KR20050013356A - Apparatus for driving of plasma display panel - Google Patents

Abstract

PURPOSE: A driving apparatus is provided to radiate heat even without using a heat sink, by arranging a thermal conductive pad attached on a rear surface of an intelligent power module. CONSTITUTION: A driving apparatus comprises a display panel(110); a frame(120) for supporting the display panel; a printed circuit board(130); an intelligent power module(140) inserted into a hole formed at the printed circuit board; and a thermal conductive pad(170) attached to a rear surface of the intelligent power module in such a manner that the thermal conductive pad transfers heat generated from the intelligent power module to the frame.

Description

A device for driving a plasma display panel {APPARATUS FOR DRIVING OF PLASMA DISPLAY PANEL}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a driving device of a plasma display panel, and more particularly to a driving device of a plasma display panel capable of self-heating heat generated without using a heat sink.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include Liquid Crystal Display, Field Emission Display, Plasma Display Panel (hereinafter referred to as "PDP") and Electro-Luminescence display. Device and the like.

Among such flat panel display devices, the PDP is composed of a plurality of discharge cells in which the PDP is arranged in a matrix form, and one discharge cell constitutes one pixel of the screen. Ultraviolet rays generated when an inert mixed gas such as Ne discharges emit light to display an image. Such PDPs are used for high resolution televisions, monitors, and indoor / outdoor advertising because they have fast response speed and are suitable for displaying large-area images.

Referring to FIG. 1, a driving apparatus of a PDP according to the related art is a display panel 10, a frame (or heat sink) 20 for supporting the display panel 10, and a drive for driving the display panel 10. A printed circuit board 30 on which devices are disposed.

The display panel 10 includes an upper substrate on which a sustain electrode pair including a first electrode and a second electrode is formed; A lower substrate having an address electrode, a phosphor, a partition, and the like intersecting the sustain electrode pair is provided.

A double-sided tape (not shown) having a high thermal conductivity function is attached to the rear substrate of the display panel 10, and the display panel 10 and the frame 20 are bonded to each other by the double-sided tape. In this case, the double-sided tape serves to transfer heat generated when the display panel 10 is driven to the frame 20.

The printed circuit board 30 is attached to the frame 20 to supply a predetermined driving signal to the display panel 10. To this end, the printed circuit board 30 and the display panel 10 are connected by an FPC (Flexible Printed Circuit) (not shown). The printed circuit board 30 is equipped with driving circuits for driving the electrodes of the display panel 10. These drive circuits include a data driver, a sustain driver, an energy recovery circuit, and the like. These driving circuits are attached to the printed circuit board 30 as an intelligent power module (hereinafter referred to as 'IPM') 40. Here, the IPM refers to a component having a power switching device (power transistor, power FET, etc.), a protection circuit protecting the power switching device, and a driving circuit driving the power switching device in one package. These IPMs are used throughout refrigerators, air conditioners, PDPs, TVs, computers, etc., and play a key role in power supply.

As shown in FIG. 2, the IPM 40 includes a metal PCB (hereinafter, referred to as a “metal PCB”) 46 on which various circuit elements 52 are mounted, and a case for supporting the metal PC 46. 44).

Metal PCB 46 is a kind of PCB (Printed Circuit Board), the epoxy resin plate 50, the circuit elements 52 are bonded in the form of a surface mount device (SMD) and the circuit element 52 A metal plate 48 is provided to absorb heat generated and radiate heat to a heat sink. As the metal plate 48, aluminum (Al) having high thermal efficiency is used to sufficiently absorb heat.

The case 44 is installed to protect the metal PCB 46. The case 44 has a rectangular frame shape as an injection molded product made of synthetic resin, and the metal PCB 46 is inserted therein. In addition, a plurality of pins 54 are installed in the case 44, and the pins 54 supply a signal from the outside to the circuit elements 52, and drive signals from the circuit elements 52 to the outside. To supply. In addition, holes 56 are formed at both ends of the case 44.

The heat sink 60 for dissipating heat generated in the IPM 40 is installed on the back of the IPM 40. The heat sink 60 and the IPM 40 are coupled by the holes 56 formed in the case 44. In other words, the screw 62 is installed to penetrate the hole 56 to couple the heat sink 60 and the IPM 40.

The heat sink 60 is formed with a plurality of vertical pillars extending vertically on the base plate. The plurality of vertical pillars serve to increase heat dissipation efficiency by increasing the surface area of the heat sink 60. To this end, aluminum having high thermal efficiency is used for the heat sink 60 to efficiently dissipate heat from the IPM 40. In addition, a heat conductive medium 58 is provided between the IPM 40 and the heat sink 60. As the heat conductive medium 58, a silicone resin is mainly used. Accordingly, the heat sink 60 emits heat generated by the IPM 40 by using friction between the vertical pillars and the air.

As described above, in the conventional PDP driving apparatus, the IPM 40 has a limit in slipping to further reduce the thickness of the PDP due to the height of the heat sink 60.

Accordingly, it is an object of the present invention to provide a driving apparatus for a plasma display panel that can dissipate heat generated by itself without using a heat sink.

1 is an exploded perspective view showing a driving apparatus of a general plasma display.

FIG. 2 is a perspective view illustrating an intelligent power module to which a heat sink illustrated in FIG. 1 is attached.

3 is an exploded perspective view showing a driving device of the plasma display panel according to the first embodiment of the present invention.

4 is an exploded perspective view showing the intelligent power module not attached to the hit sink shown in FIG.

FIG. 5 is a plan view illustrating a driving apparatus of the plasma display panel according to the first embodiment of the present invention shown in FIG. 3.

FIG. 6 is a cross-sectional view illustrating a driving apparatus of the plasma display panel according to the first embodiment of the present invention shown in FIG. 3.

FIG. 7 is an exploded perspective view illustrating a driving device of a plasma display panel according to a second exemplary embodiment of the present invention. FIG.

FIG. 8 is a plan view illustrating a driving apparatus of the plasma display panel according to the second embodiment of the present invention shown in FIG. 7.

9 is a cross-sectional view illustrating a driving apparatus of a plasma display panel according to a second embodiment of the present invention shown in FIG. 7.

<Description of Symbols for Main Parts of Drawings>

10, 110, 210: display panel 20, 120, 220: frame

30, 130, 230: printed circuit board 40, 140, 240: IPM

44, 144: case 48, 148: metal plate

50, 150: epoxy resin plate 52, 152: circuit element

54, 154, 254: pin 60: heat sink

132: hole 170, 270: thermal conductive pad

In order to achieve the above object, a driving apparatus of a plasma display panel according to an embodiment of the present invention is an intelligent power that is attached through a display panel, a frame supporting the display panel, a printed circuit board, and the printed circuit board. An intelligent power module (IPM) and a thermally conductive pad attached to a rear surface of the intelligent power module to transfer heat generated from the intelligent power module to the frame.

In the driving device, the printed circuit board may include a hole through which the intelligent power module penetrates and signal wires connected to pins of the intelligent power module.

In the driving device, the pins are bent and elongated to have a step shape.

An apparatus for driving a plasma display panel according to an exemplary embodiment of the present invention includes a printed circuit board, an intelligent power module attached to the printed circuit board, and a heat generated from the intelligent wave source module attached to a rear surface of the intelligent power module. And a thermally conductive pad for transferring to the printed circuit board.

In the driving device, signal wires connected to the pins of the intelligent power module are formed on the printed circuit board.

The pins in the driving device is characterized in that extending vertically on the back of the intelligent power module.

In the driving device, the thermally conductive pad is formed of an insulating material.

Other objects and features of the present invention in addition to the above object will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 3 to 9.

Referring to FIG. 3, a plasma display panel (hereinafter referred to as a “PDP”) according to a first embodiment of the present invention may include a display panel 110 and a frame (or a frame for supporting the display panel 110). And a printed circuit board 130 on which driving devices for driving the display panel 110 are disposed.

The display panel 110 may include an upper substrate having a sustain electrode pair including a first electrode and a second electrode; A lower substrate having an address electrode, a phosphor, a partition, and the like intersecting the sustain electrode pair is provided.

A double sided tape (not shown) having a high thermal conductivity function is attached to the rear substrate of the display panel 110, and the display panel 110 and the frame 120 are bonded to each other by the double sided tape. In this case, the double-sided tape serves to transfer heat generated when the display panel 110 is driven to the frame 120.

The printed circuit board 130 is attached to the frame 120 to supply a predetermined driving signal to the display panel 110. To this end, the printed circuit board 130 and the display panel 110 are connected by an FPC (Flexible Printed Circuit) (not shown). The printed circuit board 130 is provided with driving circuits for driving the electrodes of the display panel 110. These drive circuits include a data driver, a sustain driver, an energy recovery circuit, and the like. These driving circuits are attached to the printed circuit board 130 as an intelligent power module (hereinafter, referred to as 'IPM') 140. Here, the IPM refers to a component having a power switching device (power transistor, power FET, etc.), a protection circuit protecting the power switching device, and a driving circuit driving the power switching device in one package. These IPMs are used throughout refrigerators, air conditioners, PDPs, TVs, computers, etc., and play a key role in power supply.

The IPM 140 is a type of a printed circuit board (PCB) on which various circuit elements 152 are mounted, as shown in FIG. 4, and the circuit elements 152 are in the form of a surface mounted device (SMD). It is provided with an epoxy resin plate 150 is bonded. The back surface of the epoxy resin plate 150 is provided with a metal plate 148 for absorbing heat generated by the circuit element 152. The metal plate 148 is made of aluminum (Al) having high thermal efficiency so as to absorb heat sufficiently.

The epoxy resin plate 150 is provided with a plurality of pins 154 that are bent and elongated in a step shape, and the pins 154 supply circuit signals 152 to the circuit elements 152 as well as circuit elements 152. The driving signals from the plurality of terminals are supplied to the printed circuit board 130.

The rear surface of the IPM 140 is attached with a thermally conductive pad 170 for dissipating heat generated from the IPM 140. That is, the thermal conductive pad 170 is attached to the metal plate 148 of the IPM 140 to transfer heat from the circuit elements 152 absorbed by the metal plate 148 to the frame 120. To this end, the thermally conductive pad 170 must be high in viscosity and resistant to heat, and the thinner the thickness, the faster the heat generated from the IPM 140 is transferred to the frame 120.

As such, the IPM 140 to which the thermal conductive pad 170 is attached is inserted into the printed circuit board 130 as shown in FIG. 5. To this end, the printed circuit board 130 has a hole 132 into which the IPM 140 is inserted. Accordingly, the IPM 140 to which the thermal conductive pad 170 is attached is inserted into the printed circuit board 130, and the plurality of pins 154 are electrically connected to the signal wiring formed on the printed circuit board 130. At this time, the thermally conductive pad 170 is in surface contact with the rear surface of the frame 120, as shown in FIG. Accordingly, heat generated in the IPM 140 is transferred to the frame 120 through the thermal conductive pad 170.

As described above, the driving apparatus of the PDP according to the first embodiment of the present invention attaches the thermally conductive pad 170 attached to the rear surface of the IPM 140 to the frame 120 without the heat sink attached to the IPM 140. The heat generated by the IPM 140 by contacting is effectively dissipated by the frame 120 having a large surface area. Therefore, the driving apparatus of the PDP according to the first embodiment of the present invention is advantageous in slipping since no heat sinking is required.

Referring to FIG. 7, the PDP driving apparatus according to the second embodiment of the present invention may include a printed circuit board 230 and an IPM 240 in the driving apparatus of the PDP according to the first embodiment of the present invention illustrated in FIG. 3. Same as other components except Accordingly, in the driving apparatus of the PDP according to the second embodiment of the present invention, description of other components except for the printed circuit board 230 and the IPM 240 will be omitted.

In the PDP driving apparatus according to the second embodiment of the present invention, the printed circuit board 230 is attached to the frame 220 to supply a predetermined driving signal to the display panel 210. To this end, the printed circuit board 230 and the display panel 210 are connected by an FPC (Flexible Printed Circuit) (not shown). The printed circuit board 230 includes driving circuits for driving the electrodes of the display panel 210. These drive circuits include a data driver, a sustain driver, an energy recovery circuit, and the like. These driving circuits are attached to the printed circuit board 230 as an IPM 240.

The IPM 240 is a type of a printed circuit board (PCB) on which various circuit elements 152 are mounted, as shown in FIG. 4, and the circuit elements 152 are in the form of a surface mounted device (SMD). Equipped with an epoxy resin plate 150 is coupled, the description thereof will be replaced by the description of Figure 4 described above.

On the other hand, the epoxy resin plate 150 is provided with a plurality of pins (254) of the "I" shaped to extend vertically, these pins 254 supply a signal from the outside to each circuit element 152 and In addition, the driving signals from the circuit elements 152 are supplied to the printed circuit board 230.

In order to dissipate heat generated in the IPM 240 when the IPM 240 is driven, a thermally conductive pad 270 is attached between the pins 254 provided on the rear surface of the IPM 240. The thermally conductive pad 270 is high in viscosity and resistant to heat, and the thinner the thermal conductive pad 270 is, the faster the heat generated from the IPM 240 is. In addition, the thermally conductive pad 270 is formed of an insulating material.

As such, the IPM 240 to which the thermal conductive pad 270 is attached is installed on the printed circuit board 230 as shown in FIG. 8. For this purpose, signal wirings are formed on the printed circuit board 230 to be electrically connected to the pins 254 of the IPM 240. Accordingly, the thermal conductive pad 270 is in surface contact with the printed circuit board 230 as shown in FIG. 9. Accordingly, heat generated in the IPM 240 is transferred to the printed circuit board 230 through the thermal conductive pad 270. At this time, since the thermally conductive pad 270 is insulative, electrical contact with the printed circuit board 230 does not occur.

As described above, the driving apparatus of the PDP according to the second embodiment of the present invention uses the thermal conductive pad 270 attached to the rear surface of the IPM 240 without the heat sink attached to the IPM 240. Heat generated in the IPM 240 is effectively radiated by the printed circuit board 230 having a large surface area. Therefore, the driving apparatus of the PDP according to the second embodiment of the present invention is advantageous in slipping since no heat sinking is required.

As described above, the driving apparatus of the plasma display panel according to the embodiment of the present invention includes a heat conductive pad attached to the rear surface of the intelligent power module by removing a heat sink attached to the intelligent power module. Accordingly, heat generated from the intelligent power module is transferred to the frame or the printed circuit board through the thermally conductive pad to dissipate heat. Therefore, the present invention can effectively dissipate heat generated from the intelligent power module.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (7)

Display panel, A frame supporting the display panel; Printed circuit boards, Intelligent Power Module (IPM) attached through the printed circuit board, And a thermally conductive pad attached to a rear surface of the intelligent power module to transfer heat generated from the intelligent power module to the frame. The method of claim 1, The printed circuit board, A hole through which the intelligent power module penetrates, And driving signal wires connected to the pins of the intelligent power module. The method of claim 2, And the pins are bent and extended to have a step shape. Printed circuit boards, An intelligent power module attached to the printed circuit board; And a thermally conductive pad attached to the rear surface of the intelligent power module to transfer heat generated from the intelligent wave source module to the printed circuit board. The method of claim 4, wherein And a signal line connected to the pins of the intelligent power module is formed on the printed circuit board. The method of claim 5, wherein And the pins extend vertically from the rear surface of the intelligent power module. The method of claim 4, wherein And the thermally conductive pads are formed of an insulating material.