KR20050017339A - Intelligent power module - Google Patents

Intelligent power module

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Publication number
KR20050017339A
KR20050017339A KR1020030055969A KR20030055969A KR20050017339A KR 20050017339 A KR20050017339 A KR 20050017339A KR 1020030055969 A KR1020030055969 A KR 1020030055969A KR 20030055969 A KR20030055969 A KR 20030055969A KR 20050017339 A KR20050017339 A KR 20050017339A
Authority
KR
South Korea
Prior art keywords
pcb
cooling plate
thermal paste
power module
intelligent power
Prior art date
Application number
KR1020030055969A
Other languages
Korean (ko)
Inventor
김창성
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020030055969A priority Critical patent/KR20050017339A/en
Publication of KR20050017339A publication Critical patent/KR20050017339A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: An intelligent power module is provided to improve heat emission efficiency by enlarging contact area of a thermal paste and a cooling plate by discharging air through a discharge hole although the air exists between the central portion of a thermal paste and a cooling fan. CONSTITUTION: An intelligent power module includes a PCB(Printed Circuit Board)(110), a PCB block(130), a cooling plate(150), a thermal paste(170), and an air ventilator(155). The PCB block includes a rectangular block having the PCB pressed therein and a connection pin which is injected onto the rectangular block. The cooling plate contacts the PCB at one side and includes a plurality of heat emitting pins at the other side. The thermal paste is applied on the other side of the PCB to absorb the heat from the PCB and delivers the heat to the cooling plate. The air ventilator is formed on a region of the cooling plate to which a center of the thermal paste is attached.

Description

인텔리전트 파워 모듈{INTELLIGENT POWER MODULE}Intelligent Power Module {INTELLIGENT POWER MODULE}

본 발명은 PCB와 냉각판의 방열효율을 향상시킬 수 있는 인텔리전트 파워 모듈에 관한 것이다.The present invention relates to an intelligent power module that can improve the heat dissipation efficiency of the PCB and the cooling plate.

인텔리전트 파워 모듈(INTELLIGENT POWER MODULE 이하 "IPM"이라 함)이란, 전력용 반도체 소자와 보호회로와 구동회로 및 제어회로 등을 하나의 패키지로 구성한 것으로, 전력용 소자를 중심으로 한 가전기기 등의 전원공급장치로 많이 사용된다. 이러한, IPM은 작은 공간 안에 많은 반도체 소자 및 제어회로 등이 집적되어 있어 IPM의 구동시 많은 열이 발생되는데, IPM에서 발생된 열을 방열하기 위해 써멀페이스트와 알루미늄 재질의 냉각판이 사용된다.An intelligent power module (hereinafter referred to as "IPM") is a package of power semiconductor elements, protection circuits, drive circuits, and control circuits. It is a power supply for home appliances such as electric power devices. It is often used as a feeder. In this IPM, many semiconductor devices and control circuits are integrated in a small space, and a lot of heat is generated when the IPM is driven. A thermal paste and a cooling plate made of aluminum are used to dissipate heat generated in the IPM.

이하, 첨부된 도면을 참조하여 종래의 인텔리전트 파워 모듈을 상세히 설명한다. 도 1은 종래의 인텔리전트 파워 모듈을 보인 분해 사시도이다.Hereinafter, a conventional intelligent power module will be described in detail with reference to the accompanying drawings. 1 is an exploded perspective view showing a conventional intelligent power module.

도시된 바와 같이, 종래의 IPM(10)은 일면에 다수의 반도체 소자(미도시)가 실장된 PCB(11)를 가진다. PCB(11)는 사각형상의 PCB블록(13)에 압입되어 고정되고, PCB블록(13)의 테두리부에는 다수의 연결핀(13a)이 마련된다. 연결핀(13a)은 PCB(11)와 외부 부품(미도시)이 상호 연결되도록 일측은 PCB(11)에 접속되고 타측은 상기 외부 부품에 접속된다.As shown, the conventional IPM 10 has a PCB 11 having a plurality of semiconductor devices (not shown) mounted on one surface thereof. The PCB 11 is pressed into the rectangular PCB block 13 and fixed, and a plurality of connection pins 13a are provided at the edge of the PCB block 13. The connecting pin 13a is connected to the PCB 11 and the other side is connected to the external component so that the PCB 11 and the external component (not shown) are interconnected.

PCB(11)의 타면은 냉각판(15)에 접촉되고, PCB(11)에서 발생되는 열은 냉각판(15)을 통해 방열된다. 이때, PCB(11)의 타면에는 젤 형태의 써멀페이스트(Thermal paste)(17)가 도포되는데, 써멀페이스트(17)는 PCB(11)에서 발생된 열을 흡수하여 냉각판(15)으로 전달함과 동시에 PCB(11)를 냉각판(15)에 접착시킨다.The other surface of the PCB 11 is in contact with the cooling plate 15, and heat generated in the PCB 11 is radiated through the cooling plate 15. At this time, the other surface of the PCB 11 is coated with a thermal paste 17 in a gel form, the thermal paste 17 absorbs the heat generated from the PCB 11 and transfers it to the cooling plate 15. At the same time, the PCB 11 is bonded to the cooling plate 15.

그러나, 상기와 같이 구성된 종래의 IPM(10)은 써멀페이스트(17)를 PCB(11)에 도포하고, 써멀페이스트(17)가 도포된 PCB(11)를 냉각판(15)에 접착할 때 써멀페이스트(17)의 외측부위가 냉각판(15)에 먼저 접착되면, 써멀페이스트(17)의 중앙부측 공기가 외부로 배출되지 않아 써멀페이스트(17)가 냉각판(15)에 완전히 접촉되지 않는다. 그러면, 써멀페이스트(17)와 냉각판(15)의 접촉부위가 작아져 방열효율이 저하되는 단점이 있다.However, the conventional IPM 10 configured as described above has thermal when the thermal paste 17 is applied to the PCB 11, and the thermal paste 17 is applied to the cold plate 15 when the PCB 11 is applied. When the outer portion of the paste 17 is first adhered to the cooling plate 15, the air at the center side of the thermal paste 17 is not discharged to the outside so that the thermal paste 17 does not completely contact the cooling plate 15. Then, the contact area between the thermal paste 17 and the cooling plate 15 is small, there is a disadvantage that the heat radiation efficiency is lowered.

본 발명은 상기와 같은 문제점을 해결하기 위해 창출된 것으로, 본 발명의 목적은 써멀페이스트와 냉각판의 사이에 남아있는 공기가 배출되도록 써멀페이스트의 중앙부측과 접촉되는 냉각판의 부위에 공기 배출로를 형성하여 써멀페이스트와 냉각판을 완전히 접촉시키므로써, 방열효율을 향상시킬 수 있는 IPM을 제공함에 있다.The present invention has been made to solve the above problems, an object of the present invention is to discharge the air to the portion of the cooling plate which is in contact with the central side of the thermal paste so that the air remaining between the thermal paste and the cooling plate is discharged. By forming a complete contact between the thermal paste and the cooling plate, to provide an IPM that can improve the heat dissipation efficiency.

상기와 같은 목적을 달성하기 위한 본 발명에 따른 IPM은 일면에 다수의 반도체 소자가 실장된 PCB와, 상기 PCB가 내측에 압입되는 사각형상의 블록과 상기 블록에 압입되는 연결핀을 가지는 PCB블록과, 일면에는 상기 PCB의 타면이 접촉되어 결합되고 타면에는 다수의 방열핀이 형성되어 PCB에서 발생되는 열을 외부로 방출하는 냉각판과, 상기 PCB의 타면에 도포되어 상기 PCB에서 발생된 열을 흡수하여 상기 냉각판으로 전달함과 동시에 상기 PCB와 상기 냉각판을 접착시키는 써멀페이스트와, 상기 써멀페이스트의 중앙부가 접착되는 상기 냉각판의 부위에 형성된 공기 배출수단을 구비한다.IPM according to the present invention for achieving the above object is a PCB block having a plurality of semiconductor devices mounted on one surface, a rectangular block in which the PCB is pressed into the inside and the connection pin is pressed in the block, The other surface of the PCB is in contact with each other and a plurality of heat radiation fins are formed on the other surface and the cooling plate for dissipating heat generated from the PCB to the outside, the other surface of the PCB is absorbed by the heat generated from the PCB And a thermal paste formed on a portion of the cooling plate to which the central portion of the thermal paste is bonded, the thermal paste having a transfer to a cooling plate and simultaneously bonding the PCB to the cooling plate.

이하, 첨부한 도면을 참조하여 본 발명의 일 실시예에 따른 인텔리전트 파워 모듈을 상세히 설명한다. 도 2는 본 발명의 일 실시예에 따른 인텔리전트 파워 모듈의 분해 사시도이다.Hereinafter, an intelligent power module according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 2 is an exploded perspective view of an intelligent power module according to an embodiment of the present invention.

도시된 바와 같이, 본 발명의 IPM(100)은 일면에 다수의 반도체 소자(미도시)가 실장된 PCB(110)를 가진다. PCB(110)는 PCB블록(130)에 의해 외부 부품(미도시)과 연결되는데, PCB블록(130)는 PCB(110)가 삽입/고정되는 사각형상의 블록(135)과 블록(135)에 압입되는 연결핀(131)을 가진다. 연결핀(131)은 PCB(110)와 상기 외부 부품이 상호 연결되도록 일단은 PCB(110)에 접속되고 타단부는 상기 외부 부품에 접속된다. As shown, the IPM 100 of the present invention has a PCB 110 mounted with a plurality of semiconductor devices (not shown) on one surface. PCB 110 is connected to an external component (not shown) by the PCB block 130, the PCB block 130 is pressed into the block 135 and the block 135 and the rectangular block 135 is inserted / fixed to the PCB 110 It has a connecting pin 131. The connecting pin 131 is connected to the PCB 110 and the other end thereof so that the PCB 110 and the external component are connected to each other, and the other end thereof is connected to the external component.

또한, PCB(110)는 PCB블록(130)에 의해 냉각판(150)에 접착되어 방열되는데, PCB블록(130)의 블록(135)에는 제 1 결합공(133)이 형성되고, 제 1 결합공(133)과 대응되는 냉각판(150)의 부위에는 제 2 결합공(153)이 형성된다. 그리하여, 제 1 결합공(133)과 제 2 결합공(153)이 연통되게 PCB블록(130)에 결합된 PCB(110)의 타면을 냉각판(150)의 일면과 접촉시킨 후, 제 1 및 제 2 결합공(133,153)에 나사(137)를 체결하여 PCB블록(130)과 냉각판(150)을 결합한다. 그러면, PCB(110)에서 발생된 열이 냉각판(150)을 통해 방열된다. 이때, PCB(110)의 타면에는 PCB(110)에서 발생된 열을 흡수하여 냉각판(150)으로 전달함과 동시에 PCB(110)와 냉각판(150)을 접착시키는 써멀페이스트(170)가 도포된다. 한편, 냉각판(150)의 타면에는 공기와의 마찰 면적을 넓혀 냉각판(150)의 방열효과를 향상시키기 위한 냉각핀(157)이 돌출/형성된다.In addition, the PCB 110 is bonded to the cooling plate 150 by the PCB block 130 to radiate heat, the first coupling hole 133 is formed in the block 135 of the PCB block 130, the first coupling The second coupling hole 153 is formed in the portion of the cooling plate 150 corresponding to the hole 133. Thus, after contacting the other surface of the PCB 110 coupled to the PCB block 130 so that the first coupling hole 133 and the second coupling hole 153 communicate with one surface of the cooling plate 150, the first and second coupling holes 133 and the second coupling hole 153 communicate with each other. The screws 137 are fastened to the second coupling holes 133 and 153 to couple the PCB block 130 and the cooling plate 150 to each other. Then, heat generated in the PCB 110 is radiated through the cooling plate 150. At this time, the other surface of the PCB 110 absorbs heat generated from the PCB 110 and transfers it to the cooling plate 150, and at the same time, a thermal paste 170 is applied to bond the PCB 110 and the cooling plate 150 to each other. do. On the other hand, the other surface of the cooling plate 150 has a cooling fin 157 protrudes / formed to widen the friction area with the air to improve the heat radiation effect of the cooling plate 150.

본 실시예에서는 써멀페이스트(170)의 중앙부측과 냉각판(150)의 사이에 존재하는 공기를 배출하기 위한 수단이 마련된다. 상기 수단은 써멀페이스트(170)의 중앙부측과 대응되는 냉각판(150)의 일면에 형성되어 냉각판(150)의 외측과 연통되는 배출로(155)로 마련된다. 그리하여, 써멀페이스트(170)가 도포된 PCB(110)를 배출로(155)가 형성된 냉각판(150)의 일면에 접착시킬 때, 써멀페이스트(170)의 외측부위가 냉각판(150)에 먼저 접촉되어 써멀페이스트(170)의 중앙부측과 냉각판(150) 사이에 공기가 존재하여도 상기 공기는 배출로(155)를 따라 외부로 배출되므로, 써멀페이스트(170)와 냉각판(150)이 완전히 접착된다. 이때, 써멀페이스트(170)와 대응되는 배출로(155)에는 공기가 배출되면서 써멀페이스트(170)가 채워진다. In this embodiment, a means for discharging air existing between the central portion side of the thermal paste 170 and the cooling plate 150 is provided. The means is formed on one surface of the cooling plate 150 corresponding to the central side of the thermal paste 170 is provided with a discharge passage 155 is in communication with the outside of the cooling plate 150. Thus, when the PCB 110 to which the thermal paste 170 is applied is bonded to one surface of the cooling plate 150 on which the discharge path 155 is formed, the outer portion of the thermal paste 170 is first attached to the cooling plate 150. Since the air is discharged to the outside along the discharge path 155 even if there is air between the central portion of the thermal paste 170 and the cooling plate 150 in contact with each other, the thermal paste 170 and the cooling plate 150 Fully glued At this time, the discharge path 155 corresponding to the thermal paste 170 is filled with the thermal paste 170 while the air is discharged.

도 3은 본 발명의 다른 실시예에 따른 인텔리전트 파워 모듈의 사시도로써, 냉각판(250)의 일면에 써멀페이스트(270)의 중앙부측 공기를 외부로 배출하기 위한 수단으로 배출공(255)이 관통/형성된다.3 is a perspective view of an intelligent power module according to another embodiment of the present invention, in which a discharge hole 255 penetrates the outside of the central portion of the thermal paste 270 on one surface of the cooling plate 250 to the outside. / Formed.

이상에서 설명한 바와 같이 본 발명에 따른 IPM은 써멀페이스트가 도포된 PCB를 냉각판에 접착할 때 써멀페이스트의 중앙부측과 냉각판 사이에 공기가 존재하여도 상기 공기가 배출로 또는 배출공을 통하여 외부로 배출되므로, 써멀페이스트와 냉각판이 완전하게 접촉된다. 그러면, 써멀페이스트와 냉각판의 접착 면적이 넓어지므로, 방열효율이 향상된다.As described above, in the IPM according to the present invention, even when air is present between the center portion of the thermal paste and the cooling plate when the thermal paste-coated PCB is bonded to the cooling plate, the air is discharged through the discharge path or the discharge hole. The thermal paste and the cooling plate are in perfect contact with each other. As a result, the bonding area between the thermal paste and the cooling plate is widened, so that the heat radiation efficiency is improved.

이상에서는, 본 발명의 일 실시예에 따라 본 발명을 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 변경 및 변형한 것도 본 발명에 속함은 당연하다.In the above, the present invention has been described in accordance with one embodiment of the present invention, but those skilled in the art to which the present invention pertains have been changed and modified without departing from the spirit of the present invention. Of course.

도 1은 종래의 인텔리전트 파워 모듈을 보인 분해 사시도.1 is an exploded perspective view showing a conventional intelligent power module.

도 2는 본 발명의 일 실시예에 따른 인텔리전트 파워 모듈의 분해 사시도.2 is an exploded perspective view of an intelligent power module according to an embodiment of the present invention.

도 3은 본 발명의 다른 실시예에 따른 인텔리전트 파워 모듈의 분해 사시도.3 is an exploded perspective view of an intelligent power module according to another embodiment of the present invention.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

100 : IPM 110 : PCB100: IPM 110: PCB

130 : PCB블록 150 : 냉각판130: PCB block 150: cooling plate

155 : 배출로 170 : 써멀페이스트155: discharge path 170: thermal paste

Claims (3)

일면에 다수의 반도체 소자가 실장된 PCB와,PCB having a plurality of semiconductor devices mounted on one surface 상기 PCB가 내측에 압입되는 사각형상의 블록과 상기 블록에 압입되는 연결핀을 가지는 PCB블록과,A PCB block having a rectangular block into which the PCB is pressed into the inside and a connection pin pressed into the block; 일면에는 상기 PCB의 타면이 접촉되어 결합되고 타면에는 다수의 방열핀이 형성되어 PCB에서 발생되는 열을 외부로 방출하는 냉각판과,The other side of the PCB is in contact with the other side is coupled to the other side is formed a plurality of heat sink fins to discharge the heat generated from the PCB to the outside, 상기 PCB의 타면에 도포되어 상기 PCB에서 발생된 열을 흡수하여 상기 냉각판으로 전달함과 동시에 상기 PCB와 상기 냉각판을 접착시키는 써멀페이스트와,A thermal paste coated on the other surface of the PCB to absorb and transfer heat generated from the PCB to the cooling plate, and simultaneously bond the PCB to the cooling plate; 상기 써멀페이스트의 중앙부가 접착되는 상기 냉각판의 부위에 형성된 공기 배출수단을 구비하는 것을 특징으로 하는 인텔리전트 파워 모듈.Intelligent power module, characterized in that it comprises an air discharge means formed in the portion of the cooling plate to which the central portion of the thermal paste is bonded. 제 1 항에 있어서,The method of claim 1, 상기 공기 배출수단은, 상기 냉각판의 외측과 연통되게 상기 냉각판의 일면에 형성된 배출로인 것을 특징으로 하는 인텔리전트 파워 모듈.The air discharge means is an intelligent power module, characterized in that the discharge path formed on one surface of the cooling plate in communication with the outside of the cooling plate. 제 1 항에 있어서,The method of claim 1, 상기 공기 배출수단은, 상기 냉각판의 일면에 관통/형성된 배출공인 것을 특징으로 하는 인텔리전트 파워 모듈.The air discharge means is an intelligent power module, characterized in that the discharge hole penetrated / formed on one surface of the cooling plate.
KR1020030055969A 2003-08-13 2003-08-13 Intelligent power module KR20050017339A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220107796A (en) * 2021-01-26 2022-08-02 엘에스일렉트릭(주) Inverter module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220107796A (en) * 2021-01-26 2022-08-02 엘에스일렉트릭(주) Inverter module

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