론이다. 따라서, 본 발명의 한계는 다음의 특허청구범위에 의해서만 한정되어야 한다.Although the present invention has been described above with reference to one embodiment shown in the accompanying drawings, the present invention is not limited thereto, and various modifications may be made within a range easily understood by those skilled in the art. Therefore, the limitation of the present invention should be limited only by the following claims.
이상에서 상세히 설명한 바와 같이, 본 발명에 의한 아이씨카드에 의하면, 코일(12)이 소프트판(10)에 묻히게 된 상태에서 IC칩(40)의 단자(41, 41')에 접속이 되므로, 단자와 코일의 접속점에서 단락의 문제점을 해결하면서도, 상층(30)과 하층(20) 및 소프트층(10)의 3개층 만으로 구성되므로 제조공정이 간단하여지고, 카드의 외부로 칩의 윤곽이 돌출되지 않으면서, 아울러 상.하층이 대칭을 이루어 휨을 방지할 수 있으며, IC칩의 회로부가 삽입되는 삽입홀(11)만을 형성하면 족하므로 홀의 위치를 정확히 할 수 있어 오차를 줄임에 따라 칩이 파손될 위험성도 크게 낮추게 된다는 여러 가지 장점이 있게 된다.As described in detail above, according to the IC card according to the present invention, since the coil 12 is connected to the terminals 41 and 41 'of the IC chip 40 in the state where the coil 12 is buried in the soft plate 10, the terminal Solving the short-circuit problem at the connection point between the coil and the coil, the upper layer 30, the lower layer 20, and the soft layer 10 consist of only three layers, which simplifies the manufacturing process and does not protrude the outline of the chip out of the card. In addition, the upper and lower layers are symmetrical to prevent warpage, and only the insertion hole 11 into which the circuit portion of the IC chip is inserted is sufficient, so the position of the hole can be precisely reduced, thereby reducing the error of the chip as the error is reduced. There are also several advantages of significantly lowering the rate.
도 1은 종래의 집적회로칩 카드의 분해사시도1 is an exploded perspective view of a conventional integrated circuit chip card
도 2는 종래의 집적회로칩 카드의 단면도2 is a cross-sectional view of a conventional integrated circuit chip card
도 3은 본 발명에 따르는 아이씨카드의 단면도Figure 3 is a cross-sectional view of the IC card according to the present invention
도 4는 본 발명에 따르는 아이씨카드의 제조단계를 설명하기 위한 사진Figure 4 is a photo for explaining the manufacturing steps of IC card according to the present invention
* 도면의 주요부분에 대한 설명 *Description of the main parts of the drawing
1: 집적회로칩카드 2: 집적회로1: integrated circuit chip card 2: integrated circuit
2a: 기판 2b: 회로소자2a: substrate 2b: circuit element
2c: 배선 3: 코일2c: wiring 3: coil
4: 하측외부판 5: 상측외부판4: lower outer plate 5: upper outer plate
6: 기판보호판 6a: 기판설치구멍6: Board protective plate 6a: Board mounting hole
7: 회로소자보호판 7a: 회로소자설치구멍7: Circuit element protection plate 7a: Circuit element mounting hole
10: 소프트판 11: IC삽입홀10: Soft plate 11: IC insertion hole
12: 코일 13: 페이스트12: coil 13: paste
20: 하판 30: 상판20: lower plate 30: upper plate
40: 집적회로(IC)칩 41, 41': IC단자40: IC chip 41, 41 ': IC terminal
42: IC회로부 43: IC기판42: IC circuit 43: IC board
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030061314A KR20050024527A (en) | 2003-09-03 | 2003-09-03 | Ic card and fabricating method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030061314A KR20050024527A (en) | 2003-09-03 | 2003-09-03 | Ic card and fabricating method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20050024527A true KR20050024527A (en) | 2005-03-10 |
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ID=37231658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030061314A KR20050024527A (en) | 2003-09-03 | 2003-09-03 | Ic card and fabricating method therefor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20050024527A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000057304A (en) * | 1998-07-20 | 2000-02-25 | St Microelectronics | Production of smart card and same |
| KR20030051442A (en) * | 2003-03-12 | 2003-06-25 | (주)아이씨코리아 | Smart card having loop coil contact laminated metal plate and method for manufacturing the same |
| KR100402643B1 (en) * | 2001-08-27 | 2003-10-22 | 전경호 | loop coil contact structure and manufacturing process for combination IC card |
-
2003
- 2003-09-03 KR KR1020030061314A patent/KR20050024527A/en not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000057304A (en) * | 1998-07-20 | 2000-02-25 | St Microelectronics | Production of smart card and same |
| KR100402643B1 (en) * | 2001-08-27 | 2003-10-22 | 전경호 | loop coil contact structure and manufacturing process for combination IC card |
| KR20030051442A (en) * | 2003-03-12 | 2003-06-25 | (주)아이씨코리아 | Smart card having loop coil contact laminated metal plate and method for manufacturing the same |
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