KR200472644Y1

KR200472644Y1 - Apparatus for transferring a substrate

Info

Publication number: KR200472644Y1
Application number: KR2020090010385U
Authority: KR
Inventors: 이항림
Original assignee: 세메스 주식회사
Priority date: 2009-08-10
Filing date: 2009-08-10
Publication date: 2014-05-13
Also published as: KR20110001602U

Abstract

The substrate transfer apparatus includes a base member, a plate, and clamps. The plate is disposed under the base member and fixes the die-bonded substrate. The clamp is fixed to the lower surface of the base member and fixes the plate to detachably replace the plate according to the size of the substrate. The clamp includes a body, a latch, a spring, and a latch push pin. The body is fixed to the lower surface of the base member and has a groove on one side. The latch is inserted into the first groove to be hinged to the body, and supports the plate for fixing the substrate. A spring is disposed between the body and the latch and provides an elastic force to the latch to project from the body to support the plate. A latch push pin is provided through the body from the other side of the body opposite the one side and pushes the latch so that the latch is received in the groove to separate the plate from the base member.

Description

[0001] Apparatus for transferring a substrate [0002]

The present invention relates to a substrate transfer apparatus, and more particularly, to a substrate transfer apparatus for transferring a die-bonded substrate into a mold for molding.

In general, a substrate on which die bonding is completed is transferred to a mold and molded with a molding resin. The transfer of the substrate is performed by a substrate transfer device.

The substrate transfer apparatus includes a base member, a plate disposed below the base member for fixing the substrate, and a clamp mounted on the base member to fix the plate. The clamp is fitted in a bolt fixed to the base member and fixed by a nut.

In order to transfer substrates of various sizes, the plate is replaced according to the size of the substrate. The nut is loosened, the clamp is rotated about the bolt, and the plate is separated from the base member. After the other plate is positioned below the base member, the clamp is rotated to support the plate, and the plate is fixed by tightening the nut.

The above-mentioned substrate transfer device needs to loosen the nut for replacing the plate, so that it takes much time to replace the plate. Further, when the nut is loosened, the plate may be suddenly dropped while the clamp is rotated, thereby causing a risk of a safety accident.

The present invention provides a substrate transfer apparatus in which a plate can be easily replaced.

According to the present invention, there is provided a substrate transfer apparatus comprising: a base member; a plate disposed at a lower portion of the base member to fix a die-bonded substrate; a fixing member fixed to a lower surface of the base member, The clamp comprising a body fixed to a lower surface of the base member and having a first groove on one side thereof and a second groove inserted into the first groove so as to be hinged to the body, And a first spring disposed between the body and the latch and configured to provide an elastic force to the latch to protrude from the body to support the plate.

According to one embodiment of the present invention, the clamp is provided through the body from the other side of the body opposite to the one side, and the latch is provided to the first groove And a latch push pin for pushing the latch to be received in the latch.

According to one embodiment of the present invention, the clamp is provided between the body and the latch push pin, and provides an elastic force to the latch push pin to restore the latch push pin to a position before pushing the latch 2 spring, and a push pin stopper fixed to the other side of the body, for preventing the latch push pin from being detached from the body.

According to one embodiment of the present invention, the body may further have a second groove receiving the first spring on the bottom surface of the first groove parallel to one side of the body.

According to one embodiment of the present invention, the cross-sectional area can be increased from the bottom of the second groove to the bottom of the first groove to provide a space in which the first spring can bend.

The substrate transfer apparatus according to the present invention can push the latch with the latch push pin to separate the plate from the base member and push the other plate to mount the base member. Since the replacement operation of the plate is simple, it is possible to reduce the time required for replacing the plate.

Further, since the latch push pin can be pushed by one hand and the plate can be supported by the other hand, it is possible to prevent a safety accident that the plate suddenly falls off.

Hereinafter, a substrate transfer apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It is to be understood, however, that the intention is not to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged from the actual size in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted to have the meaning consistent with the meaning in the context of the related art and, unless explicitly defined in the present application, are interpreted in an ideal or overly formal sense It does not.

1 is a schematic bottom perspective view for explaining a substrate transfer apparatus according to an embodiment of the present invention;

Referring to FIG. 1, the substrate transfer apparatus 10 is for transferring a die-bonded substrate into a mold for molding, and includes a base member 100, a plate 200, and a clamp 300.

The base member 100 provides a place for the plate 200 and the clamp 300 to be provided. The base member 100 can be transferred to the inside of the mold by a separate transfer means.

The base member 100 has alignment pins 110. At least one alignment pin 110 is provided on both sides of the lower surface of the base member 100.

The plate 200 is for fixing the substrate and is disposed below the base member 100 to transfer the substrate to a lower one of the molds. The substrate is fixed to the lower surface of the plate 200. At this time, the die-bonded surface of the substrate faces the lower surface of the plate 200. For example, the plate 200 can fix the substrate by vacuum force, electrostatic force, mechanical force, or the like.

The plate 200 has at least one alignment hole 210 passing through the upper and lower sides on both sides. The alignment pins 210 are fitted into the alignment holes 210 so that the plate 200 can be accurately positioned at a predetermined reference position of the base member 100.

The plate 200 may further include a reinforcing member 220. The reinforcing member 220 is provided to surround both sides of the plate 200 supported by the clamp 300. The reinforcing member 220 prevents the plate 200 from being damaged by the clamp 300.

The clamp 300 fixes the plate 200 to the lower surface of the base member 100 and is provided with a plurality of opposite sides of the lower surface of the base member 100 facing each other. In order to stably fix the plate 200, two clamps 300 are preferably provided on both sides of the lower surface of the base member 100, and more than two clamps 300 may be provided.

FIG. 2 is an enlarged view of the clamp portion shown in FIG. 1, and FIG. 3 is a perspective view for explaining the clamp shown in FIG. 4 is a cross-sectional view for explaining the operation of the clamp shown in Fig.

2 to 4, the clamp 300 includes a body 310, a latch 320, a latch push pin 330, and a push pin stopper 340.

The body 310 has a rectangular block shape and is fixed to the lower surface of the base member 100. For example, the body 310 may be fixed to the base member 100 with screws.

The body 310 has a first groove 312 and a second groove 314.

The first groove 312 is provided on one side of the body 310 and extends along the vertical direction. The one side surface is a surface facing the clamp 300 located on the opposite side of the base member 100.

The second groove 314 is provided at a predetermined depth on the bottom surface of the first groove 312. The bottom surface of the first groove 312 is parallel to one side surface of the body 310. That is, the second grooves 314 extend along the horizontal direction perpendicular to the vertical direction. The second groove 314 may be tapered. That is, the cross-sectional area of the second groove 314 may be increased from the bottom of the second groove 314 to the entrance of the second groove 314. The bottom surface of the second groove 314 is parallel to the bottom surface of the first groove 312. The second groove 314 may have a tapered shape or a tapered shape. When the second groove 314 is in a tapered shape, a first spring 324 described later provides a space for bending.

Meanwhile, the second groove 314 may have a constant cross-sectional area. In this case, the first spring 324 may be retracted.

The latch 320 has an angular block shape and is inserted into the first groove 312. The fixing pin 322 passes through the body 310 and the latch 320. The latch 320 is divided into an upper long portion 320a and a lower short portion 322b with reference to a portion fixed by the fixing pin 322. [ Thus, the latch 320 is hinged to the body 310. The latch 320 may be received in the first groove 312 or the long portion 320a may protrude from the body 310.

A first spring 324 is provided between the body 310 and the latch 320. For example, the first spring 324 is inserted into the second groove 314 to support the elongated portion 320a of the latch 320.

The long portion 320a of the latch 320 is inserted into the first groove 312 by the urging force of the plate 200 when the plate 200 is moved to the lower surface of the base member 100 . At this time, the first spring 324 is bent or contracted. When the second groove 314 is tapered, the first spring 324 can be easily bent.

When the plate 200 is in close contact with the lower surface of the base member 100, the pressing force of the plate 200 is released so that the long portion 320a of the latch 320 Are protruded from the body 310. The elongated portion 320a of the protruded latch 320 supports one side of the lower surface of the plate 200.

The latch push pin 330 is inserted through the body 310 from the other side of the body 310 opposite to the one side. The latch push pin 330 pushes the short portion 320b of the latch 320. [ The long portion 320a of the latch 320 is received in the first groove 312 by the pushing of the latch push pin 330. Since the latch 320 supporting one side of the lower surface of the plate 200 moves, the plate 200 can be easily separated from the base member 100.

A second spring 332 is provided between the body 310 and the latch push pin 330. For example, the second spring 332 may be wound. The second spring 332 provides an elastic force to the latch push pin 330 to restore the latch push pin 330 to a position before the latch 320 is pushed.

The long portion 320a of the latch 320 is protruded from the body 310 by the restoring force of the first spring 324 without the second spring 332, A short portion 320b of the latch push pin 330 may push the latch push pin 330 to restore the latch push pin 330 to a position before pushing the latch 320. [

The push pin stopper 340 is fixed to the other side of the body 310. For example, the push pin stopper 340 may be coupled to the body 310 by a screw. The push pin stopper 340 supports one side of the latch push pin 330. Accordingly, the push pin stopper 340 prevents the latch push pin 330 from being detached from the body 310.

The substrate transfer apparatus 10 can separate the plate 200 from the base member 100 at once by pushing the latch 320 with the latch push pin 330. [ In addition, the substrate transfer device 10 can be mounted on the base member 100 by pushing the plate 200 upward from below the base member 100. The substrate transfer device 10 can easily replace the plate 200 according to the size of the substrate because the operation of attaching and detaching the plate 200 is simple. Therefore, the time required for replacing the plate 200 can be reduced.

Hereinafter, a method of replacing the plate 200 of the substrate transfer apparatus 100 will be described.

The latch push pins 330 of the clamps 300 are sequentially pushed in a state in which the plate 200 is supported. The latch push pin 330 pushes the short portion 320b of the latch 320 by the push operation. The long portion 320a of the latch 320 is received in the first groove 312 by the pushing of the latch push pin 330. At this time, the first spring 324 contracts or warps. The plate 200 is separated from the base member 100 due to its own weight since the latch 320 supporting one side of the lower surface of the plate 200 moves. The plate 200 can be quickly and conveniently separated from the base member 100 only by the pushing action of the latch push pins 330.

The long portion 320a of the latch 320 protrudes from the body 310 by the restoring force of the first spring 324 when the pressing force of the latch push pin 330 is removed. In addition, due to the restoring force of the second spring 332, the latch push pin 330 is restored to a position before the latch 320 is pushed. At this time, the push pin stopper 340 supports one side of the latch push pin 330 to prevent the latch push pin 330 from being detached from the body 310.

Thereafter, the plate 200 is pushed upward from below the base member 100 to mount another plate 200 on the base member 100. The long portion 320a of the latch 320 is inserted into the first groove 312 by the pressing force of the plate 200. [ At this time, the first spring 324 is bent or contracted.

The plate 200 can be quickly and conveniently mounted on the base member 100 only by pushing up the plate 200.

As described above, the substrate transfer apparatus according to the preferred embodiment of the present invention can push the latch with the latch push pin, separate the plate from the base member, and push the other plate to mount the base member. Since the replacement operation of the plate is simple, it is possible to reduce the time required for replacing the plate.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made thereto without departing from the spirit and scope of the invention as defined in the appended claims. It can be understood that

2 is an enlarged view of the clamp portion shown in Fig.

3 is a perspective view for explaining the clamp shown in Fig.

4 is a cross-sectional view for explaining the operation of the clamp shown in Fig.

Description of the Related Art [0002]

10: substrate transfer unit 100: base member

200: Plate 300: Clamp

310: body 312: first groove

314: second groove 320: latch

322: fixing pin 324: first spring

330: latch push pin 332: second spring

340: push pin stopper

Claims

A base member;

A plate disposed below the base member and fixing the die-bonded substrate;

A plurality of clamps fixed to a lower surface of the base member to detach the plate to replace the plate according to the size of the substrate,

The clamp

A body fixed to a lower surface of the base member and having a first groove on one side;

A latch inserted into the first groove and hinged to the body and supporting a plate for fixing the substrate;

A first spring disposed between the body and the latch and providing a resilient force to the latch to project from the body to support the plate; And

And a latch push pin extending through the body from the other side of the body opposite to the one side and pushing the latch such that the latch is received in the first groove to separate the plate from the base member And the substrate transfer device is configured to transfer the substrate.

delete

The clamp according to claim 1 ,

A second spring provided between the body and the latch push pin to provide an elastic force to the latch push pin to restore the latch push pin to a position before the latch is pushed; And

Further comprising a push pin stopper fixed to the other side of the body for preventing the latch push pin from being detached from the body.

The substrate transfer apparatus according to claim 1, wherein the body further comprises a second groove receiving the first spring on a bottom surface of the first groove parallel to one side surface of the body.

5. The substrate transfer device according to claim 4, wherein a cross-sectional area of the first groove is increased from the bottom of the second groove to the bottom of the first groove to provide a space in which the first spring can bend.