KR20050011766A - Thin film heater and fabrication method of it - Google Patents
Thin film heater and fabrication method of it Download PDFInfo
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- KR20050011766A KR20050011766A KR1020030050555A KR20030050555A KR20050011766A KR 20050011766 A KR20050011766 A KR 20050011766A KR 1020030050555 A KR1020030050555 A KR 1020030050555A KR 20030050555 A KR20030050555 A KR 20030050555A KR 20050011766 A KR20050011766 A KR 20050011766A
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- thin film
- heating element
- metal thin
- polymer substrate
- film heating
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000010409 thin film Substances 0.000 title claims description 125
- 238000000034 method Methods 0.000 title claims description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 92
- 229920000307 polymer substrate Polymers 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims description 68
- 229910052751 metal Inorganic materials 0.000 claims description 68
- 238000005530 etching Methods 0.000 claims description 8
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- 229920013716 polyethylene resin Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- -1 Polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
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- 239000011347 resin Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
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- 241000270295 Serpentes Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- 210000002615 epidermis Anatomy 0.000 description 1
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- 229910052742 iron Inorganic materials 0.000 description 1
- 235000021109 kimchi Nutrition 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910001120 nichrome Inorganic materials 0.000 description 1
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- 239000013077 target material Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/267—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an organic material, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
- H05B3/845—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields specially adapted for reflecting surfaces, e.g. bathroom - or rearview mirrors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/004—Heaters using a particular layout for the resistive material or resistive elements using zigzag layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
본 발명은 박막 발열체 및 그 제조방법에 관한 것으로, 보다 자세히는 가열부를 구성하는 금속박막을 두께가 얇으며 가열면적이 넓도록 형성함으로써 균일한 가열이 가능하도록 한 박막 발열체 및 그 제조방법에 관한 것이다.The present invention relates to a thin film heating element and a method for manufacturing the same, and more particularly, to a thin film heating element and a method for manufacturing the same, which enables uniform heating by forming a thin metal thin film constituting the heating portion to have a large heating area. .
박막 발열체는 전기를 인가할 때에 박막의 저항성분에 의해 열을 발생시키는 전기히터를 말한다. 상기 박막 발열체는 발생되는 열에 의해 습기를 제거하거나 인접하는 물체에 열을 전달한다.The thin film heating element refers to an electric heater that generates heat by the resistance component of the thin film when electricity is applied. The thin film heating element removes moisture by heat generated or transfers heat to an adjacent object.
예를 들어, 박막 발열체를 거울의 뒷면에 부착시키면 발생되는 열에 의하여 거울면에 있는 습기를 제거할 수 있다. 즉, 욕실내에서 온수를 사용할 때 욕실 내부에 안개 현상이 발생하여 거울면에 김이 서리거나, 습한 날씨나 겨울철에 자동차의 사이드미러(side mirror)의 거울면에 얼음이나 김이 서려 시야가 나빠지면, 상기 거울이나 사이드미러의 뒷면에 부착된 박막 발열체를 동작시켜 거울면의 김이나 얼음 등을 제거하여 시야를 좋게 할 수 있다.For example, when the thin film heating element is attached to the rear side of the mirror, moisture on the mirror surface may be removed by heat generated. In other words, when hot water is used in the bathroom, fog occurs in the bathroom, causing the mirror to steam, or in wet weather or winter, when the mirror surface of the side mirror of the car becomes bad or the vision is bad. In addition, by operating the thin film heating element attached to the rear surface of the mirror or the side mirror may improve the visibility by removing the steam or ice on the mirror surface.
또한, 상기 박막 발열체가 냉장고의 서리 및 습기 제거와, 다리미와 전기밥솥 및 전열기구 등의 히터로 이용되면 절전 및 종래의 히터가 차지하는 공간을 최소화하여 공간활용도를 높일 수 있는 장점이 있다.In addition, when the thin film heating element is used as a heater for removing frost and moisture of the refrigerator, and an iron, an electric rice cooker, and a heating device, there is an advantage of increasing space utilization by minimizing power saving and space occupied by a conventional heater.
도 1은 종래 기술에 따른 박막 발열체를 도시한 평면도로서, 도면을 참조하면 종래의 박막 발열체는 절연판(6) 상측에 금속패턴(4)을 형성하였다. 또한, 전기를 공급하기 위한 단자(9,9')가 포함되어 있다. 이외에도 니크롬선을 뱀이 기어가는 듯한 형상으로 사행시켜서 절연판에 부착한 것, 탄소분말 등의 도전성 입자를 수지 등의 바인더 중에 분산시켜서 평판을 성형하고 전극을 부착한 것 및 탄소섬유포에 전극을 형성시켜서 발열체로 한 것 등 많은 것을 들 수 있다.FIG. 1 is a plan view illustrating a thin film heating element according to the prior art. Referring to the drawings, the conventional thin film heating element has a metal pattern 4 formed on an insulating plate 6. Also included are terminals 9, 9 'for supplying electricity. In addition, the nichrome wire is meandered in the shape of a snake crawling and attached to an insulating plate, conductive particles such as carbon powder are dispersed in a binder such as resin to form a flat plate, and an electrode is formed on a carbon fiber cloth. Many things, such as what made into a heating element, are mentioned.
그러나, 상기 종래의 박막 발열체는 저항체로 사용되는 금속박막의 두께가 두꺼워서 큰 저항값을 얻기 위해서는 미세한 패턴을 형성하여야 하기 때문에 제작시간이 오래 걸리는 문제점이 있다.However, the conventional thin film heating element has a problem in that it takes a long time to produce a fine pattern in order to obtain a large resistance value because the thickness of the metal thin film used as a resistor is thick.
또한, 미세 패턴이 형성됨으로 인해 패턴과 패턴간에 금속박막이 없는 부분이 생겨서 균일한 온도로 가열하기 어려운 문제점이 있다.In addition, since a fine pattern is formed, a portion having no metal thin film is formed between the pattern and the pattern, and thus there is a problem that it is difficult to heat at a uniform temperature.
또한, 금속박막의 두께가 두꺼워짐으로 인해 박막 발열체의 중량이 증가하게 되고, 박막을 형성하는 금속의 재료비가 증가하는 문제점이 있다.In addition, as the thickness of the metal thin film is increased, the weight of the thin film heating element is increased, and there is a problem that the material ratio of the metal forming the thin film is increased.
또한, 금속 박막의 밀착성이 취약하기 때문에 박막이 부착되는 기판과 분리되는 문제점이 있다.In addition, since the adhesion of the metal thin film is weak, there is a problem of separation from the substrate to which the thin film is attached.
본 발명이 이루고자 하는 기술적 과제는 저항체로 사용되는 금속박막의 두께를 얇게 하고 넓은 면적을 동일한 온도로 가열할 수 있는 박막 발열체 및 그 제조방법을 제공하는 데 있다.SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a thin film heating element and a method of manufacturing the same, which can reduce the thickness of a metal thin film used as a resistor and heat a large area at the same temperature.
본 발명의 다른 목적은 비저항값이 높으며 밀착성이 우수한 재료를 사용하여 박막 발열체를 제작함으로써 무게를 감소시키며 가공시간을 단축시키는 박막 발열체 및 그 제조방법을 제공하는 데 있다.Another object of the present invention is to provide a thin film heating element that reduces weight and shortens processing time by manufacturing a thin film heating element using a material having high specific resistance and excellent adhesion, and a method of manufacturing the same.
도 1은 종래 기술에 따른 박막 발열체를 도시한 평면도이고,1 is a plan view showing a thin film heating element according to the prior art,
도 2는 본 발명의 일 실시예에 따른 박막 발열체를 도시한 평면도이고,2 is a plan view showing a thin film heating element according to an embodiment of the present invention,
도 3은 본 발명의 다른 실시예에 따른 박막 발열체를 도시한 평면도이고,3 is a plan view showing a thin film heating element according to another embodiment of the present invention,
도 4는 본 발명의 박막 발열체의 작동 블록도이고,4 is an operation block diagram of a thin film heating element of the present invention,
도 5는 본 발명에 따른 박막 발열체의 제조 공정도이다.5 is a manufacturing process chart of the thin film heating element according to the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
12 : 폴리머 기판 14 : 금속박막12 polymer substrate 14 metal thin film
14a : 전극부 16 : 마스크14a: electrode portion 16: mask
20 : 온도센서 30 : 마이크로프로세서20: temperature sensor 30: microprocessor
40 : 전류제어장치 50 : 박막 발열체40: current control device 50: thin film heating element
상기 과제를 달성하기 위하여 본 발명의 박막 발열체는 폴리머 기판과; 상기 폴리머 기판의 표면에 5nm∼100nm의 두께로 부착된 금속박막으로 이루어진 발열부와; 상기 금속박막의 양 끝단에 형성되는 전극부를 포함하여 구성된다.In order to achieve the above object, the thin film heating element of the present invention comprises a polymer substrate; A heat generating portion made of a metal thin film attached to the surface of the polymer substrate with a thickness of 5 nm to 100 nm; It comprises an electrode portion formed on both ends of the metal thin film.
여기서, 상기 금속박막은 전기비저항이 큰 스테인레스를 사용하는 것이 바람직하다.Here, it is preferable to use stainless steel having a large electrical resistivity as the metal thin film.
또한, 상기 폴리머 기판은 절연성과 내열성이 우수한 폴리에틸렌 수지, 폴리카보네이트 수지, 실리콘 수지, 폴리이미드 수지 중 하나를 사용하는 것이 바람직하다.In addition, the polymer substrate is preferably one of polyethylene resin, polycarbonate resin, silicone resin, and polyimide resin having excellent insulation and heat resistance.
또한, 상기 박막 발열체는 산화 등이 발생되어 전기저항이 변화되는 것을 방지하기 위하여 상기 전극부를 제외한 발열부의 상측에 폴리머를 도포하여 상기 발열부를 보호하는 것이 바람직하다.In addition, the thin film heating element preferably protects the heat generating part by coating a polymer on an upper side of the heat generating part except the electrode part in order to prevent oxidation or the like from changing.
상기 금속박막은 선간거리를 1mm이하로 하여 금속패턴을 형성함으로써 가열온도 편차를 줄이도록 하는 것이 바람직하다.The metal thin film is preferably to reduce the heating temperature variation by forming a metal pattern with a line distance of 1mm or less.
상기 박막 발열체는 상기 발열부의 발열온도를 조절하기 위하여 인입된 전류의 세기를 제어하는 장치를 더 포함할 수 있다.The thin film heating element may further include a device for controlling the intensity of the current drawn in order to adjust the heating temperature of the heating portion.
한편, 본 발명의 박막 발열체의 제조방법은 폴리머 기판과, 금속박막으로 이루어지는 발열부와, 상기 금속박막의 끝단에 형성되는 전극부로 구성되는 박막 발열체의 제조방법에 있어서, 폴리머 기판을 원하는 크기로 절단하거나 제작하여 배치하는 폴리머 기판 준비단계와; 상기 폴리머 기판의 상측에 금속박막을 5nm∼100nm의 두께로 형성하는 금속박막 형성단계와; 상기 금속박막 형성단계에서형성된 금속박막의 상측에 원하는 박막 발열체 형상의 마스크를 형성하는 마스크 형성단계와; 상기 마스크가 형성된 금속박막을 에칭시키는 에칭 단계와; 상기 에칭 단계를 거친 다음 상기 마스크를 제거하는 마스크 제거단계를 포함하여 구성된다.On the other hand, the manufacturing method of the thin film heating element of the present invention is a method of manufacturing a thin film heating element comprising a polymer substrate, a heat generating portion made of a metal thin film, and an electrode portion formed at the end of the metal thin film, wherein the polymer substrate is cut to a desired size. Preparing or disposing a polymer substrate; A metal thin film forming step of forming a metal thin film on the upper side of the polymer substrate with a thickness of 5 nm to 100 nm; A mask forming step of forming a mask of a desired thin film heating element shape on an upper side of the metal thin film formed in the metal thin film forming step; An etching step of etching the metal thin film on which the mask is formed; And a mask removing step of removing the mask after the etching step.
여기서, 상기 금속박막은 스퍼터링이나, 진공증착에 의해 상기 폴리머 기판에 부착될 수 있다.Here, the metal thin film may be attached to the polymer substrate by sputtering or vacuum deposition.
이하, 첨부된 도면을 참조로 하여 본 발명에 의한 박막 발열체의 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the thin film heating element according to the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명의 일 실시예에 따른 박막 발열체를 도시한 평면도이다. 도면을 참조하면, 본 발명에 따른 박막 발열체는 폴리머 기판(12)과, 상기 폴리머 기판(12)의 상측 표면에 부착된 금속박막(14)과, 상기 금속박막(14)의 양 끝단에 형성되는 전극부(14a)로 구성된다.2 is a plan view illustrating a thin film heating element according to an exemplary embodiment of the present invention. Referring to the drawings, the thin film heating element according to the present invention is formed on both sides of the polymer substrate 12, the metal thin film 14 attached to the upper surface of the polymer substrate 12, and the metal thin film 14; It consists of the electrode part 14a.
상기 금속박막(14)은 두께는 5nm∼100nm이며, 선간거리(d)를 1mm이하로 형성한다.The metal thin film 14 has a thickness of 5 nm to 100 nm, and forms a line distance d of 1 mm or less.
폴리머 기판(12) 위에 형성된 상기 금속박막(14)은 그 두께를 정밀하게 조절하는 것이 매우 중요하다. 두께에 따라 발열체로서의 발열량이 과소하거나 발열량이 과도하여 발열체의 사용상 문제점이 발생할 수 있기 때문이다.It is very important to precisely control the thickness of the metal thin film 14 formed on the polymer substrate 12. This is because, depending on the thickness, the amount of heat generated as the heating element is too low or the amount of heat generation is excessive, which may cause a problem in using the heating element.
상기 금속박막(14)의 발열량은 상기 금속박막(14)의 전기저항에 비례하는데 이러한 전기저항은 단면적에 반비례하고, 길이에 비례하는 값을 갖는다. 상기 금속박막(14)의 단면적은 두께와 폭을 곱한 값이기 때문에 두께를 얇게 할수록 폭은 넓어질 수 있게 된다. 금속 박막(14)의 폭이 넓어지게 되면 발열부의 온도편차가 줄어들게 되어 균일하게 열을 발생시킬 수 있게 된다.The amount of heat generated by the metal thin film 14 is proportional to the electrical resistance of the metal thin film 14, which is inversely proportional to the cross-sectional area and has a value proportional to the length. Since the cross-sectional area of the metal thin film 14 is a value multiplied by the thickness and the width, the thinner the thickness, the wider the width. When the width of the metal thin film 14 is widened, the temperature deviation of the heat generating portion is reduced, and thus heat can be generated uniformly.
금속박막(14)은 5nm∼100nm의 두께로 형성하는 것이 공정의 안정성이 뛰어나기 때문에 바람직하다. 이러한 두께로 형성된 금속박막(14)은 적은 패턴으로 원하는 저항값을 얻을 수 있어서 공정시간을 단축할 수 있으며 재료를 절감할 수 있게 된다.It is preferable to form the metal thin film 14 with a thickness of 5 nm to 100 nm because of excellent stability of the process. The metal thin film 14 formed with such a thickness can obtain a desired resistance value with a small pattern, thereby shortening process time and saving materials.
상기 금속박막(14)의 선간거리를 1mm이하로 형성한 것은 금속박막(14)이 없는 부분을 최소화하여 균일 가열이 가능하도록 하기 위함이다.The line distance of the metal thin film 14 is formed to be 1 mm or less in order to minimize the portion where the metal thin film 14 is absent so that uniform heating is possible.
한편, 상기 금속박막(14)은 비저항값이 높은 재료를 사용함으로써 동일한 저항값을 갖는 저항체를 적은 패턴으로도 형성하는 것이 가능하다.On the other hand, the metal thin film 14 can be formed with a small pattern of resistors having the same resistance value by using a material having a high specific resistance value.
상기 금속박막(14)은 알루미늄이나 기타의 합금을 재료로 하는 것이 가능하지만 비저항값이 알루미늄의 20배에 근사하고 밀착성이 우수한 스테인레스를 사용하는 것이 바람직하다.The metal thin film 14 may be made of aluminum or another alloy, but it is preferable to use stainless steel having a specific resistance of approximately 20 times that of aluminum and having excellent adhesion.
상기 금속박막(14)으로 이루어진 발열부는 그 평면부를 원형, 타원형 또는 사각형 등 어떠한 형상으로도 할 수 있다. 상기 발열부의 형상은 본 발명의 발열체가 적용되는 물체의 용도에 따라 필요한 형상으로 형성할 수 있다. 이러한 발열부의 형상은 기초용액의 증기를 기판에 분무한 다음, 필요한 형상이외의 부분을 에칭에 의해 제거함으로써 용이하게 달성할 수 있다. 이 때 발열부의 면적에 따라 발열량이 달라지므로, 발열체의 면적을 적절히 조절할 필요가 있다.The heat generating portion formed of the metal thin film 14 may have a flat portion in any shape such as circular, elliptical or square. The heat generating unit may be formed in a shape required according to the use of the object to which the heat generating element of the present invention is applied. The shape of this heat generating portion can be easily achieved by spraying the vapor of the basic solution onto the substrate and then removing portions other than the required shape by etching. At this time, since the heat generation amount varies depending on the area of the heat generating portion, it is necessary to appropriately adjust the area of the heat generating element.
상기 폴리머 기판(12)은 그 재질이 폴리에틸렌 수지, 폴리카보네이트 수지,실리콘 수지, 폴리이미드 수지 중 하나를 선택할 수 있다.The material of the polymer substrate 12 may be selected from polyethylene resin, polycarbonate resin, silicone resin, and polyimide resin.
폴리에틸렌(polyethylene)은 가공하기 쉽고 사용하기 쉬우며, 각종 병이나 냉장고의 제빙용 상자 등의 재료로 많이 사용된다. 폴리에틸렌은 CH2만으로 구성되기 때문에 전기절연성이 우수하다.Polyethylene is easy to process and easy to use, and is widely used as a material for various bottles and ice-making boxes for refrigerators. Polyethylene is excellent in electrical insulation because it is composed of only CH 2 .
폴리카보네이트(polycarbonate)는 폴리탄산에스테르라고도 하며, 투명하고 뛰어난 기계적 성질(특히 내충격성), 내열성, 내한성, 전기적 성질을 균형있게 갖추고, 무독하고 자기소화성(自己消火性)도 있는 엔지니어링 플라스틱이다.Polycarbonate, also known as polycarbonate ester, is an engineering plastic that is transparent, has excellent mechanical properties (particularly impact resistance), heat resistance, cold resistance, and electrical properties, and is nontoxic and self-extinguishing.
실리콘수지(silicone resin)는 규소수지라고도 하며, 가소물이나 금속을 성형할 때 이형제(離型劑)로 쓸 수 있을 정도로 피복력이 양호하며, 전기절연성이 좋다. 특히, 유기기(有機基)가 메틸기일 때 내열성이 최고이다.Silicone resin, also called silicon resin, has good coating power and good electrical insulation so that it can be used as a release agent when molding plastics or metals. In particular, heat resistance is the best when the organic group is a methyl group.
도 3은 본 발명의 다른 실시예에 따른 박막 발열체를 도시한 평면도로서, 박막 발열체는 폴리머 기판(12)과, 상기 폴리머 기판(12)의 상측 표면에 부착된 금속박막(14)과, 상기 금속박막(14)의 양 끝단에 형성되는 전극부(14a)로 구성된다.3 is a plan view showing a thin film heating element according to another embodiment of the present invention, wherein the thin film heating element includes a polymer substrate 12, a metal thin film 14 attached to an upper surface of the polymer substrate 12, and the metal. It consists of the electrode part 14a formed in the both ends of the thin film 14.
상기 박막 발열체는 저항을 높이기 위해 금속박막(14)상에 미세 금속패턴을 다수 형성하여 발열부의 길이를 증대시켰다. 상기 금속박막(14)의 미세 금속패턴은 선간거리(d)를 1mm이하로 형성한다.The thin film heating element increases the length of the heating part by forming a plurality of fine metal patterns on the metal thin film 14 to increase the resistance. The fine metal pattern of the metal thin film 14 forms a line distance d of 1 mm or less.
도 4는 본 발명의 박막 발열체의 작동 블록도이다.4 is an operation block diagram of the thin film heating element of the present invention.
본 발명의 박막 발열체(50)는 외부의 전원이 공급되어 상기 금속박막으로 이루어진 발열부에 통전이 되면 상기 발열부가 소정의 온도로 일정하게 열을 발생하게 된다. 전원의 공급은 상기 발열부의 가장자리에 전극부를 형성하여 이 전극부에 전류를 공급함으로써 이루어진다.When the external power is supplied to the thin film heating element 50 of the present invention and is energized to the heat generating portion made of the metal thin film, the heat generating portion constantly generates heat at a predetermined temperature. The power is supplied by forming an electrode part at the edge of the heat generating part and supplying a current to the electrode part.
특히, 상기 발열부의 발열온도를 조절하기 위하여 인입된 전류의 세기를 제어하는 전류제어장치(40)가 포함된다.In particular, the current control device 40 for controlling the intensity of the current drawn in order to adjust the heating temperature of the heat generating unit is included.
본 발명의 박막 발열체(50)에 있어서, 가열되는 부위에 온도센서(20)를 제공함으로써 발열부의 온도를 측정한다. 특히, 이 온도센서(20)의 측정치와 상기 전류제어장치(40)를 연동시켜, 박막 발열체(50)가 과열되거나 발열량이 적을 경우에 바이메탈식에 의한 전원의 단락에 의해서 또는 마이크로프로세서(30)에 의해서 상기 전류제어장치(40)를 제어함으로써 박막 발열체의 발열량을 일정하게 유지하도록 조절하는 것이 바람직하다.In the thin film heating element 50 of the present invention, the temperature of the heat generating portion is measured by providing the temperature sensor 20 at the portion to be heated. In particular, when the measured value of the temperature sensor 20 and the current control device 40 are linked to each other, when the thin film heating element 50 is overheated or the amount of heat is low, a short circuit of a power supply by a bimetal type or the microprocessor 30 By controlling the current control device 40 by adjusting the heat generation amount of the thin film heating element is preferably adjusted.
또한, 일반적으로 발열체의 안전성을 확보하기 위하여 합선이나 과도한 전류가 인가되었을 때 전원의 공급을 차단하는 퓨즈(미도시)를 제공하거나, 발열체의 발열량이 과다하여 화재의 위험이 있을 때 전원의 공급을 차단하는 장치(미도시)를 부가할 수 있다.In addition, in order to ensure the safety of the heating element, a fuse (not shown) that cuts off the power supply when a short circuit or an excessive current is applied is generally provided, or when there is a risk of fire due to excessive heat generation of the heating element, Blocking devices (not shown) can be added.
위에서 설명한 본 발명의 박막 발열체는 얇은 면에서 고온의 열을 발생하므로, 산업용 또는 가정용 가열기로서 각종 공산품의 가열, 건조를 위해 사용될 수 있으며, 자동차 뒷창 유리에 적용하여 신속하게 물방울 또는 성에를 제거하기 위해서도 적용될 수 있다. 또한, 조리기구로서 본 발명의 발열체를 적용하는 것도 가능하다. 특히, 본 발명의 금속박막 발열체는 발열부의 온도가 균일하므로 균일가열을 필요로 하는 김치냉장고에 적용할 경우 효용이 크다고 할 수 있다.Since the thin film heating element of the present invention described above generates high temperature heat in a thin surface, it can be used for heating and drying various industrial products as an industrial or household heater, and also applied to an automobile rear window glass to quickly remove water droplets or frost. Can be applied. It is also possible to apply the heating element of the present invention as a cooking utensil. In particular, the metal thin film heating element of the present invention can be said to have great utility when applied to a kimchi refrigerator requiring uniform heating since the temperature of the heat generating portion is uniform.
도 5는 본 발명에 따른 박막 발열체의 제조 공정도이다. 도면을 참조하여 본 발명의 박막 발열체의 제조방법을 상세히 설명한다.5 is a manufacturing process chart of the thin film heating element according to the present invention. A method of manufacturing the thin film heating element of the present invention will be described in detail with reference to the drawings.
우선, 폴리머 기판(12)을 원하는 크기로 절단하거나 제작하여 배치한다.(a)First, the polymer substrate 12 is cut or fabricated and placed in a desired size. (A)
그런 다음, 상기 폴리머 기판의 상측에 금속박막(14)을 소정의 두께로 형성한다. 금속박막(14)의 형성방법은 스퍼터링, 진공증착 등이 있다.(b)Then, the metal thin film 14 is formed on the polymer substrate to a predetermined thickness. The metal thin film 14 is formed by sputtering, vacuum deposition, or the like. (B)
스퍼터링은 스퍼터링 가스를 진공분위기로 이루어진 챔버내로 주입하여 성막하고자 하는 목표물질과 충돌시켜 플라즈마를 생성시킨 후 이를 기판(substrate)에 코팅시키는 방법이다.Sputtering is a method of injecting a sputtering gas into a chamber made of a vacuum atmosphere to collide with a target material to be deposited to generate a plasma and then coat it on a substrate.
진공증착은 고진공 상태에 놓여진 용기 속에 피복될 물체와 그 표면에 부착시키려는 금속 등의 입자를 넣어 둔 다음, 히터에 전류를 흘려서 가열함으로써 그 금속입자를 증발시키면, 차가운 물체 표면에 응축해서 부착하는 것을 이용하여 표피를 붙이는 방식이다.Vacuum evaporation involves placing an object to be coated and particles such as a metal to be attached to the surface in a high vacuum state, and then evaporating the metal particles by heating a current through a heater to condense and adhere to the surface of a cold object. The epidermis is attached by using.
이러한 방법으로 금속박막(14)이 형성된 다음, 상기 금속박막(14)의 상측에 소정 형상의 마스크(16)를 형성하여 에칭작업시 보호되는 부분인 가열부의 형상을 만든다.(c)After the metal thin film 14 is formed in this manner, a mask 16 having a predetermined shape is formed on the metal thin film 14 to form a shape of a heating part that is a portion to be protected during the etching operation.
다음으로, 상기 마스크(16)가 형성된 금속박막(14)을 물 1리터에 FeCl3100g을 녹인 수용액으로 에칭시키면 마스크(16)가 부착되지 않은 부분의 금속이 녹아서 가열부의 형상이 나타나게 된다.(d)Next, when the metal thin film 14 on which the mask 16 is formed is etched with an aqueous solution in which 100 g of FeCl 3 is dissolved in 1 liter of water, the metal in the portion to which the mask 16 is not attached melts to form the heating portion. d)
이후, 상기 마스크(16)를 제거하면 본 발명의 박막 발열체가 완성된다.(e)Thereafter, the mask 16 is removed to complete the thin film heating element of the present invention. (E)
한편, 상기 박막 발열체는 상기 전극부(14a)를 제외한 발열부의 상측에 폴리머를 도포하여 상기 발열부가 공기나 습기에 노출되어 부식되거나 내구성이 저하되는 것을 방지하는 것도 가능하다.On the other hand, the thin film heating element may be coated with a polymer on the upper side of the heating unit except for the electrode unit 14a to prevent the heating unit from being exposed to air or moisture to deteriorate corrosion or durability.
상기와 같은 구성을 가진 본 발명의 실시예에 따른 박막 발열체의 동작을 살펴본다.It looks at the operation of the thin film heating element according to an embodiment of the present invention having the configuration as described above.
먼저, 발열부의 양 끝단에 형성된 전극부에 전원이 공급되면 금속박막으로 이루어진 발열부에 통전이 되어 상기 발열부가 소정의 온도로 일정하게 열을 발생하게 된다.First, when power is supplied to the electrode portions formed at both ends of the heat generating portion, power is supplied to the heat generating portion made of a metal thin film so that the heat generating portion generates heat at a predetermined temperature.
가열작업중에는 가열되는 부위에 설치된 온도센서를 통하여 온도를 측정한다. 이를 통하여 박막 발열체가 과열되거나 발열량이 적을 경우, 바이메탈식에 의한 전원의 단락에 의해서 또는 마이크로프로세서에 의해서 온도센서와 연동된 전류제어장치를 제어함으로써 박막 발열체의 발열량을 일정하게 유지할 수 있다.During the heating operation, the temperature is measured by means of a temperature sensor installed at the heated part. Accordingly, when the thin film heating element is overheated or has a small amount of heat, the heat generation amount of the thin film heating element can be kept constant by controlling the current controller connected to the temperature sensor by a short circuit of a bimetal type or by a microprocessor.
발열부는 넓은 폭을 갖고 선간 간격이 1mm이하인 패턴이 형성되어 있으며 금속은 우수한 열전달 특성이 있기 때문에 넓은 면적에 대해 균일하게 열을 발생시킬 수 있게 된다.The heat generating part has a wide width and a pattern having a line spacing of 1 mm or less is formed. Since the metal has excellent heat transfer characteristics, heat can be generated uniformly over a large area.
상기한 바와 같이, 본 발명에 따른 박막 발열체는 저항체로 사용되는 금속박막을 두께가 얇고 가열면적이 넓도록 형성함으로써 균일하게 열을 발생시키는 박막 발열체를 제공하는 효과가 있다.As described above, the thin film heating element according to the present invention has an effect of providing a thin film heating element that generates heat uniformly by forming a metal thin film used as a resistor to have a thin thickness and a large heating area.
또한, 본 발명에 따른 박막 발열체는 비저항값이 높으며 밀착성이 우수한 스테인레스를 사용하여 박막 발열체를 제작함으로써 발열체의 무게를 감소시키며 내구성이 우수한 박막 발열체를 제공하는 효과가 있다.In addition, the thin film heating element according to the present invention has the effect of reducing the weight of the heating element by providing a thin film heating element having a high resistivity value and excellent adhesion, by producing a thin film heating element.
상술한 바와 같은 본 발명의 상세한 설명에서는 구체적인 실시예에 관해 설명하였으나, 본 발명의 범주에서 벗어나지 않는 한도 내에서 여러 가지 변형이 가능함은 물론이다. 그러므로, 본 발명의 범위는 설명된 실시예에 국한되어 정해져서는 안되며 후술하는 특허청구범위 뿐만 아니라 이 특허청구범위와 균등한 것들에 의해 정해져야 한다.In the detailed description of the present invention as described above, specific embodiments have been described, but various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.
Claims (9)
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| KR1020030050555A KR20050011766A (en) | 2003-07-23 | 2003-07-23 | Thin film heater and fabrication method of it |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009116787A3 (en) * | 2008-03-17 | 2009-12-17 | 주식회사 엘지화학 | Heating element and manufacturing method for same |
| CN101978776A (en) * | 2008-03-17 | 2011-02-16 | Lg化学株式会社 | Heating element and manufacturing method for same |
| US9611171B2 (en) | 2008-06-13 | 2017-04-04 | Lg Chem, Ltd. | Heating element and manufacturing method thereof |
| US9624126B2 (en) | 2008-06-13 | 2017-04-18 | Lg Chem, Ltd. | Heating element and manufacturing method thereof |
| US10412788B2 (en) | 2008-06-13 | 2019-09-10 | Lg Chem, Ltd. | Heating element and manufacturing method thereof |
| KR20200072662A (en) | 2018-12-13 | 2020-06-23 | 하이엔드테크놀로지(주) | Thin film laminated heating element and manufacturing method thereof |
-
2003
- 2003-07-23 KR KR1020030050555A patent/KR20050011766A/en not_active Application Discontinuation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009116787A3 (en) * | 2008-03-17 | 2009-12-17 | 주식회사 엘지화학 | Heating element and manufacturing method for same |
| CN101978776A (en) * | 2008-03-17 | 2011-02-16 | Lg化学株式会社 | Heating element and manufacturing method for same |
| US9611171B2 (en) | 2008-06-13 | 2017-04-04 | Lg Chem, Ltd. | Heating element and manufacturing method thereof |
| US9624126B2 (en) | 2008-06-13 | 2017-04-18 | Lg Chem, Ltd. | Heating element and manufacturing method thereof |
| US10412788B2 (en) | 2008-06-13 | 2019-09-10 | Lg Chem, Ltd. | Heating element and manufacturing method thereof |
| KR20200072662A (en) | 2018-12-13 | 2020-06-23 | 하이엔드테크놀로지(주) | Thin film laminated heating element and manufacturing method thereof |
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