KR200457758Y1 - a fluorescent lamp using LED with mounting electric power PCB on socket - Google Patents

a fluorescent lamp using LED with mounting electric power PCB on socket Download PDF

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Publication number
KR200457758Y1
KR200457758Y1 KR2020090011284U KR20090011284U KR200457758Y1 KR 200457758 Y1 KR200457758 Y1 KR 200457758Y1 KR 2020090011284 U KR2020090011284 U KR 2020090011284U KR 20090011284 U KR20090011284 U KR 20090011284U KR 200457758 Y1 KR200457758 Y1 KR 200457758Y1
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South Korea
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led module
socket
light emitting
power
emitting diode
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KR2020090011284U
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Korean (ko)
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KR20110002259U (en
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박명규
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세진텔레시스 주식회사
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/278—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

본 고안은, 형광등 대체용으로서 사용되는 엘이디모듈에 도통가능하게 접속되는 전원PCB를 소켓에 장착하고 소켓 측벽에 방열용 관통공을 형성하여, 엘이디를 점등시 엘이디모듈로부터 발생되는 열을 형광등 튜브 외부로 배출시켜 방열 효율을 향상(전원PCB를 엘이디모듈에 장착한 경우와, 소켓에 장착할 경우 형광등 튜브 내부의 온도차가 10℃정도 발생됨)시킬수 있도록 한 것으로,The present invention is to install a power supply PCB connected to the LED module used as a replacement for the fluorescent lamp in the socket and to form a through hole for heat dissipation in the side wall of the socket, the heat generated from the LED module when the LED is turned on outside the fluorescent tube To improve heat dissipation efficiency (in case of installing power supply PCB to LED module and when installing to socket, temperature difference inside fluorescent tube is about 10 ℃).

본 고안의 실시예에 의한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등은,Fluorescent lamp using a light emitting diode provided with a power supply PCB in the socket according to an embodiment of the present invention,

발광 다이오드를 이용한 형광등에 있어서,In a fluorescent lamp using a light emitting diode,

내측면에 결합홈이 대향되게 형성되고, 방열핀용 요철부가 일체형으로 형성되는 튜브형상의 몸체와,A tube-shaped body in which a coupling groove is formed to face the inner side, and an uneven portion for the heat dissipation fin is integrally formed;

결합홈에 끼워맞춤되는 인쇄회로기판과, 인쇄회로기판에 일정간격을 유지하여 고정되는 다수개의 발광 다이오드를 구비하는 엘이디모듈과,An LED module having a printed circuit board fitted into the coupling groove, and a plurality of light emitting diodes fixed to the printed circuit board by maintaining a predetermined distance therebetween;

몸체 양단부에 끼워맞춤되며, 외부로부터의 전원을 엘이디모듈에 공급하는 한 쌍의 전원핀과, 전원핀을 통해 엘이디모듈에 공급되는 전원을 제어하는 전원PCB가 구비되는 소켓을 포함한다.Fitted at both ends of the body, and includes a pair of power pins for supplying power from the outside to the LED module, and a socket provided with a power PCB for controlling the power supplied to the LED module through the power pin.

발광 다이오드, 형광등, 소켓, 엘이디모듈, 전원PCB, 방열  Light Emitting Diode, Fluorescent Lamp, Socket, LED Module, Power PCB, Heat Dissipation

Description

소켓에 전원피씨비가 구비된 발광 다이오드를 이용한 형광등{a fluorescent lamp using LED with mounting electric power PCB on socket}Fluorescent lamp using LED with mounting electric power PCB on socket

본 고안은 형광등 대체용으로서 사용되는 엘이디모듈(인쇄회로기판(PCB) 상에 다수개의 발광 다이오드(이하, 엘이디(LED)라 칭함)가 실장된 것을 말함)로부터 발생되는 열을 소켓을 통해 외부로 방열시킬 수 있도록 한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등에 관한 것이다.The invention devises heat generated from an LED module (a plurality of light emitting diodes (hereinafter referred to as LEDs) mounted on a printed circuit board (PCB)) used as a fluorescent lamp replacement to the outside through a socket. The present invention relates to a fluorescent lamp using a light emitting diode provided with a power supply PCB in one socket to dissipate heat.

더욱 상세하게는, 엘이디모듈에 도통가능하게 접속되는 전원PCB를 소켓에 장착하고 소켓 측벽에 방열용 관통공을 형성하여, 엘이디를 점등시 엘이디모듈로부터 발생되는 열을 형광등 튜브 외부로 배출시켜 방열 효율을 향상(전원PCB를 엘이디모듈(LED module)에 장착한 경우와, 소켓(socket)에 장착할 경우 형광등 튜브 내부의 온도차가 10℃정도 발생됨)시킬수 있도록 한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등에 관한 것이다.More specifically, a power supply PCB connected to the LED module conductively is mounted on the socket, and a through hole for heat dissipation is formed in the side wall of the socket, and when the LED is turned on, heat generated from the LED module is discharged to the outside of the fluorescent tube so that the heat dissipation efficiency The light emitting diode equipped with a power PCB in the socket so that the temperature difference between the fluorescent tube and the inside of the fluorescent tube occurs by 10 ℃ when the power PCB is mounted on the LED module and when it is mounted on the socket. It relates to a used fluorescent lamp.

일반적으로, 엘이디는 반도체의 빠른 처리 속도와 낮은 전력 소모 등의 장점 과, 에너지 절약 효과가 높아 형광등 대체용으로서 활용되고 있다. 기존의 광원에 비해 극소형이며, 수명이 전구에 비해 10배 이상이며, 자외선과 같은 유해파의 방출이 없고, 수은 및 기타 방전용 가스를 사용하지않아 환경 친화적이다.In general, LEDs are used as replacements for fluorescent lamps due to the advantages of high processing speed and low power consumption of semiconductors and high energy saving effects. It is very small compared to the conventional light source, its lifespan is more than 10 times that of the light bulb, no emission of harmful waves such as ultraviolet rays, and environmentally friendly since it does not use mercury and other discharge gases.

도 1에 도시된 종래 기술에 의한 발광 다이오드를 이용한 형광등은,Fluorescent lamp using a light emitting diode according to the prior art shown in Figure 1,

반구형상의 베이스(12)와, 베이스(12) 상단에서 내향하며 절곡형성된 연장부(14)를 포함하여 이루어진 본체(10)와,A main body 10 including a hemispherical base 12 and an extension part 14 which is bent inwardly at an upper end of the base 12,

베이스(12) 내측에 길이방향을 따라 형성되고, 방열면적을 넓혀 방열효율을 높이기 위한 방열 날개부(20)와,It is formed along the longitudinal direction inside the base 12, the heat dissipation wing portion 20 for increasing the heat dissipation area to increase the heat dissipation efficiency,

베이스(12)의 연장부(14)에 안착되는 플레이트(32)와,A plate 32 seated in the extension 14 of the base 12,

플레이트(32) 양측에 연결된 수용돌기(34)를 포함하는 고정부(30)와,A fixing part 30 including a receiving protrusion 34 connected to both sides of the plate 32,

수용돌기(34) 사이에 안착되고, 다수의 엘이디(42)가 실장된 인쇄회로기판(44)으로 이루어진 엘이디모듈(40)과,The LED module 40, which is seated between the receiving protrusions 34 and is formed of a printed circuit board 44 on which a plurality of LEDs 42 are mounted,

본체(10)를 덮고 반구형상으로 이루어지며, 상부 중심보다 양측부 두께가 상대적으로 얇게 형성되어, 양측부로 방사되는 빛의 투과량을 높여 엘이디모듈(40)에서 조사되는 빛의 지향각을 확장시키는 캡(50)과,Covering the main body 10 is made in a hemispherical shape, the thickness of both sides is formed relatively thinner than the upper center, to increase the transmission of light emitted to both sides to extend the directivity of the light irradiated from the LED module 40 50,

본체(10)의 상단부에는 삽입부(62)가 형성되고, 캡(50)의 하단부에는 삽입부에 결합되는 대응삽입부(64)가 형성되어, 본체(10)의 캡(50)의 착탈시 삽입부(62)와 대응삽입부(64)가 탄성을 발휘하여 탈착되어, 본체(10)와 캡(50)의 결합,분리를 용이하게 하는 탈착수단과,Insertion part 62 is formed in the upper end part of the main body 10, and the corresponding insertion part 64 couple | bonded with the insertion part is formed in the lower end part of the cap 50, and when attaching and detaching the cap 50 of the main body 10 is carried out. Desorption means for the insertion portion 62 and the corresponding insertion portion 64 exerts elasticity to facilitate the engagement and separation of the main body 10 and the cap 50, and

엘이디모듈(40)과 접속되어 엘이디(42)를 점,소등시키는 구동회로(70)와,A driving circuit 70 connected to the LED module 40 to turn on / off the LED 42;

본체(10)와 캡(50)의 결합 후, 양단을 고정 결합하는 고정커버(80)를 포함한다.After the main body 10 and the cap 50 are coupled, the fixing cover 80 is fixed to both ends.

종래의 발광 다이오드를 이용한 형광등은, 외부로부터 엘이디모듈(40)에 공급되는 전원을 제어하는 구동회로(70)가 엘이디모듈(70)에 일체형으로 장착됨에 따라, 다수개의 엘이디(42)를 점등시킬 경우 엘이디모듈(40)에 발생되는 열이 형광등 튜브 외부로 쉽게 방열되지 않는다. 이로 인해 엘이디(42)의 수명을 단축시키는 문제점을 갖는다.In the conventional fluorescent lamp using a light emitting diode, as the driving circuit 70 for controlling the power supplied to the LED module 40 from the outside is integrally mounted to the LED module 70, a plurality of LEDs 42 to be turned on. In this case, heat generated in the LED module 40 is not easily radiated to the outside of the fluorescent tube. This has a problem of shortening the life of the LED 42.

또한, 엘이디모듈(40) 등을 보호하는 본체(10)가 반구형 베이스(12)와 캡(50)으로서 2원화되어 형성된다. 즉 이들을 따로따로 제작한 후 슬라이딩 결합시켜 사용하므로, 원가비용이 상승되고, 이들을 조립하는 작업성이 떨어지는 문제점을 갖는다.In addition, the main body 10 that protects the LED module 40 and the like is formed in a binary form as the hemispherical base 12 and the cap 50. That is, since they are manufactured separately and then used by sliding coupling, the cost cost is increased, and workability of assembling them is inferior.

또한, 본체(10)에 형성된 삽입부(62)와, 이와 대응되게 캡(50)에 형성된 대응삽입부(64)의 상호 요철결합에 의해 원통형 튜브를 형성하게 되므로, 엘이디모듈(40)을 포함한 베이스(12)의 자중(약 800g정도임)에 의해 분리될 경우 낙하로 인해 안전성 및 신뢰성이 떨어지는 문제점을 갖는다.In addition, since the cylindrical tube is formed by mutually uneven coupling between the insertion portion 62 formed in the main body 10 and the corresponding insertion portion 64 formed in the cap 50 corresponding thereto, the LED module 40 is included. When separated by the weight (about 800g) of the base 12 has a problem of falling safety and reliability due to falling.

또한, 베이스(12)와 캡(50)을 착탈수단에 의해 결합시킬 경우, 튜브형상의 중간정도에 엘이디모듈(40)이 배치되어 엘이디(42)와 이와 대향되는 캡(50)의 내측면 사이의 거리가 짧게 된다. 이로 인해 엘이디(42)를 점등시킬 경우 캡(50)에 엘 이디모듈(40)에 의한 그림자가 발생 되고(엘이디모듈(40)에 의한 잔상이 발생됨), 엘이디(42)의 조사각도가 제한 되므로 조명효율이 떨어지는 문제점을 갖는다.In addition, when the base 12 and the cap 50 are coupled to each other by a detachable means, the LED module 40 is disposed at an intermediate level in the shape of a tube so that the LED 42 and the inner surface of the cap 50 opposed thereto are disposed. The distance becomes shorter. Therefore, when the LED 42 is turned on, the shadow of the LED module 40 is generated in the cap 50 (afterimages are generated by the LED module 40), and the irradiation angle of the LED 42 is limited. There is a problem that the lighting efficiency is low.

본 고안의 실시예는, 엘이디모듈에 전원을 공급하는 전원PCB를 소켓에 장착하고 방열용 관통공을 소켓 측벽에 형성하여, 엘이디를 점등시 엘이디모듈로부터 발생되는 열을 형광등 튜브 외부로 쉽게 배출시킬수 있도록 한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등과 관련된다.According to an embodiment of the present invention, a power supply PCB for supplying power to an LED module is mounted in a socket, and a through hole for heat dissipation is formed in the side wall of the socket, so that the heat generated from the LED module when the LED is turned on can be easily discharged to the outside of the fluorescent tube. It relates to a fluorescent lamp using a light emitting diode having a power supply PCB in one socket.

본 고안의 실시예는, 엘이디모듈이 내부에 장착되는 원통형 튜브를 단일체로 형성함에 따라, 이의 제조가 용이하여 원가비용을 낮추고, 중량이 줄어들어 자중으로 인해 낙하되는 것을 방지할 수 있도록 한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등과 관련된다.According to an embodiment of the present invention, as the LED module is formed in a single cylindrical tube mounted therein, it is easy to manufacture the cost of the lower cost, and the weight is reduced to the power supply to the socket to prevent falling due to its own weight It relates to a fluorescent lamp using a light emitting diode equipped with a PCB.

본 고안의 실시예는, 원통형 튜브를 성형시 이의 일측에 방열핀용 요철부를 형성하여, 엘이디모듈에 장착되는 별도의 방열부재를 이용하지않고 방열효과를 높일 수 있도록 한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등과 관련된다.An embodiment of the present invention, when forming a cylindrical tube formed on the one side of the radiating fins uneven portion, the light emitting power provided with a power supply PCB in the socket to increase the heat dissipation effect without using a separate heat dissipation member mounted on the LED module Related to fluorescent lamps using a diode.

본 고안의 실시예에 의한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등은,Fluorescent lamp using a light emitting diode provided with a power supply PCB in the socket according to an embodiment of the present invention,

발광 다이오드를 이용한 형광등에 있어서,In a fluorescent lamp using a light emitting diode,

내측면에 결합홈이 대향되게 형성되고, 방열핀용 요철부가 일체형으로 형성 되는 튜브형상의 몸체와,A tube-shaped body in which a coupling groove is formed to face the inner side, and a concave-convex portion for radiating fins is integrally formed;

결합홈에 끼워맞춤되는 인쇄회로기판과, 인쇄회로기판에 일정간격을 유지하여 고정되는 다수개의 발광 다이오드를 구비하는 엘이디모듈과,An LED module having a printed circuit board fitted into the coupling groove, and a plurality of light emitting diodes fixed to the printed circuit board by maintaining a predetermined distance therebetween;

몸체 양단부에 끼워맞춤되며, 외부로부터의 전원을 엘이디모듈에 공급하는 한 쌍의 전원핀과, 전원핀을 통해 엘이디모듈에 공급되는 전원을 제어하는 전원PCB가 구비되는 소켓을 포함한다.Fitted at both ends of the body, and includes a pair of power pins for supplying power from the outside to the LED module, and a socket provided with a power PCB for controlling the power supplied to the LED module through the power pin.

바람직한 실시예에 의하면, 전술한 소켓에 형성되고, 엘이디의 점등시 엘이디모듈에 발생되는 열을 외부로 배출시키는 방열용 관통공을 포함한다.According to a preferred embodiment, it is formed in the above-described socket, and includes a heat dissipation through hole for discharging heat generated in the LED module to the outside when the LED is turned on.

전술한 바와 같이 구성되는 본 고안의 실시예에 의한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등은 아래와 같은 이점을 갖는다.The fluorescent lamp using the light emitting diode provided with the power PCB in the socket according to the embodiment of the present invention configured as described above has the following advantages.

엘이디모듈에 전원을 공급하는 전원PCB를 소켓에 장착하고 방열용 관통공을 소켓 측벽에 형성하여, 엘이디를 점등시 엘이디모듈로부터 발생되는 열을 형광등 튜브 외부로 쉽게 배출시켜 방열 효과를 상승시킬수 있다.The power supply PCB for supplying power to the LED module is mounted on the socket, and a through hole for heat dissipation is formed on the side wall of the socket. When the LED is turned on, the heat generated from the LED module can be easily discharged to the outside of the fluorescent tube to increase the heat dissipation effect.

또한, 엘이디모듈이 내부에 장착되는 원통형 튜브를 단일체로 형성함에 따라 이의 제조가 용이하여 원가비용을 낮출수 있다.In addition, since the LED module is formed as a single body of the cylindrical tube mounted therein, it is easy to manufacture the cost can be lowered.

또한, 원통형 튜브를 성형시 이의 일측에 방열핀용 요철부를 형성하여 엘이디모듈에 별도의 방열부재를 장착하는 작업공정이 불필요하다.In addition, when forming a cylindrical tube, there is no need for a work process for mounting a separate heat dissipation member on the LED module by forming an uneven portion for the heat dissipation fin on one side thereof.

이하, 본 고안의 바람직한 실시예를 첨부된 도면을 참조하여 설명하되, 이는 본 고안이 속하는 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있을 정도로 상세하게 설명하기 위한 것이지, 이로 인해 본 고안의 기술적인 사상 및 범주가 한정되는 것을 의미하지는 않는 것이다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, which are intended to be described in detail so that those skilled in the art to which the present invention pertains can be easily carried out, and thus the present invention It does not mean that the technical spirit and scope of the company is limited.

도 2 내지 도 4에 도시된 본 고안의 실시예에 의한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등은,The fluorescent lamp using a light emitting diode equipped with a power PCB in the socket according to the embodiment of the present invention shown in Figures 2 to 4,

발광 다이오드를 이용한 형광등에 있어서,In a fluorescent lamp using a light emitting diode,

내측면에 결합홈(100)이 대향되게 형성되고, 방열면적을 넓혀 발광 다이오드(104)(LED)로부터의 열을 방열시킴에 따라, 과열로 인한 발광 다이오드(104)의 손상을 방지하고 화재 발생을 방지할 수 있도록, 방열핀용 요철부(101)가 일체형으로 형성되는 튜브형상의 몸체(102)와,As the coupling groove 100 is formed on the inner side to face each other, and the heat dissipation area is widened to dissipate heat from the light emitting diode 104 (LED), thereby preventing damage to the light emitting diode 104 due to overheating and generating a fire. In order to prevent the heat dissipation fin concave-convex portion 101 is formed integrally with the tube-shaped body 102,

결합홈(100)에 슬라이딩 끼워맞춤되는 인쇄회로기판(103)(PCB)과, 인쇄회로기판(103)에 일정간격을 유지하여 고정되는 다수개의 발광 다이오드(104)(LED)를 구비하는 엘이디모듈(105)과,LED module having a printed circuit board 103 (PCB) slidingly fitted into the coupling groove 100 and a plurality of light emitting diodes 104 (LEDs) fixed by maintaining a predetermined distance to the printed circuit board 103. 105,

몸체(102) 양단부에 끼워맞춤되며, 외부로부터의 전원(100∼240Ⅴ)을 엘이디모듈(105)에 공급하는 한 쌍의 전원핀(106)과, 전원핀(106)을 통해 엘이디모듈(105)에 공급되는 전원을 제어하는 전원PCB(108)가 구비되는 소켓(107)을 포함한다.Fitted at both ends of the body 102, the LED module 105 through a pair of power pins 106 and a power pin 106 for supplying power (100 ~ 240V) from the outside to the LED module 105 It includes a socket 107 is provided with a power source PCB 108 for controlling the power supplied to.

전술한 소켓(107)의 측벽에 형성되고, 엘이디(104)의 점등시 엘이디모듈(105)에 발생되는 열을 외부로 배출시키는 방열용 관통공(112)을 포함한다.It is formed on the side wall of the socket 107 described above, and includes a heat radiation through-hole 112 for discharging the heat generated in the LED module 105 to the outside when the LED 104 is lit.

전술한 몸체(102)는 발광 다이오드(104)의 빛을 확산시킴에 따라 발광 다이오드(104)의 빛이 자연스럽게 확산되어 발광 다이오드(104)의 잔상을 제거시킬 수 있는 확산물질이 포함되는 반투명체의 PC재로 형성된다. 또는 전술한 몸체(102)는 발광 다이오드(104)의 빛을 확산시키는 확산물질이 포함되지않은 투명체의 PC재로 형성될 수 있다.As described above, the body 102 diffuses the light of the light emitting diode 104, so that the light of the light emitting diode 104 naturally diffuses, and the PC of the translucent body including a diffusion material capable of removing an afterimage of the light emitting diode 104 is included. It is formed of ash. Alternatively, the body 102 may be formed of a PC material of a transparent material that does not contain a diffusion material for diffusing light of the light emitting diode 104.

전술한 발광 다이오드(104)에 의한 열을 방출시키도록 인쇄회로기판(103)은 방열핀용 요철부(101)의 내측단(109)과 밀착되도록 결합홈(100)에 슬라이딩 끼워맞춤 된다.The printed circuit board 103 is slid and fitted into the coupling groove 100 to be in close contact with the inner end 109 of the heat dissipation fin uneven portion 101 so as to dissipate heat by the above-described light emitting diode 104.

전술한 엘이디모듈(105)과 이와 대향되는 몸체(102)의 내측벽(110)사이의 거리(L1)는, 엘이디모듈(105)과 이와 대향되는 방열핀용 요철부(101)의 외측단(111)사이의 거리(L2)보다 큰 것이다(L1 〉L2).The distance L1 between the above-described LED module 105 and the inner wall 110 of the body 102 opposite thereto is the outer end 111 of the LED module 105 and the uneven portion 101 for the heat dissipation fins opposite thereto. ) Is greater than the distance (L2) between (L1> L2).

이하에서, 본 고안의 실시예에 의한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등의 사용예를 첨부된 도면을 참조하여 상세하게 설명한다.Hereinafter, a use example of a fluorescent lamp using a light emitting diode equipped with a power PCB in a socket according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 3 및 도 4에 도시된 바와 같이, 전술한 발광 다이오드(104)와, 발광 다이오드(104)가 일정간격을 유지하여 실장된 인쇄회로기판(103)으로서 이루어진 엘이 디모듈(105)을, 원통형 튜브 형상의 몸체(102) 내측면에 대향되게 형성된 결합홈(100)에 슬라이딩 결합시킨다. 이때 원통형 몸체(102)가 단일체로 형성됨에 따라 원가비용을 절감하고, 이를 제조 및 조립하는 작업성을 향상시킬 수 있다.As shown in FIGS. 3 and 4, the LED module 105 including the above-described light emitting diode 104 and the printed circuit board 103 mounted with the light emitting diode 104 at a constant interval therebetween, Sliding coupling to the coupling groove 100 formed to face the inner surface of the body 102 of the cylindrical tube shape. In this case, as the cylindrical body 102 is formed as a single body, it is possible to reduce the cost cost and improve workability of manufacturing and assembling it.

전술한 엘이디모듈(105)에 도통가능하게 접속되도록 연결된 소켓(107)의 전원핀(106) 및 전원PCB(108)(미 도시된 커넥터를 통해 엘이디모듈(105)에 도통가능하게 접속됨)를 통해 공급되는 전원에 의해 발광 다이오드(104)를 점등시킬 경우, 발광 다이오드(104)로부터 발생되는 열을 몸체(102)에 형성된 방열핀용 요철부(101)를 통해 방열시킬 수 있다.The power pin 106 and the power PCB 108 of the socket 107 connected to the LED module 105 as described above are connected to the LED module 105 through a connector (not shown). When the light emitting diode 104 is turned on by the power supplied through the heat emitting diode 104, heat generated from the light emitting diode 104 may be radiated through the uneven portion 101 for the radiating fin formed on the body 102.

즉 방열핀용 요철부(101)에 의해 방열면적을 증대시키고, 엘이디모듈(105)을 방열핀용 요철부(101)의 내측단(109)에 밀착되도록 고정시킴에 따라, 발광 다이오드(104)로부터 발생되는 열을 효율적으로 낮출 수 있다.That is, as the heat dissipation area is increased by the heat dissipation fin uneven parts 101, and the LED module 105 is fixed to the inner end 109 of the heat dissipation fin uneven parts 101, it is generated from the light emitting diode 104. It is possible to lower the heat to be efficiently.

전술한 엘이디모듈(105)에 공급되는 전원을 제어하는 전원PCB(108)를, 엘이디모듈(105)로부터 분리시켜 소켓(107)에 장착함에 따라, 발광 다이오드(104)를 점등시킬 경우 원통형 튜브 내에 발생되는 열로 인해 고온이 형성되는 것을 방지할 수 있다. 또한 엘이디모듈(105)에 발생되는 열은 소켓(107)의 측벽에 형성된 방열용 관통공(112)을 통해 외부로 신속하게 배출시켜 방열시킬 수 있다.As the power supply PCB 108 for controlling the power supplied to the LED module 105 described above is detached from the LED module 105 and mounted in the socket 107, the light emitting diode 104 is turned on in the cylindrical tube. It is possible to prevent the formation of high temperature due to the heat generated. In addition, heat generated in the LED module 105 may be quickly discharged to the outside through the heat radiation through-holes 112 formed in the side wall of the socket 107 to radiate heat.

전술한 바와 같이, 엘이디모듈(105)에 전원을 공급하는 전원PCB(108)를 엘이디모듈(105)로부터 분리시켜 소켓(107)에 장착하고 소켓(107) 측벽에 방열용 관통공(112)을 형성할 경우 엘이디(104)를 점등시 엘이디모듈(105) 주변에서 측정되는 온도값은, 엘이디모듈(105)에 전원PCB를 장착하여 엘이디(104)를 점등시 엘이디모 듈(105) 주변에서 측정되는 온도값보다 10℃ 낮게됨을 확인할 수 있었다.As described above, the power supply PCB 108 for supplying power to the LED module 105 is separated from the LED module 105 to be mounted on the socket 107, and the through hole 112 for heat dissipation is formed on the side wall of the socket 107. When formed, the temperature value measured around the LED module 105 when the LED 104 is turned on is measured around the LED module 105 by mounting a power PCB to the LED module 105 to turn on the LED 104. It could be confirmed that the temperature is lower than 10 ℃.

전술한 튜브형 몸체(102)가 확산물질이 포함된 반투명체의 PC재로 형성됨에 따라, 발광 다이오드(104)를 점등시킬 경우, 발광 다이오드(104)로부터의 빛이 자연스럽게 확산되어 발광 다이오드(104)의 잔상을 제거할 수 있다(즉 발광 다이오드(104)의 조도를 높일 수 있다.).As the above-described tubular body 102 is formed of a PC material of a translucent body containing a diffusion material, when the light emitting diode 104 is turned on, light from the light emitting diode 104 is naturally diffused to cause an afterimage of the light emitting diode 104. Can be eliminated (that is, the illuminance of the light emitting diode 104 can be increased).

전술한 엘이디모듈(105)과 이와 대향되는 몸체(102)의 내측벽(110)사이의 거리(L1)는, 엘이디모듈(105)과 이와 대향되는 방열핀용 요철부(101)의 외측단(111)사이의 거리(L2)보다 크게 된다(L1 〉L2). 이로 인해 발광 다이오드(104)를 점등시킬 경우 몸체(102)의 내측벽(110)에 그림자 형성되는 것을 방지할 수 있다.The distance L1 between the above-described LED module 105 and the inner wall 110 of the body 102 opposite thereto is the outer end 111 of the LED module 105 and the uneven portion 101 for the heat dissipation fins opposite thereto. ) Is larger than the distance L2 (L1 > L2). Therefore, when the light emitting diode 104 is turned on, shadows may be prevented from being formed on the inner wall 110 of the body 102.

도 1은 종래 기술에 의한 발광 다이오드를 이용한 형광등의 분해사시도,1 is an exploded perspective view of a fluorescent lamp using a light emitting diode according to the prior art,

도 2는 본 고안의 실시예에 의한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등의 사시도,2 is a perspective view of a fluorescent lamp using a light emitting diode having a power supply PCB in the socket according to an embodiment of the present invention,

도 3은 본 고안의 실시예에 의한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등의 분해사시도,3 is an exploded perspective view of a fluorescent lamp using a light emitting diode having a power supply PCB in the socket according to an embodiment of the present invention,

도 4는 본 고안의 실시예에 의한 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등의 결합단면도이다.4 is a cross-sectional view of a fluorescent lamp using a light emitting diode provided with a power supply PCB in the socket according to an embodiment of the present invention.

*도면중 주요 부분에 사용된 부호의 설명* Explanation of symbols used in the main part of the drawing

100; 결합홈100; Combined groove

101; 방열핀용 요철부101; Uneven part for heat radiation fin

102; 몸체102; Body

103; 인쇄회로기판(PCB)103; Printed Circuit Board (PCB)

104; 발광 다이오드(LED)104; Light Emitting Diode (LED)

105; 엘이디모듈(LED module)105; LED module

106; 전원핀106; Power pin

107; 소켓107; socket

108; 전원PCB108; Power PCB

109; 내측단109; Medial end

110; 내측벽110; Inner wall

111; 외측단111; Outer end

112; 방열용 관통공112; Through hole for heat dissipation

Claims (2)

삭제delete 내측면에 결합홈이 대향되게 형성되고, 방열핀용 요철부가 일체형으로 형성되는 튜브형상의 몸체와,A tube-shaped body in which a coupling groove is formed to face the inner side, and an uneven portion for the heat dissipation fin is integrally formed; 상기 결합홈에 끼워맞춤되는 인쇄회로기판과, 인쇄회로기판에 일정간격을 유지하여 고정되는 다수개의 발광 다이오드를 구비하는 엘이디모듈과,An LED module having a printed circuit board fitted into the coupling groove, and a plurality of light emitting diodes fixed at a predetermined interval on the printed circuit board; 상기 몸체 양단부에 끼워맞춤되며, 외부로부터의 전원을 엘이디모듈에 공급하는 한 쌍의 전원핀과, 전원핀을 통해 엘이디모듈에 공급되는 전원을 제어하는 전원PCB가 구비되는 소켓을 포함하여 이뤄지는 발광 다이오드를 이용한 형광등에 있어서,A light emitting diode fitted to both ends of the body, the light emitting diode comprising a pair of power pins for supplying power from the outside to the LED module and a power PCB for controlling the power supplied to the LED module through the power pin. In the fluorescent lamp using, 상기 소켓의 측벽에 형성되고, 엘이디의 점등시 엘이디모듈에 발생되는 열을 외부로 배출시키는 방열용 관통공을 포함하는 것을 특징으로 하는 소켓에 전원PCB가 구비된 발광 다이오드를 이용한 형광등.The fluorescent lamp using a light emitting diode provided with a power supply PCB in the socket, characterized in that formed on the side wall of the socket, the heat dissipation through-holes for discharging the heat generated by the LED module to the outside when the LED is turned on.
KR2020090011284U 2009-08-28 2009-08-28 a fluorescent lamp using LED with mounting electric power PCB on socket KR200457758Y1 (en)

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KR101239084B1 (en) * 2011-04-20 2013-03-06 이효찬 Socket
KR200469209Y1 (en) * 2012-04-05 2013-09-27 유현임 Cap of fluorescent lamp type led lamp
KR200469297Y1 (en) * 2013-04-05 2013-10-04 (주)파트론정밀 Bar shape LED night light
CN104235652B (en) * 2014-09-18 2017-03-29 彭雯 Multijaw radial elastic support axial compression glass LED light pipe and manufacture method

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KR20030014952A (en) * 2001-08-13 2003-02-20 김부현 Fluorescence light led use fluorescence lamp
KR20080005381A (en) * 2005-03-30 2008-01-11 램 리써치 코포레이션 Etch profile control
KR20080093527A (en) * 2007-04-17 2008-10-22 주식회사 대진디엠피 Led lighting apparatus

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KR20030014952A (en) * 2001-08-13 2003-02-20 김부현 Fluorescence light led use fluorescence lamp
KR20080005381A (en) * 2005-03-30 2008-01-11 램 리써치 코포레이션 Etch profile control
KR20080093527A (en) * 2007-04-17 2008-10-22 주식회사 대진디엠피 Led lighting apparatus

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