KR200411526Y1 - Thermal overload relay having a rotatable trip-indicating device - Google Patents

Abstract

The present invention provides a thermal compensation bimetal composed by stacking a plurality of bimetal layers having a thin thickness, thereby improving mechanical strength and increasing sensitivity to temperature, thereby improving the temperature for an environment where a thermal overload relay is used. The present invention relates to a thermal overload relay having a thermal compensation bimetal having excellent mechanical characteristics and less deformation due to a mechanical impact. The present invention relates to a thermal overload relay, and includes a main bimetal that curves when an overcurrent occurs in a main circuit. The shift is installed to be horizontally moved by the main bimetal, the release lever rotated by the pressing force transmitted from the shift, and the state separated from the corresponding terminal during normal operation. In contact with the corresponding terminal The reverse mechanism part and one end of which is transmitted is mounted on one side of the release lever, the other end is in contact with the shift, and a plurality of bimetal layers are stacked to provide a temperature compensation bimetal for transferring the pressing force generated in the shift to the release lever. It provides a thermal overload relay, characterized in that comprising a.

Main bimetal, shift, release lever, reverse mechanism part, temperature compensation bimetal, bimetal layer

Description

Thermal Overload Relay with Rotating Trip Indicator {THERMAL OVERLOAD RELAY HAVING A ROTATABLE TRIP-INDICATING DEVICE}

1 to 3 show a conventional thermal overload relay,

1 is a perspective view of a conventional thermal overload relay.

FIG. 2 is a longitudinal cross-sectional view of the thermal overload relay along line II-II of FIG. 1.

3 is a side view showing the configuration of the temperature compensation bimetal provided in the conventional thermal overload relay.

4 to 7 illustrate a thermal overload relay according to an embodiment of the present invention,

4 and 5 are a side view and a perspective view showing the configuration of the temperature compensation bimetal provided in the thermal overload relay according to an embodiment of the present invention.

6 and 7 are cross-sectional views showing a normal energized state and a tripped state of the thermal overload relay according to the embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: main terminal 10 ': auxiliary terminal

11: heater 12: lower case

13: main bimetal 14: heater

15: shift 16: shift ring

21: opening and closing mechanism 22: upper case

23: release lever 24: temperature compensation bimetal

25 pressurization portion 26 inversion mechanism portion

28: reverse spring 29: reset button

30: upper cover 31: auxiliary holder

33: exposed part 100: temperature compensation bimetal

101, 102, 103: bimetal layer

The present invention provides a thermal compensation bimetal composed by stacking a plurality of bimetal layers having a thin thickness, thereby improving mechanical strength and increasing sensitivity to temperature, thereby improving the temperature for an environment where a thermal overload relay is used. The present invention relates to a thermal overload relay having a thermal compensation bimetal having excellent mechanical characteristics and less deformation due to mechanical impact. The present invention relates to a thermal overload relay.

In general, thermal overload relay forms an electromagnetic switch together with a magnetic contactor to prevent the motor from being burned out by tripping the circuit after a predetermined time when the current supplied to the motor becomes higher than a preset current value. It is an electric device.

Typically, in the case of an AC motor, an alternating current of three phases (R, S, T) flows in the interior thereof.At this time, any one of the three phases is broken so that no current flows (phase). As the concentration is concentrated or the temperature rises in the event of overload or overcurrent, the winding is burned out. To prevent this, the motor usually has an overload relay as described above to prevent burnout during overload or phase loss. Connect and use.

A detailed configuration of the above-described overload relay will be described with reference to FIGS. 1 to 3.

1 to 3 show a conventional thermal overload relay, FIG. 1 is a perspective view of a conventional thermal overload relay, and FIG. 2 is a longitudinal cross-sectional view of the thermal overload relay along the line II-II of FIG. 1. to be.

1 and 2, the conventional thermal overload relay is largely connected to a circuit between a power supply and a load, that is, a motor, as shown in FIGS. 1 and 2, and a heater unit 11 located under the overload relay that generates heat when an overcurrent or an image occurs In order to interlock with the curvature of the main bimetal 13 that curves in accordance with the heat generated by the heater 11 in the heater 11, an opening / closing mechanism 21 located at an upper portion of the overload relay for opening and closing the circuit between the power and the load. Can be distinguished.

Here, the lower case (12) inside the main bimetal 13, the heater (14), the heater (14), the main bimetal 13, which is connected to the drive driving 11 connected to the main bimetal 13 In accordance with this, a horizontal shifter 15 is incorporated, and externally, three main terminals 10 (for three-phase alternating current) to which a power supply side wire is connected are provided.

In addition, the upper case 22 connected to the upper portion of the lower case 12 includes a release lever 23, an inversion mechanism 26, a reset button 29, and an auxiliary holder 31 that constitute the opening / closing mechanism 21. ) Is built in.

Here, the release lever 23 provided in the upper case 22 is provided with a temperature compensation bimetal 24, and rotates in association with the rotation of the temperature compensation bimetal 24 to rotate the central portion of the inversion mechanism 26. And a pressurizing portion 25 protruding to push down the 27.

The reversal mechanism portion 26 includes a central portion 27 and a reversal spring 28 fitted between the central portion 27 and the reversal mechanism portion 26. In the normal energized state, the central portion 27 is the reversal mechanism portion. Lifted up (26) and this state is configured to be held by the reversing spring (28).

Here, a detailed configuration of the temperature compensation bimetal 24 provided at one side of the release lever 23 will be described with reference to FIG. 3.

3 is a side view showing the configuration of the temperature compensation bimetal provided in the conventional thermal overload relay.

As shown in FIG. 3, the temperature compensation bimetal 24 is configured to rotate in a counterclockwise direction with reference to the direction of FIG. 2 in conjunction with the shift of the shift ring 16. It is composed of materials of different materials with different coefficients of thermal expansion so that they can bend according to the change of.

That is, the temperature compensation bimetal 24 transmits the pressing force transmitted from the shift ring 16 to the release lever 23 as the shift 15 moves in parallel, thereby causing the release lever 23 to be released. It is configured to rotate to open and close the terminal provided in the inverting mechanism (26).

However, the shift 15 is often moved in parallel due to the curvature of the main bimetal 13, and because the pressing force generated therefrom is often transmitted to the temperature compensation bimetal 100 through the shift ring 16, There is a problem that the mechanical strength of the temperature compensation bimetal 100 is weakened and its shape is deformed.

As a result, the trip characteristics of the thermal overload relay may be changed, and a phenomenon may occur in which the device does not trip even when an overcurrent occurs.

Therefore, the present invention is to solve the above problems, an object of the present invention is to improve the mechanical strength by providing a thermal compensation bimetal composed of a plurality of layers of a plurality of bimetal layers having a thin thickness at the same time with respect to temperature It is to provide a thermal overload relay equipped with a thermal compensation bimetal that has excellent thermal characteristics for the environment in which the thermal overload relay is used and has little deformation due to mechanical shock by increasing the sensitivity.

In order to achieve the above object, the present invention provides a main bimetal that is curved when an overcurrent occurs in a main circuit, a shift installed to be horizontally moved by the main bimetal, a release lever rotated by a pressing force transmitted from the shift, and a normal An inversion mechanism part and one end thereof which are kept separated from the corresponding terminal during operation and inverted to contact with the corresponding terminal by the rotational force of the release lever when an overcurrent occurs are mounted on one side of the release lever and the other end thereof. The thermal contact type overload relay comprising a temperature compensating bimetal which is in contact with the shift and is configured by stacking a plurality of bimetal layers to transfer the pressing force generated in the shift to the release lever.

According to the configuration as described above, by providing a thermal compensation bimetal composed of a plurality of layers of a plurality of bimetal layers having a thin thickness to improve the mechanical strength and to increase the sensitivity to temperature thermal thermal overload relay is used It is effective to provide a thermal overload relay having a thermal compensation bimetal having excellent thermal characteristics to the environment and less deformation due to mechanical impact.

The purpose of the present invention and the configuration for achieving the above will be more clearly understood by the following detailed description with reference to the accompanying drawings of the thermal overload relay according to a preferred embodiment of the present invention.

Hereinafter, a thermal overload relay according to a preferred embodiment of the present invention with reference to the accompanying drawings in more detail as follows.

4 to 7 illustrate a thermal overload relay according to an embodiment of the present invention, and FIGS. 4 and 5 illustrate a configuration of a temperature compensation bimetal provided in the thermal overload relay according to an embodiment of the present invention. Side view and perspective view.

4 and 5, the thermal overload relay according to the embodiment of the present invention is installed to be horizontally movable by the main bimetal 13 and the main bimetal 13 that are curved when an overcurrent occurs in the main circuit. The shift 15 and the release lever 23 rotated by the pressing force transmitted from the shift 15 maintain the state separated from the corresponding terminal during the normal operation, and the release lever 23 rotates when the overcurrent occurs. The reverse mechanism 26 and one end thereof inverted in contact with the corresponding terminal by power are mounted on one side of the release lever 23, and the other end thereof is in contact with the shift 15, and a plurality of bimetal layers ( 101, 102, and 103 are stacked to include a temperature compensation bimetal 100 for transmitting the pressing force generated in the shift 15 to the release lever 23.

Here, each of the bimetal layers 101, 102, and 103 are configured to have the same thickness and have the same temperature characteristic.

That is, the temperature compensation bimetal 100 provided in the thermal overload relay according to the embodiment of the present invention has a plurality of bimetal layers 101, 102, and 103 configured to have a thin thickness and have the same thickness. It is configured to be stacked on each other, the overall thickness of each of the bimetal layer (101, 102, 103) is formed is laminated is the same as the thickness of the temperature compensation bimetal (24, see Fig. 3) provided in the conventional thermal overload relay It is configured to be equivalent.

In addition, the plurality of bimetal layers 101, 102, and 103 constituting the temperature compensation bimetal 100 have the same temperature characteristics, and thus the temperature at which the bimetal layers 101, 102, and 103 are stacked. The overall curvature ratio of the compensating bimetal 100 is configured to be constant so that the overall tripping characteristic of the thermal overload relay is configured to be reliable.

Hereinafter, the operating state of the thermal overload relay according to the embodiment of the present invention with the temperature compensation bimetal having the above configuration will be described with reference to FIGS. 6 and 7.

6 and 7 are cross-sectional views showing a normal energized state and a tripped state of the thermal overload relay according to the embodiment of the present invention.

As shown in FIG. 6, in the thermal overload relay according to the embodiment of the present invention, when an overcurrent flows or an image occurs in a circuit between a power supply and a load,

As shown in FIG. 6, the thermal overload relay according to the embodiment of the present invention exists in a basic configuration in a normal state, but as shown in FIG. 7, an overcurrent flows in a circuit between a power supply and a load of the thermal overload relay. When abnormal operation is performed, such as when an image or an image is generated, the overcurrent or an image signal is transmitted through the main terminal 10, and thus a coil-type heater wound around the main bimetal 13 in the lower case 12. 14) will generate heat.

When the main bimetal 13 is bent by the heat and the shift 15 moves to the right in the drawing, the shift ring 16 rotates the temperature compensation bimetal 24 of the release lever 23 counterclockwise. .

At this time, the temperature compensation bimetal 100 provided in the thermal overload relay according to an embodiment of the present invention is configured to stack a plurality of thin bimetal layers 101, 102, 103 as described above, and thus mechanical strength. Due to the reinforcement, the pressing force transmitted from the shift ring 16 according to the parallel movement of the shift 15 is not bent or the shape thereof is not deformed and the pressure is faithfully transmitted to the release lever 23.

By the rotational motion of the temperature compensation bimetal 24 as described above, the pressurizing portion 25 of the release lever 23 presses the center portion 27 of the reversal mechanism 26 downward in the drawing, and thus the reversal mechanism ( When 26 and the central portion 27 cross the horizontal threshold, the reverse mechanism 26 composed of the leaf spring as shown in FIG. Will come down.

In addition, the plurality of bimetal layers 101, 102, and 103 constituting the temperature compensation bimetal 100 are configured to have the same temperature characteristics to each other so as to be sensitive to the ambient temperature characteristics of the thermal overload relay. And, it is configured to ensure the reliability of the thermal overload relay trip characteristics.

The thermal overload relay according to the embodiment of the present invention, which is converted to the trip state by the configuration as described above, is maintained in the trip state by the reverse spring 28 as in the normal state.

As described above, the thermal overload relay according to the present invention provides a thermal compensation bimetal configured by stacking a plurality of bimetal layers having a thin thickness, thereby improving mechanical strength and increasing sensitivity to temperature. As a result, it is possible to provide a thermal overload relay equipped with a thermal compensation bimetal having excellent thermal characteristics for the environment in which the thermal overload relay is used and less deformation due to mechanical shock.

Claims (3)

A main bimetal curved when an overcurrent occurs in the main circuit; A shift installed to move horizontally by the main bimetal; A release lever rotated by the pressing force transmitted from the shift; An inverting mechanism part which maintains a state separated from the corresponding terminal during normal operation and inverts to a state in contact with the corresponding terminal by the rotational force of the release lever when an overcurrent occurs; And One end of which is mounted on one side of the release lever, the other end of which is in contact with the shift, and a plurality of bimetal layers are stacked to include a temperature compensation bimetal that transmits the pressing force generated in the shift to the release lever. Thermal overload relay. The method of claim 1, Each bimetal layer is, Thermal overload relay, characterized in that composed of the same thickness with each other. The method according to claim 1 or 2, Each bimetal layer is, A thermal overload relay, characterized by having the same temperature characteristic to each other.

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