KR200463459Y1

KR200463459Y1 - Resin molding apparatus including thickness measurement unit

Info

Publication number: KR200463459Y1
Application number: KR20080001056U
Authority: KR
Inventors: 김태기; 정태숙; 황동주
Original assignee: 세크론 주식회사
Priority date: 2008-01-23
Filing date: 2008-01-23
Publication date: 2012-11-05
Also published as: KR20090007620U

Abstract

The present invention relates to a resin molding apparatus having a semiconductor element thickness measuring unit.

The semiconductor element resin molding apparatus of the present invention is a semiconductor element resin molding apparatus including a thickness measuring unit for measuring a thickness of a semiconductor element, which is a work object, for controlling a molding operation, wherein the thickness measuring unit comprises the semiconductor element. Seating means for supporting in a horizontal state; And a pair of contact displacement sensors provided on upper and lower sides spaced apart from the mounting means to measure a thickness of the upper and lower surfaces of the semiconductor element supported by the mounting means. Characterized in that it comprises a.

Therefore, the thickness of the semiconductor device to be measured can be quickly measured with high accuracy regardless of the state (bending or deformation state) or the type of the semiconductor device without having to closely adhere to the flat plate inspection table. This has the effect of improving quality.

Resin, Molding, Semiconductor Device, Thickness, Measurement, Contact, Sensor

Description

Resin molding apparatus provided with a semiconductor element thickness measuring unit {RESIN MOLDING APPARATUS INCLUDING THICKNESS MEASUREMENT UNIT}

The present invention relates to a resin molding apparatus having a semiconductor element thickness measuring unit. More specifically, the thickness of a semiconductor element, which is a work object, can be measured quickly and with higher precision, thereby improving productivity and quality of the manufactured semiconductor element. The resin molding apparatus provided with the semiconductor element thickness measuring unit which can be improved.

In general, a post-process for manufacturing a semiconductor product is to mount a semiconductor chip separated from a wafer on a package substrate such as a lead frame or a printed circuit board (PCB). The die bonding process of attaching to each other, the wire bonding process of electrically connecting the mounted semiconductor chip and the package substrate with a connection member such as a metal wire, and the outside of the semiconductor package manufactured by wire bonding are completed. And a resin molding step of sealing with resin.

Among these, the resin molding process is a process of molding to wrap a semiconductor package manufactured by using a sealing resin such as epoxy molding compound (EMC), and physical or chemical outside such as impact, heat, and moisture. It protects the semiconductor chip and the metal wire from the environment, and maintains the connection of the metal wire.

Hereinafter, for convenience of description, a semiconductor semifinished product composed of a package substrate, a semiconductor chip, and a metal wire after die bonding and wire bonding is completed will be referred to as a 'semiconductor device'.

As is well known, a resin molding apparatus for carrying out a resin molding process introduces a sealing resin into a mold part together with a semiconductor element, which is a process target, to mold the semiconductor element into a sealing resin.

The type of resin molding apparatus includes an injection molding method of injecting and supplying molten resin through a passage into a cavity in a mold part to be molded, and a semiconductor element and a resin together in the mold part. BACKGROUND OF THE INVENTION A compression molding method is known in which a predetermined temperature and pressure are applied together in a position to be molded.

When molding the resin, the thickness of the semiconductor element to be molded is measured to calculate the appropriate amount of resin for molding and to supply the quantitatively to accurately mold the desired thickness. Check that it is done correctly.

To this end, the resin molding apparatus is provided with a thickness measuring unit for measuring the thickness of the semiconductor element.

1A and 1B each show an example of a semiconductor element thickness measuring unit included in a conventional resin molding apparatus.

The thickness measuring unit 10 shown in FIG. 1A uses a contact displacement sensor 14 for thickness measurement, and the thickness measuring unit 20 shown in FIG. 1B uses a non-contact displacement sensor 24-1, for measuring thickness. 24-2).

First, the thickness measuring unit 10 using the contact displacement sensor 14 shown in FIG. 1A will be described. The thickness measuring unit 10 is mounted so that the semiconductor element SD to be measured is placed in a horizontal state. It is provided on the flat plate 12 and the upper side spaced apart from the flat plate 12, the flat surface is provided so as to be in contact with the semiconductor element (SD) on the flat plate 12 during the measurement and the semiconductor element as it descends The contact displacement sensor 14 which contacts the upper surface of SD, and measures thickness, and the lifting drive means (not shown) which raises and lowers this contact displacement sensor 14 by a fixed amount.

Here, the flat surface inspection table 12 adsorbs the semiconductor device SD with a vacuum pressure so that the semiconductor device SD to be seated against the upper surface thereof, and for this purpose, a plurality of vacuum holes (not shown) are provided on the upper surface thereof. Is formed.

Then, the contact displacement sensor 14 is moved pin 14a which is pressed in the state of being in contact with the upper surface of the semiconductor element SD and is displaced up and down in accordance with the downward movement, and the displacement movement distance of the movable pin 14a. It consists of a displacement detecting means 14b for detecting.

Therefore, before the semiconductor element SD to be measured is introduced, the contact displacement sensor 14 is lowered by the operation of the elevating drive means, and the moving pin 14a is in contact with the upper surface of the flat inspection table 12. It is displaced by pressing and the displacement sensing means 14b detects the displacement movement distance and measures the reference value.After completion of the measurement of the reference value, the contact displacement sensor 14 is raised by the operation of the elevating drive means and returns to its original height. do.

Subsequently, the semiconductor element SD to be measured is introduced to be seated in a horizontal state on the upper surface of the flat inspection table 12, and the flat inspection table 12 applies a vacuum pressure to closely adhere to the seated semiconductor device SD. Fix it.

Thereafter, the contact displacement sensor 14 is lowered again by the operation of the elevating drive means, and the moving pin 14a contacts the upper surface of the semiconductor element SD seated on the flat inspection table 12 and then is pressed. The displacement measurement means measures the thickness measurement by the displacement sensing means 14b by detecting the displacement movement distance, and after the measurement of the thickness measurement is completed, the contact displacement sensor 14 is raised by the operation of the elevating drive means to Return to height

Then, the contact displacement sensor 14 or the controller (not shown) connected to the contact displacement sensor 14 electrically or networkly is connected to the semiconductor device SD from the difference between the obtained reference value and the measured thickness value. Obtain by obtaining the actual thickness value.

On the other hand, the thickness measuring units 20 using the non-contact displacement sensors 24-1 and 24-2 shown in FIG. 1B are paired side by side to be spaced apart from each other so as to support both end portions of the semiconductor element SD to be measured. A pair of mounting rails 22 and upper and lower sides spaced apart from the mounting rails 22 are provided to face each other, and the upper and lower surfaces of the semiconductor device SD are reflected by irradiating light for measurement. Non-contact displacement sensors 24-1 and 24-2 for measuring the thickness of the semiconductor element SD by receiving the reflected light are included.

Here, the non-contact displacement sensors 24-1 and 24-2 mainly use laser light as measurement light, irradiate the measurement light perpendicularly to the semiconductor element SD, and receive and detect the reflected light reflected therefrom. do.

Therefore, when the semiconductor element SD is introduced and seated so as to be supported by the mounting rail 22, the pair of upper and lower contactless displacement sensors 24-1 and 24-2 transmits the measurement light to the semiconductor element ( The thickness of the semiconductor element SD is measured by irradiating the upper and lower surfaces of the SD) and receiving the reflected light reflected therefrom.

Furthermore, the thickness value information of the semiconductor device SD measured by the contact displacement sensor 14 or the non-contact displacement sensors 24-1 and 24-2 is obtained from the controller, and the controller obtains the thickness value information. Is used to control the resin molding apparatus, that is, to determine the supply resin amount or to determine whether or not the thickness of the molded semiconductor element SD is poor.

However, the conventional thickness measuring units 10 and 20 as described above have the following problems.

That is, in the method using the contact displacement sensor 14, a flat plate 12 is provided to closely support the semiconductor element SD to be measured, and the semiconductor element SD should be in close contact with the flat plate 12. As the thickness can be accurately measured, the plate inspection table 12 uses vacuum adsorption to closely contact the semiconductor element SD, so that the installation is rather complicated and difficult as it must be connected to an external vacuum line during the installation. In addition, if the applied vacuum pressure is unstable or non-uniform, the adhesion degree of the semiconductor device SD is changed, causing variation in measured values, so that the thickness cannot be accurately measured. Since there is a problem that productivity is reduced.

In addition, since the semiconductor element SD is preheated to a predetermined temperature before molding and exposed to a high temperature environment during the molding process, the semiconductor element SD before and after molding is usually bent or deformed due to a heat effect. As shown in FIG. 2, the semiconductor device SD in a curved or deformed state cannot be accurately measured at the thickness of the semiconductor device SD by using the contact displacement sensor 14 as a reflection of the curved or deformed thickness value. There is a problem.

On the other hand, in the method using the non-contact displacement sensor (24-1, 24-2) is measured by using light, there is a problem in that the accuracy of measurement is basically lowered according to the surface color or reflectance of the semiconductor device (SD).

Incidentally, if the thickness of the molded semiconductor device SD cannot be accurately measured, the poor thickness semiconductor device SD may be continuously produced, which may cause serious results.

The present invention was devised to solve the above problems, and provides a resin molding apparatus having a semiconductor element thickness measuring unit capable of quickly measuring the thickness thereof with high precision regardless of the state or type of the semiconductor element. Its purpose is to.

The above object and various advantages of the present invention will become more apparent from the preferred embodiments of the present invention by those skilled in the art.

In the semiconductor device resin molding device of the present invention for achieving the above object, in the semiconductor device resin molding device having a thickness measuring unit for measuring the thickness of the semiconductor device that is the work object for the control of the molding work, the thickness measurement The unit includes seating means for supporting the semiconductor element in a horizontal state; And a pair of contact displacement sensors provided on upper and lower sides spaced apart from the mounting means to measure a thickness of the upper and lower surfaces of the semiconductor element supported by the mounting means. Characterized in that it comprises a.

Preferably, the thickness measuring unit, the lifting drive means for raising and lowering the contact displacement sensor by a predetermined amount; As shown in FIG.

Also preferably, the seating means may be seating rails provided on both sides side by side to support both end portions of the semiconductor device.

Also preferably, the contact displacement sensor may include a moving pin that is pressed and displaced up and down while being in contact with one surface of the semiconductor element supported by the seating means; Displacement sensing means for sensing a displacement movement distance of the movable pin; &Lt; / RTI >

Also preferably, after the semiconductor device is not introduced, the pair of contact displacement sensors of the pair of contact displacement sensors are pressed in contact with each other to measure a reference value, and then the semiconductor element is connected to the pair of contact displacements. In the state introduced between the sensors, the moving pins of the pair of contact displacement sensors are pressed in contact with the semiconductor element to measure the thickness measurement, and the difference between the reference value and the thickness measurement value of the semiconductor element is measured. The actual thickness value can be calculated.

According to the present invention, it is possible to quickly measure the thickness with high precision regardless of the state (bending or deformation state) or the type of the semiconductor element without having to closely adhere the semiconductor element to be measured to a separate flat plate. An effect that can improve productivity and manufacturing quality can be achieved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 shows a semiconductor device thickness measurement unit according to a preferred embodiment of the present invention.

The semiconductor element thickness measuring unit 100 according to the present invention includes a seating rail 102 and a seating rail 102 which are provided in pairs side by side and spaced apart from each other so as to support both end portions of the semiconductor element SD, which is a measurement target. It is provided in a pair opposing each other on the upper and lower sides spaced apart from each other) and moved close to contact with the semiconductor element (SD) on the seating rail 102 during measurement, and in contact with the upper and lower surfaces of the semiconductor element (SD) in accordance with the proximity movement And the lift-off driving means (not shown) which raises and lowers the contact-displacement sensors 104-1 and 104-2 which measure the thickness, and this contact-displacement sensors 104-1 and 104-2 by a fixed amount.

Here, the seating rail 102 supports the semiconductor device SD which is transported and seated by a separate transfer means (not shown), or the semiconductor device SD that the seating rail 102 itself is horizontally moved and seated on an upper surface thereof. The SD may be transferred to a measurement position where the contact displacement sensors 104-1 and 104-2 are located.

The mounting rail 102 may be implemented in other forms or structures as long as it can properly support the outer portion of the semiconductor device SD, mainly avoiding the center portion of the semiconductor device SD, which is a thickness measurement point.

Each of the contact displacement sensors 104-1 and 104-2 is moved and moved up and down by being pressed in contact with the upper or lower surface of the semiconductor element SD according to the proximity movement with respect to the semiconductor element SD. 104a and displacement detection means 104b which detects the displacement movement distance of this moving pin 104a.

The semiconductor element thickness measuring unit 100 having the above-described configuration may be manufactured as a separate unit and mounted detachably with respect to the resin molding apparatus. Is electrically connected to a control unit (not shown) for overall operation control of the resin molding apparatus, and thus the thickness value information of the semiconductor element SD measured through the contact displacement sensors 104-1 and 104-2 is obtained. By using the control unit to control the operation of the resin molding device.

Hereinafter, the operation of the semiconductor device thickness measurement unit 100 according to the present invention will be described with reference to the flowchart of FIG. 5.

First, before the semiconductor element SD, which is a measurement object, is introduced, the upper and lower pairs of contact displacement sensors 104-1 and 104-2 are moved to be close to each other by a certain amount by the operation of the lifting driving means, The tip ends of the moving pins 104a are contacted with each other and then are displaced by being pressed, and the displacement moving distance is sensed by their displacement detecting means 104b to measure the reference value (S200), and after the measurement of the reference value is completed, the contact displacement sensor ( The 104-1, 104-2 are moved to be spaced apart from each other by the operation of the lift drive means and returned to their original height.

Subsequently, the semiconductor element SD to be measured is transferred by a separate transfer means and seated on the seating rail 102 corresponding to the measurement position, or the seating rail 102 is horizontally moved and seated on the upper surface thereof. The device SD is transferred to a measurement position where the contact displacement sensors 104-1 and 104-2 are positioned (S202).

Thereafter, the upper and lower pairs of contact displacement sensors 104-1 and 104-2 are repositioned so as to be in close proximity to each other by the operation of the elevating drive means so that the leading ends of their moving pins 104a are interposed. After contact with the upper and lower surfaces of the semiconductor element SD, the displacement is moved by pressing, and the displacement sensing means 104b detects the displacement movement distance, thereby measuring the thickness measurement value (S204), and measuring the thickness measurement value. After completion the contact displacement sensors 104-1 and 104-2 are repositioned to be spaced apart from each other by the operation of the lift drive means and returned to their original height.

At this time, the contact displacement sensors 104-1 and 104-2 are preferably moved back to each other again to measure the amount and thickness of the position displacement so that the contact displacement sensors 104-1 and 104-2 are moved close to each other by the operation of the lifting drive means. The amount of position shifted so as to be close to each other may be set equally.

Then, the reference value and the measured thickness value obtained by controlling the contact displacement sensor 104-1, 104-2 or the control unit electrically or networked to the corresponding contact displacement sensor 104-1, 104-2. The actual thickness value of the semiconductor device SD is calculated and obtained from the difference of S206.

Then, the semiconductor device SD having completed the thickness measurement is minutely moved by the horizontal movement of the seating rail 102 or the transfer by a separate transfer means, and then the thickness measurement for another point is repeated, or the thickness Once all the measurements have been completed, it may be transferred to the subsequent process by the seating rail 102 or a separate transfer means.

Of course, if the two or more points are to be measured, the semiconductor device SD is not moved, but the pair of contact displacement sensors 104-1 and 104-2 are moved relative to the semiconductor device SD. May be

In addition, the controller may perform the determination of whether the semiconductor device SD is good or bad by comparing the obtained thickness value with the set target thickness value, and if it is determined to be defective, generate an error or operate the resin molding apparatus. You can stop it.

According to the semiconductor element thickness measurement unit 100 of the present invention as described above, as shown in FIG. 4, even if the semiconductor element SD of the measurement object is bent or deformed, the thickness can be accurately measured, and the semiconductor The thickness can be measured accurately regardless of the surface color and reflectance of the device SD.

In addition, since the process of fixing the semiconductor device SD in close contact with the flat plate inspection table is unnecessary, fast measurement may be possible.

Thus, the control on the resin molding apparatus can also be carried out accurately based on the measured exact thickness value, thereby improving the molding quality.

In addition, the controller may accurately detect the semiconductor device SD having a thickness defect using the obtained thickness value, thereby preventing mass production of the semiconductor device SD having a thickness thickness in advance.

As described above, the above description merely illustrates a preferred embodiment of the present invention, and those skilled in the art should recognize that modifications and changes can be made to the present invention without changing the subject matter of the present invention.

1A and 1B are schematic configuration diagrams each showing an example of a semiconductor element thickness measuring unit included in a conventional resin molding apparatus;

FIG. 2 is a schematic view showing a situation of measuring a semiconductor device in a bent or deformed state by using the semiconductor device thickness measuring unit shown in FIG. 1A;

3 is a schematic block diagram showing a semiconductor device thickness measurement unit according to a preferred embodiment of the present invention,

4 is a schematic diagram illustrating a situation of measuring a semiconductor device in a bent or deformed state by using a semiconductor device thickness measuring unit according to a preferred embodiment of the present invention;

5 is a flowchart illustrating the operation of a semiconductor device thickness measuring unit according to a preferred embodiment of the present invention.

100: thickness measurement unit 102: seating rail

104-1, 104-2: contact displacement sensor 104a: moving pin

104b: displacement detection means SD: semiconductor element

Claims

In the semiconductor element resin molding apparatus provided with the thickness measuring unit which measures the thickness of the semiconductor element which is a workpiece | work for control of a molding operation | work,

The thickness measuring unit,

Mounting means including a mounting rail which is provided in pairs side by side spaced apart from each other to support the semiconductor element in a horizontal state; And

A pair of contact displacement sensors provided on the upper and lower sides spaced apart from the mounting means and measuring a thickness in contact with the upper and lower surfaces of the semiconductor element supported by the mounting means; And,

The seating rail supports a semiconductor device to be transported and seated by a separate transport means, or the seating rail itself is moved horizontally so that the semiconductor device seated on the upper surface is transferred to a measurement position where a contact displacement sensor is located. You can

The displacement sensor includes an electrically connected control unit, the semiconductor device resin molding apparatus, characterized in that the control unit controls the operation of the resin molding apparatus using the measured thickness value information of the semiconductor device.

The method of claim 1,

The thickness measuring unit,

Elevating drive means for elevating the contact displacement sensor by a predetermined amount; Semiconductor device resin molding apparatus further comprises.

The method of claim 1,

The seating means,

The semiconductor device resin molding apparatus, characterized in that the mounting rails are provided on both sides side by side to support both end portions of the semiconductor device.

3. The method according to claim 1 or 2,

The contact displacement sensor,

A moving pin that is pressed and displaced up and down while being in contact with one surface of the semiconductor element supported by the seating means; And

Displacement sensing means for sensing a displacement movement distance of the movable pin; A semiconductor element resin molding apparatus comprising: a.

5. The method of claim 4,

After measuring the reference value by pressing the moving pins of the pair of contact displacement sensors in contact with each other in the state that the semiconductor element is not introduced,

Measuring the thickness measurement value by pressing the movable pin of the pair of contact displacement sensors in contact with the semiconductor element with the semiconductor element introduced between the pair of contact displacement sensors,

And an actual thickness value of the semiconductor device is calculated from the difference between the reference value and the thickness measurement value.