KR200480035Y1 - Magnetic compaction apparatus - Google Patents

Magnetic compaction apparatus Download PDF

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Publication number
KR200480035Y1
KR200480035Y1 KR2020150001712U KR20150001712U KR200480035Y1 KR 200480035 Y1 KR200480035 Y1 KR 200480035Y1 KR 2020150001712 U KR2020150001712 U KR 2020150001712U KR 20150001712 U KR20150001712 U KR 20150001712U KR 200480035 Y1 KR200480035 Y1 KR 200480035Y1
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KR
South Korea
Prior art keywords
magnetic force
conductive powder
mold
heater
magnetic
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KR2020150001712U
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Korean (ko)
Inventor
정광채
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주식회사 명성마그네트
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Priority to KR2020150001712U priority Critical patent/KR200480035Y1/en
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Publication of KR200480035Y1 publication Critical patent/KR200480035Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
    • H01F1/04—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys
    • H01F1/06—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/08—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0253—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets
    • H01F41/0266—Moulding; Pressing

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The present invention relates to a magnetic field forming apparatus using a conductive powder and more particularly to a magnetic field forming apparatus using a conductive powder which generates magnetic force at the top and bottom of the mold section 10, And a heater part (30) for fixing the conductive powder coagulated at the forming position of the mold part (10) with the silicon to be melted by the heater heating, wherein the upper and lower magnetic force generation The magnetic body 21 of the parts 20 and 20 'faces the protruding part 24 to the conductive powder coagulation forming position of the mold part 10 at the magnetic force surface 23 facing the upper and lower sides of the mold part 10, So that the magnetic force is concentrated at the position of the conductive powder coagulation molding of the mold part 10 so that the conductive powder is concentrated to the forming position and can not be formed by coagulation molding as in the prior art, It is characterized by its superior quality.

Description

[0001] MAGNETIC COMPACTION APPARATUS [0002]

The present invention relates to a magnetic field forming apparatus using a conductive powder, and more particularly, to a magnetic field forming apparatus using a conductive powder by concentrating magnetic force to a forming position of a mold portion in which a conductive powder is molded and concentrating the conductive powder in a molding position of the mold portion, To a magnetic field shaping apparatus using a conductive powder which is improved to be improved.

Generally, the magnetic field shaping apparatus is used to coagulate and form a conductive powder by a magnetic force such as a semiconductor element.

1 and 2, the magnetic field shaping apparatus includes a mold section 2 having a cavity to be formed into a conductive powder, (3 ') for causing the conductive powder to coagulate to the forming position of the mold part (2) by the magnetic force of the magnetic body (3b) wound around the mold part (3a) And a heater unit 4 for fixing the conductive powder agglomerated at the forming position with silicon to be melted by heater heating.

This magnetic field shaping apparatus is a device in which a semiconductor element is charged into a cavity of a mold portion 2 and a device (conductive powder) is injected to the molding position of the mold portion 2 by the magnetic force of the upper and lower magnetic force generating portions 3, The silicon is melted by the heater heating of the heater unit 4 to fix the cohered element (conductive powder), so that the molding is completed.

However, the conventional magnetic field forming apparatus has the following problems.

First, the conventional magnetic field forming apparatus generates magnetic force in the magnetic bodies 3b of the upper and lower magnetic force generating units 3 and 3 'at the upper and lower portions of the mold unit 2, Since the magnetic force surfaces 3c facing the upper and lower portions are formed in the same plane shape, there is a problem that a larger magnetic force is generated at the outer end than the center of the magnetic body due to the characteristics of the magnetic force.

That is, since the magnetic force of the magnetic body at the outer end of the magnetic force surface 3c is larger than the center of the magnetic force surface 3c, scattered elements (conductive powder) concentrate at the molding position located at the center of the mold portion, .

Secondly, in the conventional magnetic field forming apparatus described above, the magnetic force is weakened by the heat generated in the coils 3a of the upper and lower magnetic force generating units 3 and 3 ', and the magnetic forces of the upper and lower magnetic force generating units 3, (Conductive powder) is deteriorated due to weakening of the magnetic force of the electrode (3 '), resulting in defective molding, as well as a delay in the molding cycle time, resulting in poor productivity of the product.

Thirdly, the conventional magnetic field forming apparatus is heated by the heater of the heater unit 4 in order to melt the silicon that fixes the element (conductive powder) agglomerated to the molding position of the mold unit. The heater of the heater unit 4 Is cooled again after the heating operation, the molded product is separated, and the next molding cycle is performed. Therefore, the cooling time of the heater is increased and the productivity of the product is deteriorated.

Patent Document 1: Open Patent No. 2002-38128 Patent Document 2: Registration No. 10-0809050 Patent Document 3: Published Patent Application No. 2004-0046176

The present invention is conceived to solve all the problems of the prior art described above, and concentrates the magnetic force to the forming position of the mold part in which the conductive powder is molded so that the conductive powder concentrates intensively on the forming position of the mold part, The goal is to improve.

In this design, the cooling structure is applied to the coil that generates the magnetic force and the heater that heats the mold part, which keeps the magnetic force constant by preventing the temperature rise of the coil and shortens the molding cycle time due to the falling of the heater temperature, The objective is to improve the productivity even more.

The present invention is characterized in that the upper and lower magnetic force generating portions coagulate the conductive powder to the forming position of the mold portion by the magnetic force of the magnetic body around which the coil is wound in the upper and lower portions of the mold portion and the conductive powder coagulated at the molding position of the mold portion, And a heater portion fixed by silicone which is melted by heating,

The magnetic bodies of the upper and lower magnetic force generating portions are formed so as to protrude from the magnetic force faces opposing the upper and lower portions of the mold portion to the conductive powder coagulation molding position of the mold portion so as to concentrate the magnetic force to the conductive powder coagulation- ,

The coil of the upper and lower magnetic force generating portion is provided with a first cooling line for preventing the temperature of the coil from rising, and a second cooling line for rapidly raising and lowering the temperature of the heater outside the heater is provided in the heater portion. .

The protruding portion of the magnetic body may be configured to protrude from the center of the magnetic force surface so as to protrude, or the outer end of the magnetic force surface may be chamfered to protrude horizontally at the center.

The present invention concentrates the magnetic force of the upper and lower magnetic force generating parts at the forming position (mainly central position) of the mold part in which the conductive powder is molded so that the conductive powder concentrates on the forming position of the mold part, It is possible to concentrate and not be aggregated and dispersed to prevent molding defects from occurring, and thus, the product has an excellent moldability.

In addition, by applying a cooling structure to the coils of the upper and lower magnetic force generating parts generating magnetic force and the heater for heating the mold part, the magnetic force is kept constant by preventing the temperature rise of the coil and, at the same time, The moldability and the productivity of the product are more excellent.

1 is a front view showing a conventional magnetic field forming apparatus;
Fig. 2 is a front view of the recessed portion of Fig. 1; Fig.
3 is a front view showing a magnetic field forming apparatus according to the present invention;
4 is an enlarged view of the main part of Fig.
FIG. 5 and FIG. 6 are an outline drawing showing a specific embodiment of the lower magnetic force generating section in the present invention. FIG.
7 is a plan view of a main portion showing a heater portion of the present invention;
Fig. 8 is a cross-sectional view of the main part of Fig. 7; Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The magnetic field forming apparatus using the conductive powder of the present invention includes a mold section 10 having a cavity for forming conductive powder as shown in FIGS. 3 to 7,

An upper and lower magnetic force generating unit 20 (a magnetic force generating unit) for coherently conducting the conductive powder to the forming position of the mold unit 10 by the magnetic force of the magnetic body 21 wound with the coil 22 on the upper and lower sides of the mold unit 10 And a heater unit 30 for fixing the conductive powder agglomerated at the molding position of the mold unit 10 with silicon to be melted by heating the heater 31.

Particularly, the magnetic body 21 of the upper and lower magnetic force generating units 20 and 20 'is formed by the conductive powder agglomerating molding of the mold portion 10 from the magnetic force surface 23 facing the upper and lower portions of the mold portion 10, So that the magnetic force is concentrated to the conductive powder coagulation-molding position of the metal mold part 10. As shown in FIG.

5, the protruding portion 24 of the magnetic body 21 may be configured so as to protrude from the center of the magnetic force surface 23 or to protrude from the outer end of the magnetic force surface 23 as shown in FIG. 6, The chamfered shape can be formed so as to protrude horizontally at the center, and it is formed so as to protrude from various positions as well as various positions where the conductive powder is coagulated and molded.

The coil 22 of the upper and lower magnetic force generating units 20 and 20 'is provided with a first cooling line 25 for preventing the temperature of the coil from rising and keeping the magnetic force constant, 30 is provided with a second cooling line 35 for shortening the molding cycle time by rapidly lowering the temperature of the heater outside the heater 31.

The cooling water is circulated and supplied to the first cooling line 25 for cooling the coil 22 and the second cooling line 35 for cooling the heater 31. [

Reference numerals 25a and 25b denote the inlet and outlet of the first cooling line 25 and reference numerals 35a and 35b denote the inlet and the outlet of the second cooling line 35, respectively.

Hereinafter, the operation and operation of the present invention will be described.

After the mold part 10 is mounted, the semiconductor device is inserted into the cavity of the mold part 10.

In this state, when the apparatus is turned on and the mold section 10 is moved up, the elements (conductive powder) dispersed in the semiconductor elements are agglomerated to the molding position by the magnetic force of the upper and lower magnetic force generating sections 20 and 20 ' .

That is, the magnetic force of the magnetic body 21 of the upper and lower magnetic force generating portions 20 and 20 'facing each other at the upper and lower portions of the metal mold portion 10 acts on the metal mold portion 10, ) To the forming position.

Particularly, the magnetic force surface 23 of the magnetic body 21 is not formed in the same plane as in the conventional case, but the protruding portion 24 is protruded to the conductive powder coagulation molding position of the mold portion 10, (Conductive powder) coagulation molding position, the conductive powder is effectively agglomerated at the forming position.

For example, as shown in FIG. 5, the protruding portion 24 protruding to the center of the magnetic force surface 23 may be formed. Alternatively, as shown in FIG. 6, a protruding portion 24 having a chamfered outer end, The magnetic force of the magnetic body is not concentrated to the outside of the mold portion as in the conventional case, but the conductive powder effectively coheres to the center of the mold portion, that is, the coagulation forming position of the conductive powder.

After the conductive powder is agglomerated to the coagulation-molding position of the element (conductive powder) in the cavity of the mold part 10 in this way, the silicon is melted by heating the heater 31 of the heater part 30 to form the agglomerated conductive powder And the molding is completed.

Therefore, in the present invention, the conductive powder dispersed in the semiconductor element is formed in a coagulated state at a position where the conductive powder dispersed in the semiconductor element is formed in a coagulated state, Therefore, the molding quality of the product is excellent.

In addition, the first cooling line 25 is disposed in the coil 22 of the upper and lower magnetic force generating units 20 and 20 ', and the temperature of the coil is prevented from rising by circulating and supplying the insulating oil by the oil cooler The magnetic force of the upper and lower magnetic force generating portions 20 and 20 'is prevented from being weakened by the temperature rise of the coil 22 as in the prior art, thereby effectively performing the forming operation.

The second cooling line 35 is also provided outside the heater 31 of the heater unit 30 so that the cooling water is circulated and supplied by the cooling cooler so that the heater 31 melts the silicon of the semiconductor element, The temperature of the heater 31 is rapidly cooled, not the natural cooling, so that the time required for the natural cooling of the heater is shortened as in the conventional art, so that the molding cycle time is reduced and the productivity of the product is greatly improved.

10: mold part 20,20 ': upper and lower magnetic force generating part
21: magnetic body 22: coil
23: magnetic force surface 24:
25: first cooling line 30: heater part
31: heater 35: second cooling line

Claims (6)

A mold part 10 having a cavity for molding with a conductive powder,
An upper and lower magnetic force generating unit 20 (a magnetic force generating unit) for coherently conducting the conductive powder to the forming position of the mold unit 10 by the magnetic force of the magnetic body 21 wound with the coil 22 on the upper and lower sides of the mold unit 10 And a heater unit (30) for fixing the conductive powder agglomerated at the forming position of the mold unit (10) with silicon to be melted by heating the heater (31)
The magnetic body 21 of the upper and lower magnetic force generating portions 20 and 20 'is moved from the magnetic force surface 23 facing the upper and lower portions of the mold portion 10 to the conductive powder agglomerating and molding position of the mold portion 10 Wherein the protrusions (24) are formed so as to protrude so as to concentrate the magnetic force to the conductive powder coagulation molding position of the mold section (10).
The method according to claim 1,
Wherein the projecting portion (24) of the magnetic body (21) is formed so as to protrude from the center of the magnetic force surface (23) in a curved manner.
The method according to claim 1,
Wherein the protruding portion (24) of the magnetic body (21) is configured such that the outer end of the magnetic force surface (23) forms a chamfer and protrudes horizontally at the center.
A mold part 10 having a cavity for molding with a conductive powder,
An upper and lower magnetic force generating unit 20 (a magnetic force generating unit) for coherently conducting the conductive powder to the forming position of the mold unit 10 by the magnetic force of the magnetic body 21 wound with the coil 22 on the upper and lower sides of the mold unit 10 And a heater unit 30 for fixing the conductive powder agglomerated at the molding position of the mold unit 10 with silicon to be melted by heating the heater 31,
The magnetic body 21 of the upper and lower magnetic force generating sections 20 and 20 'is moved from the magnetic force surface 23 facing the upper and lower portions of the mold section 10 to the conductive powder molding position of the mold section 10, (24) are formed so as to protrude so as to concentrate the conductive powder while concentrating magnetic force to the position of the protruding portion (24)
The coil 22 of the upper and lower magnetic force generating units 20 and 20 'is provided with a first cooling line 25 for preventing the temperature of the coil from rising inside, And a second cooling line (35) for rapidly lowering the temperature of the heater.
5. The method of claim 4,
Wherein the projecting portion (24) of the magnetic body (21) is formed so as to protrude from the center of the magnetic force surface (23) in a curved manner.
5. The method of claim 4,
Wherein the protruding portion (24) of the magnetic body (21) is configured such that the outer end of the magnetic force surface (23) forms a chamfer and protrudes horizontally at the center.
KR2020150001712U 2015-03-18 2015-03-18 Magnetic compaction apparatus KR200480035Y1 (en)

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KR2020150001712U KR200480035Y1 (en) 2015-03-18 2015-03-18 Magnetic compaction apparatus

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Application Number Priority Date Filing Date Title
KR2020150001712U KR200480035Y1 (en) 2015-03-18 2015-03-18 Magnetic compaction apparatus

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001342502A (en) 2000-03-28 2001-12-14 Sumitomo Special Metals Co Ltd Powder pressing apparatus and method for producing molded article of rare earth metal alloy magnetic powder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001342502A (en) 2000-03-28 2001-12-14 Sumitomo Special Metals Co Ltd Powder pressing apparatus and method for producing molded article of rare earth metal alloy magnetic powder

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