KR200466918Y1 - Led module - Google Patents

Abstract

Apparatus for manufacturing an LED module which can reduce the manufacturing cost and defects by shortening the manufacturing process of the LED module by attaching an upper cover having a transparent window and having a transparent window to the upper surface of the module body using an ultrasonic welding machine. It provides an LED module manufactured through. By attaching the mold cover manufactured by double injection to the upper surface of the LED module using ultrasonic welding means, a high sealing effect can be obtained, and since the mold cover is manufactured by double injection, at least one or more transparent windows are provided. Bright light can be emitted to the outside smoothly. In addition, the manufacturing cost and time is reduced by manufacturing the LED module through an automated process, and the mold cover is attached to the upper surface of the LED module compared to the discoloration of the upper surface of the LED module, the epoxy resin is applied to the upper surface of the LED module The upper surface portion is prevented from being discolored by sunlight.
[Index]
LED Module, Screw, Ultrasonic Fusion

Description

Apparatus for manufacturing LED module and LED module manufactured therefrom {LED MODULE}

The present invention relates to an LED module, and more particularly, by manufacturing a double injection, and attaching the upper cover having a transparent window to the upper surface of the module body by using an ultrasonic welding machine to shorten the manufacturing process of the LED module manufacturing cost and defects It relates to a device for manufacturing an LED module that can reduce the occurrence and to an LED module manufactured through the same.

In general, advertising billboards installed on buildings or roadsides are getting advertising effects by using light-emitting bulbs. Light bulbs installed with such indoor and outdoor advertisements have a short lifespan and have recently used various advertisements using LED modules (MODULE) equipped with LEDs for generating light. Such outdoor billboards are commonly used as high-brightness LED modules as LED modules. The LED module or high-brightness LED module has been widely used in recent years to replace a bulb and a fluorescent lamp that requires a lot of power for driving. In addition, in order to obtain various advertisement effects, many LED modules are attached to an advertisement board in an edge type or a direct type. The edge type is a method of providing light from one side of the billboard, the direct type is a method of providing the light from the back by attaching the LED module to be located on the back of the billboard and billboards.

Recently, the LED module mainly used in billboards has a rectangular box-shaped lower body that is injection molded on a wire that is a power supply line supplied from the outside and at least one LED is provided inside the lower body. It consists of an LED board mounted on the seating groove. In the state where the LED board is seated in the seating groove of the lower body, two screws are screwed so that each of the two wires is connected to the LED board. When the screw is driven in the direction of the wire from the upper surface of the LED substrate, the wire is connected to the LED substrate through the screw. After the LED substrate and the wire are connected to each other through a screw, the upper surface of the LED substrate is filled with a transparent epoxy resin and cured. The transparent epoxy resin covers the upper surface of the LED substrate to improve the waterproof effect and the light emitting effect of the LED, but there is a problem that the transparency of the epoxy resin is reduced due to macular degeneration due to sunlight over time. In addition, in the process of filling the epoxy resin on the upper surface of the LED substrate over-filling is a cause of many defects of the product. In addition, when the LED module is inclined while the epoxy resin is cured, the epoxy resin is not evenly distributed.

In addition, since the upper part of the LED emitting light does not undergo epoxy treatment, it is used in the state of silicone finish, which is a form of the original product, so there is a possibility of water inundation or damage due to user's carelessness in the use environment. It causes a problem of shortening the product life due to silicon damage and moisture penetration of the upper LED layer caused by direct sunlight, rain and snow.

The present invention has been made to solve the above problems, an object of the present invention is to produce a LED module by attaching the upper cover having a transparent window to the upper surface of the module body by using an ultrasonic welding machine manufactured by double injection It is to provide an apparatus for manufacturing an LED module that can be shortened to reduce the production cost and defects.

Another object of the present invention to provide an LED module manufactured through the apparatus for manufacturing the above-described LED module.

In order to achieve the above object, the present invention provides a wire supply unit to which the wire is supplied; A module body supply unit for supplying a module body having an injection molded rectangular shape; LED substrate supply unit for supplying the LED substrate; A screw supply unit for supplying a screw; A cover supply part which is supplied with a mold cover having at least one transparent window formed on one side by double injection; A module body coupling part for inserting the wire supplied from the wire supply part into a coupling hole provided at one side of the module body supplied from the module body supply part to couple the wire and the module body together; An air cleaning unit for washing a mounting groove provided in an upper surface of the module body coupled to the wire; An LED substrate seating part for mounting an LED substrate supplied from an LED substrate supply part to a seating groove of the module body; A seating checking unit configured to include a spring and a sensing sensor to check whether the LED board is seated in the seating groove of the module body; A screw fastening part which drives two screws supplied from the screw supply part to the LED substrate so that each screw is in contact with each of the two strands of wires so that power is supplied to the LED substrate through the wires; An energization inspection unit which checks whether power is supplied to the LED substrate through a wire; A cover seating part for seating the mold cover supplied from the cover supply part on the upper surface of the LED substrate to cover the upper surface of the module body; An ultrasonic welding unit for welding the mold cover to the upper surface of the module body using the ultrasonic welding machine while the mold cover is seated on the upper surface of the module body; A tape attachment part attaching the tape to the bottom surface of the module body in a state in which the mold cover is fused to the module body; And it provides a device for manufacturing an LED module consisting of a screw insertion portion for inserting a fixing screw in the screw insertion groove provided on the outer side of the module body.

The LED board is seated in the mounting groove of the module body passing through the module body coupling part, and the LED board and the electric wire are energized with each other by screwing. Ultrasonic welding machine provides a module that is manufactured by completely sealing the interior through the process of fusion of the module body and the mold cover.

According to the present invention, a high sealing effect can be obtained by attaching a mold cover manufactured by double injection to the upper surface of the LED module by using ultrasonic welding means, and the mold cover is manufactured by double injection, so that at least one or more Since a transparent window is provided, bright light generated from the LED can be smoothly emitted to the outside. In addition, the manufacturing cost and time is reduced by manufacturing the LED module through an automated process, and the mold cover is attached to the upper surface of the LED module compared to the discoloration of the upper surface of the LED module, the epoxy resin is applied to the upper surface of the LED module The upper surface portion is prevented from being discolored by sunlight.

1 is a block diagram schematically showing an apparatus for manufacturing an LED module according to the present invention.
2 is a view schematically showing an LED module manufactured by a device for manufacturing an LED module according to the present invention.
3 is an exploded perspective view schematically showing the structure of the LED module according to the present invention.

Hereinafter, the present invention will be described with reference to the accompanying drawings. The embodiments described below exemplarily illustrate one preferred configuration of the present invention, and examples of such embodiments are not intended to limit the scope of the present invention, and the present invention is within the scope without departing from the technical spirit thereof. It can be carried out in a variety of variations.

1 is a schematic block diagram showing an apparatus for manufacturing an LED module according to the present invention, Figure 2 is a schematic view showing an LED module manufactured by the apparatus for manufacturing an LED module according to the present invention, Figure 3 An exploded perspective view schematically showing the structure of the LED module according to the invention.

Referring to FIGS. 2 and 3, first, the LED module 100 installed in a lighting device such as an advertisement board or a neon sign is exposed to the outside with a plurality of LEDs 162 exposed to the outside to power the LED 162. When this is supplied, light is generated to the outside. The LED module 100 has a wire body 120 to allow power to be applied to the LED 162 from the outside, a module body 110 having a rectangular box shape and a seating groove is formed in the upper surface, at least one or more The LED 162 is provided and is embedded in the upper surface of the LED substrate 130 mounted on the seating groove 164 of the module body 110 and the LED substrate 130 mounted on the seating groove of the module body 110. The screw body 140 is in contact with the wire 120 so that the power supplied to the wire 120 is applied to the LED 162, and the screw body 140 is stuck to the LED substrate 130. The mold cover 150 is installed on the upper surface portion.

The mold cover 150 is manufactured by double injection into two plastic materials having different characteristics. Thus, the mold cover 150 has a transparent window 160 is formed on one side of the upper surface. As the LED 162 is positioned to correspond to the transparent window 160, the light generated from the LED 162 is emitted to the outside through the transparent window 160.

The module body 110 has a rectangular box shape. Both shortening surfaces of the module body 110 are respectively provided with coupling holes, and the wires 120 are inserted into the through holes. The plurality of module bodies 110 are coupled to the wire 120 at regular intervals.

The LED substrate 130 is positioned in the mounting groove 164 provided in the module body 110. At least one LED 162 is mounted on the LED substrate 130. The LED substrate 130 is installed to be in close contact with the mounting groove 164. After the LED substrate 130 is installed in the seating groove 164 of the module body 110, two screws 140 are embedded in the upper surface of the LED substrate 130. Each of the screws 140 passes through the LED substrate 130 and is embedded in the wire 120 in close contact with the bottom surface of the LED substrate 130. Since the screw 140 serves to conduct electricity between the wire 120 and the LED substrate 130, power supplied through the wire 120 is applied to the LED substrate 130 through the screw 140.

After screwing the screw 140 on the upper surface of the LED substrate 130, the mold cover 150 is installed on the upper surface of the module body (110). The transparent window 160 provided on the mold cover 150 and the LED 162 provided on the LED substrate 130 face each other so that light generated in the LED 162 is emitted to the outside through the transparent window 160. can do.

The mold cover 150 is fusion-bonded to the mold cover 150 and the module body 110 by irradiating ultrasonic waves to a portion where the mold cover 150 and the module body 110 abut so as to be tightly fixed to the module body 110. do.

The mold cover 150 is bonded to the module body 110 using ultrasonic waves to fix the mold cover 150 to each other, and then a double-sided tape is attached to the bottom surface of the module body 110. In addition, the screw insertion portion 228 provided on one side of the mold cover 150 may be inserted into the fixing screw to smoothly attach the LED module 100 to the billboard.

Referring to FIG. 1, a device for manufacturing an LED module is described. The wire 120 for supplying power to the LED module 100 from the outside is wound around the wire supply unit 200. The module body 110 coupled to the wire 120 is supplied from the cylindrical module body supply unit 202. The module body supply unit 202 is filled with a large number of module body 110.

The LED substrate 130 mounted on the module body 110 is filled in the LED substrate supply unit 208. The screw 140 for allowing the LED substrate 130 and the wire 120 to be energized with each other is filled in the screw supply part 214.

The mold cover 150 fused to the upper surface of the module body 110 is filled in the cover supply part 220. After the injection of the product name on the upper surface of the mold cover 150 may be printed in advance.

The module body 110 supplied from the wire 120 and the module body supply unit 202 supplied from the wire supply unit 200 are provided on both shortened surfaces of the module body 110 while passing through the module body coupling unit 204. The wires 120 are fitted to each other and are coupled to each other. The module body 110 is continuously coupled to the wire 120 at regular intervals.

The module body 110 coupled to the wire 120 passes through the air cleaning unit 206 and air is applied to the seating groove 164 provided in the upper surface of the module body 110 so that the seating groove ( Foreign matter present in 164 is removed from the air cleaning unit 206.

The module body 110 passing through the air cleaning unit 206 passes through the LED substrate seating unit 210, the LED substrate 130 is supplied from the LED substrate supply unit 208 of the module body 110 It is seated in the seating groove 164.

After the LED substrate 130 is seated in the seating groove 164 of the module body 110, the module body 110 passes through the seating checking unit 212. The seating check unit 212 is composed of a spring and a sensor to sense the LED substrate 130 is seated in the seating groove 164 of the module body 110, the LED substrate 130 is seating groove 164 Make sure that it rests properly.

The module body 110 passed through the seating check unit 212 passes through the screw fastening portion 216. The screw fastener 216 is supplied with a screw 140 from the screw supply unit 214 so that the two screws 140 are embedded in the LED substrate 130. The screw 140 is nailed to the LED substrate 130 so that the end of the screw 140 penetrates the wire 120. The two screws 140 penetrate each of the two strands of wires so that the wires 120 and the LED substrate 130 are energized with each other so that the power supplied through the wires 120 is applied to the LED substrate 130. do.

In the screw fastening portion 216, the screw 140 is nailed to the LED substrate 130, the module body 110 passes through the conduction inspection unit 218. The energization inspection unit 218 is provided with an electricity supply inspection pin, and whether the power is well applied to the LED 162 of the LED substrate 130 from the wire 120 by the elevating operation of the cylinder equipped with the electricity inspection inspection pin. Will be checked.

The module body 110 passed through the energization inspection unit 218 passes through the cover seating portion 222. The cover cover 222 is supplied with a mold cover 150 from the cover supply unit 220. The mold cover 150 has a number of transparent windows 160 corresponding to the LEDs 162 provided on the LED substrate 130, and transparent windows 160 on each LED 162 of the LED substrate 130. The mold cover 150 is seated on the upper surface of the module body 110 to position.

In the cover seating portion 222, the mold cover 150 is seated on the upper surface of the module body 110 so that the ultrasonic welding portion 224 in the state in which the mold cover 150 covers the upper surface of the module body 110. Will pass. The ultrasonic fusion unit 224 generates ultrasonic waves and applies them to the contact portion between the mold cover 150 and the module body 110.

The ultrasonic fusion unit 224 is provided with an ultrasonic generator for generating ultrasonic waves, and when the ultrasonic wave generated by the ultrasonic generator is applied to the contact portion between the mold cover 150 and the module body 110, the mold cover 150 and the module. The contact portions of the body 110 are fused with each other while melting by ultrasonic waves. The mold cover 150 and the module body 110 are completely sealed by fusion of the contact portion between the mold cover 150 and the module body 110.

After the mold cover 150 is fused to the module body 110 in the ultrasonic welding unit 224, the module body 110 passes through the tape attaching unit 226. In the tape attachment part 226, a tape for attaching and fixing the LED module 100 to the installation place is attached to the bottom surface of the module body 110. In addition, the module body 110 passing through the tape attachment portion 226 passes through the screw insertion portion 228. In the screw insertion portion 228, a fixing screw is inserted into a screw insertion groove provided at an outer side of the module body 110. The fixing screw 164 inserted into the screw insertion groove fixes the LED module 100 firmly to the installation surface.

* Explanation of symbols for the main parts of the drawings *
100: LED module 110: module body
120: wire 130: LED substrate
140: screw nail 150: mold cover
160: transparent window 162: LED

Claims (2)

A module body coupling part 204 to which a wire supplied from the wire supply part 200 is inserted into a coupling hole provided at one side of the module body supplied from the module body supply part 202 so that the wire and the module body are coupled to each other;
An air cleaning unit 206 for washing a mounting groove provided in an upper surface of the module body coupled to the wire;
An LED substrate seating portion 210 for mounting an LED substrate supplied from the LED substrate supplying portion 208 to a seating groove of the module body;
A seating check unit 212 configured to check whether the LED substrate is seated in the seating groove of the module body by using a spring and a sensor;
Screw fastening unit 216 to drive the two screws supplied from the screw supply unit 214 to the LED board so that the screws are in contact with each of the two strands of wire to supply power to the LED substrate through the wire;
An energization inspection unit 218 for inspecting whether power is supplied to the LED substrate through a wire;
A cover seating part 222 seating the mold cover supplied from the cover supply part 220 on the upper surface of the LED substrate to cover the upper surface of the module body;
An ultrasonic welding unit 224 for fusion welding the mold cover to the upper surface of the module body using an ultrasonic welding machine in a state in which the mold cover is seated on the upper surface of the module body;
A tape attachment part 226 for attaching a tape to a bottom surface of the module body; And
Includes; screw insertion portion 228 for inserting a fixed screw into the screw insertion groove provided on the outer side of the module body;
Device for manufacturing LED module.
Manufactured through a device for manufacturing the LED module according to claim 1,
LED module.

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