KR200426873Y1 - A LED module - Google Patents

Abstract

The present invention relates to an LED module that is installed on the outer wall or roof of a building and applied to advertising and decorative advertising panels for advertisement of a product or decoration of a building.

This invention is in the LED module used for advertising or decoration;

A PCB substrate on which one or more LED lamps are installed and fixed; Power lines connected to both ends of the PCB substrate; A hollow base plate for binding and supporting the PCB substrate such that the PCB substrate is inserted from the rear surface to allow the LED lamp to protrude outwardly; A cover member fixed to the top of the base plate to block contact of fine dust or foreign matter with the LED lamp protruding outward; It is characterized by consisting of a sealing member for filling the lower side of the base plate to which the PCB substrate is bound to seal both ends of the PCB substrate to which the power line is connected.

In addition, the substrate seating portion for mounting the PCB substrate inwardly from both ends of the base plate is projected apart, characterized in that both ends of the base plate is formed higher than the height of the PCB substrate seated on the substrate mounting portion.

And, when the PCB substrate is mounted on the substrate mounting portion, it is characterized in that the space between the both ends of the PCB substrate and the inner surface of both ends of the base plate.

Therefore, according to the present invention, while assembling the PCB according to the simultaneous filling of the sealing member by the multiple injection of the base plate in the state in which the PCB substrate is seated on the substrate mounting portion protruding spaced inside both ends of the base plate, Filling the sealing member by multiple injection of the lower part of the base plate through the gap between both ends and the inner surface of both ends of the base plate flows into both ends of the PCB board connected to the power line, and the base plate is lowered by the multiple injection and both sides of the PCB board. Since the sealing is done at one time to the power line connected to the stage, the LED lamp and the power line fixed to the PCB substrate by rainwater, as well as the fixing force to block the flow of the power line and the PCB substrate on the base plate, as well as blocking the inflow of fine dust There is an excellent effect such that the waterproof effect can be increased.

In addition, by ultrasonic welding of a semi-spherical cover member, which is a transparent synthetic resin material on the top of the base plate having an open hole in the LED module of the present invention for the position and irradiation of the LED lamp, with frequent breakage of the LED lamp due to external protrusion from the case The LED lamp can be more effectively protected from external forces than in the past, which had a great influence on the roughness due to the attachment of fine dust, and the base plate and the cover member were fused using ultrasonic waves to prevent fine dust and rain from entering the LED lamp. As water is also blocked, there is also an effect that can be used for a long time compared to the same external environment.

LED module, LED lamp, PCB board, base board, cover member, sealing member, board mounting part, gap between both ends of PCB board and inner side of both ends of base board, advertising panel

Description

LED module {A LED module}

Figure 1a is a schematic diagram showing a conventional LED module.

1b is a cross-sectional view of a conventional LED module.

Figure 2 is an exploded perspective view of the LED module of the present invention.

3 is a cross-sectional view of the LED module of the present invention.

Figure 4 is a rear perspective view of the base plate of the LED module of the present invention.

5 is a state diagram using the LED module of the present invention.

Explanation of symbols on the main parts of the drawings

1a. LED Module 10. PCB Board

12. LED lamp 14. Power line

20a. Base plate 21. Power line exhaust groove

22. Board mounting part 23. Opening hole

30. Sealing member 40. Cover member

41. Junctions s. Gap

The present invention relates to an LED module, and more particularly, both ends and the base plate of the PCB substrate seated through the substrate seating part by protruding the substrate seating portion to the inside of both ends of the base plate for holding the PCB substrate, the LED lamp is fixed By forming a gap between the inner surface of both ends for filling a large injection of the sealing member and at the same time by forming a transparent cover member on the top of the base plate by ultrasonic fusion, the PCB seating portion protruding from both ends of the base plate While the assembly is easy due to the simultaneous filling of the sealing member by the multiple injection of the base plate while the substrate is seated, it is possible to use the multiple injection of the lower part of the base plate through the gap between both ends of the PCB substrate and the inner surface of both ends of the base plate. When filling the sealing member by the inflow to both ends of the PCB board connected to the power line, Since the sealing is made to the lower part of the base plate and the power lines connected to both ends of the PCB board at a time, the fixing force to block the flow of the power line and the PCB board on the base plate, as well as blocking the inflow of fine dust The present invention relates to an LED module for increasing the waterproof effect of an LED lamp and a power line fixed to a PCB substrate.

In general, various types of advertising panels are used for advertisement or decoration, and in this case, a separate advertising device is used in the case of a conventional advertising panel so that people can easily recognize advertisement contents even at night.

As such an illumination device, it is common to use an illumination lamp such as a fluorescent lamp or a neon lamp.

However, in the case of such a lamp, because its life is short, the power consumption also has a lot of problems, such as the need to replace the lamp from time to time.

Therefore, in recent years, various attempts have been made to apply LEDs to semi-permanent, relatively low power consumption LED panels.

As described above, in the case of the conventional LED module 1, as shown in FIGS. 1A and 1B, a PCB substrate 10 having one or more LED lamps 12 fixed thereto is installed in a rectangular or square case 20. Epoxy, which is a sealing material 30, is filled in the case 20 while only the upper end of the LED lamp 12 is exposed, so that the PCB substrate 10 together with the LED lamp 12 is fixed within the case 20 to form a fixed module state. Consists of.

In the case of the conventional LED module 1 configured as described above, in order to fix the PCB substrate 10 to which the LED lamp 12 is fixed in the case 20, the case 20 is manually operated by an operator using epoxy or silicon. Since the sealing operation of the power line 14 connected to both ends of the LED lamp 12 and the PCB substrate 10 for the work process and work time is increased accordingly, LED module (1) There was also a problem that greatly affects the increase in labor costs and labor costs.

In the sealing operation of the conventional LED module 1, the lower end of the LED lamp 12 from the PCB substrate 10 in a state in which the PCB substrate 10 in which the LED lamp 12 is fixed in the case 20 is coupled. Since the worker manually seals the sealing material 30 by epoxy or silicon, the uniform sealing work of the LED module 1 is not performed, and thus, the PCB substrate 10 is fixed in the case 20. This is not completely made and the power line 14 of both ends of the PCB substrate 10 due to the flow is broken, leading to a failure of the inoperative state, as well as the sealing operation is not made as described above Problems such as a malfunction caused by the LED lamp 12 having the excellent action toward the LED module 1 and seeping into the gap between the LED lamp 12 and the PCB substrate 10 or between the sealing part and the case 20 may cause malfunction. there was.

In addition, in the case of epoxy, which is a sealing material 30 of the conventional LED module 1, after filling in the case 20, it takes 6 hours in summer and 10 hours in winter during natural drying. In addition to the deterioration, there is a disadvantage that the management of the LED module 1 during the drying is very cumbersome, and in particular, in the case of the above-mentioned epoxy, since environmental hormones, which are environmentally harmful substances, are discharged, they rise as a hotbed of environmental pollution. There was a problem too.

In addition, in the case of the conventional LED module 1, the LED lamp 12 is fixed in a state fixed to the PCB substrate 10 in the case 20, the LED lamp 12 is the front of the case 20 Due to the structure of the state exposed to the outside, when the external force acts, the LED lamp 12 frequently breaks, and there is a need to replace it frequently. Particularly, when the LED lamp 12 is exposed to the outside as described above, fine dust When they are attached to the LED lamp 12 exposed to the outside, when used for a long time there was also a problem such that the efficiency of the overall lamp 12 roughness is also greatly reduced by the fine dust attached on the LED lamp 12.

The present invention devised in order to solve the above-described conventional problems, by protruding the substrate seating portion spaced apart in the both ends of the base plate for holding the PCB substrate to which the LED lamp is fixed among the components of the LED module through the substrate seating portion The gap between the both ends of the seated PCB and the inner surface of both ends of the base plate is formed so as to form a gap for filling the multiple injection of the sealing member. The assembling work by the simultaneous filling of the sealing members becomes very simple, and the sealing work of the LED lamp and the PCB board in the base plate, which has been done manually by the conventional method, is converted into an automated process, and the overall assembly work of the LED lamp is also a simple process. The purpose is to make it happen.

In addition, as described above, the sealing member of the lower part of the base plate through the gap between the both ends of the PCB substrate and the inner surface of both ends of the base plate seated on the substrate seating part of the LED module of the present invention as the sealing member In the filling operation of the base plate is introduced into the both ends of the PCB substrate connected to the power line 14 is sealed at a time to the power line 14 connected to the lower side of the base plate and the both sides of the PCB substrate by multiple injections on the base plate Fixing power to block the flow of the power line 14 and the PCB substrate, as well as blocking the inflow of fine dust has another purpose to increase the waterproof effect of the LED lamp and power line fixed to the PCB substrate by rainwater.

In addition, by ultrasonic welding of a hemispherical cover member, which is a transparent synthetic resin material, on the top of the base plate having an open hole in the LED module of the present invention for the position and irradiation of the LED lamp, frequent occurrence of the LED lamp according to the external protrusion from the case 20 In addition to the damage, the LED lamp can be more effectively protected from external forces than in the past, which had a great influence on the roughness due to the attachment of fine dust. Also, since the base plate and the cover member are fused using ultrasonic waves, fine dust flowing into the LED lamp side And it also has another purpose to allow long-term use compared to the same external environment by blocking the moisture by rain.

LED module of the present invention, in the LED module used for advertising or decoration;

A PCB substrate on which one or more LED lamps are installed and fixed;

Power lines connected to both ends of the PCB substrate;

A hollow base plate for binding and supporting the PCB substrate such that the PCB substrate is inserted from the rear surface to allow the LED lamp to protrude outwardly;

A cover member fixed to the top of the base plate to block contact of fine dust or foreign matter with the LED lamp protruding outward;

It is characterized by consisting of a sealing member for filling the lower side of the base plate to which the PCB substrate is bound to seal both ends of the PCB substrate to which the power line is connected.

Here, the base plate is formed in a rectangular shape in which a rectangular open hole is formed in the center of the top so that the LED lamp protrudes to the outside when combined with the PCB substrate, power lines connected to both ends of the PCB substrate at the center of both ends of the base plate Characterized in that the power line discharge groove is formed in the "U" shape to be discharged to the outside of the plate.

In addition, the substrate seating portion for mounting the PCB substrate inwardly from both ends of the base plate is characterized in that the projecting apart.

And, both ends of the base plate is characterized in that formed higher than the height of the PCB substrate seated on the substrate mounting portion.

In addition, the gap between the two ends of the PCB substrate and the inner surface of the both ends of the base plate is formed when the PCB substrate is seated in the substrate mounting portion.

On the other hand, the cover member is formed in a hemispherical shape made of a transparent synthetic resin material so as not to affect the illuminance of the LED lamp irradiated to the outside, and ultrasonically fused the cover member on the top of the base plate to prevent separation from the base plate It is characterized by.

The sealing member is formed of a synthetic resin material, and the sealing operation for sealing the lower portion of the base plate on which the PCB substrate is bound is made by simultaneous injection of the lower portion of the base plate by multiple injection.

Hereinafter, the LED module of the present invention will be described in detail in comparison with the drawings.

2 is an exploded perspective view of the LED module of the present invention, Figure 3 is a cross-sectional view of the LED module of the present invention, Figure 4 is a rear perspective view of the base plate of the LED module of the present invention.

In addition, Figure 5 shows a state diagram using the LED module of the present invention.

Before describing the LED module of the present invention in detail, the same reference numerals will be applied to the same structure of the conventional LED module.

Accordingly, the LED module 1a of the present invention is a main body of an advertisement panel applied to an advertisement or a decoration and installed on an exterior wall or a roof of a building, and as shown in FIGS. 2 and 3, one or more LED lamps 12 are provided. A PCB substrate 10 fixed to the installation; Power lines 14 connected to both ends of the PCB substrate 10; A hollow base plate (20a) for binding and supporting the PCB substrate (10) such that the PCB substrate (10) is inserted from the rear surface to allow external projection of the LED lamp (12); A cover member 40 fixed to an upper end of the base plate 20a to block contact of fine dust or foreign matter with the LED lamp 12 protruding to the outside; It is composed of a sealing member 30 is filled in the lower portion of the base plate 20a to which the PCB substrate 10 is bound to seal both ends of the PCB substrate 10 to which the power line 14 is connected.

At this time, the base plate 20a of the LED module 1a of the present invention configured as described above is combined with the PCB substrate 10 to support and protect the PCB substrate 10, as shown in FIG. As described above, the LED lamp 12 is formed of a rectangular synthetic resin material having a rectangular opening hole 23 formed at the center of the upper end so that the LED lamp 12 protrudes to the outside when the PCB substrate 10 is coupled to the PCB substrate 10. Both ends of the base plate 20a are formed. That is, power lines 14 connected to both ends of the PCB board 10 are discharged to the outside of the base plate 20a at the centers of the left and right ends so as to be connected to a power line (not shown). 21) an incision is formed.

In addition, both sides of the base plate 20a may have a substrate seating portion spaced apart from the both ends of the base plate 20a to the inside where the opening hole 23 is formed so as to seat the PCB substrate 10 in the base plate 20a. 22 is formed to protrude. At this time, both ends of the base plate 20a may be filled and sealed to the sealing member 30 in the lower portion in the state in which the PCB substrate 10 is seated on the substrate seating portion 22. The substrate mounting portion 22 is formed higher than the overall height of the PCB substrate 10 is seated.

In addition, when the PCB substrate 10 is seated on the substrate seating portion 22 formed in the coupling relationship between the base plate 20a and the PCB substrate 10 inwardly spaced from both ends of the base plate 20a, the PCB substrate 10 As the gap s between the two ends of the base 10 and the inner side surfaces of both ends of the base plate 20a is formed, the sealing member 30 filled from the lower portion of the base plate 20a is formed on the base. Fine dust is excellent as well as the inflow sealing of both ends of the PCB substrate 10, that is, both ends of the PCB substrate 10 connected to the power line 14, through the gap s between the plate 20a and the PCB substrate 10. Water inflow by is also blocked.

On the other hand, in the case of the cover member 40 of the LED module (1a) of the present invention by a transparent synthetic resin material so as not to affect the roughness of the LED lamp 12 irradiated to the outside as shown in Figs. It is formed in a hemispherical shape and at both sides of the joint portion 41 for fusion-fixing the cover member 40 on the top of the base plate 20a by using ultrasonic waves to prevent separation of the cover member 40 from the base plate 20a ) Is formed.

As such, when the cover member 40 is ultrasonically fused to the top of the base plate 20a, the LED lamp 12 protruding outside the front of the base plate 20a through the opening hole 23 is protected from external force. At the same time, the fine dust is attached to the LED lamp 12 can achieve a characteristic effect, such as to prevent the overall illuminance is lowered.

In addition, the sealing member 30 of the LED module 1a of the present invention is made of a synthetic resin material as shown in FIGS. 2 and 3, and in particular, the base plate 20a on which the PCB substrate 10 is bound. The sealing operation of the sealing member 30 for the sealing of the LED lamp for the case 20 using an epoxy or silicon, as it is made of an automated process in which the simultaneous filling of the bottom of the base plate 20a is made by multiple injections ( 12) and the work process and working time can be significantly shortened compared to the conventional method of manually sealing the power line 14, and at the same time, the sealing member 30 of the sealing member 30 by the multiple injection into the base plate 20a is lowered. The sealing operation is introduced into and sealed to both ends of the PCB substrate 10 connected to the power line 14 through a gap s between the both ends of the PCB substrate 10 and the inner surfaces of both ends of the base plate 20a. Powerline 14 and PC on 20a) The fixing force to block the flow of the B substrate 10 is increased, and the waterproof effect of the LED lamp 12 and the power line 14 fixed to the PCB substrate 10 by fine dust as well as the water is also greatly increased. The effect can be achieved.

In addition, in the case of the LED lamp 12 which is the main body of the advertising panel applied to the advertising or decoration of the LED module (1a) of the present invention full color (full color) color-specific lamp 12 that can irradiate various colors Is installed on the PCB substrate 10, the PCB substrate 10 is applied to the LED lamp 12 is formed in the same shape as the base plate 20a, the length of the PCB substrate as described above Sizes positioned between both ends of the base plate 20a and the substrate seating portion 22 so that a gap s between the two ends of the base 10 and the inner side surfaces of both ends of the base plate 20a is formed. Consists of

In addition, the LED module 1a of the present invention is installed on an advertisement panel applied to an advertisement or a decoration as shown in FIG. 5 and fixed to an exterior wall or a roof of a building to be used for advertisement of a product or decoration of a building.

In the case of the LED module 1a of the present invention configured as described above, the substrate mounting portion 22 protrudes spaced apart from both ends of the base plate 20a for holding and supporting the PCB substrate 10 on which the LED lamp 12 is fixed. In the state in which the PCB substrate 10 is seated, the assembling operation is easy due to the simultaneous filling of the sealing member 30 by the multiple injection into the base plate 20a and the PCB substrate 10 is placed on the substrate seating part 22. Simultaneous filling of the sealing member 30 by multiple injection of the lower part of the base plate 20a through a gap s between the both ends of the PCB substrate 10 formed by the seat and the inner surface of both ends of the base plate 20a. Sealing is made at both ends of the PCB board 10 connected to the power line 14 to the power line 14 connected to both ends of the base board 20a and the PCB board 10 by the multiple injection. Therefore, to block the flow of the power line 14 and the PCB substrate 10 on the base plate 20a Tack, as well as the waterproof effect of the LED lamp 12 and the power line 14 is fixed to the PCB substrate 10 by a solid block with the inlet of the fine dust is also useful in the design of such is to be greatly enhanced.

In addition, by the ultrasonic welding of the hemispherical cover member 40 which is a transparent synthetic resin material on the top of the base plate 20a to which the PCB substrate 10 is fixed and fixed, the LED lamp 12 according to the external protrusion from the case 20. In addition to the frequent breakage of the large impact on the roughness due to the attachment of fine dust can more effectively protect the LED lamp 12 from the external force, and using the ultrasonic base plate 20a and the cover member 40 It is another effective and useful design, such as being able to use for a long time compared to the same external environment by blocking the fine dust and moisture due to rain also flows into the LED lamp 12 side.

As described above, the above-described embodiment is described with reference to the most preferred example of the present invention, but is not limited to the above embodiment, and it will be apparent to those skilled in the art that various modifications are possible without departing from the technical spirit of the present invention. .

LED module according to the present invention, both ends and the base plate of the PCB substrate seated through the substrate mounting portion by protruding the space between the substrate mounting portion inside the both ends of the base plate for holding the PCB substrate to which the LED lamp is fixed among the components of the LED module By forming a gap between the inner surface of both ends for filling the multiple injection of the sealing member, the assembly work according to the simultaneous filling of the sealing member by the multiple injection in the base plate in the state in which the PCB substrate is seated in the substrate mounting portion In addition to this very simple, the conventional assembly of the LED lamp and the PCB substrate in the base plate, which has been made manually, has been converted into an automated process, and thus the overall assembly of the LED lamp can also be accomplished in a simple process. .

In addition, as described above, the sealing member of the lower part of the base plate through the gap between the both ends of the PCB substrate and the inner surface of both ends of the base plate seated on the substrate seating part of the LED module of the present invention as the sealing member During the filling operation of the power line and the PCB substrate on the base plate because the sealing flows to both ends of the base board connected to the power line and to the power line connected to both ends of the base board and the PCB board by multiple injection As well as the fixing force to block the flow, as well as blocking the inflow of fine dust, the waterproof effect of the LED lamp and power line fixed to the PCB substrate by rainwater can be increased.

In addition, by ultrasonic welding of a semi-spherical cover member, which is a transparent synthetic resin material, on the top of the base plate having an open hole in the LED module of the present invention for the position and irradiation of the LED lamp, with frequent breakage of the LED lamp due to external protrusion from the case The LED lamp can be more effectively protected from external forces than in the past, which had a great influence on the roughness due to the attachment of fine dust, and the base plate and the cover member were fused using ultrasonic waves to prevent fine dust and rain from entering the LED lamp. As water is also blocked, there is an effect that can be used for a long time compared to the same external environment.

Claims (7)

An LED module used for advertising or for decoration; A PCB substrate on which one or more LED lamps are installed and fixed; Power lines connected to both ends of the PCB substrate; A hollow base plate for binding and supporting the PCB substrate such that the PCB substrate is inserted from the rear surface to allow the LED lamp to protrude outwardly; A cover member fixed to the top of the base plate to block contact of fine dust or foreign matter with the LED lamp protruding outward; LED module, characterized in that consisting of a sealing member that is filled in the lower portion of the base plate to which the PCB substrate is bound to seal both ends of the PCB substrate to which the power line is connected. The base plate of claim 1, wherein the base plate is formed in a rectangular shape in which a rectangular open hole is formed at the center of the top so that the LED lamp protrudes to the outside when the base plate is coupled to the PCB board. LED module, characterized in that the "U" shaped power line discharge groove is formed so that the connected power line is discharged to the outside of the base plate. The LED module according to claim 2, wherein a substrate seating portion for protruding the PCB substrate from the opposite ends of the base plate is spaced apart from each other. 4. The LED module according to claim 3, wherein both ends of the base plate are formed higher than a height at which the PCB substrate is seated on the substrate seating portion. The LED module according to claim 4, wherein a gap between the two ends of the PCB substrate and the inner surfaces of both ends of the base plate is formed when the PCB substrate is mounted on the substrate mounting portion. The cover member of claim 1, wherein the cover member is formed in the shape of a hemisphere by a transparent synthetic resin material so as not to affect the illuminance of the LED lamp irradiated to the outside, and the cover member on the top of the base plate to prevent separation from the base plate. LED module characterized in that the ultrasonic fusion. The method of claim 1, wherein the sealing member is formed of a synthetic resin material, the sealing operation for sealing the lower portion of the base plate to which the PCB substrate is bound is a multiple injection, the LED is characterized in that the simultaneous filling of the lower portion of the base plate module.

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