KR200492907Y1 - Robot mounted thru-beam substrate detector - Google Patents

Abstract

A robot, processing system, and method for transferring a substrate is provided. In one embodiment, a robot is provided, the robot comprising a rotatable body, a first end effector, and a through-beam detector mounted on the robot. The first end effector is mounted on the body and is rotatable with the body. The first end effector is substantially movable in a first direction between a retracted position and an extended position on the body. The through-beam detector includes a first sensor and a second sensor. While the first end effector moves between the extended position and the retracted position, the first and second sensors are lateral in a position operable to sense opposite edges of the substrate disposed on the first end effector. It is spaced laterally.

Description

Robot mounted through-beam substrate detector {ROBOT MOUNTED THRU-BEAM SUBSTRATE DETECTOR}

Cross-reference to related applications

[0001] This application is a US provisional application serial number 62/076,887 filed on November 7, 2014 (agent document number APPM/22422 USL), and a US provisional application serial number filed on November 24, 2014 Claim 62/083,859 (attorney document number APPM/22422 USL2), both of which are incorporated by reference in their entirety.

[0002] Embodiments of the present disclosure generally relate to an apparatus and method for detecting misalignment and substrate breakage of a moving substrate in a continuous and cost-effective manner.

[0003] The fabrication of microelectronic devices typically involves a complex process sequence requiring hundreds of individual steps performed on semi-conductor, dielectric, and conductor substrates. Examples of such processes include oxidation, diffusion, ion implantation, thin film deposition, cleaning, etching, and lithography, among other operations. The substrate processing system may include a cluster tool comprising one or more processing chambers surrounding a centrally located transfer chamber, the transfer chamber having a transfer chamber robot disposed within the transfer chamber.

[0004] With the progress of larger dimension substrates and increased device density, the cost of each substrate is greatly increased, and in the face of these larger wafers and smaller feature sizes, reducing variability and improving quality In doing so, additional pressure is being put on the industry to keep costs down. The trend towards larger substrates and smaller device features requires precise positioning accuracy of the substrate in the processing chambers to ensure repetitive device fabrication at low defect rates. Increasing the positioning accuracy of the substrates throughout the processing system is a challenge to ensure that the substrate is properly aligned and can pass slots or other obstacles in the load lock or processing chambers without collisions due to misalignment. . Collision may damage the substrate or may introduce particles and defects in subsequent operations. Additionally, subsequent operations on the damaged substrate may be of no benefit if the yield from the substrate is less than the cost of processing the substrate.

In order to reduce defects, a number of strategies have been employed to enhance the positional accuracy (ie, alignment) of substrates throughout the processing system. For example, in the transfer chamber, groups of four sensors may be equipped with a sensor arrangement adjacent to the inlet of each load lock and processing chamber. However, such arrangements increase the initial cost of the processing system with a significant number of sensors. Additionally, having so many sensors introduces costs associated with process idle time to replace and maintain such sensors.

[0006] Therefore, there is a need for a cost effective means to ensure the quality throughput of substrates in a substrate processing system.

[0007] A robot, processing system, and method for transferring a substrate is provided. In one embodiment, a robot is provided, the robot comprising a rotatable body, a first end effector, and a through-beam detector mounted on the robot. The first end effector is mounted on the body and is rotational with the body. The first end effector is substantially movable in a first direction between a retracted position and an extended position on the body. The through-beam detector includes a first sensor and a second sensor. While the first end effector moves between the extended position and the retracted position, the first and second sensors are lateral in a position operable to sense opposite edges of the substrate disposed on the first end effector. It is spaced laterally.

[0008] In another embodiment, a robot is provided, and the robot includes a rotatable body, a first end effector, and a through-beam detector mounted on the robot. The first end effector is mounted on the body and is rotatable with the body. The first end effector is substantially movable in a first direction between a returned position and an extended position on the body. The through-beam detector is rotatable with the body. The through-beam detector includes a first sensor having a first transmitter and a first reflector, and a second sensor having a second transmitter and a second reflector. While the first end effector moves between the extended position and the retracted position, the first and second sensors are laterally spaced at a position operable to sense opposite edges of the substrate disposed on the first end effector. .

[0009] In another embodiment, a processing system is provided, the processing system comprising a plurality of processing chambers coupled to the transfer chamber, a robot, and a through-beam detector rotatable with the robot. The robot includes a first end effector disposed in the transfer chamber and movable in a first direction substantially between a returned position and an extended position on the body. The first end effector is selectively orientatable to align a first direction with a selected one of the processing chambers. The through-beam detector includes a first sensor having a first transmitter and a first reflector, and a second sensor having a second transmitter and a second reflector. While the first end effector moves between the extended position and the retracted position, the first and second sensors are laterally spaced at a position operable to sense opposite edges of the substrate disposed on the first end effector. .

[0010] In a manner in which the above-listed features of the present invention can be understood in detail, a more detailed description of the present invention, briefly summarized above, may be made with reference to embodiments, some of which are the accompanying drawings It is illustrated in the field. However, it should be noted that the accompanying drawings show only typical embodiments of the present invention and should not be regarded as limiting the scope of the present invention, since the present invention may allow other equally effective embodiments. to be.
1 is a schematic diagram showing a plan view of a multi-chamber vacuum processing system having a robot mounted through-beam detector for detecting a substrate.
[0012] Figure 2 is a cross-sectional view of a portion of a robot (transfer chamber) having a robot-mounted through-beam detector or coupled to a robot-mounted through-beam detector.
3 is a side plan view of a transfer chamber robot having a robot-mounted through-beam detector.
[0014] Figure 4 illustrates a top view of a cooled sensor box suitable for use with a robot mounted through-beam detector.
5 is another side plan view of a transfer chamber robot having a robot-mounted through-beam detector.
6 is a top view of a substrate with illustrative defects detectable by a robot mounted through-beam detector.
7 illustrates an alternative embodiment for a cooled sensor box mounted under a cooling plate of a robot.
8 is another embodiment for a cooled sensor box with a line camera mounted on the front part of the robot.
In order to facilitate understanding, if possible, the same reference numerals have been used to indicate the same elements common to the drawings. It is contemplated that elements and features of one embodiment may be advantageously incorporated into other embodiments without further recitation.
However, it should be noted that the accompanying drawings show only exemplary embodiments of the present invention and should not be regarded as limiting the scope of the present invention, which permits other equally effective embodiments of the present invention. Because you can.

[0021] The present disclosure generally relates to at least two robots that are supported on a blade of a robot and continuously detect the presence of a substrate chip, crack, and/or misalignment along two parallel edges of the substrate. It provides an apparatus and method comprising mounted through-beam sensors. The apparatus may be in the form of a robot, or a processing chamber containing such a robot.

1 is a schematic diagram showing a top view of a multi-chamber vacuum processing system 100 with a robot-mounted through-beam detector 200 for a substrate 110. The substrate 110 (shown as a dotted line) may have a top surface area greater than about 25,000 cm 2, for example, a glass or polymer substrate having a top surface area of about 40,000 cm 2 (2.2 m x 1.9 m). However, it should be understood that the robotic mounted through-beam detector 200 can be made to operate on any size substrate or processing system. The multi-chamber vacuum processing system 100 also includes a system controller 190, a vacuum-tight processing platform 120, and a factory interface (FI) 130.

[0023] The system controller 190 is coupled to each chamber or module of the multi-chamber vacuum processing system 100 to control each chamber or module. In general, the system controller 190 controls the operation of the processing system 100 by using direct control of the apparatus and chambers of the processing system 100, or alternatively, by controlling the computers associated with these chambers and apparatus. You can control all aspects of In addition, the system controller 190 may also be configured to communicate with the robot mounted through-beam detector 200 and a control unit associated with the transfer chamber robot 140. For example, movements of the transfer chamber robot 140, transfer of substrates to and from processing chambers 102, 104, and 106, performing process sequences, and multi-chamber vacuum processing. Coordinating the operations of various components of system 100, and the like, may be controlled by system controller 190. Additionally, the system controller 190 may be configured with a robot-mounted through-beam detector 200 to determine the location and defects of the substrate 110 that are moved about by the transfer chamber robot 140. Can be controlled operably.

[0024] In operation, the system controller 190 enables feedback from the respective chambers and apparatus, to optimize substrate throughput. The system controller 190 includes a central processing unit (CPU) 192, a memory 194, and a support circuit 196. The CPU 192 may be one of any type of general purpose computer processor that can be used in an industrial setting. The support circuit 196 is conventionally coupled to the CPU 192 and may include a cache, clock circuits, input/output subsystems, and power supplies, and the like. . The software routines, when executed by the CPU 192, convert the CPU into a special purpose computer (controller) 190. The software routines also include a second controller (not shown) located remotely from the multi-chamber vacuum processing system 100, as in the robot-mounted through-beam detector 200, on the transfer chamber robot 140. Can be stored and/or executed by

[0025] The FI 130 may have a plurality of front opening universal pods (FOUPs) 162 and at least one factory interface (FI) robot 150. FI 130 may also have additional stations, such as a metrology station (not shown). The FI robot 150 may have rails 134 and a movable end effector 152, such an end effector being a blade, a plurality of fingers, a gripper, or a substrate on top of the end effector. It may be another suitable device for transporting. The FI robot 150 is operable in atmospheric conditions and between the FOUPs 162 and one or more load lock chambers 112 of the processing system 100, a movable end effector 152 ) Is configured to have a range of motion sufficient to transfer the substrates 110 disposed on the ). FOUPs 162 may hold a plurality of substrates 110 to transfer the substrates 110 to and from the multi-chamber vacuum processing system 100.

[0026] In order to facilitate the transfer of the substrate 110 between the substantially surrounding environment maintained in the FI 130 and the vacuum environment maintained in the vacuum-sealed processing platform 120, the load lock chamber 112 is FI It is disposed between 130 and the vacuum-sealed processing platform 120. The load lock chamber 112 has one or more inlet/outlet slots (not shown) through which the substrate 110 is transferred from the FI 130 into and out of the load lock chamber 112. I can. Similarly, the load lock chamber 112 has the same number of inlet/outlet slots, through which the substrate 110 is transported between the vacuum-sealed processing platform 120 and the interior of the load lock chamber 112. I can. In order to isolate the interior of the load lock chamber 112 from the interiors of the FI 130 or the vacuum-sealed processing platform 120, each of the inlet/outlet slots of the load lock chamber 112 has a slit valve ( Not shown).

The vacuum-sealed processing platform 120 has a plurality of attached chambers 101 disposed around the transfer chamber 105. One of the attachable chambers 101 may be a load lock chamber 112. The other one or more of the attachable chambers 101 may be the etch chamber 108. Some of the attachable chambers 101 may be deposition chambers. The deposition chambers may include one of a chemical vapor deposition chamber 102, a physical vapor deposition chamber 106, and an atomic layer deposition chamber 104. Additionally, one of the adherent chambers 101 may be a metrology chamber, an orientation chamber, a de-gas chamber, or other suitable chamber for processing the substrate 110.

[0028] In the vacuum-sealed processing platform 120, the transfer chamber 105 is coupled to a vacuum system (not shown) to provide reduced ambient conditions. The transfer chamber 105 houses at least one transfer chamber robot 140. The robot 140 includes a base 148 that supports the robot 140 on the bottom of the transfer chamber 105. The transfer chamber 105 defines an evacuated inner volume, through which the transfer chamber robot 140, between the chambers 101 and one of the chambers 101 and the load lock chamber The substrates 110 are transferred between 112.

The transfer chamber robot 140 has a body 146 disposed on a base 148. The transfer chamber robot 140 has a cooling plate 147. The cooling plate 147 may be attached to a cooling fluid source (not shown) that provides a heat transfer fluid for reducing the amount of heat transferred from the substrate 110 to the transfer chamber robot 140. The body 146 is rotatable on a vertical axis extending through the base 148. The transfer chamber robot 140 has a wrist 145 attached to a retractable end effector 142. The wrist 145 and the returnable end effector 142 are movable with respect to the body 146. The end effector 142 includes a substrate support surface configured to support the substrate 110 while being moved by the robot 140. The returnable end effector 142 is configured to support the substrate 110 during transfer. More specifically, the wrist 145 and the end effector 142 have a substantially centered returned position on the body 146 and an end effector 142 to facilitate substrate transfer between the chambers. It is movable between the extended positions extending the end effector 142 laterally, beyond the front portion 149 of the body 146 so that it can be positioned within the chambers 101. The body 146 may rotate to orient the front portion 149 of the body in the direction of extension of the end effectors 142 and align with any of the chambers 101. When the robot 140 includes a plurality of end effectors 142, each end effector 142 may be independently controlled by a motor. In one embodiment, the transfer chamber robot 140 is a dual-arm robot with two returnable end effectors 142 and a separate motor for each arm. In another embodiment, the transfer chamber robot 140 has end effectors coupled through a common linkage. A sensor support 144 for supporting a portion of the through-beam detector 200 is attached to the body 146. When the end effector 142 is extended and returned, the returnable end effector 142 moves between the through-beam detectors 200. The substrate 110 positioned on the end effector 142 moves through the sensing area of the robot-mounted through-beam detector 200, whereby, along with the position of the substrate 110 relative to the end effectors, Allow defects on the edges to be detected.

2 is a partial cross-sectional view of the transfer chamber robot 140, showing the robot-mounted through-beam detector 200. The transfer chamber robot 140 may have a support 244 attached to the body 146. The support 244 holds up the sensor support 144. The position of the sensor support 144 with respect to the body 146 is fixed, and when the body 146 moves, the sensor support 144 moves in a corresponding manner, so that the sensor support 144 includes the support 244 and It may be rigidly attached to the main body 146 through the support part 230.

The through-beam detector 200 is composed of an array of sensors 210 and 216 for detecting breakage and misalignment of the substrate 110 before and after processing in the chamber. The sensors 210 and 216 may be disposed in the cooled sensor box 220. The cooled sensor box 220 maintains a safe operating temperature for the sensors 210 and 216 disposed therein. The cooled sensor boxes 220 may use a cooling fluid such as water or air, heat shields, thermally conductive plates, insulators, or other suitable means for controlling the temperature inside the cooled sensor boxes. . The through-beam detector 200 may have one or more of the cooled sensor boxes 220, such as the upper sensor box 224 or the lower sensor box 202, depending on the configuration. For example, the through-beam detector 200 may have one or more lower sensor boxes 202 to detect damage to the substrate 110. In another example, the through-beam detector 200 may have one or more upper sensor boxes 224 to detect damage to the substrate 110. In another example, through-beam detector 200 may employ both lower and upper sensor boxes 202 and 224 to detect damage to substrate 110.

The lower sensor box 202 may be directly attached to the body 146 of the robot 140. Alternatively, the lower sensor box 202 may be attached to the body 146 by means of the support 230. A plurality of cooling lines 272 for cooling the lower sensor box 202 may be routed within the support 230 or may be coupled to the support 230. Additionally, the support 230 may have a plurality of communication lines for communicating with the sensors or for providing power to the lower sensor box 202.

[0033] The upper sensor box 224 may be coupled to the lower sensor box 202 by the support 226. Alternatively, the upper sensor box 224 can be attached directly to the body 146 by means of a support 226. The support 226 may have bellows 262 covering an expansion joint 264. The expansion joint 264 allows the support 226 to expand and contract independently of the outer supports, to protect the connections within the support. A plurality of cooling lines 274 for cooling the upper sensor box 224 may be disposed in the support part 226. Additionally, the support 226 may have a plurality of communication lines for communicating with the sensors or for providing power to the upper sensor box 224. One or more of the cooling lines 272 and 274 are fluidly connected to the fluid source 270. In order to maintain the temperature to prevent damage to the sensors 210 and 216 in the box, the fluid source 270 transfers the cooling fluid to the cooled sensor boxes 220, that is, the upper sensor box 224 and the lower sensor box. Provided to (202). In one example, the fluid source provides water as a cooling fluid for regulating the temperature of the cooled sensor boxes 220.

The cooled sensor box 220 may have a window 222. The window 222 is transparent to sensor signals and protects one or more of the sensors 210, 216 disposed within the sensor box 220 from heat and/or other damage. Window 222 may be formed of a material such as quartz, sapphire, or any other suitable material that is transparent to sensor signals. The through-beam detector 200 may include one or more sensors 210, 216 in the cooled sensor box 220. In one embodiment, the sensors 210 and 216 may include a trigger sensor and a chip detection sensor. The sensor 210 may have a beam width suitable for detecting an edge of the substrate 110 passing through the width of the beam, such as a width of about 7 mm. The chip detection sensor may detect wobbling, shifts, or rotation of the substrate 110 as well as chips or cracks less than 2 mm in the substrate 110. The chip detection sensor may comprise a photoelectric sensor, such as a through-beam sensor, for example a line laser sensor. The laser line sensor may include a laser emitter, a laser receiver, a reflector, or other suitable sensing devices for detecting damage to side edges of the substrate 110. The chip detection sensor may alternatively or additionally include a camera such as a vision camera to detect defects along the side edge of the substrate, or a vision line camera to detect defects on the entire substrate surface. The sensor 216 may be disposed on the upper sensor box 224, and may be attached or disposed on the sensor support 144 of the transfer chamber robot 140. The sensor 210 may be disposed in the lower sensor box 202, and may be attached or disposed to the body 146 of the transfer chamber robot 140 at or near the front portion 149 of the robot 140. . In one embodiment, sensor 210 is active and transmits a signal to sensor 216. Alternatively, sensor 216 is active and transmits a signal to sensor 210. In still other embodiments, both of the sensors 210 and 216 may be in an active or passive state.

In one embodiment, the sensor 210 is a through-beam sensor comprising at least one transmitter 212 and a receiver 214. The system controller 190 instructs the transmitter 212 to emit a signal returned by the reflector (ie, sensor 216) and detected by the receiver 214. Receiver 214 provides signal information to system controller 190.
The sensor 216 may be a mirror-type structure suitable for reflecting the energy beam generated by the sensor 210. The sensor 216 is operable within the vacuum and temperature environments of the transfer chamber 105. During the sensing operation by the through-beam detector 200, a beam of light is emitted by the transmitter 212 and travels along the beam transmission path 211 to the sensor 216, where the beam is reflected and the return path ( Follow 215 and return to receiver 214. The transmitter 212 may be a laser or a light emitting diode configured to emit a beam of light having a diameter of less than 3 mm when the beam of light collides on the substrate 110 disposed on the first end effector 142.

In another embodiment, the sensor 210 disposed in the lower sensor box 202 includes either a transmitter 212 or a receiver 214. The sensor 216 disposed in the upper sensor box includes the other of a transmitter 212 or a receiver 214. The transmitter 212 and receiver 214 can form a line laser sensor. A set of line laser sensors detects the width of a line laser transition blocked by the substrate 110. When the substrate 110 moves forward and passes through the trigger sensor, the line sensor starts to emit a beam for detecting the edge of the substrate 110. The sensor 210 may utilize a simple algorithm to determine the defects and position of the substrate 110. The sensor 210 may have a reference output in order to compare the position and edge information of the edges facing the substrate 110 with each other. When the substrate 110 moves forward, the receiver 214 is the portion of the line laser beam unbroken by the substrate 110 while the rest of the beam is attenuated or blocked by the substrate. Only register. Changes in the uninterrupted portion of the line laser beam may indicate chips, cracks, or skew in the substrate. For example, the uninterrupted portion of the beam for both sides of the substrate 110 can be monitored simultaneously. If the two uninterrupted portions of the beam are summed to a higher value than the calibrated value for substrates without chips, then the substrate 110 may have a chip. If the signal positions on both sides of the substrate 110 change over time but are still substantially similar, then the substrate 110 may be oscillating. Checking the total value for the uninterrupted beam on both sides of the substrate compensates for the substrate fluctuation during transport by the robot 140. If the signal positions on both sides of the substrate 110 are substantially similar, but are biased in one direction, then the substrate 110 may be shifted toward the side of the bias. If the signal positions of both sides of the substrate 110 are substantially similar, but are biased growing in one direction, then the substrate 110 may be rotated. Thus, the information can show whether the substrate 110 has been shifted or rotated. When the substrate passes through the second trigger sensor, the sensor ends detection.

In another embodiment, sensor 210 or sensor 216 comprises a linear image sensor or camera. The camera may be a trigger sensor, a movement of the end effectors 142 of the robot 140, or a vision camera that may be activated by another sensing device. Alternatively, the vision camera can always be active. Sensors 210 and 216 provide an image of the substrate edge, which can be analyzed for changes in pixel values or compared to a defect free substrate image. The vision camera can detect chips of about 0.7 mm or less, along the edge. Additionally, the vision camera may detect chips off the edge having an area of about 0.25 square mm. A threshold level may be applied to each chip and crack to determine when damage to the substrate 110 is not acceptable and the substrate 110 should be removed from further processing.

The sensors 210, 216 may be configured to prevent effects from beam weakening due to dust on the sensing head. In the linear image sensor, even if the intensity of the received light falls, if the distribution pattern of the intensity of light received by the linear image sensor is the same, the output does not change. Additionally, a light intensity drop alarm may also be included to determine the frequency or need for maintenance of the sensors 210 and 216.

8 is another embodiment of a cooled sensor box having a line camera 820 mounted on the front portion 149 of the robot 140. To form the line camera 820, a plurality of vision cameras may be spaced apart. The line camera 820 has a width 830 sufficient to scan the entire surface of the substrate 110. The line camera 820 may be a plurality of CCD cameras. The cameras may monitor the state of the lift pin, slit valve and I/O door of the process chamber, and the robot to prevent damage when the substrate 110 is transferred to the robot 140. The line camera 820 scans the entire area of the substrate during transport by the robot to check for breakage and, in addition, to determine process deposition conditions such as film uniformity and location along the substrate surface.

The sensor 210 may be employed to enhance the positional accuracy (ie, alignment) of the substrate 110 throughout the processing system to reduce defects. In one embodiment, light from sensor 210 is diffracted. At the receiver, the distribution pattern of the intensity of the diffracted light depends on the working distance of the sensor 210 (receiver) to the edge of the substrate 110. The true edge position is about 25 percent of the total intensity of incoming light of sensor 210. The true edge position of the substrate 110 can be determined with a high accuracy of about +/- 1 micrometer to about +/- 5 micrometers at any working distance relative to the sensor 210.

Returning to FIG. 2, the through-beam detector 200 is coupled to the system controller 190 and continuously records, monitors, and compares the beam signals received by the sensors 210 and 216. Is configured to The system controller 190 can then determine defects, such as chips or cracks, of the substrate 110, passing through the paths 211 and 215 of the beam. Advantageously, the position of the through-beam detector 200 on the transfer chamber robot 140 enables detection of substrate 110 defects while reducing the number of sensors 210, 216. The reduced number of sensors 210, 216 is maintenance of replacing additional chamber components, i.e. sensors 210, 216, compared to conventional systems with sensors in front of each processing chamber. It reduces idle time, maintenance costs of replacing additional chamber components, and the overall cost for the through-beam detector 200.

[0043] In at least one embodiment of the present invention, for example, when a heated substrate is transferred in the transfer chamber 105, thermal energy (eg, infrared wavelengths) reaches the sensor 210 To block doing/heating the sensor 210, a heat shield, cooling plate 147, or other suitable device, such as an insulating material, may be employed. The sensor 210 may be positioned near the cooling plate 147 in a manner that allows the sensor 210 to scan the substrate 110.

Referring briefly to FIG. 7, FIG. 7 illustrates an alternative embodiment for a cooled sensor box 220 mounted under the cooling plate 147 of the robot 140. The sensor 210 may be a vision camera housed in the cooled sensor box 220. The cooled sensor box 220 may be attached to the body 146 by an angled support part 320. The cooling plate 147 may have a viewing port 747. In one embodiment, the viewing port 747 is a cut away, such as a notch or corner chamber of the cooling plate 147. In another embodiment, the viewing port 747 is a hole formed through the cooling plate 147. The inclined support 320 may align the sensor with the observation port 747. The viewing port 747 may be configured to have dimensions 710 such that the optical viewing area 720 of the substrate 110 is visible to the sensor 210. The cooling plate 147 can substantially prevent the temperature from rising above a temperature suitable for operating the vision camera. By mounting the sensor 210 on an angle, the resolution of the edge of the substrate is improved, allowing more accurate chip detection. In one embodiment, the angle of the sensor 210 may be 0 to about 20 degrees from the horizontal.

Alternatively, the vision camera may be additionally cooled by a cooled sensor box 220. In order to maintain a suitable temperature for operation, the sensors 210 and 216 may be housed in the cooled sensor box 220. Referring briefly to FIG. 4, FIG. 4 illustrates a top view of a cooled sensor box 220 suitable for use with a robot mounted through-beam detector 200. The cooled sensor box 220 is shown with the top cover removed so that the inner portion 420 of the cooled sensor box 220 can be seen. A gasket 410 is disposed between the cover (not shown) of the cooled sensor box 220 and the body 414. Body 414 has a plurality of threaded holes to receive removable fasteners 412 used to secure the lid to body 414. The gasket 410 forms a seal between the cover and the body 414 when the cover is fastened to the body 414 using fasteners 412.

Cooled sensor box 220 has a connector (connector) 430. The connector 430 provides the cooling lines 274 and the ingress of the communication lines 290. Connector 430 may include a sealing for sealing to cooling and communication lines 274 and 290. Alternatively, the connector 430 may provide a direct seal to one of the supports, such as the beveled support 320, the support 230, or the support 244.

The gasket 410 allows the cooled sensor box 220 to be sealed from the chamber environment and operated at a pressure different from that of the external environment of the cooled sensor box 220. For example, the pressure outside of the cooled sensor box 220 may be vacuum pressure, while the pressure of the inside portion 420 is atmospheric pressure. The inner portion 420 may be filled with a gas such as nitrogen, clean dry air, or other suitable gas. The gas-filled inner portion 420 provides a heat transfer fluid between the sensor 210 and the cooling line 274. In order to maintain a temperature suitable for the operation of the sensor 210 in the cooled sensor box, the cooling lines 274 can be looped through the cooled sensor box 220, and thus, the high temperature placed in the robot Prevents overheating of the sensors in the cooled sensor box 220 from heat radiation from hot substrates. The cooling lines 274 prevent each sensor 210, 216 disposed in the cooled sensor box 220 from heating beyond a predetermined temperature. By maintaining the sensors 210 and 216 at a temperature within an operable range, the reliability of the sensor information is improved and the life of the sensors 210 and 216 is extended, and the drift of the sensor information is reduced. .

The windows 222 of the cooled sensor box 220 may be filters. For example, the filter may allow wavelengths or wavelengths emitted by the transmitter 212 or camera to pass, while reflecting infrared wavelengths that may damage the sensors 210.

Referring again to FIG. 1, the transfer chamber 105 is surrounded by environmentally sequesterable chambers 101. Each of the environmentally-isolable chambers 101 has one or more inlet/outlet slots to allow passage of the substrate 110 disposed on the end effector 142. Slit valves, not shown, are used to open and sealably close the inlet/outlet slots that allow passage between the chambers 101 and 105 of the substrates 110 disposed on the end effector 142. It is utilized in The through-beam detector 200 attached to the transfer chamber robot 140, prior to processing in one of the chambers 101, the substrate 110 while the substrate 110 is being handled by the transfer chamber robot 140. ) Has an arrangement for sensors 210, 216 that allow detection of misalignment and/or breakage. Through-beam detector 200, when the substrate 110 is moved into or out of the transfer chamber 105, each of the beams emitted from the sensors 210 pass through the edge regions of the substrate 110 Thus, the sensors 210 and 216 may be arranged in a side-spaced relationship. Alternatively, the through-beam detector 200 may align the sensors 210 to scan the entire surface of the substrate 110 when the substrate 110 is moved into or out of the transfer chamber 105. have.

Advantageously, when the substrate 110 is moving even at high transfer speeds, breakage and misalignment of the substrate 110 can be detected by the through-beam detector 200. During detection by the through-beam detector 200 for defects, the substrate 110 is moving at a transfer speed in the range of less than about 100 mm/s to about 2000 mm/s (e.g., the end effector 142 of the robot ) In the middle of being transferred on). The smallest size substrate chip, crack, or even the smallest degree of substrate misalignment that can be detected by an LED or laser system is the emitted beam when it impinges on the top or bottom surface of the substrate. It depends on both the beam size (ie, spot size or diameter) of the beam and the transfer speed of the substrate. In general, the smaller the emitted beam diameter, the finer or smaller the defect features that can be detected. For example, a suitable laser sensor can emit a laser beam having a diameter in the range of about 0.25 mm to about 3 mm. However, in order to detect substrate chips or cracks having a size as small as 1 mm (i.e., greater than about 1 mm), for example, when the beam strikes the surface of the substrate, the diameter of the emitted laser beam is preferably about 1 mm. Less than Thus, to ensure that the beam diameter impinging on the top or bottom surface of the substrate 110 is small enough to detect the smallest sized substrate chip, crack, or misalignment that needs to be detected, the sensors 210 is positioned within a short working distance.

3 is a side plan view of a transfer chamber robot 140 having a robot-mounted through-beam detector 200. The transfer chamber robot 140 has an upper robot unit 306 and a lower robot unit 308.

[0052] The upper robot unit 306 may be configured to access the same processing chamber 101 as the lower robot unit 308. Alternatively, the upper robotic unit 306 can access a separate processing chamber, such as a processing chamber stacked over another processing chamber. As shown in Figure 5, the upper robot unit 306, to the end effector 142 of the upper robot unit 306, a linear motion from the fully returned position 550 to the fully extended position 552. It may have a rail 304 to provide. Alternatively, the end effector 142 of the upper robotic unit 306 may have link arms that operate to extend and return the end effector 142. Similarly, the lower robotic unit 308 may have a rail 302 for actuating the end effector 142 of the lower robotic unit 308. The end effector 142 of the lower robot unit 308 may slideably move from the extended position to the returned position along the rail 302. The end effector 142 of the upper robot unit 306 is in a different or same linear direction as the end effector 142 of the lower robot unit 308, such as extending and returning along the respective rails 304 and 302 Can move autonomously.

Upper and lower robot units 306 and 308 are disposed above the body 146 of the transfer chamber robot 140 and below the sensor support 144. The sensor support 144 has a sensor 216 configured to interface with the sensor 210 of the body 146. The end effectors 142 of the upper and lower robotic units 306, 308, when the upper and lower robotic units 306, 308 extend and return along their respective rails 302, 304, It moves between the sensor 210 and the sensor 216.

[0054] The upper and lower robotic units 308, 306 may be rotated by the body 146, as shown by the arrows indicated by 360, and/or as shown by the arrows indicated by 362. Likewise, it can move in the vertical direction. The movement of the upper and lower robotic units 308 and 306 may be in unison with the respective movement of the body 146. For example, the main body 146 can rotate and move vertically, and the upper and lower robot units 308 and 306 move together with the main body 146. Alternatively, the upper and lower robot units 308 and 306 may move and rotate in a vertical direction independent of each other.

5 is another side plan view of the transfer chamber robot 140 having the robot-mounted through-beam detector 200. The end effectors 142 of the upper and lower robotic units 306 and 308 are shown in the reverted position 550. In the returned position 550, the substrate (not shown) supported on the end effector 142 is completely on the first side 502 of the through-beam detector 200. As the end effector 142 of one of the upper and lower robot units 306 and 308 moves to the extended position 552, the substrate supported on the end effector 142 is a through-beam detector 200 ) Between the sensor 210 and the sensor 216 (ie, through the sensing area) on the second side 504 of the through-beam detector 200. When the substrate 110 passes through the sensing region of the through-beam detector 200, the sensor 210 transmits information indicating the state of the substrate 110 to the system controller 190. When the end effector 142 reaches the extended position 552, the substrate is completely on the second side of the through-beam detector 200 and is no longer between the sensor 210 and the sensor 216, and the substrate The side edges of (110) passed through the sensing area of the through-beam detector (200).

The end effectors 142 of the upper and lower robotic units 306 and 308 may independently move between the extended position 552 and the returned position 550. For example, the end effector 142 of the upper robot unit 306 can be operated to remove the first substrate from the processing chamber 101, while the end effector 142 of the lower robot unit 308 is the upper robot. Immediately following the operation of unit 306, it operates to place the second substrate in the same processing chamber 101 for processing. In scenarios in which the end effectors 142 of the upper and lower robot units 306 and 308 move independently of each other, the sensor support 144 and the sensor 210 on the body 146 and the sensor 216 are paired. An intermediate bridge (not shown) may be placed between the sensor support 144 and the body 146 to accommodate the additional sensor 210 and sensor 216 arrangement to achieve a configuration. The intermediate bridge may be mounted on a rotatable body 146 and rotatable with the body 146. The end effector 142 of the upper robot unit 306 can move between the through-beam detector 200 provided between the intermediate bridge and the sensor support 144. In addition, the first end effector 142 may be configured to move between the main body 146 and the intermediate bridge. The end effector 142 of the lower robot unit 308 can move between the through-beam detector 200 provided between the intermediate bridge and the main body 146. A reflector may be mounted on the intermediate bridge to reflect the beam emitted by the sensor 216. In this way, the substrates disposed on the end effectors 142 of the upper and lower robot units 306 and 308 can be simultaneously and independently scanned. Advantageously, irrespective of the position in which the robot may be present, only by the operation of the robot, the substrate 110 is scanned for defects by a single through-beam detector 200. This reduces the need for additional scanners to measure defects in the substrate.

In one example, the through-beam detector 200 disposed on the transfer chamber robot 140 has sensors 210 and 216 spaced apart on two sides. The sensors may be configured with a 660nm visible red LED of up to about 2000mm working distances (ie less than about 40 inches working distances). In some embodiments, the LED may include additional sensors such as a camera. The sensors operate to detect both parallel edges of the substrate individually and simultaneously when the substrate supported on the end effector of the transfer chamber robot 140 passes through the sensors attached to the transfer chamber robot 140 It is located on the robot 140 in a possible position. The sensor has an output response time of 500 microseconds, with a repeatability of 150 microseconds. At a substrate transfer speed of about 1000 mm/s, defects with a size of about 3 mm or more were detectable. The center of the impact beam from each sensor was positioned at a distance of about 3 mm inward from the edges of the substrate. At a substrate transfer speed of about 100 mm/s, defects having a size of about 1 mm or more were detectable, and at a substrate transfer speed of about 2000 mm/s, defects having a size of about 10 mm or more were detectable. Thus, the two impingement beams for sensing a substrate conveyed at a speed in the range of about 100 mm/s to about 2000 mm/s are preferably, respectively, inward from the substrate edges, distances in the range of about 1 mm to about 10 mm. Is positioned on. Using a laser to detect defect features with a size of less than 3 mm can be accomplished by reducing the velocity of the substrate, or by using the Banner ^® Model No. This can be achieved by using faster sensors such as DF-G2 sensors. Reducing the substrate speed reduces the vibration experienced by the substrate, and consequently smaller defects can be resolved. Conversely, increasing the substrate speed increases the vibration of the substrate and makes the detectable defects larger.

In another example, the through-beam detector 200 attached to the transfer chamber robot 140 has an output response time as low as about 10 μs, for fast substrate transfer speeds exceeding about 1000 mm/s. The sensor may be operable to detect chips on the substrate 110 that exceed a size of about 4 inches. The sensor is also operable to detect misalignment of a substrate disposed on the end effector, up to about 2.6 degrees and more.

In another example, the through-beam detector 200 may be configured as a laser sensor 210. The laser sensor 210 is a beam having a spot size of about 0.25 mm that moves along the beam transmission path 211 to the sensor 216 mounted on the sensor support 144, past the edge of the substrate 110 Has. Substrate chips of less than about 3 mm or more and substrate misalignment of about 0.18 degrees or more are detectable on the substrates on the end effector 142 while being transported at a speed of about 1000 mm/s.

[0060] The size of the defect that can be detected by the through-beam detector 200 using the laser sensor 210 is also, while the moving substrate is transferred, for example on the end effector of the robot, at any time ( Invariably) as a result of the vibration experienced, it is affected by the transfer speed of the substrate. In general, the higher the transfer speed or speed of the substrate, the more vibration the substrate experiences. Vibration tends to cause the edges of the substrate to move upwards and downwards. As a result, the sensor is positioned so that the emitted beam impinges at a nominal distance inward from the edge of the substrate, on the top or bottom surface of the moving substrate. Otherwise, a beam directed at the very edge of the vibrating substrate will always detect the absence of the substrate whenever the substrate edge moves in and out of the beam due to vibration. Thus, the more the substrate vibrates, the more inward the incident beam is directed from the edge of the substrate. For example, in a laser sensor having an emitted beam diameter in the range of about 0.25 mm to about 3 mm and a substrate moving at a transfer speed in the range of about 100 mm/s to about 2000 mm/s, the laser beam may be at the top of the substrate ( Alternatively, the impact beam on the bottom) surface can be directed to be positioned at a distance in the range of about 1 mm to about 10 mm from the edge of the substrate.

6 is a plan view of a substrate with exemplary defects detectable by a robot-mounted through-beam detector 200. Sample defects illustrated are crack 610, chip 620, and misaligned substrate 630 (shown by dotted lines in FIG. 6). In operation, the chips 620, the cracks 610, and the misaligned substrates 630, as discussed below, the substrate 110 is disposed on the transfer chamber robot 140 through- When passing through the beam detector 200, it can be detected. The dotted lines 650 near the edges of the substrate 110, substantially parallel to the end effectors 142, represent paths near the edges of the substrate 110, and in such paths, the moving glass substrate Is traversed the beams emitted by sensors 210 located below the substrate 110 on the body 146 of the transfer chamber robot 140.

When the chip 620 of the substrate 110 passes through the through-beam detector 200 mounted on the transfer chamber robot 140, the substrate 110 supported on the end effector 142 , Can be detected. Prior to sensing the substrate 110, the receivers 214 of each of the sensors 210 detect complete (non-attenuated) beam signals. When the substrate enters the beam paths (ie, the sensing area), the intensity of the beam signal received by the receivers 214 decreases, indicating the presence of the substrate 110. As the substrate 110 continues to traverse the beam path along the length of the substrate 110, the beam signal strength is still low. However, when the beginning of the chip 620 of the substrate 110 enters the beam path, the signal again increases to an uninterrupted signal of full strength, and the substrate 110 over the length of the chip 620 Continue to detect the absence of. When the end of the chip 620 of the substrate 110 passes through the beam, the beam signal decreases again, until the end of the substrate 110 disposed on the end effector 142 passes the beam, the substrate 110 ).

The crack 610 of the substrate 110, when the substrate 110 disposed on the end effector 142 passes through the through-beam detector 200 mounted on the transfer chamber robot 140 , Can be detected. Prior to sensing the substrate 110, the receivers 214 of each of the sensors 210 detect the intensity of the complete beam signals. When the substrate 110 enters the beam paths 211 and 215, the beam signals received by the receivers 214 decrease, indicating the presence of the substrate 110. As the substrate 110 continues to traverse the beams along the length of the substrate 110, the beam signals are still low. However, when the start portion of the crack 610 of the substrate 110 enters the beam paths 211 and 215, the signal strength again increases to an undegraded signal strength, and over the length of the crack 610, the substrate ( 110) is continuously detected. As the end of the crack 610 of the substrate 110 disposed on the end effector 142 passes through the beam, the beam signal decreases again, indicating the presence of the substrate 110.

Misalignment may be detected when the misaligned substrate 630 supported on the end effector 142 passes through the through-beam detector 200 mounted on the transfer chamber robot 140. Prior to detecting the substrate, the receivers 214 of each of the sensors 210 detect the intensity of the complete beam signals reflected from the corresponding sensor 216 (not shown) located on the substrate. do. As the substrate enters the beam paths 211 and 215 of the transmitter 212, the beam signal received by the corresponding receiver 214 decreases, indicating the presence of the substrate 110. At the same time, however, the beam paths for the additional sensors are still unobstructed for some additional length of motion of the misaligned substrate 630 due to a shift in alignment (ie, misalignment). The complete, unobstructed signal continues while the beam traverses the length of the misaligned substrate 630. As the misaligned substrate 630 continues to move, blocking the beam path of additional sensors 210, the signal from those sensors decreases, indicating the presence of the substrate 110. Thereafter, the beam path of the sensor 210 detects the end of the substrate 110, and the signal strength increases to full strength at the corresponding receiver 214. However, the beam path of the additional sensors 210 continues to detect the presence of the substrate 110. That is, the plurality of sensors 210 at the same distance from the end effectors 142 do not record substantially similar signal intensities.

[0065] Upon detecting the misalignment or breakage of the substrate, the controller coupled to the sensors determines the cause of the breakage or misalignment of the substrate, for example, and a chipped/cracked substrate By replacing and correcting the alignment of the misaligned substrate, it can be configured to trigger an alarm and immediately stop movement/transfer of the defective substrate, to allow the breakage or misalignment to be removed. . Often, detection of a substrate with a chip requires the opening of the transfer chamber and/or the processing chamber to thoroughly clean any potential contaminating debris produced by the chip. The sensor arrangement of the present disclosure allows early detection of substrate defects, which minimizes idle time and thus increases the overall throughput of processing system 100. Thereafter, the system controller 190 may determine that it is desirable to further process the substrate 110.

[0066] Illustrative detection of substrate breakage and misalignment uses at least two sensors 210 and sensor 216 to sense the total length of the opposing edges of the substrate, and the length and/or misalignment of the chip Although information on the degree is provided, additional sensors may be utilized to detect the length of the inner portion of the substrate 110 to provide additional information. For example, additional sensors may be used to provide additional information about the degree of misalignment (e.g., range of shift in alignment) or dimensions of the substrate chip (e.g., width or lateral depth of the chip). , Is positioned between the dotted lines 650. Finally, the exemplary detection of substrate breakage and misalignment is described in connection with the exemplary processing system 100, but the description is one of the examples, and thus, the method can be used to detect any misalignment or breakage of a moving substrate. Can only be run on

Advantageously, the through-beam detector 200 installed in the vacuum robot, one set of sensors, in order to detect chipping problems in the substrate, all chambers (process chamber, load lock, heating chamber ) To cover. The through-beam detector 200 also detects misalignment and breakage (e.g., chips, cracks) of the substrate while the substrate is supported and transferred on the dual-arm robot while replacing the substrate in and out of the process chambers. Allow The use of a dual-arm robot provides increased throughput of the processing system. In addition, since the through-beam detector 200 rotates with the robot and is still aligned with the end effector no matter which chamber the robot faces, a single set of sensors can be utilized, and thus, the Externally, it eliminates the need for individual sets of sensors to be positioned. Another advantage that contributes to the increased throughput is the ability to detect breakage and misalignment of the substrate while it is moving on the robot's end effector even at high transfer speeds (eg 1000 mm/s). Another advantage of the present disclosure is that only two sensors are required to detect misalignment and breakage of the substrate. Still another advantage of the sensor arrangement is that the sensors are removed from damaging heat from the processing chambers. Finally, another advantage of the present disclosure is the ability to detect breakage and misalignment of the substrate along the entire length of the substrate as it moves past the sensors. In addition, the detection of substrate misalignment and breakage can be performed during normal robotic transfer operations (i.e., in-situ), which is an additional or unnecessary robotic for the purpose of detecting the substrate. Prevents the need for movements (including stops and starts to provide a fixed substrate) in advance. Thus, the through-beam detector 200 prevents even deposition of one substrate in a chamber where portions of the substrate 110 may be present or in damaged conditions. For example, the through-beam detector 200 may determine that a substrate leaving the processing chamber has been damaged in the processing chamber, and portions of the substrate, or contamination, may be present in such processing chamber. Therefore, the processing chamber may have to be taken offline to prevent damage to subsequent substrates.

[0068] The above description relates to embodiments of the present invention, but other and additional embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure is in the following claims. Determined by

100 exemplary processing systems
101 attachable chambers
102 chemical vapor deposition
104 layer deposition chamber
105 chamber
106 physical vapor deposition chamber
108 etching chamber
110 detection board
112 load lock chamber
117 load lock chambers
120 vacuum-sealed processing platform
130 factory interface
134 rails
140 chamber robot
142 End Effector
144 sensor support
145 lists
146 body
147 cooling plate
148 base
149 front part
150 at least one FI robot
152 Movable End Effector
162 FOUPs
190 system controller
192 CPU
194 memory
196 support circuit
200 robot-mounted through-beam detector
202 lower sensor box
210 additional sensors
211 beam path
212 transmitters
214 receiver
215 beam path
216 sensor
220 cooled sensor box
222 windows
224 upper sensor box
226 Support
230 support
244 Support
262 bellows
264 expansion joint
270 fluid source
272 cooling lines
274 cooling lines
290 communication lines
302 rail
304 rails
306 Upper Robot Unit
308 lower robot unit
320 Inclined support
410 gasket
412 removable fasteners
414 main unit
420 inner part
430 connector
550 returned positions
552 Extended Position
610 crack
620 chips
630 Misaligned Substrate
650 dotted lines
710 dimensions
720 optical observation area
747 observation port
820 cooled sensor box
830 width

Claims (15)

As a robot,
Rotatable body;
A first end effector mounted on the body and rotating with the body, the first end effector being substantially movable between a retracted position and an extended position on the body; And
Including a through-beam (thru-beam) detector mounted on the robot,
The through-beam detector,
A first sensor; And
A second sensor comprising a second sensor, while the first end effector moves between the extended position and the restored position, the first and second sensors are disposed on the first end effector and the first Laterally spaced in a position operable to sense opposite edges of the substrate being moved with the end effector,
robot. The method of claim 1,
Further comprising an intermediate bridge mounted on the rotatable body and rotatable with the body,
The first end effector is configured to move between the main body and the intermediate bridge,
robot. The method of claim 2,
The through-beam detector,
A first reflector mounted on the intermediate bridge at a position for reflecting the beam emitted by the first sensor; And
Comprising a second reflector mounted to the intermediate bridge in a position for reflecting the beam emitted by the second sensor,
robot. The method of claim 1,
The through-beam detector,
A first cooled sensor box having the first sensor disposed therein; And
Further comprising a second cooled sensor box having the second sensor disposed therein,
robot. The method of claim 1,
Further comprising a second end effector rotatably mounted to the body,
The second end effector is movable in a first direction, independent of the movement of the first end effector, substantially between a restored position and an extended position on the body,
robot. The method of claim 1,
The through-beam detector is rotatable with the main body while maintaining alignment between the through-beam detector and the first end effector,
robot. The method of claim 1,
Each sensor of the first and second sensors comprises a transmitter and a receiver,
robot. The method of claim 7,
The transmitter is a laser or light emitting diode configured to emit the beam of light having a diameter of less than 3 mm when the beam of light collides on the substrate disposed on the first end effector,
robot. The method of claim 8,
The laser beam of light has a diameter of less than 1 mm when the laser beam of light collides on the top or bottom surface of the substrate disposed on the first end effector,
robot. The method of claim 1,
Each of the first and second sensors comprises a camera,
robot. The method of claim 1,
The sensor is configured to detect chipping, cracks, substrate rotation and shifting by comparing sensor readings of the edges of the substrate with a reference output,
robot. The method of claim 1,
Further comprising a cooling plate coupled to the rotatable body and operable to thermally shield the first sensor from the substrate disposed on the first end effector,
robot. As a processing system,
Transfer chamber;
A plurality of processing chambers coupled to the transfer chamber; And
Including a robot disposed in the transfer chamber,
The robot,
Cooling plate;
A first end effector movable in a first direction substantially between a returned position and an extended position on the body, wherein the first end effector is selectively configured to align the first direction with a selected one of the processing chambers. Orientatable -; And
A through-beam detector mounted on the robot and rotatable with the robot,
The through-beam detector,
A first sensor having a first transmitter and a first reflector; And
A second sensor having a second transmitter and a second reflector, and while the first end effector moves between the extended position and the returned position, the first and second sensors Disposed on an effector and laterally spaced in a position operable to sense opposing edges of the substrate moving with the first end effector,
The first and second sensors are thermally shielded from the substrate disposed on the end effector by the cooling plate,
Processing system. The method of claim 13,
The sensor detects chipping, cracks, substrate rotation and shifting by comparing sensor readings of the edges of the substrate with a reference output,
Processing system. The method of claim 13,
The through-beam detector,
A first cooled sensor box having the first sensor disposed therein; And
Further comprising a second cooled sensor box having the second sensor disposed therein,
Processing system.

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